CN105793795A - 显示模块和系统应用 - Google Patents
显示模块和系统应用 Download PDFInfo
- Publication number
- CN105793795A CN105793795A CN201480065436.7A CN201480065436A CN105793795A CN 105793795 A CN105793795 A CN 105793795A CN 201480065436 A CN201480065436 A CN 201480065436A CN 105793795 A CN105793795 A CN 105793795A
- Authority
- CN
- China
- Prior art keywords
- display
- base plate
- display module
- viewing area
- display base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- H05K1/115—Via connections; Lands around holes or via connections
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Abstract
本发明描述了一种显示模块(201)和包括显示模块的系统应用。显示模块可包括显示基板(202),该显示基板包括前表面(203)、后表面(205)和位于前表面上的显示区域(201)。多个互连件(204,206)从前表面延伸穿过显示基板至后表面。发光二极管(LED)阵列(214)位于显示区域中并与多个互连件电连接,并且一个或多个驱动电路(230,234)位于显示基板的后表面上。示例性系统应用包括可穿戴、可卷曲并且可折叠的显示器。
Description
背景技术
技术领域
本发明涉及显示模块。更具体地,本发明的实施方案涉及显示模块封装及其系统应用。
背景信息
发光二极管(LED)正日益被视为现有光源的替代技术。例如,LED存在于标记、交通信号、汽车尾灯、移动电子显示器和电视机中。一些具体的移动电子产品为智能电子设备,诸如智能电话、智能手表等,它们包括比功能手机或手表更先进的计算能力。对更薄、重量更轻并且成本更低又具有更高分辨率和更大触摸屏的智能电子设备的需求正在增加。有机发光二极管(OLED)显示器和液晶显示器(LCD)是在当前智能电子设备中的两种最广泛采用的显示技术。
OLED技术一般包括像素区域中的有机化合物层和薄膜晶体管(TFT)背板以开关每个单个像素。OLED显示器在没有背光源的情况下工作并且可显示深黑水平。有机化合物层对空气和水分敏感,从而可导致显示器的劣化。OLED显示器通常用刚性玻璃盖包封以使有机化合物免于接触空气和水分。
LCD技术一般包括填充有液晶的像素和薄膜晶体管(TFT)背板以开关每个单个像素。由于液晶自身不产生光,因此他们需要来自显示面板后面或侧面的背光照明。
用于基于OLED或LCD封装显示模块的两种广泛采用的方式包括玻璃覆晶(COG)封装和薄膜覆晶(COF)封装。图1A-1B为COG封装的显示模块的示例性横截面侧视示意图和前视示意图。如图所示,显示模块100包括由柔性印刷电路(FPC)108连接至印刷电路板(PCB)106的显示面板115。显示面板115包括由OLED或LCD显示技术形成的显示基板102、安装在显示基板102上的一个或多个驱动IC110和位于显示基板上的覆盖件114。密封环113可围绕显示基板的显示区域101用于附接覆盖件114并封闭显示区域101免于接触空气和水分。在智能电子设备中,显示基板102还可包括在显示区域101内的触摸屏。另选地,触摸屏可在显示基板102上方形成。就LCD显示技术而言,背光源105被定位在显示基板后面。
用于操作显示模块100的附加器件和IC芯片104脱离显示基板102被定位在PCB106上。例如,IC芯片104可包括功率管理IC、处理器、定时控制器、触摸感测IC、无线控制器、通信IC等。如图所示,PCB106利用FPC108通过FPC108的键合到显示基板102和PCB106的表面的接触区域107连接至显示基板102。参考图1A-1B,显示基板上针对一个或多个驱动IC110和接触区域107而保留的区域被称为接触凸部111。PCB106可从显示基板102侧向地延伸,或者另选地可被封装在所示的显示基板后面。如图1A-1B所示,FPC108的侧向延伸长度109可与显示模块的FPC108相关联,即便是PCB106被封装在显示基板102后面亦如此。电池112也可与PCB106一起被定位在显示基板后面。
