CN1302542C - 模块部件 - Google Patents
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- H—ELECTRICITY
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- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
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- H01L2924/19041—Component type being a capacitor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H—ELECTRICITY
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- H—ELECTRICITY
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
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Abstract
提供一种具有充分的屏蔽效果以及高度降低的模块部件。电路基板(10)上安装有由电子部件形成的安装部件(30)、用密封体(40)密封该安装部件(30)。在该密封体(40)的表面上形成金属膜(20)。在电路基板(10)的表层面的外周边上形成接地图形(50),将所述金属膜(20)和接地图形(50)导电连接。
Description
技术领域
本发明涉及用于各种电子设备、通信设备的模块部件。
背景技术
传统的模块部件如图7所示,由至少在其一侧面上装载一个以上的安装部件23的电路基板21、设置在电路基板21的侧面上的接地电极24、和覆盖安装部件23的金属壳体22构成。如此,该金属壳体22的一端与接地电极24通过软钎料连接而构成电屏蔽。如上所述的模块部件,为了将金属壳体22和电路基板21的侧面通过软钎料进行连接,则就需要具有能够使金属壳体22自支承的电路基板21的厚度。此外,当装载在电路基板21上的安装部件23与金属壳体22接触时,就会发生短路或由于外部应力而造成的电路工作出现问题。为避免所述问题,需要使金属壳体22的高度大于安装部件23的高度。而且,在电路基板21和金属壳体22连接时,不应使金属壳体22和在电路基板21的表面上形成的电路图形和安装部件23接触。因此在电路基板21和金属壳体22之间设置有间隙。
将在金属壳体22上形成的端子与电路基板21的接地电极24连接。这样做的结果是难以进行部件的薄型化并且屏蔽效果不充分。
发明内容
鉴于所述问题,本发明的目的在于使模块部件的低高度化和充分的屏蔽效果得以实现。
本发明提供一种模块部件,它包括安装有由电子部件构成的安装部件的电路基板、具有和所述电路基板相同外形并用第一树脂密封该安装部件的密封体、以及覆盖该密封体的表面和所述电路基板的侧面的金属膜,其中,在所述电路基板的表层面的最外周上形成接地图形,并且使所述金属膜和所述接地图形的侧面端部导通。
此外,提供一种模块部件,它包括安装有由电子部件构成的安装部件的电路基板、具有和所述电路基板相同外形并用第一树脂密封该安装部件的密封体、以及覆盖该密封体的表面和所述电路基板的侧面的金属膜,其中,所述密封体具有与要求的电路块相对应的分割槽,在所述分割槽的底面和侧面中的至少一个中所述金属膜和所述电路基板的接地图形连接。
附图说明
图1是本发明的第一实施例的模块部件的透视图;
图2是本发明的第一实施例的模块部件沿A-A’的剖面图;
图3是本发明的第一实施例的模块部件的另一示例的剖面图;
图4是本发明的第二实施例的模块部件的透视图;
图5是本发明的第二实施例的模块部件沿A-A’的剖面图;
图6是本发明的第二实施例的模块部件的另一示例的剖面图;
图7是传统的模块部件的透视图。
具体实施方式
下面参照附图对本发明的实施例进行说明。
此外,附图作为示意图,并没有以恰当的尺寸表示各位置。
(第一实施例)
使用图1和图2对本发明的第一实施例的模块部件进行说明。电路基板10由多层衬底构成。
在该多层衬底中,经至少2层以上的布线层形成有电源、接地、高频等的电路图形。
在该电路基板10的表面上安装有电阻器、电容器、线圈、软半导体、晶体振荡器等的安装部件30。这些部件的连接通过使用无铅软钎料而进行。此外,也可以使用导电性粘接剂进行连接。可以使用公知的导电性粘接剂。在该电路基板10的背面上形成有用于和母基板(未示出)连接的电极11。将用于覆盖该安装部件30的由作为第1树脂的环氧类树脂形成的密封体40形成为和电路基板10具有相同的外形。此外,在该密封体40的表面和电路基板10的侧面上形成有金属膜20。该金属膜20与形成在电路基板10的表面的最外周的4侧边上的第1接地图形50相连接。通过该构成、电路基板10除了背面上的电极11以外全部由金属膜20覆盖。结果,可以获得可靠的屏蔽效果。如图2所示,可以使形成在电路基板10的表层上的接地图形50和金属膜20连接。如图3所示,还可以使形成在电路基板10的背面的外周部上的接地图形12的侧面端部和金属膜20连接。此外,当金属膜20的厚度为约1μm或1μm以上时就可以获得充分的屏蔽效果。该金属膜20通过在密封体40的表面上形成铜等的无电解镀层之后再在其表面上覆盖一电镀层而形成。如此可以将该金属膜20制成为致密的金属膜。结果,因为可以降低和接地图形50的接触电阻,所以可以通过稳定在密封体40上形成的金属膜20的接地电位而提高屏蔽效果。
如图2和3所示,构成为用金属膜20所覆盖的密封体40的投影面积和电路基板10的投影面积相等。
因为在密封体40和电路基板10之间没有台阶,所以可以使通过无电解镀和电镀所形成的金属膜20均匀地紧密接触。结果可以防止密封体40和接地图形50的剥离。如此,将在电路基板10上形成的接地图形50和形成在密封体40上的金属膜20连接。由此,可以可靠地屏蔽在电路基板10上所形成的由安装部件30所构成的电路。
(第二实施例)
