Classifications

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  • H01L24/10—Bump connectors ; Manufacturing methods related thereto
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  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
  • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
  • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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  • H01L24/10—Bump connectors ; Manufacturing methods related thereto
  • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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  • H01L2224/02—Bonding areas; Manufacturing methods related thereto
  • H01L2224/023—Redistribution layers [RDL] for bonding areas
  • H01L2224/0231—Manufacturing methods of the redistribution layers
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  • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
  • H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
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  • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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  • H01L2224/13001—Core members of the bump connector
  • H01L2224/13099—Material
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  • H01L2224/1319—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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  • H01L2924/351—Thermal stress

Definitions

• the present invention relates to an electronic component with an electronic circuit according to the preamble of the independent claims.
• the invention further relates to a method for producing the electronic component according to the invention.
• Wise-shaped edged elevation protruding from the surface of the component and encased in a metal layer. Because of the polyimide film and because of the complete covering with a relatively rigid metal coating, this elevation is not suitable for compensating between the contacts of the component and the connections of a component carrier to which the component is to be electrically connected via the external contacts. A component with such an external contact structure often has damage or destruction of the soldered connections between the component and the carrier when it is applied to a circuit board. It is also known from US Pat. No. 5,685,885 to arrange electrical contacts on a rubber-elastic layer. The production of components with the layer disclosed there is complex.
• the object of the present invention is therefore to provide an electronic component which permanently soldered connections. fertilize and provides level compensation for unevenness between the electronic component and a carrier such as a circuit board.
• the electronic component has an electronic circuit and conductor tracks on a surface for electrically connecting the electronic circuit to metal-coated elevations made of insulating material, the elevations having a rubber-elastic material and each having a metallic contact spot on its tip and on its slope side or have a line path in their volume, which is arranged between the contact pad and one of the conductor tracks on the surface of the electronic component.
• line path means any electrically conductive path on the slope side of the rubber-elastic elevation and / or within the volume of the rubber-elastic elevation, while conductor tracks represent electrically conductive paths on the surface of the electronic component or on a semiconductor chip of the electronic component.
• This arrangement according to the invention is particularly important in the case of electronic components, the size of which largely corresponds to the size of the electronic circuit or the circuit chip corresponds to the component, namely in so-called chip-size components. Since here, apart from the electronic circuit on a circuit chip, there are practically no further housing elements that can intercept voltages on the electronic component. Thus, there is a risk of damage or destruction of the electrical contacts in such components.
• a rubber-elastic elevation prevents the occurrence of excessive mechanical stresses and thus guarantees the operational reliability of the component. At the same time, the rubber-elastic elevation advantageously compensates for unevenness between the components to be contacted.
• the electrical contact pads of the electronic component are arranged on a rubber-elastic elevation, which compensates for the mechanical stresses that occur.
• a line path can be provided on the slope side or in the volume of the rubber-elastic bump between the electrical contact pad and the electronic circuit or the conductor tracks.
• the electronic circuit can directly adjoin the rubber-elastic elevation with its conductor tracks and is electrically connected to the conduction paths of the elevation.
• the elevation has a dome-like contour with a soft, slightly curved transition to the surface of the electronic component.
• This contour has the advantage that both the crest on which the
• the contact patch is at rest, as is the derivation from the tip via the conduction path to the surface without crack-prone sharp transitions, so that a gradual increase from the Surface of the electronic component to the top of the rubber-elastic elevation for the metal is possible and thus a rubber-elastic-supported contact patch with a safe conduction path to the electronic circuit is created.
• this rubber-elastic property of the elevations is further increased by first arranging a flat base surface made of rubber-elastic material on the surface of the electronic component and then forming the rubber-elastic elevations on this rubber-elastic flat base surface. From the respective crests of the rubber-elastic elevations, which are equipped with contact patches, line paths can first be led on the slopes of the respective rubber-elastic elevation and then via the rubber-elastic flat base to the conductor tracks on the surface.
• a high degree of flexibility of the contact patches on the tip of the elevations is achieved because the compliance of the elevations and the rubber-elastic base complement one another.
• the rubber-elastic elevation has a base with a diameter between 100 microns and 250 microns. With this minimal base area, elevations at a height of 50 ⁇ m to 80 ⁇ m can be displayed, which then arch like a dome over the base area with a smooth transition to the surface of the electronic component.