COF封装类似于COG封装,存在一个主要不同之处在于一个或多个驱动IC110从显示基板102移动到FPC108上。在此类应用中,接触凸部可能需要比COG封装更小的空间。
发明内容
描述了显示模块封装及其系统应用。在一个实施方案中,显示模块包括具有前表面、后表面和位于前表面上的显示区域的显示基板。多个互连件从前表面延伸穿过显示基板至后表面,并且LED阵列位于显示区域中并且与多个互连件电连接。一个或多个驱动电路位于显示基板的前表面或后表面上。在一个实施方案中,多个互连件从前表面延伸穿过显示基板至显示区域的正后方的后表面,并且一个或多个驱动电路位于显示基板的后表面上。在一个实施方案中,柔性印刷电路不将一个或多个驱动电路连接至显示基板。
多个互连件可为从前表面延伸穿过显示基板至后表面的通孔。互连件可用于多种应用,例如接地孔。多种设备可被定位在显示基板的前表面或后表面上。例如,电池可被定位在显示基板的后表面上。在一个实施方案中,微型芯片阵列被定位在显示基板的前表面上并且位于显示区域内。微型芯片阵列可与多个互连件和LED阵列电连接。在一些实施方案中,微型芯片阵列与多个互连件重叠。在其他实施方案中,微型芯片阵列不与多个互连件重叠。在一个实施方案中,微型芯片阵列包括环境光传感器阵列。环境光传感器的均匀分布可被定位在微型芯片阵列中。
根据本发明的实施方案,显示模块可被结合到可穿戴电子设备例如智能手表中。在此类实施方案中,显示基板的显示区域跨越智能手表的表盘和表带。在另一个实施方案中,显示基板被固定到卷轴。在此类实施方案中,卷轴可包括与多个互连件电接触的一个或多个驱动电路。在一种应用中,显示模块可被结合到电视机中。
在一个实施方案中,一种非暂态计算机可读介质存储指令,该指令在被处理器执行时使得所述处理器执行用于调节可穿戴电子设备的显示区域的显示数据的操作。这些操作包括从控制设备接收输入,所述输入包括用于可穿戴电子设备的显示区域的数据。解析输入以获取用于显示的数据,并且在显示区域上显示所获取的数据,其中显示区域位于跨越可穿戴电子设备的面和带的柔性显示基板上。例如,可穿戴电子设备可为智能手表。在一个实施方案中,非暂态计算机可读介质存储用于执行附加操作的附加指令,这些附加指令包括接收表盘和表带的显示区域的配置,从所获取的数据接收设计,该设计包括表盘和表带,以及用所接收的设计更新显示区域。
在一个实施方案中,可穿戴电子设备的显示模块包括跨越可穿戴电子设备的面和带的柔性显示基板。附件管理器耦接至显示基板,以从通信地耦接到显示模块的控制设备接收输入。显示模块还包括图形用户界面(GUI)管理器,该GUI管理器用于控制显示在显示基板上的信息,其中该显示基板包括与可穿戴电子设备的面相关联的第一显示区域和与可穿戴电子设备的带相关联的第二显示区域。在一个实施方案中,GUI管理器进一步向第一显示区域提供表盘设计并向第二显示区域提供表带设计。在一个实施方案中,附件管理器进一步经由通信模块从控制设备接收输入数据,输入数据包括GUI管理器的配置数据。
附图说明
图1A为COG封装的显示模块的示意性横截面侧视图。
图1B为COG封装的显示模块的示意性前视图。
图2A为根据本发明的实施方案的包括多个互连件的显示基板的示意性横截面侧视图。
图2B为根据本发明的实施方案的包括多个通孔的显示基板的示意性横截面侧视图。
图3为根据本发明的实施方案的包括在显示基板的前表面上显示区域中的LED和微型芯片阵列的显示基板的示意性横截面侧视图。
图4为根据本发明的实施方案的包括在显示基板的位于显示区域的正后方的后表面上的一个或多个驱动电路的显示模块的示意性横截面侧视图。
图5A为根据本发明的实施方案的包括在显示区域中的LED和微型芯片阵列和位于显示区域的正下方的多个通孔的显示基板的示意性前视图,其中微型芯片阵列与多个通孔重叠。
图5B为根据本发明的实施方案的包括位于显示基板的后表面上的一个或多个驱动电路和位于显示区域的正后方的多个通孔的显示基板的示意性后视图。
图5C为根据本发明的实施方案的包括在显示区域中的LED和微型芯片阵列和位于显示区域的正下方的多个通孔的显示基板的示意性前视图,其中微型芯片阵列不与多个通孔重叠。
图5D为根据本发明的实施方案的包括位于显示区域中的LED和微型芯片阵列和位于显示区域之外的多个通孔的显示基板的示意性前视图。
图6A为根据本发明的实施方案的包括一个或多个通孔的TFT显示基板的示意性横截面侧视图。
