DE602004028462D1 - Rfid-etikett und verfahren zu dessen herstellung - Google Patents

Rfid-etikett und verfahren zu dessen herstellung

Info

Publication number
DE602004028462D1
DE602004028462D1 DE602004028462T DE602004028462T DE602004028462D1 DE 602004028462 D1 DE602004028462 D1 DE 602004028462D1 DE 602004028462 T DE602004028462 T DE 602004028462T DE 602004028462 T DE602004028462 T DE 602004028462T DE 602004028462 D1 DE602004028462 D1 DE 602004028462D1
Authority
DE
Germany
Prior art keywords
production
rfid label
rfid
label
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004028462T
Other languages
English (en)
Inventor
Shunji Baba
Takashi Yamagajo
Toru Maniwa
Manabu Kai
Hiroyuki Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of DE602004028462D1 publication Critical patent/DE602004028462D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00Antennas with active circuits or circuit elements integrated within them or attached to them
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07771Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2216Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in interrogator/reader equipment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00011Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01078Platinum [Pt]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/15165Monolayer substrate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
DE602004028462T 2004-08-13 2004-12-10 Rfid-etikett und verfahren zu dessen herstellung Active DE602004028462D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004236155A JP4653440B2 (ja) 2004-08-13 2004-08-13 Rfidタグおよびその製造方法

Publications (1)

Publication Number Publication Date
DE602004028462D1 true DE602004028462D1 (de) 2010-09-16

Family

ID=35429235

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004028462T Active DE602004028462D1 (de) 2004-08-13 2004-12-10 Rfid-etikett und verfahren zu dessen herstellung

Country Status (7)

Country Link
US (2) US7342498B2 (de)
EP (3) EP2190060A3 (de)
JP (1) JP4653440B2 (de)
KR (1) KR100799140B1 (de)
CN (1) CN1734478A (de)
DE (1) DE602004028462D1 (de)
TW (1) TWI267788B (de)

Families Citing this family (188)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2005208313A1 (en) * 2004-01-22 2005-08-11 Mikoh Corporation A modular radio frequency identification tagging method
KR100952797B1 (ko) * 2004-12-14 2010-04-14 후지쯔 가부시끼가이샤 안테나 및 비접촉형 태그
WO2006072990A1 (ja) 2005-01-07 2006-07-13 Fujitsu Limited タグ装置、アンテナ及び携帯型カード
US7712674B1 (en) * 2005-02-22 2010-05-11 Eigent Technologies Llc RFID devices for verification of correctness, reliability, functionality and security
CN102270316B (zh) * 2005-03-31 2015-08-26 株式会社半导体能源研究所 无线芯片以及具有无线芯片的电子设备
JP4750455B2 (ja) * 2005-04-15 2011-08-17 富士通株式会社 Rfidタグセット、rfidタグ、およびrfidタグ部品
