JP2002246515A - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JP2002246515A JP2002246515A JP2001043439A JP2001043439A JP2002246515A JP 2002246515 A JP2002246515 A JP 2002246515A JP 2001043439 A JP2001043439 A JP 2001043439A JP 2001043439 A JP2001043439 A JP 2001043439A JP 2002246515 A JP2002246515 A JP 2002246515A
- Authority
- JP
- Japan
- Prior art keywords
- metal block
- semiconductor device
- power element
- metal
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- H—ELECTRICITY
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
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- H—ELECTRICITY
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Landscapes
- Engineering & Computer Science (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001043439A JP2002246515A (ja) | 2001-02-20 | 2001-02-20 | 半導体装置 |
| US09/895,025 US6914321B2 (en) | 2001-02-20 | 2001-07-02 | Semiconductor device |
| DE2001149580 DE10149580B4 (de) | 2001-02-20 | 2001-10-08 | Halbleitervorrichtung |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| JP2001043439A JP2002246515A (ja) | 2001-02-20 | 2001-02-20 | 半導体装置 |
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| JP2002246515A5 JP2002246515A5 (enExample) | 2006-11-02 |
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| JP (1) | JP2002246515A (enExample) |
| DE (1) | DE10149580B4 (enExample) |
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| JP2021190505A (ja) * | 2020-05-27 | 2021-12-13 | ローム株式会社 | 半導体装置 |
| JP2022149879A (ja) * | 2021-03-25 | 2022-10-07 | 株式会社日立製作所 | 電力変換装置 |
| WO2022202248A1 (ja) * | 2021-03-25 | 2022-09-29 | 株式会社日立製作所 | 電力変換装置 |
| JP7558866B2 (ja) | 2021-03-25 | 2024-10-01 | 株式会社日立製作所 | 電力変換装置 |
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| Publication number | Publication date |
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| DE10149580A1 (de) | 2002-09-05 |
| DE10149580B4 (de) | 2009-07-16 |
| US6914321B2 (en) | 2005-07-05 |
| US20020113302A1 (en) | 2002-08-22 |
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