• additional conductor tracks can be provided between the rubber-elastic elevation and the electronic circuit so that the rubber-elastic elevation is separated from the electronic one Circuit can be arranged spaced apart by a rewiring foil.
• the rubber-elastic material of the elevations has more than 50% elastic extensibility.
• Such a material has the advantage that it can be compressed to more than half its height or can be laterally displaced in the same way, so that the contact spot on the dome is also displaceable relative to the center of the base area.
• a further embodiment of the invention therefore provides that the rubber-elastic material of the elevation has an elastomer.
• Such elastomers act like natural rubbers and can accordingly be moved with little effort both parallel to the surface of the electronic component and thus perpendicular to it.
• the rubber-elastic material has a silicone-based elastomer.
• silicone rubbers are widespread and can be processed in different consistencies, so that a staggering of differently viscous and differently consistent silicone-based materials can be stacked on top of one another in order to realize an optimal dome-like contour with a smooth transition to the surface.
• the elevation made of rubber-elastic material can be deformed by several 10 ⁇ m.
• This rubber-elastic deformability of several 10 ⁇ m is particularly in demand when electronic components on contact connections of printed circuit boards or circuit boards at the wafer level for test purposes. Due to the thermal load, it is quite the case that the semiconductor component expands slightly than the contact connection areas on the circuit board, so that displacements in the range from 50 ⁇ m to 150 ⁇ m with a diameter of 300 mm of the semiconductor wafer to be tested are possible.
• the rubber-elastic elevations according to the invention can advantageously bridge or compensate for these high deflections.
• the elevations to the surface can be deflected by at least 30 ⁇ m in the vertical direction, which has the advantage that tolerances of up to 150 ⁇ m can be compensated for by warping of a semiconductor wafer or the warping of a circuit board.
• the rubber-elastic elevation has a height h of 60 to 300 ⁇ m, so that, with rubber-elastic compression of up to 50%, the elevations can advantageously be compressed to 30 to 150 ⁇ m vertically to form the electrical component.
• a further embodiment of the invention provides that the width b of a line path made of metal is less than or equal to 150 ⁇ m when producing the elevation. This is to ensure at the same time that the metallic path, which acts practically like a metallic spring supported by an elastomer and cooperates with the contact spot on the tip of the elevation, is not too wide and thus does not reduce the flexibility or the rubber-elastic properties .
• the electronic component has a semiconductor component, on the active top side of which an insulating layer is applied, and this insulating layer only leaves bond channels free, via which contact areas on the semiconductor chip can be connected to the conductor tracks on the insulating layer, the conductor tracks again are connected on the insulating layer via the line paths on the slope side of the rubber-elastic elevation to the contact spot on the summit of the elevation.
• the electronic component can also have a polymer component, such as an electronic circuit on a circuit board, and the rubber-elastic elevations are then arranged directly on the circuit board.
• a polymer component such as an electronic circuit on a circuit board
• the contact pads can be soldered onto a circuit board.
• the contact pads can be coated with a thin solderable layer and / or the contact connection areas on the circuit board can have such a solderable layer, so that when the electronic component is applied to the circuit board, an intensive connection can be achieved using soft solder.
• a further connection between the contact pads on the dome of the rubber-elastic elevations and contact connection areas on a circuit board can be achieved by means of a conductive adhesive which is applied, for example, to the contact pads of the dome of the elevation.
• the elevation with the contact spot and the conduction path is completely embedded in a conductive adhesive.
• This complete embedding in a conductive adhesive can be carried out when the electronic component is attached to a printed circuit board or a circuit board or a ceramic carrier by applying an appropriate conductive adhesive to the contact connection surfaces of the respective carrier material, which adhesive then spreads over the contour of the rubber-elastic elevation ,
• the electronic component is arranged on a circuit board, is bonded to the circuit board by means of adhesive bumps shrinking on curing, and, via the at least one electrical contact, forms a rubber-elastic elevation with at least one contact connection area on the circuit board.
• no solder material is used, and no conductive adhesive will also be required, but the contact to the contact connection areas on a circuit board is effected only by pressure, which in turn takes place by shrinking solder bumps from a shrinking adhesive.