KR101293588B1 (ko) 2005-04-27 2013-08-13 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
TW200707301A (en) * 2005-05-25 2007-02-16 Ibm ID tag package and RFID system
US20070182559A1 (en) * 2005-09-15 2007-08-09 Zih Corp. Rfid antenna on multiple sides of 3-d packaging
US9361568B2 (en) 2005-12-09 2016-06-07 Tego, Inc. Radio frequency identification tag with hardened memory system
JP4815207B2 (ja) * 2005-12-13 2011-11-16 株式会社サトー Rfidラベル
US20070159340A1 (en) * 2006-01-09 2007-07-12 Yuen Foong Yu Paper Mfg. Co., Ltd. Structure and method for packaging radio frequency identification devices
US20070159337A1 (en) * 2006-01-12 2007-07-12 Sdgi Holdings, Inc. Modular RFID tag
US9130602B2 (en) 2006-01-18 2015-09-08 Qualcomm Incorporated Method and apparatus for delivering energy to an electrical or electronic device via a wireless link
US7519328B2 (en) 2006-01-19 2009-04-14 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
JP5034371B2 (ja) 2006-02-10 2012-09-26 富士通株式会社 Rfidタグの製造方法およびrfidタグ
JP4755921B2 (ja) * 2006-02-24 2011-08-24 富士通株式会社 Rfidタグ
EP1993170A4 (de) 2006-03-06 2011-11-16 Mitsubishi Electric Corp Rfid-etikett, verfahren zur herstellung des rfid-etiketts und verfahren zur anordnung des rfid-etiketts
KR100746635B1 (ko) 2006-03-21 2007-08-06 삼성전기주식회사 Rfid 시스템의 태그 및 그 제조 방법
JP4854362B2 (ja) 2006-03-30 2012-01-18 富士通株式会社 Rfidタグ及びその製造方法
US9064198B2 (en) 2006-04-26 2015-06-23 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
JP5123493B2 (ja) * 2006-05-30 2013-01-23 新光電気工業株式会社 配線基板及び半導体装置
JP4281850B2 (ja) 2006-06-30 2009-06-17 株式会社村田製作所 光ディスク
JP2008009881A (ja) 2006-06-30 2008-01-17 Fujitsu Ltd Rfidタグ製造方法およびrfidタグ
JP4855849B2 (ja) 2006-06-30 2012-01-18 富士通株式会社 Rfidタグの製造方法、およびrfidタグ
EP2041701B1 (de) 2006-07-13 2012-08-29 Confidex OY Hochfrequenz-identifikationsetikett
US7589419B2 (en) * 2006-08-07 2009-09-15 Rcd Technology, Inc. Side connectors for RFID chip
JP5057786B2 (ja) * 2006-08-09 2012-10-24 富士通株式会社 タグ
JP4627537B2 (ja) * 2006-09-04 2011-02-09 株式会社日立情報システムズ 小型金属rfidタグを内装する金属製rfidタグ
JP5006961B2 (ja) * 2006-09-04 2012-08-22 株式会社日立システムズ 小型金属rfidタグ
WO2008050535A1 (fr) 2006-09-26 2008-05-02 Murata Manufacturing Co., Ltd. Module couplé électromagnétiquement et article muni de celui-ci
CN101601054B (zh) * 2006-10-09 2011-12-14 Nxp股份有限公司 包括芯片和衬底的系统以及组装该系统的方法
WO2008105970A2 (en) * 2006-11-22 2008-09-04 Rsi Id Technologies Method and apparatus for rfid antennas
US20080122631A1 (en) * 2006-11-29 2008-05-29 Intermec Ip Corp. Multiple band / wide band radio frequency identification (rfid) tag, such as for use as a metal mount tag
CN101227202B (zh) * 2007-01-19 2011-07-27 鸿富锦精密工业(深圳)有限公司 电子装置
US20080197969A1 (en) * 2007-02-15 2008-08-21 Vogt Eric E Methods and systems for authenticating contents of a bottle