图6B为根据本发明的实施方案的包括位于显示区域中的LED阵列和位于显示区域之外的一个或多个通孔的TFT显示基板和显示模块的示意性横截面侧视图。
图7A-7B为根据本发明的实施方案的包括与位于显示区域之外的一个或多个通孔接触的一个或多个驱动电路的TFT基板和显示模块的示意性前视图。
图8为根据本发明的实施方案的包括LED阵列和多个通孔的TFT显示基板和显示模块的示意性前视图。
图9为根据本发明的实施方案的包括显示面板的可穿戴电子设备的示意性前视图。
图10-12为根据本发明的实施方案的显示各种显示图像的可穿戴电子设备的透视图。
图13为根据本发明的实施方案的具有显示面板的可穿戴电子设备的系统示意图。
图14为根据本发明的实施方案的包括固定到卷轴的柔性显示面板的系统的示意性横截面侧视图。
图15为根据本发明的实施方案的包括在显示基板的前表面上显示区域中的LED和微型芯片阵列的柔性显示面板的示意性横截面侧视图。
图16为根据本发明的实施方案的包括暴露于不同程度的环境光线的微型芯片的两个区域的柔性显示面板的示意性前视图。
图17为根据本发明的实施方案的包括柔性显示面板的显示系统的系统示意图。
具体实施方式
本发明的实施方案描述了显示模块封装配置及其系统应用。在一个实施方案中,显示模块包括显示面板,该显示面板包括显示基板,该显示基板具有前表面、后表面和位于前表面上的显示区域。多个互连件从前表面延伸穿过显示基板至后表面,并且与位于显示基板的前表面上的LED阵列电连接。例如,每个互连件可以是单个通孔或穿过多个层的一系列互连线和互连孔。一个或多个驱动电路被定位在显示基板的前表面或后表面上并且与多个互连件电连接。在一个实施方案中,一个或多个驱动电路被定位在显示基板的后表面上。在一个实施方案中,一个或多个驱动电路被定位在显示基板的位于显示区域正后方的后表面上,该显示区域位于显示基板的前表面上。
在各种实施方案中,参照附图进行描述。然而,某些实施方案可在不存在这些具体细节中的一个或多个或者与其他已知方法和构型相结合的情况下实施。在以下的描述中,示出诸如特定构型、尺寸和工艺等许多具体细节以提供对本发明的透彻理解。在其他情况下,未对众所周知的半导体工艺和制造技术进行特别详细地描述,以免不必要地模糊本发明。整个说明书中所提到的“一个实施方案”是指,结合实施方案所描述的特定特征、结构、构型或特性包括在本发明的至少一个实施方案中。因此,整个说明书中多处出现短语“在一个实施方案中”不一定是指本发明的相同实施方案。此外,特定特征、结构、构型或特性可以任何适当的方式结合在一个或多个实施方案中。
本文所使用的术语“跨越”、“在...上方”、“到”、“在...之间”和“在...上”可指一层相对于其他层的相对位置。一层“跨越”另一层、在另一层“上方”或“上”或者键合“到”另一层或与另一层“接触”可为直接与其他层接触或可具有一个或多个居间层。一层在多层“之间”可为直接与该多层接触或可具有一个或多个居间层。
在一个方面,相比于COG显示模块封装配置和COF显示模块封装配置,本发明的实施方案允许在x-y方向和z方向以减小的形状因数制造显示面板和显示模块。在一个实施方案中,通过将一个或多个驱动电路连接至互连件例如通孔、从前表面延伸穿过显示基板至后表面,而不是利用FPC,x-y形状因数和z形状因数相比于COG显示模块封装配置和COF显示模块封装配置减小。此外,由于部件之间存在更短的互连件,因此根据本发明的实施方案的封装方法可提高系统性能。
在一个实施方案中,通过移除或减小在显示基板的显示区域侧上本将为一个或多个驱动IC110保留的接触凸部区域、FPC与显示基板的接触区域和/或在侧向定位到显示基板102或封装在显示基板周围或下方时与FPC相关联的侧向延伸长度,x-y形状因数(例如,长度-宽度)相比于COG显示模块封装配置和COF显示模块封装配置减小。根据本发明的实施方案,此类x-y形状因数的减小还可允许显示区域在显示基板上的分配增大。例如,COG封装可能需要至少4-5mm的接触凸部来分配驱动IC和FPC接触区域。根据本发明的实施方案,为驱动IC和FPC分配空间并非必需的。这样,围绕显示区域的倒角宽度可减小至1mm以下,例如小于0.5mm。
在一个实施方案中,通过移除FPC和PCB,z形状因数(例如,厚度)相比于COG显示模块封装配置和COF显示模块封装配置减小。根据本发明的实施方案,多个互连件例如通孔从前表面延伸穿过显示基板至后表面以连接驱动IC和任何附加IC芯片,这些芯片包括功率管理IC、处理器、定时控制器、触摸感测IC、无线控制器、通信IC等。这样,用于操作显示面板和模块的芯片和电路可被定位在显示基板的后表面上,消除了PCB的厚度。在许多实施方案中,驱动IC和附加IC芯片被定位在显示区域的正后方。