• This embodiment of the invention has the advantage that mass production can be carried out in an inexpensive manner, in which it is important to arrange electronic components on circuit boards as quickly and inexpensively as possible, to mechanically fasten them, for example via the shrinking adhesive bumps, and to connect them electrically , what automatically at
• a line path on the slope side of the rubber-elastic elevation a line path can also be arranged inside the rubber-elastic elevation between the electrical contact pad and the electronic circuit. Starting from the electrical contact pad on the tip of the rubber-elastic elevation, the conductive connection is thus guided through the rubber-elastic elevation and to the electronic circuit.
• the entire rubber-elastic or flexible elevation can also be made from a flexible or rubber-elastic and electrically conductive material, so that the conductive connection is not made from a different material through a separate conduction path, but rather through the rubber-elastic material itself.
• This requires very specific materials, which place high demands on the rubber-elastic materials, both in their selection and in their composition. Such materials are generally more high-resistance than a pure line material, which forms a line path.
• a contact spot designed as a metal region can be provided on the cap of the rubber-elastic elevation, a conductor track leading away from the underside of the rubber-elastic elevation.
• conductor tracks can be arranged on an insulating layer that at least partially covers the first surface of the electronic component, with the insulating layer on the rubber-elastic elevation is adjacent.
• This has the advantage that the conductor tracks can be structured by indirect structuring, namely by structuring the insulating layer.
• the electronic component can in principle be designed in any suitable usable form.
• the component can be a semiconductor component or a polymer component.
• the electrical contact spot on the dome of the rubber-elastic elevation can also be of any design and adapted to the particular use of the electronic component.
• the electrical contact can be supplemented by a conductive layer, a conductive pin or a conductive ball and thus advantageously adapted to the requirements of the electronic component.
• the rubber-elastic elevation is applied to the electronic component by means of a printing process which can be carried out simply and inexpensively.
• the requirements for the strength tolerances for such surveys can be met by adapting the technically possible printing processes.
• the insulating layer can also be applied by a printing process.
• the conductive material for producing the conductor tracks or the conductor paths and the electrical contacts can be applied to the rubber-elastic elevation or to the insulating layer by sputter metallization or chemical metallization.
• a stencil printing is preferably used, in which the printing is carried out by means of a perforated stencil.
• This locking template can be optimized in such a way that the entire rubber-elastic elevation can already be formed through the perforated template.
• perforated templates are used that use a perforated metal foil. This perforated metal foil with its holes is precisely matched to the position and the size of the rubber-elastic elevation, whereby an exact adaptation of the dome-shaped design of the rubber-elastic elevation can be achieved with smooth transitions to the top and the base.
• a perforated metal foil is used as the shadow mask.
• such perforated metal foils can be produced extremely precisely, on the other hand, they do not have a fabric structure over the opening for stabilizing the screen printing network, as in the screen printing process, but a completely free through hole, which facilitates metering the amount of silicone rubber.
• a further exemplary embodiment of the method provides that, in the production of the metal layer structure on the surface of the electronic component and on the rubber-elastic elevations, the conduction paths on the slopes of the elevations, the contact spots on the tips of the elevations and the conductor tracks on the surface of the electronic component simultaneously getting produced.
• it is initially intended to open a closed metal layer. bring what is possible by sputtering metal layers such as copper-nickel or gold or their alloys or can be achieved by electroplating or by vapor deposition of these metals.
• a closed photoresist layer is then also applied, it being difficult to apply a uniformly thin or thick layer of lacquer both on the flat or flat upper side of the electronic component and on the dome-like bulges of the elevations.
• a particularly favorable method here is spraying or electrodeposition, in which a special photoresist can be deposited evenly from an organometallic solution under current.
• the exposure of the photoresist is also difficult due to the large differences in the surface level, especially since a high depth of field must be achieved, both in the area of the contact spots on the elevations and in the area of the conduction paths on the slope side of the elevation and then on the lower level
• the top of the electronic component to allow a sharp imaging and exposure.
• projection exposure is carried out using parallel light beams, and then the photoresist is developed and the structure is cured to form a photoresist mask.
• the metal layer can then be structured through the photoresist mask by dry or wet etching.
• the photoresist mask is removed and the desired metal layer structure remains, which has contact spots on the top of the elevation, conductor tracks on the slope side of the elevations and connecting lines on the top of the electronic component.