US9774086B2 (en) 2007-03-02 2017-09-26 Qualcomm Incorporated Wireless power apparatus and methods
US8235299B2 (en) 2007-07-04 2012-08-07 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
JP4930586B2 (ja) 2007-04-26 2012-05-16 株式会社村田製作所 無線icデバイス
EP2148449B1 (de) 2007-05-11 2012-12-12 Murata Manufacturing Co., Ltd. Drahtlose ic-vorrichtung
US9124120B2 (en) 2007-06-11 2015-09-01 Qualcomm Incorporated Wireless power system and proximity effects
JP4894923B2 (ja) 2007-06-29 2012-03-14 富士通株式会社 ループアンテナ
CN104078767B (zh) 2007-07-09 2015-12-09 株式会社村田制作所 无线ic器件
US20090015432A1 (en) * 2007-07-10 2009-01-15 Nathan Barsetti Remote Control System for Electronic Devices
WO2009011400A1 (ja) 2007-07-17 2009-01-22 Murata Manufacturing Co., Ltd. 無線icデバイス及び電子機器
JP4561932B2 (ja) * 2007-07-18 2010-10-13 株式会社村田製作所 無線icデバイス
WO2009011423A1 (ja) 2007-07-18 2009-01-22 Murata Manufacturing Co., Ltd. 無線icデバイス
TWI418089B (zh) * 2007-07-25 2013-12-01 Fujitsu Ltd 無線射頻識別標籤及其製造方法
WO2009013817A1 (ja) * 2007-07-25 2009-01-29 Fujitsu Limited 無線タグ
CN101842962B (zh) * 2007-08-09 2014-10-08 高通股份有限公司 增加谐振器的q因数
EP2180432B1 (de) * 2007-08-13 2016-09-14 Fujitsu Limited Funketikett und herstellungsprozess dafür
WO2009022921A1 (en) * 2007-08-16 2009-02-19 Times-7 Holdings Limited An rfid tag and a method of forming an rfid tag
JP4715823B2 (ja) * 2007-09-05 2011-07-06 三菱電機株式会社 Rfidタグ
TWI423519B (zh) 2007-09-04 2014-01-11 Mitsubishi Electric Corp Radio frequency identification tag
WO2009041497A1 (ja) * 2007-09-28 2009-04-02 Nec Corporation ループアンテナ
TW200919327A (en) * 2007-10-29 2009-05-01 China Steel Corp Three-dimensional wireless identification label adhered onto metal
US9300032B2 (en) * 2007-10-31 2016-03-29 Tyco Fire & Security Gmbh RFID antenna system and method
AU2013257441B2 (en) * 2007-10-31 2016-06-23 Sensormatic Electronics Llc RFID antenna system and method
US8098201B2 (en) * 2007-11-29 2012-01-17 Electronics & Telecommunications Research Institute Radio frequency identification tag and radio frequency identification tag antenna
KR101047189B1 (ko) 2007-12-20 2011-07-06 가부시키가이샤 무라타 세이사쿠쇼 무선 ic 디바이스
EP2717196B1 (de) 2007-12-26 2020-05-13 Murata Manufacturing Co., Ltd. Antennenvorrichtung und drahtlose ic-vorrichtung
US7982616B2 (en) 2008-02-14 2011-07-19 3M Innovative Properties Company Radio frequency identification (RFID) tag including a three-dimensional loop antenna
JP5267463B2 (ja) 2008-03-03 2013-08-21 株式会社村田製作所 無線icデバイス及び無線通信システム
JP2009227298A (ja) * 2008-03-21 2009-10-08 Fujitsu Ltd 梱包箱、梱包材、タグid読取方法、タグid送信プログラム
CN103729676B (zh) 2008-05-21 2017-04-12 株式会社村田制作所 无线ic器件
WO2009145007A1 (ja) 2008-05-26 2009-12-03 株式会社村田製作所 無線icデバイスシステム及び無線icデバイスの真贋判定方法
JP4535210B2 (ja) 2008-05-28 2010-09-01 株式会社村田製作所 無線icデバイス用部品および無線icデバイス
JPWO2009157081A1 (ja) * 2008-06-26 2011-12-01 富士通株式会社 Rfidタグ
