AU2001232863A1 - Sputtering assembly and target therefor - Google Patents

Sputtering assembly and target therefor

Info

Publication number
AU2001232863A1
AU2001232863A1 AU2001232863A AU3286301A AU2001232863A1 AU 2001232863 A1 AU2001232863 A1 AU 2001232863A1 AU 2001232863 A AU2001232863 A AU 2001232863A AU 3286301 A AU3286301 A AU 3286301A AU 2001232863 A1 AU2001232863 A1 AU 2001232863A1
Authority
AU
Australia
Prior art keywords
sputtering assembly
target therefor
therefor
target
sputtering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001232863A
Inventor
Robert G. Hieronymi
Gary D. Lutz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Veeco Instruments Inc
Original Assignee
Veeco Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Veeco Instruments Inc filed Critical Veeco Instruments Inc
Publication of AU2001232863A1 publication Critical patent/AU2001232863A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3423—Shape
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
AU2001232863A 2000-01-19 2001-01-19 Sputtering assembly and target therefor Abandoned AU2001232863A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/487,082 US6299740B1 (en) 2000-01-19 2000-01-19 Sputtering assembly and target therefor
US09487082 2000-01-19
PCT/US2001/001796 WO2001053557A1 (en) 2000-01-19 2001-01-19 Sputtering assembly and target therefor

Publications (1)

Publication Number Publication Date
AU2001232863A1 true AU2001232863A1 (en) 2001-07-31

Family

ID=23934331

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001232863A Abandoned AU2001232863A1 (en) 2000-01-19 2001-01-19 Sputtering assembly and target therefor

Country Status (3)

Country Link
US (2) US6299740B1 (en)
AU (1) AU2001232863A1 (en)
WO (1) WO2001053557A1 (en)

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US6454911B1 (en) * 2000-06-01 2002-09-24 Honeywell International Inc. Method and apparatus for determining the pass through flux of magnetic materials
US7041204B1 (en) 2000-10-27 2006-05-09 Honeywell International Inc. Physical vapor deposition components and methods of formation
KR20030077633A (en) * 2001-02-20 2003-10-01 허니웰 인터내셔날 인코포레이티드 Topologically tailored sputtering targets
DE60236264D1 (en) * 2001-04-24 2010-06-17 Tosoh Smd Inc PROCESS FOR OPTIMIZING THE TARGET PROFILE
US7744735B2 (en) * 2001-05-04 2010-06-29 Tokyo Electron Limited Ionized PVD with sequential deposition and etching
US7279046B2 (en) * 2002-03-27 2007-10-09 Nanoink, Inc. Method and apparatus for aligning patterns on a substrate
US20040129559A1 (en) * 2002-04-12 2004-07-08 Misner Josh W. Diffusion bonded assemblies and fabrication methods
US20050061857A1 (en) * 2003-09-24 2005-03-24 Hunt Thomas J. Method for bonding a sputter target to a backing plate and the assembly thereof
US7910218B2 (en) 2003-10-22 2011-03-22 Applied Materials, Inc. Cleaning and refurbishing chamber components having metal coatings
DE102004027897A1 (en) * 2004-06-09 2006-01-05 Leybold Optics Gmbh Apparatus and method for atomization with a movable planar target
US7485210B2 (en) * 2004-10-07 2009-02-03 International Business Machines Corporation Sputtering target fixture
US7670436B2 (en) 2004-11-03 2010-03-02 Applied Materials, Inc. Support ring assembly
JP4923450B2 (en) * 2005-07-01 2012-04-25 富士ゼロックス株式会社 Batch processing support apparatus and method, program
US20070084720A1 (en) * 2005-07-13 2007-04-19 Akihiro Hosokawa Magnetron sputtering system for large-area substrates having removable anodes
US20070012663A1 (en) * 2005-07-13 2007-01-18 Akihiro Hosokawa Magnetron sputtering system for large-area substrates having removable anodes
US8617672B2 (en) 2005-07-13 2013-12-31 Applied Materials, Inc. Localized surface annealing of components for substrate processing chambers
US20070012559A1 (en) * 2005-07-13 2007-01-18 Applied Materials, Inc. Method of improving magnetron sputtering of large-area substrates using a removable anode
US20070051616A1 (en) * 2005-09-07 2007-03-08 Le Hienminh H Multizone magnetron assembly
US7762114B2 (en) 2005-09-09 2010-07-27 Applied Materials, Inc. Flow-formed chamber component having a textured surface
US7588668B2 (en) 2005-09-13 2009-09-15 Applied Materials, Inc. Thermally conductive dielectric bonding of sputtering targets using diamond powder filler or thermally conductive ceramic fillers
US20070056843A1 (en) * 2005-09-13 2007-03-15 Applied Materials, Inc. Method of processing a substrate using a large-area magnetron sputtering chamber with individually controlled sputtering zones
US20070056850A1 (en) * 2005-09-13 2007-03-15 Applied Materials, Inc. Large-area magnetron sputtering chamber with individually controlled sputtering zones
US20070080056A1 (en) * 2005-10-07 2007-04-12 German John R Method and apparatus for cylindrical magnetron sputtering using multiple electron drift paths
US9127362B2 (en) 2005-10-31 2015-09-08 Applied Materials, Inc. Process kit and target for substrate processing chamber
US20070108041A1 (en) * 2005-11-11 2007-05-17 Guo George X Magnetron source having increased usage life
US8647484B2 (en) 2005-11-25 2014-02-11 Applied Materials, Inc. Target for sputtering chamber
US20080067058A1 (en) * 2006-09-15 2008-03-20 Stimson Bradley O Monolithic target for flat panel application
US7981262B2 (en) 2007-01-29 2011-07-19 Applied Materials, Inc. Process kit for substrate processing chamber
US7942969B2 (en) 2007-05-30 2011-05-17 Applied Materials, Inc. Substrate cleaning chamber and components
US8968536B2 (en) 2007-06-18 2015-03-03 Applied Materials, Inc. Sputtering target having increased life and sputtering uniformity
US7901552B2 (en) * 2007-10-05 2011-03-08 Applied Materials, Inc. Sputtering target with grooves and intersecting channels
US8951394B2 (en) 2010-01-29 2015-02-10 Angstrom Sciences, Inc. Cylindrical magnetron having a shunt
US20110220494A1 (en) * 2010-03-11 2011-09-15 Peijun Ding Methods and apparatus for magnetron metallization for semiconductor fabrication
US20120312233A1 (en) * 2011-06-10 2012-12-13 Ge Yi Magnetically Enhanced Thin Film Coating Method and Apparatus
US8685214B1 (en) 2011-09-30 2014-04-01 WD Media, LLC Magnetic shunting pads for optimizing target erosion in sputtering processes
US10573500B2 (en) 2011-12-09 2020-02-25 Seagate Technology Llc Interchangeable magnet pack
US9347129B2 (en) * 2011-12-09 2016-05-24 Seagate Technology Llc Interchangeable magnet pack
WO2016128579A1 (en) * 2015-02-13 2016-08-18 Oerlikon Surface Solutions Ag, Pfäffikon Fixture comprising magnetic means for holding rotary symmetric workpieces
US10151023B2 (en) 2016-06-27 2018-12-11 Cardinal Cg Company Laterally adjustable return path magnet assembly and methods
US10056238B2 (en) 2016-06-27 2018-08-21 Cardinal Cg Company Adjustable return path magnet assembly and methods
US10790127B2 (en) 2017-05-04 2020-09-29 Cardinal Cg Company Flexible adjustable return path magnet assembly and methods
US10513432B2 (en) * 2017-07-31 2019-12-24 Taiwan Semiconductor Manufacturing Co., Ltd. Anti-stiction process for MEMS device
US11322338B2 (en) * 2017-08-31 2022-05-03 Taiwan Semiconductor Manufacturing Co., Ltd. Sputter target magnet
US11488814B2 (en) * 2018-10-29 2022-11-01 Taiwan Semiconductor Manufacturing Co., Ltd. Permeance magnetic assembly
JP2023029111A (en) * 2021-08-20 2023-03-03 Ktx株式会社 Mold for molding and manufacturing method thereof