• nucleation can first take place on the insulating layer of the elevations and the insulating layer on the top side of the semiconductor component. Only then is metallization carried out in this area in order to increase the adhesion of the conduction paths and the contact patch to the rubber-elastic material of the rubber-elastic elevation.
• a laser treatment of the surface of the rubber-elastic elevation and optionally also of the insulating layer or by another suitable method can be used to roughen this surface, which offers better adhesion to the conductive material of the metallization to be applied later.
• metal nuclei or other suitable nuclei which can be made of any suitable material, such as palladium, are applied to the rough surface before the metallization and after the surface roughening. Palladium can be deposited inexpensively on electrically insulating materials and forms cubic seed crystals that anchor themselves excellently in the insulating material and thus improve adhesion for the conductor path or the conductor tracks.
• the method described above for producing a metal layer structure can also be significantly improved if a method for the metal layer structure is used which works with an inkjet printing technique, wherein a metal layer structuring can be achieved by means of an organometallic solution as ink and subsequent evaporation of the solvent during an annealing process Without any masking technique, simply programming the inkjet printing process can achieve a metal structure on uneven surfaces such as the present rubber-elastic elevations.
• At least one electronic component according to the invention is bonded to a circuit board by means of an adhesive that shrinks during curing.
• the shrinking adhesive makes electrical contact between the rubber-elastic bump and its contact pad and an electrical contact pad on the circuit board, so that a rubber-elastic pressure contact occurs.
• the adhesive is applied to the circuit board in the form of individual adhesive bumps. Then the electronic component with its electrical contact pads is aligned with the electrical contact connection areas of the circuit board and pressed onto the circuit board, so that the electrical contact pads on the tips of the rubber-elastic bumps contact the contact areas of the circuit board while the adhesive shrinks as it cures.
• This method has the advantage that contacting and placement on a circuit board can be carried out at an extremely low curing temperature.
• the adhesive is applied in the form of a surface-covering drop on the top of the circuit board and the electronic component with its rubber-elastic-supported contact patches is then pressed onto the contact connection surfaces until the adhesive has cured and shrunk. Since temperatures in the range of 120 to 160 ° C are provided for the curing of the adhesive, it is also possible to provide the contact patches or the contact connection areas of the circuit board with a solderable layer before pressing the electronic component and at the same time pressing and curing the Shrink adhesive to produce a soft solder connection between the contact pads of the electronic component and the contact pads of the circuit board.
• the assembly of CSP, especially of geometrically large chips, on the board (or the circuit board) is difficult due to the different linear expansion coefficients of Si and laminate.
• the invention advantageously overcomes the thermal mismatch in the CSP housing.
• contacting can be achieved by pressing, which is also possible for a large number of contacts and very large chips.
• This pressing process can be achieved by gluing the chip onto the board selectively with an adhesive which shrinks during curing and thus moves the chip and board towards one another.
• the present invention facilitates the use of the CSP with interconnect elements that are elastic in all three directions.
• the use of shrinking glue ensures a safe electrical contact between the chip and the board, especially for large chips and high pin numbers.
• Figure 1 shows a perspective view of an embodiment of the invention with partial cross-section
• Figure 2 shows a perspective view of part of an electronic component according to a further embodiment of the invention
• Figure 3 shows a schematic cross-sectional view of the starting material for the present invention
• Figure 4 shows a schematic Cross-sectional view through a rubber-elastic elevation of an embodiment of the invention
• FIG. 5 shows a schematic cross section through a metal-coated, rubber-elastic elevation
• FIG. 6 shows a schematic cross-sectional view through several rubber-elastic elevations on a rubber-like base
• FIG. 7 shows a cross-sectional view of an overall view of a component according to a further embodiment of the invention.
• FIG. 8 shows a cross-sectional view of a section of a semiconductor chip after an insulating layer has been printed on
• FIG. 9 shows the semiconductor chip according to FIG. 2 after printing on a rubber-elastic elevation
• FIG. 10 shows the semiconductor chip according to FIG. 9 after the application of a first metallization
• FIG. 11 shows the semiconductor chip according to FIG. 9 after the application of a second metallization
• FIG. 12 shows the semiconductor chip according to FIG. 10 after a solder ball has been applied to the contact pad
• FIG. 13 shows a cross-sectional view of a further embodiment of a line path
• FIG. 14 shows a schematic cross-sectional view of a further embodiment of the invention.