EP2320519B1 (de) 2008-08-19 2017-04-12 Murata Manufacturing Co., Ltd. Drahtloses ic-element und herstellungsverfahren dafür
JP5146265B2 (ja) * 2008-11-04 2013-02-20 富士通株式会社 タグ用アンテナ及びそれを備えた無線タグ
JP5495096B2 (ja) * 2008-11-10 2014-05-21 株式会社リコー 粉体収納容器、粉体補給装置及び画像形成装置
CN104362424B (zh) 2008-11-17 2018-09-21 株式会社村田制作所 无线通信设备
CN102301445B (zh) * 2008-12-15 2014-06-04 斯马特拉克Ip有限公司 通过蚀刻来制造元件的方法
CN103500873B (zh) 2009-01-09 2016-08-31 株式会社村田制作所 无线ic器件及无线ic模块
TW201026573A (en) * 2009-01-13 2010-07-16 Taiwan Lamination Ind Inc Packaging material having radio frequency identification capability and its bag body structure thereof
DE112009003613B4 (de) 2009-01-16 2020-12-17 Murata Manufacturing Co., Ltd. Ic-bauelement
CN102301528B (zh) 2009-01-30 2015-01-28 株式会社村田制作所 天线及无线ic器件
US8384599B2 (en) * 2009-02-13 2013-02-26 William N. Carr Multiple-cavity antenna
CZ303918B6 (cs) * 2009-02-18 2013-06-26 Ceské vysoké ucení technické v Praze, Fakulta elektrotechnická Nízkoprofilová anténa
JP4796180B2 (ja) * 2009-02-23 2011-10-19 株式会社日立情報システムズ Rfidタグ
CN101814157B (zh) * 2009-02-23 2013-01-09 株式会社日立系统 Rfid标签
JP5510450B2 (ja) 2009-04-14 2014-06-04 株式会社村田製作所 無線icデバイス
WO2010122685A1 (ja) 2009-04-21 2010-10-28 株式会社村田製作所 アンテナ装置及びその共振周波数設定方法
CZ303919B6 (cs) * 2009-04-22 2013-06-26 Ceské vysoké ucení technické v Praze, Fakulta elektrotechnická Nízkoprofilová sterbinová anténa
EP2256673B1 (de) * 2009-05-29 2013-11-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. RFID-Transponder zur Montage auf Metall und Herstellungsverfahren für denselben
JP5447515B2 (ja) 2009-06-03 2014-03-19 株式会社村田製作所 無線icデバイス及びその製造方法
WO2010146944A1 (ja) 2009-06-19 2010-12-23 株式会社村田製作所 無線icデバイス及び給電回路と放射板との結合方法
JP4788850B2 (ja) 2009-07-03 2011-10-05 株式会社村田製作所 アンテナモジュール
FI20095965A0 (fi) * 2009-09-18 2009-09-18 Valtion Teknillinen Antennirakenne esimerkiksi RFID-transponderia varten
JP5182431B2 (ja) 2009-09-28 2013-04-17 株式会社村田製作所 無線icデバイスおよびそれを用いた環境状態検出方法
JP5201270B2 (ja) 2009-09-30 2013-06-05 株式会社村田製作所 回路基板及びその製造方法
JP5304580B2 (ja) 2009-10-02 2013-10-02 株式会社村田製作所 無線icデバイス
WO2011045970A1 (ja) 2009-10-16 2011-04-21 株式会社村田製作所 アンテナ及び無線icデバイス
WO2011052310A1 (ja) 2009-10-27 2011-05-05 株式会社村田製作所 送受信装置及び無線タグ読み取り装置
JP5327334B2 (ja) 2009-11-04 2013-10-30 株式会社村田製作所 通信端末及び情報処理システム
CN102473244B (zh) 2009-11-04 2014-10-08 株式会社村田制作所 无线ic标签、读写器及信息处理系统
WO2011055701A1 (ja) 2009-11-04 2011-05-12 株式会社村田製作所 通信端末及び情報処理システム
JP5526726B2 (ja) 2009-11-20 2014-06-18 富士通株式会社 無線タグ
WO2011062238A1 (ja) 2009-11-20 2011-05-26 株式会社村田製作所 アンテナ装置及び移動体通信端末
US20110145972A1 (en) * 2009-12-21 2011-06-23 Wallace Greene System for Social Interaction around a Personal Inspirational Message Selectively Hidden in a Display Article
GB2488450B (en) 2009-12-24 2014-08-20 Murata Manufacturing Co Antenna and mobile terminal
