DE69535936D1 - Verfahren zum Herstellen einer Halbleitervorrichtung mit Graben - Google Patents
Verfahren zum Herstellen einer Halbleitervorrichtung mit GrabenInfo
- Publication number
- DE69535936D1 DE69535936D1 DE69535936T DE69535936T DE69535936D1 DE 69535936 D1 DE69535936 D1 DE 69535936D1 DE 69535936 T DE69535936 T DE 69535936T DE 69535936 T DE69535936 T DE 69535936T DE 69535936 D1 DE69535936 D1 DE 69535936D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- semiconductor device
- trench semiconductor
- trench
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7816—Lateral DMOS transistors, i.e. LDMOS transistors
- H01L29/7824—Lateral DMOS transistors, i.e. LDMOS transistors with a substrate comprising an insulating layer, e.g. SOI-LDMOS transistors
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
- H01L21/76232—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials of trenches having a shape other than rectangular or V-shape, e.g. rounded corners, oblique or rounded trench walls
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- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
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- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/763—Polycrystalline semiconductor regions
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- H01L29/0692—Surface layout
- H01L29/0696—Surface layout of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
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- H01L29/42312—Gate electrodes for field effect devices
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- H01L29/66234—Bipolar junction transistors [BJT]
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- H01L29/66325—Bipolar junction transistors [BJT] controlled by field-effect, e.g. insulated gate bipolar transistors [IGBT]
- H01L29/66333—Vertical insulated gate bipolar transistors
- H01L29/66348—Vertical insulated gate bipolar transistors with a recessed gate
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- H01L29/66356—Gated diodes, e.g. field controlled diodes [FCD], static induction thyristors [SITh], field controlled thyristors [FCTh]
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/66363—Thyristors
- H01L29/66371—Thyristors structurally associated with another device, e.g. built-in diode
- H01L29/66378—Thyristors structurally associated with another device, e.g. built-in diode the other device being a controlling field-effect device
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66666—Vertical transistors
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66674—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/66712—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/66734—Vertical DMOS transistors, i.e. VDMOS transistors with a step of recessing the gate electrode, e.g. to form a trench gate electrode
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- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7391—Gated diode structures
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- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
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- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
- H01L29/7396—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions
- H01L29/7397—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions and a gate structure lying on a slanted or vertical surface or formed in a groove, e.g. trench gate IGBT
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
- H01L21/76286—Lateral isolation by refilling of trenches with polycristalline material
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- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42364—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity
- H01L29/42368—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity the thickness being non-uniform
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Element Separation (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Thyristors (AREA)
- Thin Film Transistor (AREA)
- Formation Of Insulating Films (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1255994 | 1994-02-04 | ||
JP00134795A JP3396553B2 (ja) | 1994-02-04 | 1995-01-09 | 半導体装置の製造方法及び半導体装置 |
Publications (1)
Publication Number | Publication Date |
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DE69535936D1 true DE69535936D1 (de) | 2009-05-28 |
Family
ID=26334557
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
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DE69536116T Expired - Lifetime DE69536116D1 (de) | 1994-02-04 | 1995-02-06 | Halbleiterbauelement mit Graben |
DE69535936T Expired - Lifetime DE69535936D1 (de) | 1994-02-04 | 1995-02-06 | Verfahren zum Herstellen einer Halbleitervorrichtung mit Graben |
DE69534955T Active DE69534955T8 (de) | 1994-02-04 | 1995-02-06 | Methode zur Herstellung von Gräben in einem Halbleiterbauelement |
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US (4) | US5783491A (de) |
EP (3) | EP1160872B1 (de) |
JP (1) | JP3396553B2 (de) |
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-
1995
- 1995-01-09 JP JP00134795A patent/JP3396553B2/ja not_active Expired - Lifetime
- 1995-02-02 US US08/382,581 patent/US5783491A/en not_active Expired - Lifetime
- 1995-02-04 KR KR1019950002004A patent/KR100188823B1/ko not_active IP Right Cessation
- 1995-02-06 DE DE69536116T patent/DE69536116D1/de not_active Expired - Lifetime
- 1995-02-06 EP EP01121361A patent/EP1160872B1/de not_active Expired - Lifetime
- 1995-02-06 DE DE69535936T patent/DE69535936D1/de not_active Expired - Lifetime
- 1995-02-06 EP EP01121360A patent/EP1160852B1/de not_active Expired - Lifetime
- 1995-02-06 EP EP95101591A patent/EP0666590B1/de not_active Expired - Lifetime
- 1995-02-06 DE DE69534955T patent/DE69534955T8/de active Active
-
1997
- 1997-12-22 US US08/996,041 patent/US6117734A/en not_active Expired - Lifetime
-
2000
- 2000-05-11 US US09/569,031 patent/US6710401B2/en not_active Expired - Fee Related
-
2003
- 2003-05-13 US US10/436,084 patent/US7067874B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1160852A3 (de) | 2007-05-30 |
US5783491A (en) | 1998-07-21 |
DE69534955D1 (de) | 2006-06-01 |
JPH07263692A (ja) | 1995-10-13 |
JP3396553B2 (ja) | 2003-04-14 |
EP1160872A3 (de) | 2007-06-20 |
US6117734A (en) | 2000-09-12 |
EP0666590A2 (de) | 1995-08-09 |
US6710401B2 (en) | 2004-03-23 |
EP0666590B1 (de) | 2006-04-26 |
EP1160852A2 (de) | 2001-12-05 |
US20030203573A1 (en) | 2003-10-30 |
DE69534955T8 (de) | 2007-09-13 |
DE69534955T2 (de) | 2007-04-12 |
EP1160852B1 (de) | 2009-04-15 |
US20010006836A1 (en) | 2001-07-05 |
EP0666590A3 (de) | 1996-05-08 |
US7067874B2 (en) | 2006-06-27 |
DE69536116D1 (de) | 2010-12-02 |
EP1160872B1 (de) | 2010-10-20 |
KR100188823B1 (ko) | 1999-06-01 |
EP1160872A2 (de) | 2001-12-05 |
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