• FIG. 15 shows a schematic cross-sectional view of a multilayer circuit board with an electronic component soldered on
• FIG. 16 shows a cross-sectional view of a multilayer circuit board with adhesive bumps
• FIG. 17 shows the multilayer circuit board from FIG. 16 together with an electronic component
• FIG. 18 shows a final assembled electronic component of a further embodiment of the invention on a circuit board
• FIG. 19 shows a schematic cross-sectional view of a multi-layer circuit board with a spread drop of shrinkable adhesive
• FIG. 20 shows a schematic cross-sectional view of a multilayer circuit board with an applied and aligned electronic component
• FIG. 21 shows a schematic cross-sectional view of a multi-layer circuit board with a pressed-on electronic component during the curing of the adhesive.
• FIG. 1 shows a perspective view of an embodiment of the invention with a partial cross section.
• a section of a surface 13 of an electronic component 2 is shown, the cross section arranged underneath essentially showing a semiconductor chip 6 with an insulating coating 7.
• Elevation 3 arranged, which is dome-like over the surface
• a contact pad 16 made of a metal is arranged at a height h from the surface 13 and forms an electrical contact 1 of the electronic component 2 on the dome 14 of the rubber-elastic elevation 3.
• a conduction path 8 is arranged, which can extend in a width of up to 150 ⁇ m over the slope side 15 of the rubber-elastic elevation 3. Due to the gentle curvatures 22 of the rubber elastic Exercise 3, when the rubber-elastic elevation 3 is compressed or moved, the material of the conduction path 8 is only loaded in a spring-elastic manner and is therefore protected against micro-cracking.
• the height h of the rubber-elastic elevation 3 is between 60 and 300 ⁇ m in this embodiment.
• the base area of the rubber-elastic elevation 3 has a diameter of over 150 ⁇ m to 500 ⁇ m.
• the width of the line path is between 30 ⁇ m and 150 ⁇ m.
• Components 2 which are equipped with the rubber-elastic elevations 3 according to the invention as external contacts and have a relatively large semiconductor chip 6, for example with an edge length of 20 mm, can with temperature test cycles between -40 ° C and + 160 ° C a relative shift compared to a circuit board of over 30 microns are exposed in the horizontal direction without breaking the electrical connection.
• the rubber-elastic elevation 3 can still compensate for height differences in the vertical direction up to 150 ⁇ m.
• secure electrical connections are created simultaneously for up to 2000 electronic components 2, each with 50 to 100 external contacts on rubber-elastic elevations 3 of a semiconductor wafer, simply by pressing the contact pads 16 of the elevation onto contact connection areas of a test board.
• the rubber-elastic elevations 3 not only compensate for warping of the test board of +/- 10 ⁇ m and the semiconductor wafer, but also height differences between the elevations of up to +/- 10%. Due to the high elasticity of the rubber Surveys 3 of 50% can completely compensate for these differences in the vertical direction.
• FIG. 2 shows a perspective view of part of an electronic component 2 according to a further embodiment of the invention.
• Components with the same functions as in FIG. 1 are identified by the same reference numerals and are not specifically explained.
• a plurality of rubber-elastic elevations 3 with contact pads 16 can be arranged on their tips 14 and conduction paths 8 on their slopes 15.
• Metallic conductor tracks 4 run between the rubber-elastic insulating bumps 3 on the upper side 13 of the insulating layer 7 and lead to corresponding contact spots (not shown) in a bond channel of the semiconductor chip 6.
• the insulating layer 7 is therefore also called the rewiring layer and the conductor tracks 4 represent the rewiring lines.
• FIGS. 3 to 5 represent the method steps for producing such an electronic component 2.
• Figure 3 shows a schematic cross-sectional view of the starting material for the present invention. Components with the same functions as in the previous figures are identified by the same reference numerals and are not specifically explained.
• the starting material for the present invention is a semiconductor chip 6 with contact areas 19 of an integrated circuit, not shown, on the active upper side 24 of the semiconductor chip, which lies opposite the passive rear side 25.
• An insulating layer 7 is arranged on the semiconductor chip 6, with a surface 13 leaving a bond channel 26 free, which allows access to the contact areas 19 of the semiconductor chip 6.