CN101728647A (zh) * 2010-01-20 2010-06-09 刘智佳 小型化射频识别标签及其中的微带贴片天线
US10977965B2 (en) 2010-01-29 2021-04-13 Avery Dennison Retail Information Services, Llc Smart sign box using electronic interactions
CN102725785B (zh) 2010-01-29 2015-03-25 艾利丹尼森公司 利用电子相互作用的智能标识箱
CN102792520B (zh) 2010-03-03 2017-08-25 株式会社村田制作所 无线通信模块以及无线通信设备
CN102782937B (zh) 2010-03-03 2016-02-17 株式会社村田制作所 无线通信器件及无线通信终端
WO2011111509A1 (ja) 2010-03-12 2011-09-15 株式会社村田製作所 無線通信デバイス及び金属製物品
WO2011118379A1 (ja) * 2010-03-24 2011-09-29 株式会社村田製作所 Rfidシステム
JP5521686B2 (ja) * 2010-03-25 2014-06-18 株式会社村田製作所 アンテナ装置及び無線通信デバイス
WO2011122163A1 (ja) 2010-03-31 2011-10-06 株式会社村田製作所 アンテナ装置及び無線通信デバイス
JP5299351B2 (ja) 2010-05-14 2013-09-25 株式会社村田製作所 無線icデバイス
JP5170156B2 (ja) 2010-05-14 2013-03-27 株式会社村田製作所 無線icデバイス
WO2011141860A1 (en) 2010-05-14 2011-11-17 Assa Abloy Ab Wideband uhf rfid tag
US20140258020A1 (en) * 2010-06-03 2014-09-11 Wallace Greene System for Social Interaction around a Personal Inspirational Message Selectively Hidden in a Display Article
WO2011155402A1 (ja) * 2010-06-09 2011-12-15 株式会社村田製作所 アンテナの製造方法、アンテナ及び無線icデバイスの製造方法
TWM394534U (en) * 2010-06-18 2010-12-11 zhi-xian Xu RFID directionless sensing smart card
JP5376060B2 (ja) 2010-07-08 2013-12-25 株式会社村田製作所 アンテナ及びrfidデバイス
JP5459126B2 (ja) * 2010-07-16 2014-04-02 富士通株式会社 アンテナシート、タグ及びタグ製造方法
WO2012014939A1 (ja) 2010-07-28 2012-02-02 株式会社村田製作所 アンテナ装置および通信端末機器
JP5423897B2 (ja) 2010-08-10 2014-02-19 株式会社村田製作所 プリント配線板及び無線通信システム
JP5234071B2 (ja) 2010-09-03 2013-07-10 株式会社村田製作所 Rficモジュール
WO2012043432A1 (ja) 2010-09-30 2012-04-05 株式会社村田製作所 無線icデバイス
JP5758909B2 (ja) 2010-10-12 2015-08-05 株式会社村田製作所 通信端末装置
WO2012053412A1 (ja) 2010-10-21 2012-04-26 株式会社村田製作所 通信端末装置
JP5510560B2 (ja) 2011-01-05 2014-06-04 株式会社村田製作所 無線通信デバイス
JP5304956B2 (ja) 2011-01-14 2013-10-02 株式会社村田製作所 Rfidチップパッケージ及びrfidタグ
CN103119786B (zh) 2011-02-28 2015-07-22 株式会社村田制作所 无线通信器件
WO2012121185A1 (ja) 2011-03-08 2012-09-13 株式会社村田製作所 アンテナ装置及び通信端末機器
WO2012137717A1 (ja) 2011-04-05 2012-10-11 株式会社村田製作所 無線通信デバイス
JP5482964B2 (ja) 2011-04-13 2014-05-07 株式会社村田製作所 無線icデバイス及び無線通信端末
US11948035B2 (en) 2011-05-06 2024-04-02 Neology, Inc. RFID switch tag
TWI464959B (zh) * 2011-05-06 2014-12-11 Htc Corp 無線通訊裝置
US10885418B2 (en) 2011-05-06 2021-01-05 Neology, Inc. Detachable radio frequency identification switch tag
WO2012157596A1 (ja) 2011-05-16 2012-11-22 株式会社村田製作所 無線icデバイス
JP2012252664A (ja) * 2011-06-07 2012-12-20 Murata Mfg Co Ltd 無線通信デバイス、その製造方法及び無線通信デバイス付き金属物品
WO2013008874A1 (ja) 2011-07-14 2013-01-17 株式会社村田製作所 無線通信デバイス
DE112012001977T5 (de) 2011-07-15 2014-02-20 Murata Manufacturing Co., Ltd. Funkkommunikationsvorrichtung
JP5660217B2 (ja) 2011-07-19 2015-01-28 株式会社村田製作所 アンテナ装置、rfidタグおよび通信端末装置
US8963794B2 (en) * 2011-08-23 2015-02-24 Apple Inc. Distributed loop antennas