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US4180450A (en) * 1978-08-21 1979-12-25 Vac-Tec Systems, Inc. Planar magnetron sputtering device
US4200510A (en) 1979-03-19 1980-04-29 Delbar Products, Inc. Assembly and method to extend useful life of sputtering targets
US4324631A (en) * 1979-07-23 1982-04-13 Spin Physics, Inc. Magnetron sputtering of magnetic materials
US4299678A (en) * 1979-07-23 1981-11-10 Spin Physics, Inc. Magnetic target plate for use in magnetron sputtering of magnetic films
CH649578A5 (en) 1981-03-27 1985-05-31 Ulvac Corp HIGH-SPEED CATHODE SPRAYING DEVICE.
DE3223245C2 (en) 1982-07-23 1986-05-22 Nihon Shinku Gijutsu K.K., Chigasaki, Kanagawa High speed ferromagnetic sputtering device
US4414087A (en) * 1983-01-31 1983-11-08 Meckel Benjamin B Magnetically-assisted sputtering method for producing vertical recording media
US4500408A (en) * 1983-07-19 1985-02-19 Varian Associates, Inc. Apparatus for and method of controlling sputter coating
DE3427587A1 (en) 1984-07-26 1986-02-06 Leybold-Heraeus GmbH, 5000 Köln SPRAYING DEVICE FOR CATODE SPRAYING SYSTEMS
US4610774A (en) 1984-11-14 1986-09-09 Hitachi, Ltd. Target for sputtering
US4834860A (en) 1987-07-01 1989-05-30 The Boc Group, Inc. Magnetron sputtering targets
US5073245A (en) 1990-07-10 1991-12-17 Hedgcoth Virgle L Slotted cylindrical hollow cathode/magnetron sputtering device
US5174875A (en) 1990-08-29 1992-12-29 Materials Research Corporation Method of enhancing the performance of a magnetron sputtering target
US5262028A (en) 1992-06-01 1993-11-16 Sierra Applied Sciences, Inc. Planar magnetron sputtering magnet assembly
US5415754A (en) 1993-10-22 1995-05-16 Sierra Applied Sciences, Inc. Method and apparatus for sputtering magnetic target materials
US5441614A (en) 1994-11-30 1995-08-15 At&T Corp. Method and apparatus for planar magnetron sputtering
US5770025A (en) * 1995-08-03 1998-06-23 Nihon Shinku Gijutsu Kabushiki Kaisha Magnetron sputtering apparatus
US5685959A (en) * 1996-10-25 1997-11-11 Hmt Technology Corporation Cathode assembly having rotating magnetic-field shunt and method of making magnetic recording media
US5855745A (en) * 1997-04-23 1999-01-05 Sierra Applied Sciences, Inc. Plasma processing system utilizing combined anode/ ion source
US5827414A (en) 1997-07-25 1998-10-27 International Business Machines Corporation Single piece slotted ferromagnetic sputtering target and sputtering apparatus

Also Published As

Publication number Publication date
US6395146B2 (en) 2002-05-28
US6299740B1 (en) 2001-10-09
US20010045353A1 (en) 2001-11-29
WO2001053557A1 (en) 2001-07-26

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