AU2002228716A1 - Sputtering target assemblies - Google Patents

Sputtering target assemblies

Info

Publication number
AU2002228716A1
AU2002228716A1 AU2002228716A AU2871602A AU2002228716A1 AU 2002228716 A1 AU2002228716 A1 AU 2002228716A1 AU 2002228716 A AU2002228716 A AU 2002228716A AU 2871602 A AU2871602 A AU 2871602A AU 2002228716 A1 AU2002228716 A1 AU 2002228716A1
Authority
AU
Australia
Prior art keywords
sputtering target
target assemblies
assemblies
sputtering
target
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002228716A
Inventor
Jianxing Li
Timothy Scott
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of AU2002228716A1 publication Critical patent/AU2002228716A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
AU2002228716A 2000-10-30 2001-10-24 Sputtering target assemblies Abandoned AU2002228716A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/702,156 2000-10-30
US09/702,156 US6596131B1 (en) 2000-10-30 2000-10-30 Carbon fiber and copper support for physical vapor deposition target assembly and method of forming
PCT/US2001/045535 WO2002036846A2 (en) 2000-10-30 2001-10-24 Sputtering target assemblies

Publications (1)

Publication Number Publication Date
AU2002228716A1 true AU2002228716A1 (en) 2002-05-15

Family

ID=24820077

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002228716A Abandoned AU2002228716A1 (en) 2000-10-30 2001-10-24 Sputtering target assemblies

Country Status (8)

Country Link
US (1) US6596131B1 (en)
EP (1) EP1335994A2 (en)
JP (1) JP2004513227A (en)
KR (1) KR20030045152A (en)
CN (1) CN1494602A (en)
AU (1) AU2002228716A1 (en)
TW (1) TW575669B (en)
WO (1) WO2002036846A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6596131B1 (en) 2000-10-30 2003-07-22 Honeywell International Inc. Carbon fiber and copper support for physical vapor deposition target assembly and method of forming
US20060175198A1 (en) * 2003-02-20 2006-08-10 N.V. Bekaert S.A. Method of manufacturing a sputter target
WO2004094688A1 (en) * 2003-04-02 2004-11-04 Honeywell International Inc. Pvd target/backing plate constructions; and methods of forming pvd target/backing plate constructions
US20040222090A1 (en) * 2003-05-07 2004-11-11 Tim Scott Carbon fiber and copper support for physical vapor deposition target assemblies
US20100178525A1 (en) * 2009-01-12 2010-07-15 Scott Campbell Method for making composite sputtering targets and the tartets made in accordance with the method
EP2268434A1 (en) * 2008-03-20 2011-01-05 Sci Engineered Materials, Inc. A method for making composite sputtering targets and the targets made in accordance with the method
DE102008032480A1 (en) * 2008-07-10 2010-01-14 Siemens Aktiengesellschaft detection device
EP2445835A1 (en) * 2009-06-24 2012-05-02 Third Millennium Metals, Llc Copper-carbon composition
CA2826551A1 (en) 2010-02-04 2011-08-11 Third Millennium Metals, Llc Metal-carbon compositions
MX2013010080A (en) 2011-03-04 2014-04-16 Third Millennium Metals Llc Aluminum-carbon compositions.
KR20140129018A (en) 2012-02-14 2014-11-06 토소우 에스엠디, 인크 Low deflection sputtering target assembly and methods of making same
CN106607667B (en) * 2015-10-26 2018-05-08 宁波江丰电子材料股份有限公司 The manufacture method of target material assembly
CN108315699A (en) * 2018-05-10 2018-07-24 苏州精美科光电材料有限公司 A method of it reducing target and misses the target in coating process

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5167920A (en) 1986-05-01 1992-12-01 Dural Aluminum Composites Corp. Cast composite material
JPS61288065A (en) * 1985-06-14 1986-12-18 Hitachi Metals Ltd Target
JPS6261056A (en) 1985-09-11 1987-03-17 Matsushita Electric Ind Co Ltd Photoconductor
DE3686239T2 (en) 1985-11-14 1993-03-18 Ici Plc FIBER REINFORCED COMPOSITE WITH METAL MATRIX.
JPS6462462A (en) 1987-09-01 1989-03-08 Nippon Mining Co Target assembly parts for ceramics sputtering
JPS6483634A (en) 1987-09-25 1989-03-29 Sumitomo Electric Industries Aluminum composite material combining low thermal expansion property with high heat dissipation property
KR940006708B1 (en) 1989-01-26 1994-07-25 세이꼬 엡슨 가부시끼가이샤 Manufacturing method of semiconductor device
JPH03196619A (en) 1989-12-26 1991-08-28 Nippon Mining Co Ltd Formation of copper wire and target used therefor
WO1992017622A1 (en) 1991-04-08 1992-10-15 Tosoh Smd, Inc. Thermally compatible sputter target and backing plate assembly
US5693203A (en) * 1992-09-29 1997-12-02 Japan Energy Corporation Sputtering target assembly having solid-phase bonded interface
JPH0776771A (en) 1993-09-08 1995-03-20 Japan Energy Corp Tungsten sputtering target
US5397050A (en) 1993-10-27 1995-03-14 Tosoh Smd, Inc. Method of bonding tungsten titanium sputter targets to titanium plates and target assemblies produced thereby
JPH093641A (en) * 1995-06-23 1997-01-07 Sony Corp Backing plate and its manufacture
JPH09137269A (en) 1995-11-10 1997-05-27 Vacuum Metallurgical Co Ltd Pzt-or plzt-based sputtering target
US6183686B1 (en) 1998-08-04 2001-02-06 Tosoh Smd, Inc. Sputter target assembly having a metal-matrix-composite backing plate and methods of making same
US6596139B2 (en) 2000-05-31 2003-07-22 Honeywell International Inc. Discontinuous high-modulus fiber metal matrix composite for physical vapor deposition target backing plates and other thermal management applications
US6596131B1 (en) 2000-10-30 2003-07-22 Honeywell International Inc. Carbon fiber and copper support for physical vapor deposition target assembly and method of forming

Also Published As

Publication number Publication date
WO2002036846A3 (en) 2003-03-06
EP1335994A2 (en) 2003-08-20
WO2002036846A2 (en) 2002-05-10
US6596131B1 (en) 2003-07-22
CN1494602A (en) 2004-05-05
KR20030045152A (en) 2003-06-09
TW575669B (en) 2004-02-11
JP2004513227A (en) 2004-04-30

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