US9858583B2 (en) 2011-09-01 2018-01-02 Avery Dennison Retail Information Services, Llc Apparatus, system and method for tracking consumer product interest using mobile devices
CN203553354U (zh) 2011-09-09 2014-04-16 株式会社村田制作所 天线装置及无线器件
US9178278B2 (en) * 2011-11-17 2015-11-03 Apple Inc. Distributed loop antennas with extended tails
JP5344108B1 (ja) 2011-12-01 2013-11-20 株式会社村田製作所 無線icデバイス及びその製造方法
DE102011120862A1 (de) * 2011-12-13 2013-06-13 Felix Schoeller Supply Chain Technologies Gmbh & Co. Kg Getränkekasten mit integrierter Transponderanordnung
JP5354137B1 (ja) 2012-01-30 2013-11-27 株式会社村田製作所 無線icデバイス
WO2013125610A1 (ja) 2012-02-24 2013-08-29 株式会社村田製作所 アンテナ装置および無線通信装置
JP5867591B2 (ja) * 2012-03-30 2016-02-24 富士通株式会社 Rfidタグ
WO2013145312A1 (ja) * 2012-03-30 2013-10-03 富士通株式会社 Rfidタグ
JP5304975B1 (ja) 2012-04-13 2013-10-02 株式会社村田製作所 Rfidタグの検査方法及び検査装置
US9734365B2 (en) * 2012-09-10 2017-08-15 Avery Dennison Retail Information Services, Llc Method for preventing unauthorized diversion of NFC tags
US10540527B2 (en) 2012-10-18 2020-01-21 Avery Dennison Retail Information Services Llc Method, system and apparatus for NFC security
CN103794866B (zh) * 2012-11-05 2016-07-06 宏碁股份有限公司 移动通信装置
US9202162B2 (en) 2012-11-09 2015-12-01 Maxim Integrated Products, Inc. Embedded radio frequency identification (RFID) package
CN110351693A (zh) 2012-11-19 2019-10-18 艾利丹尼森公司 禁用未经授权的nfc安全系统和方法
CN103922028B (zh) * 2013-01-11 2016-12-28 苏州数伦科技有限公司 一种包装瓶封口装置
CN103178342A (zh) * 2013-03-25 2013-06-26 浙江大学 小型抗金属rfid标签天线
JP6056978B2 (ja) 2013-08-15 2017-01-11 富士通株式会社 Rfidタグ及びその製造方法
EP3140785A4 (de) * 2014-05-08 2017-12-13 Tego Inc. Flexibles rfid-etikett zur montage auf einer metallfläche
US9953193B2 (en) 2014-09-30 2018-04-24 Tego, Inc. Operating systems for an RFID tag
BR112017020074B1 (pt) * 2015-04-08 2022-09-20 Saint-Gobain Glass France Vidraça de antena, vidraça compósita de antena, arranjo de vidraça de antena e método para produzir uma vidraça de antena
JP6809451B2 (ja) * 2015-04-21 2021-01-06 東洋製罐グループホールディングス株式会社 Rfタグ
ES2844849T3 (es) * 2015-06-02 2021-07-22 Toppan Printing Co Ltd Medio de información de tipo sin contacto
WO2016198914A1 (en) 2015-06-09 2016-12-15 Assa Abloy Ab Rifd tag with a tunable antenna
JP6288318B2 (ja) 2015-07-21 2018-03-07 株式会社村田製作所 無線通信デバイスおよびそれを備えた物品
DE112016004557B4 (de) * 2015-07-21 2023-03-02 Murata Manufacturing Co., Ltd. Drahtloskommunikationsbauelement und mit demselben ausgestatteter artikel
US10170825B2 (en) * 2015-09-11 2019-01-01 Fujikura Ltd. Antenna device
CN107078388B (zh) * 2015-09-11 2019-11-22 株式会社藤仓 天线装置
CN110431559B (zh) * 2016-09-09 2023-09-19 香港物流及供应链管理应用技术研发中心 射频通信设备及其使用方法
JP6776847B2 (ja) * 2016-11-24 2020-10-28 富士通株式会社 ループアンテナ及び電子機器
US9665821B1 (en) * 2016-12-19 2017-05-30 Antennasys, Inc. Long-range surface-insensitive passive RFID tag