在第二实施例的模块部件中,与第一实施例中相同构成的部件以相同的标号表示。
如图4所示,由金属膜20所覆盖的密封体40被由第二树脂所形成的密封体70分割成3个块。在如图5所示的电路基板10上,经至少2层以上的布线层形成有第一实施例中所述的电源、接地、高频等的电路图形。在电路基板10的表面的外周部上形成有第1接地图形50。此外,在该电路基板10的表面上安装有电阻器、电容器、线圈、半导体、晶体振荡器等的安装部件30。并形成用于覆盖该安装部件30的和电路基板10具有相同的外形的密封体40。此外,在密封体40上形成有用于分割成所希望的电路块的分割槽60。
在密封体40和分割槽60的表面上,将金属膜20形成为和接地图形50的表面连接。
此外,在形成在分割槽60中的金属膜20上,形成有由第2树脂所构成的密封体70。
如此设置将安装部件30分割成所要求的电路块的分割槽60,然后将这些用密封体40覆盖。在各电路块的表面上,设置金属膜20以与第1接地图形50相连接。如此可以在所要求的电路块之间进行电屏蔽。结果,由于在具有多个电路块的模块部件之间没有电噪声干扰,所以可以将模块部件小型化。此外,在分割槽60中形成有由第二树脂所形成的密封体70。结果,即使是通过降低高度而形成的厚度较薄的模块部件,也可以具有足够的弯曲强度以及保持较小的弯曲。而且,由于可以确保在金属膜20和接地图形50之间的连接可靠性,可以提高屏蔽性能。图6示出了其中金属膜20构成为和形成于电路基板10内部的接地图形连接的示例。在该情况下,可以屏蔽在电路基板10内部形成的电路图形的一部分。结果与图5的示例相比可以进一步提高屏蔽效果。
此外,由第三树脂所形成的密封体13设置在电路基板10和由电子元件所构成的安装部件30之间的间隙中。如此,通过排除存在于所述间隙中的空气,可以进一步地提高可靠性。
而且,本发明的由第一树脂、第二树脂、第三树脂所形成的各密封体可以相同也可以不同。作为其组成,除了环氧类的树脂以外,还可以使用包含有各种无机填料的绝缘树脂组成物。特别优选的是具有良好的耐热性以及良好的热传导性的树脂组成物。例如,可以是在硅树脂中包含氧化铝粒子的组成物。
如上所述的本发明提供了一种在电路基板上安装有由电子部件构成的安装部件、用树脂密封该安装部件的密封体、并且用金属膜覆盖该密封体的表面的模块部件,其中,在电路基板的表面的外周上形成接地图形、并且将所述金属膜和接地图形导电连接。
通过该构成,可以提供可提高屏蔽效果以及可以小型化的模块部件。
Claims (10)
1.一种模块部件,包括安装有由电子部件构成的安装部件的电路基板、具有和所述电路基板相同外形用第一树脂密封该安装部件的密封体、以及覆盖该密封体的表面和所述电路基板的侧面的金属膜,在所述电路基板的表层面的最外周上形成有接地图形,并且将所述金属膜和所述接地图形的侧面端部导电连接。
2.根据权利要求1所述的模块部件,其特征在于,在所述电路基板的外部连接面侧的最外周上形成有所述接地图形,所述金属膜和所述接地图形的侧面端部导电连接。
3.根据权利要求1所述的模块部件,其特征在于,所述金属膜具有在所述密封体上形成无电解镀层之后再在该无电解镀层上形成电镀层的结构。
4.根据权利要求1所述的模块部件,其特征在于,所述电路基板和由电子部件形成的所述安装部件通过无铅软钎料而连接。
5.根据权利要求1所述的模块部件,其特征在于,所述电路基板和由电子部件构成的所述安装部件通过导电性粘接剂而连接。
6.根据权利要求1所述的模块部件,其特征在于,所述电路基板和由电子部件构成的所述安装部件之间的间隙用第三树脂密封。
7.一种模块部件,包括安装有由电子部件构成的安装部件的电路基板、具有和所述电路基板相同外形用第一树脂密封该安装部件的密封体、以及覆盖该密封体的表面和所述电路基板的侧面的金属膜,所述密封体具有用于分割成期望的电路块的分割槽,以所述分割槽的底面和侧面中的至少一方使所述金属膜和所述电路基板的接地图形连接。
8.根据权利要求7所述的模块部件,其特征在于,所述电路块间电屏蔽。
9.根据权利要求7所述的模块部件,其特征在于,具有将所述分割槽用第二树脂密封的结构。
10.根据权利要求7所述的模块部件,其特征在于,所述金属膜具有在所述密封体上形成无电解镀层之后再在该无电解镀层上形成电镀层的结构。
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JP2002250900A JP4178880B2 (ja) | 2002-08-29 | 2002-08-29 | モジュール部品 |
JP250900/2002 | 2002-08-29 |
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CN1302542C true CN1302542C (zh) | 2007-02-28 |
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US (1) | US7180012B2 (zh) |
EP (1) | EP1450400A4 (zh) |
JP (1) | JP4178880B2 (zh) |
CN (1) | CN1302542C (zh) |
WO (1) | WO2004021435A1 (zh) |
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JP2004095607A (ja) | 2004-03-25 |
WO2004021435A1 (ja) | 2004-03-11 |
EP1450400A1 (en) | 2004-08-25 |
US20040252475A1 (en) | 2004-12-16 |
US7180012B2 (en) | 2007-02-20 |
EP1450400A4 (en) | 2005-08-17 |
CN1592966A (zh) | 2005-03-09 |
JP4178880B2 (ja) | 2008-11-12 |
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