• Figure 4 shows a schematic cross-sectional view through a rubber-elastic elevation 3 of an embodiment of the invention. Components with the same functions as in the previous figures are identified with the same reference numerals and are not specifically explained.
• a silicone-based material was used as the rubber-elastic elastomer, which is applied to the surface 13 of the insulating layer 7 via a perforated template.
• the template itself consists of a perforated metal foil.
• FIG. 5 shows a schematic cross-sectional view through a metal-coated, rubber-elastic elevation 3.
• a metal layer structure is applied to the surface 13 of the insulating layer and to the surface of the rubber-elastic elevation 3 and in the bonding channel 26, which essentially consists of a contact spot 16 on the tip of the rubber-elastic elevation 3, a conduction path 8 on the slope side 15 of the rubber-elastic heir - Exercise 3 and a conductor track 4, which connects the contact pad 16 with the contact surface 19 on the semiconductor chip 6 in the bond channel 26.
• the electronic component 2 is essentially finished by the application of this metal structure. provides, however, the entire component can be provided with the contact of the rubber-elastic elevation 3 with their contact spot 16 on the top of the elevation 3 with a protective layer, not shown, made of insulating material.
• the metal structure is produced with the aid of metallization of the entire surface, this metallization then being structured by means of a photolithography process.
• This photolithography process solves two problems, namely, on the one hand, to apply a uniformly thick layer of photoresist to the metal coating on a non-flat surface, which is predetermined by the bulging elevations. While the metal coating can be applied with a relatively uniform thickness by sputtering, this photoresist layer can be electrodeposited in a metal-organic solution either by spraying or by electrodeposition. In both cases, the coating thickness of the photoresist is relatively uniform.
• the second problem is an exposure of such an uneven surface, wherein a uniform sharpness of the image can be achieved both on the tip of the rubber-elastic elevation 3 and on the level of the insulating layer 7. This problem is solved by projection exposure.
• the problem of applying a precise metal layer structure to an uneven surface is achieved in a further exemplary embodiment of the method in FIG. 5 by printing the metal layer structure 27.
• the considerable differences in height h ie the large unevenness of the surface to be printed on, are an obstacle.
• This problem is overcome by an inkjet printing the metal layer structure with an ink composed of an organometallic solution. After printing, the solvent is evaporated by a corresponding tempering process to form a metal layer structure.
• FIG. 6 shows a schematic cross-sectional view through several rubber-elastic elevations 3 on a rubber-elastic base 17.
• the production method of this electronic component 2 can be produced with the same steps as shown in FIGS. 3 to 5, except that before the rubber-elastic elevations 3 are applied, an intermediate step for the production of flat bases 17 made of rubber-elastic material is carried out first.
• a stencil printing can be carried out with correspondingly larger openings in the template, so that a plurality of rubber-elastic elevations can subsequently be applied to the base 17.
• the height hi of the rubber-elastic base is between 30 and 50 ⁇ m, while the height h 2 corresponds to the height h of the rubber-elastic elevation in FIGS. 4 and 5.
• FIG. 7 schematically shows an overall cross section of an electronic component 2 of a further embodiment of the invention, in which case the rubber-elastic elevations 3 are shown at the edge of the electronic component 2 and the conductor tracks 4 to the corresponding contact areas 19 of an electronic circuit (not shown) in the semiconductor chip 6 lead. Further surveys not shown here gene can be arranged distributed over the entire surface 13. Conduction paths 8 connect the conductor tracks 4 on the surface 13 with electrical contact spots 16 on the tips 14 of the elevations 3, which carry contact balls 5. These contact balls 5 can be gold-plated in order to ensure oxidation-free contact with contact pads 12 of a circuit board.
• an electrical connection between this circuit of the component 2 and the wiring on the circuit board 10 is achieved by an oxidation-free flexible pressure contact, so that no environmentally harmful solder is used.
• the rubber-elastic elevations 3 it is also possible for the rubber-elastic elevations 3 to carry a solder ball 5, so that a soldered connection with a circuit board is made possible and the elastic elevations 3 not only compensate for the unevenness of the component 2 and the board, but also reduce thermal stresses, that occur due to different expansion coefficients of component 2 and board 10.
• FIGS. 8 to 13 exemplarily explain the manufacture of an electronic component 2 which has a rubber-elastic elevation 3 according to the invention.