TWI646469B (zh) * 2017-02-17 2019-01-01 創新聯合科技股份有限公司 長距離360度廣角無線射頻識別器
TWI631510B (zh) * 2017-06-06 2018-08-01 創新聯合科技股份有限公司 長距離無線識別牲畜耳標母扣結構
WO2018231853A1 (en) * 2017-06-12 2018-12-20 The Coca-Cola Company Low cost control pour
US11128052B2 (en) * 2017-06-12 2021-09-21 Fractal Antenna Systems, Inc. Parasitic antenna arrays incorporating fractal metamaterials
JP6919354B2 (ja) * 2017-06-15 2021-08-18 富士通株式会社 ループアンテナ及び電子機器
DE112018000098T5 (de) * 2017-06-30 2019-05-09 Murata Manufacturing Co., Ltd. Rfid-etikett, ein dieses umfassender artikel und ein verfahren zur herstellung von rfid-etiketten
US10296821B2 (en) 2017-08-17 2019-05-21 Assa Abloy Ab RFID devices and methods of making the same
WO2019065957A1 (ja) * 2017-09-29 2019-04-04 株式会社村田製作所 無線通信デバイス
DE102017123273A1 (de) * 2017-10-06 2019-04-11 Balluff Gmbh UHF-Datenträger und Verfahren zu seiner Herstellung
BR112020007472A2 (pt) * 2017-10-24 2020-10-27 Avery Dennison Retail Information Services Llc dispositivo condutivo plano que forma uma bobina para uma etiqueta de rfid quando dobrado
JP7014027B2 (ja) * 2018-04-18 2022-02-01 大日本印刷株式会社 Rfタグラベルおよびrfタグ構造体
CN211236956U (zh) * 2018-07-13 2020-08-11 株式会社村田制作所 无线通信器件
KR102212308B1 (ko) * 2019-04-10 2021-02-04 주식회사 디엔엑스 인체통신 사물부착 태그 장치
CN110084351B (zh) * 2019-04-17 2022-08-09 永道射频技术股份有限公司 一种用于抗金属介质的高频nfc标签
US11522267B2 (en) * 2019-10-28 2022-12-06 Battelle Energy Alliance, Llc Sensing units including a radio-frequency sensor, and related systems, devices, and methods
JPWO2021100315A1 (ja) * 2019-11-21 2021-12-09 株式会社フェニックスソリューション 耐熱icタグ
CN113178690B (zh) * 2021-04-20 2022-07-05 宿州学院 柔性天线模块、其封装结构及天线阵列
CN113919469A (zh) * 2021-09-09 2022-01-11 深圳市卓睿通信技术有限公司 一种立体nfc天线标签及其制造方法

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6045652A (en) * 1992-06-17 2000-04-04 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
US5779839A (en) * 1992-06-17 1998-07-14 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
WO1995001062A1 (en) * 1993-06-28 1995-01-05 Troyk Philip R Remote identification system for containers
JPH07176945A (ja) * 1993-12-21 1995-07-14 Matsushita Electric Works Ltd プリントアンテナ
US5682143A (en) * 1994-09-09 1997-10-28 International Business Machines Corporation Radio frequency identification tag
EP0704928A3 (de) * 1994-09-30 1998-08-05 HID Corporation HF Transpondersystem mit Parallelresonanz-Abfrage und Serienresonanz-Antwort
DE19534229A1 (de) 1995-09-15 1997-03-20 Licentia Gmbh Transponderanordnung
DE19730166A1 (de) * 1997-07-14 1999-01-21 Aeg Identifikationssys Gmbh Transponderanordnung und Verfahren zu deren Herstellung
JPH11134459A (ja) 1997-10-29 1999-05-21 Omron Corp 電磁波読取可能な柔軟性のある薄型icカード及びその製造方法
US6107920A (en) * 1998-06-09 2000-08-22 Motorola, Inc. Radio frequency identification tag having an article integrated antenna
