HK1050720A1 - Sputtering targer, transparent conductive oxide, and method for preparing sputtering target. - Google Patents

Sputtering targer, transparent conductive oxide, and method for preparing sputtering target.

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Publication number
HK1050720A1
HK1050720A1 HK03102914A HK03102914A HK1050720A1 HK 1050720 A1 HK1050720 A1 HK 1050720A1 HK 03102914 A HK03102914 A HK 03102914A HK 03102914 A HK03102914 A HK 03102914A HK 1050720 A1 HK1050720 A1 HK 1050720A1
Authority
HK
Hong Kong
Prior art keywords
sputtering
targer
transparent conductive
conductive oxide
preparing
Prior art date
Application number
HK03102914A
Other languages
English (en)
Inventor
Kyzuyoshi Inoue
Tadao Shibuya
Akira Kaijo
Original Assignee
Idemitsu Kosan Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idemitsu Kosan Co filed Critical Idemitsu Kosan Co
Publication of HK1050720A1 publication Critical patent/HK1050720A1/xx

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    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
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    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
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HK03102914A 1999-11-25 2003-04-24 Sputtering targer, transparent conductive oxide, and method for preparing sputtering target. HK1050720A1 (en)

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PCT/JP2000/008236 WO2001038599A1 (fr) 1999-11-25 2000-11-22 Cible de pulverisation cathodique, oxyde electro-conducteur transparent, et procede d'elaboration d'une cible de pulverisation cathodique

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EP1233082B1 (en) 2009-01-07
JP5306308B2 (ja) 2013-10-02
JP4850378B2 (ja) 2012-01-11
EP1752430A1 (en) 2007-02-14
WO2001038599A1 (fr) 2001-05-31
DE60042431D1 (de) 2009-07-30
JP2011068993A (ja) 2011-04-07
DE60041353D1 (de) 2009-02-26
KR20020069190A (ko) 2002-08-29
EP1777321A1 (en) 2007-04-25
EP1233082A1 (en) 2002-08-21
EP1233082A4 (en) 2006-01-25
US6669830B1 (en) 2003-12-30
CN1379827A (zh) 2002-11-13
KR101139203B1 (ko) 2012-04-26
KR100849258B1 (ko) 2008-07-29
JP2011190542A (ja) 2011-09-29
CN1195886C (zh) 2005-04-06
KR20080035025A (ko) 2008-04-22
JP5558420B2 (ja) 2014-07-23
KR20070089755A (ko) 2007-08-31
KR100774778B1 (ko) 2007-11-07
EP1752430B1 (en) 2009-06-17

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