• an insulating layer 7, which at least partially covers a first surface of the semiconductor chip 6, is first applied to a semiconductor chip 6, which is shown in cross section in FIG. 2.
• This insulating layer 7 can be applied and structured using different methods.
• a printing method in particular a screen printing method, is used which can be carried out simply and inexpensively.
• a rubber-elastic elevation 3 is then applied to the semiconductor chip 6 in the region of its surface 13, it being possible for the rubber-elastic elevation 3 to be arranged on or next to the insulating layer.
• the surface of the flexible elevation 3 and the insulating layer 7 can be roughened with the aid of a laser in those areas in which conductor paths 8 and conductor tracks 4 are to be formed in a later step. This is indicated by the vertical arrows in Figure 3.
• the rough surface ensures in particular better adhesion of the conductive material of the conductor paths 8 and conductor tracks 4 to the respective surfaces.
• FIG. 10 shows a cross section of a section of the semiconductor chip according to FIG. 9 after a structured metallization has been applied to the surface of the rubber-elastic elevation 3 and to the surface 13 of the insulating layer 7.
• FIG. 11 shows a cross section of a section of the semiconductor chip 6 according to FIG. 10 after application of a second metallization.
• This metallization will thus take place in two steps, a first basic metallization 4a and 8a being produced first, or germs 4a, 8a being deposited on the surface, each of which forms conductor tracks serve the insulating layer and a conduction path on the flexible elevation.
• the seeds can be made of any suitable material such as palladium.
• This is followed by a final metallization 4b and 8b, as shown in FIG. 11, for the final production of the conductor tracks 4 and conductor paths 8.
• This structured metallization already forms on the rubber-elastic elevation 3 an electrical contact pad 16, via which the electronic component 2 can be contacted.
• FIG. 12 shows a cross section of a section of the semiconductor chip 6 according to FIG. 10 after application of a solder ball 5 to the contact point, which forms an electrical contact pad 16.
• FIG. 13 shows a cross section of an alternative embodiment of the conductive connection to the contact point on the rubber-elastic elevation 3, here a line path 9 being guided through the rubber-elastic elevation 3.
• a line path 9 is formed in the interior of the rubber-elastic elevation 3 by laser structuring, starting from the surface of the rubber-elastic elevation 3 with a subsequent metallization.
• FIG. 14 shows a schematic cross-sectional view of a further embodiment of the invention.
• the rubber-elastic elevation 3 is formed from a simultaneously electrically conductive material and has a metallic contact spot 16 on its tip 14, which is electrically conductive conductive material of the rubber-elastic elevation 3 at the foot of the elevation 3 is connected to a conductor track 4 of the surface 13 of the electronic component.
• the rubber-elastic elevation also serves as a low-resistance resistor.
• FIG. 15 shows a schematic cross-sectional view of a multi-layer circuit board 10 with soldered electronic component 2.
• the multi-layer circuit board 10 has on its top 28 contact pads 12 which have a coating of soft solder.
• Components with the same functions as in the previous figures are identified by the same reference numerals and are not specifically explained.
• the electronic component 2 is soldered with its contact pads 16 onto the tips 14 of the rubber-elastic elevations 3 on the contact connection areas 12 of the circuit board 10 and, with its rubber-elastic elevations, can both thermal differences in the expansion of the circuit board 10 compared to the semiconductor chip 6, and also compensate for warpage of the surfaces 13 of the electronic component 2 with respect to the surface 28 of the circuit board 10.
• the height compensation between the two surfaces can require a rubber elasticity that is 1 ⁇ m on a centimeter and consequently can compensate for a distance difference between the two surfaces 13 and 28 of up to 30 ⁇ m in the case of a semiconductor wafer with semiconductor chips 6 with a diameter of 30 cm.
• the rubber-elastic extensibility of the rubber-elastic elevations 3 can be vertical
• the rubber-elastic material of the elevations 3 has one elasticity of 50%.
• the height h of the rubber-elastic elevations 3 is thus at least 60 ⁇ m.
• FIG. 16 shows a cross-sectional view of a multilayer circuit board 10 with adhesive bumps 11 and contact pads 12, which can be gold-plated to ensure an oxidation-free contact or which can be coated with solder if a solder connection is desired.
