IL141803A0 - Photoresists, polymers and processes for microlithography - Google Patents
Photoresists, polymers and processes for microlithographyInfo
- Publication number
- IL141803A0 IL141803A0 IL14180399A IL14180399A IL141803A0 IL 141803 A0 IL141803 A0 IL 141803A0 IL 14180399 A IL14180399 A IL 14180399A IL 14180399 A IL14180399 A IL 14180399A IL 141803 A0 IL141803 A0 IL 141803A0
- Authority
- IL
- Israel
- Prior art keywords
- microlithography
- photoresists
- polymers
- processes
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
- Y10S430/108—Polyolefin or halogen containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
- Y10S430/111—Polymer of unsaturated acid or ester
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/115—Cationic or anionic
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Materials For Photolithography (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10150298P | 1998-09-23 | 1998-09-23 | |
US12004599P | 1999-02-12 | 1999-02-12 | |
PCT/US1999/021912 WO2000017712A1 (en) | 1998-09-23 | 1999-09-21 | Photoresists, polymers and processes for microlithography |
Publications (1)
Publication Number | Publication Date |
---|---|
IL141803A0 true IL141803A0 (en) | 2002-03-10 |
Family
ID=26798325
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL14180399A IL141803A0 (en) | 1998-09-23 | 1999-09-21 | Photoresists, polymers and processes for microlithography |
Country Status (10)
Country | Link |
---|---|
US (2) | US6593058B1 (zh) |
EP (1) | EP1131677B1 (zh) |
JP (2) | JP4327360B2 (zh) |
CN (1) | CN1253759C (zh) |
AU (1) | AU6056099A (zh) |
DE (1) | DE69926532T2 (zh) |
HK (1) | HK1041055A1 (zh) |
IL (1) | IL141803A0 (zh) |
TW (1) | TWI221944B (zh) |
WO (1) | WO2000017712A1 (zh) |
Families Citing this family (157)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IL141803A0 (en) * | 1998-09-23 | 2002-03-10 | Du Pont | Photoresists, polymers and processes for microlithography |
US6849377B2 (en) * | 1998-09-23 | 2005-02-01 | E. I. Du Pont De Nemours And Company | Photoresists, polymers and processes for microlithography |
EP1035441A1 (en) * | 1999-03-09 | 2000-09-13 | Matsushita Electric Industrial Co., Ltd. | Pattern formation method |
KR20020012206A (ko) * | 1999-05-04 | 2002-02-15 | 메리 이. 보울러 | 플루오르화 중합체, 포토레지스트 및 마이크로리소그래피방법 |
US6790587B1 (en) | 1999-05-04 | 2004-09-14 | E. I. Du Pont De Nemours And Company | Fluorinated polymers, photoresists and processes for microlithography |
IL145654A0 (en) | 1999-05-04 | 2002-06-30 | Du Pont | Polyfluorinated epoxides and associated polymers and processes |
US6468712B1 (en) | 2000-02-25 | 2002-10-22 | Massachusetts Institute Of Technology | Resist materials for 157-nm lithography |
WO2001074916A1 (fr) | 2000-04-04 | 2001-10-11 | Daikin Industries, Ltd. | Fluoropolymere renfermant un groupe qui reagit aux acides et composition photoresist a amplification chimique contenant ledit fluoropolymere |
JP2003532765A (ja) * | 2000-05-05 | 2003-11-05 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | フォトレジスト用コポリマーおよびそのための方法 |
AU2001259509A1 (en) * | 2000-05-05 | 2001-11-20 | E.I. Du Pont De Nemours And Company | Polymers for photoresist compositions for microlithography |
US6951705B2 (en) | 2000-05-05 | 2005-10-04 | E. I. Du Pont De Nemours And Company | Polymers for photoresist compositions for microlithography |
SG100729A1 (en) * | 2000-06-16 | 2003-12-26 | Jsr Corp | Radiation-sensitive resin composition |
AU2001274579A1 (en) * | 2000-06-21 | 2002-01-02 | Asahi Glass Company, Limited | Resist composition |
US7132214B2 (en) | 2000-09-08 | 2006-11-07 | Shipley Company, L.L.C. | Polymers and photoresist compositions for short wavelength imaging |
US20020058199A1 (en) * | 2000-09-08 | 2002-05-16 | Shipley Company, L.L.C. | Novel polymers and photoresist compositions comprising electronegative groups |
WO2002021213A2 (en) * | 2000-09-08 | 2002-03-14 | Shipley Company, L.L.C. | Novel polymers and photoresist compositions for short wavelength imaging |
WO2002031595A2 (en) * | 2000-10-13 | 2002-04-18 | E.I. Dupont De Nemours And Company | Dissolution inhibitors in photoresist compositions for microlithography |
US6974657B2 (en) | 2000-10-18 | 2005-12-13 | E. I. Du Pont De Nemours And Company | Compositions for microlithography |
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JP2004537740A (ja) * | 2000-11-09 | 2004-12-16 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | ミクロリソグラフィ用フォトレジスト組成物中の光酸発生剤 |
KR20040012692A (ko) * | 2000-11-29 | 2004-02-11 | 이 아이 듀폰 디 네모아 앤드 캄파니 | 미세석판인쇄에 사용하기 위한 반사방지층 |
CN1486449A (zh) * | 2000-11-29 | 2004-03-31 | 纳幕尔杜邦公司 | 含有光刻胶组合物的多层元件及其在显微光刻中的应用 |
CN1498360A (zh) | 2000-11-29 | 2004-05-19 | 纳幕尔杜邦公司 | 聚合物掺混物及其在用于微细光刻的光刻胶组合物中的应用 |
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JP4821068B2 (ja) * | 2001-02-22 | 2011-11-24 | 大日本印刷株式会社 | 体積型ホログラム記録用感光性組成物及び体積型ホログラム記録用感光性媒体 |
US6794109B2 (en) | 2001-02-23 | 2004-09-21 | Massachusetts Institute Of Technology | Low abosorbing resists for 157 nm lithography |
US6787286B2 (en) | 2001-03-08 | 2004-09-07 | Shipley Company, L.L.C. | Solvents and photoresist compositions for short wavelength imaging |
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DE69926532D1 (de) | 2005-09-08 |
US6593058B1 (en) | 2003-07-15 |
US7276323B2 (en) | 2007-10-02 |
WO2000017712A1 (en) | 2000-03-30 |
TWI221944B (en) | 2004-10-11 |
EP1131677B1 (en) | 2005-08-03 |
JP2002525683A (ja) | 2002-08-13 |
JP4327360B2 (ja) | 2009-09-09 |
HK1041055A1 (zh) | 2002-06-28 |
CN1319199A (zh) | 2001-10-24 |
JP2009161770A (ja) | 2009-07-23 |
EP1131677A1 (en) | 2001-09-12 |
AU6056099A (en) | 2000-04-10 |
DE69926532T2 (de) | 2006-06-01 |
CN1253759C (zh) | 2006-04-26 |
US20040023152A1 (en) | 2004-02-05 |
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