JP2000057283A (ja) * 1998-08-04 2000-02-25 Sony Corp 記憶装置
DE69938929D1 (de) * 1998-09-11 2008-07-31 Motorola Inc Rfid-etikettenvorrichtung und verfahren
DE19983480T1 (de) * 1998-09-18 2001-11-29 Hitachi Maxell Halbleitervorrichtung zur kontaktlosen Kommunikation
US6100804A (en) * 1998-10-29 2000-08-08 Intecmec Ip Corp. Radio frequency identification system
JP2000332523A (ja) 1999-05-24 2000-11-30 Hitachi Ltd 無線タグ、その製造方法及びその配置方法
JP4111477B2 (ja) 1999-09-17 2008-07-02 新光電気工業株式会社 非接触型icカード用アンテナとその製造方法
JP2001143029A (ja) 1999-11-11 2001-05-25 Sony Corp Icカードの製造方法
JP4117443B2 (ja) * 2000-12-21 2008-07-16 三菱マテリアル株式会社 Rfid用アンテナコイルの製造方法
US6693541B2 (en) * 2001-07-19 2004-02-17 3M Innovative Properties Co RFID tag with bridge circuit assembly and methods of use
JP3953775B2 (ja) * 2001-10-26 2007-08-08 大日本印刷株式会社 非接触データキャリア用多面付け基材と多面付けされた非接触データキャリア
JP3908549B2 (ja) * 2002-01-31 2007-04-25 大日本印刷株式会社 Rfidタグの製造方法
JP3781109B2 (ja) * 2002-01-31 2006-05-31 三菱マテリアル株式会社 Rfid用トランスポンダのアンテナコイルの構造及び該アンテナコイルを用いた共振周波数の調整方法
JP2005520373A (ja) * 2002-02-04 2005-07-07 レイセオン カンパニー 商品識別用強化アンテナ
JP2003249814A (ja) * 2002-02-25 2003-09-05 Tecdia Kk 非接触rfidタグ用同調コンデンサ付きループアンテナ
JP2003331250A (ja) * 2002-03-05 2003-11-21 Mitsubishi Materials Corp Rfid付小円板
US20060086804A1 (en) 2002-04-01 2006-04-27 Toshiharu Takayama Communication device and package thereof
JP2003317052A (ja) * 2002-04-24 2003-11-07 Smart Card:Kk Icタグシステム
WO2003098544A1 (de) 2002-05-17 2003-11-27 Kaschke Kg Gmbh & Co. Räumlich allseitig wirksamer, mobiler transponder
JP3922969B2 (ja) * 2002-05-27 2007-05-30 株式会社東芝 アレーアンテナ装置及びこれを用いた無線通信装置
JP2004088583A (ja) * 2002-08-28 2004-03-18 Fuji Xerox Co Ltd 画像形成システムおよびその方法
JP4016261B2 (ja) * 2002-09-24 2007-12-05 三菱マテリアル株式会社 Rfid用トランスポンダ及び共振周波数の調整方法
EP1585191A4 (de) 2002-09-30 2007-03-14 Furukawa Electric Co Ltd Rifd-etikett und prozess zu seiner herstellung
JP3881949B2 (ja) * 2002-10-17 2007-02-14 東洋アルミニウム株式会社 アンテナ回路構成体およびそれを備えた機能カードならびにアンテナ回路構成体の製造方法
JP4367013B2 (ja) * 2002-10-28 2009-11-18 セイコーエプソン株式会社 非接触通信媒体
JP2004206479A (ja) * 2002-12-25 2004-07-22 Seiko Epson Corp 非接触タグ
JP2004215061A (ja) 2003-01-07 2004-07-29 Ngk Spark Plug Co Ltd 折り返しループアンテナ
GB0307501D0 (en) 2003-04-01 2003-05-07 Roke Manor Research Radio frequency identification tag
US7055754B2 (en) * 2003-11-03 2006-06-06 Avery Dennison Corporation Self-compensating antennas for substrates having differing dielectric constant values
JP2004313061A (ja) * 2003-04-15 2004-11-11 Katsuhiro Itasaka 撥水性砂利の製造方法及びその装置
JP4539038B2 (ja) * 2003-06-30 2010-09-08 ソニー株式会社 データ通信装置
FR2865329B1 (fr) 2004-01-19 2006-04-21 Pygmalyon Dispositif recepteur-emetteur passif alimente par une onde electromagnetique

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