• FIG. 17 shows the application of an electronic component 2, as is shown in FIG. 7, but with four contact balls 5, which are applied to rubber-elastic elevations 3 and are connected to conductor tracks 4 of the electronic component 2 via conductor paths 8.
• the adhesive bumps 11 deform somewhat and shrink, as shown in FIG. 18, during curing, so that the electronic component 2 with its contact balls 5 onto the contact pads 12 of the circuit board 10 are pressed in the direction of arrow A, at the same time compressing the rubber-elastic elevation 3.
• both the contact balls 5 and the contact pads 12 are gold-plated with a gold alloy, the pressure in the direction of arrow A creates an oxidation-free ohmic contact between the components involved.
• the components are coated with solder, a solder connection can also be made at appropriate soldering temperatures.
• FIG. 18 shows a final assembled component 2 of a further embodiment of the invention on a circuit board 10. Bumps and warpage of the electronic component 2, which can be up to 10 ⁇ m per cm, and bumps the circuit board 10 can be compensated for stress-free by the flexible ridges 3.
• FIGS. 19 to 21 now show in detail the fastening of the electronic component 2 to the multilayer circuit board 10 prepared with a spread drop of shrinkable adhesive.
• FIG. 19 shows a schematic cross-sectional view of a multilayer circuit board 10 with a spread drop 21 of shrinkable adhesive.
• Components with the same functions as in the previous figures are identified by the same reference numerals and are not specifically explained.
• a large-area drop of shrinkable adhesive is spread on the upper side 28 of the multilayer circuit board 10 for placing an electronic component on a multilayer circuit board 10.
• FIG. 20 shows a schematic cross-sectional view of a multilayer circuit board 10 with an applied and aligned electronic component 2.
• the electronic component 2 differs from the electronic component which is shown in FIG. 15 in that in addition a protective layer 29 leaving the rubber-elastic elevations 3 free with their contact spots 16 on their tip 14 and the conductor paths 8 on the slope side 15 of the rubber-elastic Survey 3 is applied.
• a protective layer 29 leaving the rubber-elastic elevations 3 free with their contact spots 16 on their tip 14 and the conductor paths 8 on the slope side 15 of the rubber-elastic Survey 3 is applied.
• the contact pads 16 are immersed in the droplets 21 of shrinkable adhesive 21 spread on the circuit board 10, this is displaced by the contact connection areas 12 of the circuit board 10, so that a contact between contact pads 16 and contact connection areas 12 is created.
• This electrical contact is reinforced by the fact that, in the shrinking process of the adhesive, it presses the electronic component 2 onto the contact connection surfaces in the direction of arrow A.
• FIG. 21 shows a schematic cross-sectional view of a multilayer circuit board 10 with pressed-on electronic component 2 during the curing of the adhesive.
• Components with the same functions as in the previous figures are identified by the same reference numerals and are not specifically explained.
• the adhesive between the electronic component 2 and the circuit board 10 hardens, the latter shrinks and pulls the electronic component 2 with its rubber-elastic elevations and the contact pads 16 thereon onto the contact connection areas 12 of the circuit board 10 in the direction of arrow A.
• the protective layer 29 protects the electronic component 2 from influences and damage by the shrinkable adhesive during this process.
• the curing temperature of the shrinkable adhesive lies in a temperature range which at the same time permits soft soldering between the contact pads 16 of the electronic component and the contact connection areas 12 of the circuit board 10.

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• 2000
  • 2000-03-31 DE DE10016132A patent/DE10016132A1/de not_active Withdrawn
• 2001
  • 2001-03-29 EP EP01929274A patent/EP1279195A1/de not_active Withdrawn
  • 2001-03-29 JP JP2001573547A patent/JP2004509449A/ja active Pending
  • 2001-03-29 KR KR10-2002-7013023A patent/KR100527542B1/ko not_active IP Right Cessation
  • 2001-03-29 WO PCT/DE2001/001194 patent/WO2001075969A1/de active IP Right Grant
  • 2001-03-30 TW TW090107664A patent/TW529146B/zh not_active IP Right Cessation
• 2002
  • 2002-09-30 US US10/260,872 patent/US6897568B2/en not_active Expired - Fee Related
• 2004
  • 2004-10-12 US US10/963,434 patent/US7312533B2/en not_active Expired - Fee Related

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