在一些实施方案中,显示面板包括显示区域中的多个基于半导体的LED。此类配置可允许使用本可能利用广泛采用的LCD或OLED显示技术存在问题的互连件或通孔。例如,利用在显示区域中包括液晶并且需要使用背光源的常规LCD技术,通孔和IC在显示基板的后表面上的布置可能特别成问题。利用现有的OLED显示技术,在该技术中通孔可能导致接触空气或水分,因此通孔也可能特别成问题。但应理解,本发明的实施方案可与OLED显示技术兼容。
在另一方面,本发明的实施方案描述了柔性显示面板到柔性显示模块中的可结合到多种应用中的封装配置。在一种应用中,本发明的实施方案描述了可穿戴电子设备,诸如包括柔性显示面板和柔性显示模块的智能手表。这样,智能手表的显示区域不限于刚性表盘区域。在一个实施方案中,智能手表包括集成到柔性表带中的柔性显示面板。因此,表盘区域和表带两者中柔性显示面板的弯曲度可调节以与用户的手腕尺寸相符。此外,无需包括附接至显示基板的显示区域侧的FPC。这样,柔性显示面板的显示区域可覆盖智能手表的表盘区域和表带上的更多可用空间。
可穿戴电子设备可包括非暂态计算机可读介质,该非暂态计算机可读介质包括用于从控制设备接收用户输入并且调节用于可穿戴电子设备的显示区域的显示数据的计算机代码。例如,在一种应用中,用户可选择特定手表设计来在智能手表的跨智能手表的表盘和表带的显示面板上显示。在接收到来自控制设备诸如计算机或者便携式电子设备诸如智能电话的用户输入时,对用于便携式电子设备的显示区域的显示数据进行调节。
在另一种应用中,柔性显示面板为可卷曲的。例如,显示面板可被结合到电视显示器中,该电视显示器可卷曲或折叠到外壳之中以及外壳之外。在一个实施方案中,柔性电视显示面板耦接至卷轴,显示面板可卷曲或折叠到该卷轴上。在一个实施方案中,驱动IC和/或任何附加IC芯片包括功率管理IC、处理器、定时控制器、触摸感测IC、无线控制器、通信IC等可通过柔性电视显示面板的后表面上的重新分布层重定位到卷轴上并与柔性电视显示面板电连接。另选地,驱动IC和任何附加IC芯片可被定位在显示面板的后表面上。在另一种应用中,柔性显示面板为可折叠的。例如,显示面板可被结合到智能电话或平板电脑中并折叠成各种构型。
图2A为根据本发明的实施方案的包括多个互连件的显示基板的示意性横截面侧视图。如图所示,显示基板202可包括前表面203、后表面205和位于前表面上的显示区域201。多个互连件204,206从前表面203延伸穿过显示基板至显示区域201正后方的后表面205。如图所示,每个互连件204,206可以是穿过多层显示基板202的多个层的一系列互连线207A和互连孔207B。参考图2B,每个互连件204,206可以是穿过显示基板202形成的单个通孔,该显示基板可以是单个显示基板或多层显示基板202。为了简洁,以下描述和附图指的是如通孔之类的互连特征部204,206。然而,应理解,此类构型参照一种实施方案并且在涉及通孔204,206时,这些构型可由包括穿过多层显示基板的多个层的一系列互连线和互连孔的互连件来代替。通孔204,206可使用包括但不限于化学蚀刻或激光钻孔的多种技术来形成。
显示基板202可由多种材料形成,这些材料包括玻璃、非晶硅、多晶硅、单晶硅、金属箔、电介质的金属箔或聚合物诸如聚(甲基丙烯酸甲酯)(PMMA)、聚对苯二甲酸乙二酯(PET)、聚萘二甲酸乙二醇酯(PEN)、聚碳酸酯(PC)、聚醚砜(PES)、含氟芳香族聚芳酯(PAR)、多环烯烃(PCO)和聚酰亚胺(PI)。在一个实施方案中,显示基板包括聚合硅堆。在一个实施方案中,显示基板202为柔性玻璃基板。例如,显示基板202可为柔性硼硅酸玻璃基板。一个示例性柔性玻璃基板由坐落在Corning,NewYork的CorningIncorporated以商品名WILLOW(TM)玻璃制造。
在例示的实施方案中,重新分布层208形成在显示基板的后表面205上。重新分布层可包括包含接线210A,210B的单个层或多个层。例如,接线210A可用于通过一个或多个通孔204与形成在显示基板202的顶表面203上的LED阵列电接触,而接线210B可用于与一个或多个通孔206的Vss连接。在一个实施方案中,一个或多个通孔204,206位于显示区域201的正后方。一个或多个通孔204,206也可被定位在显示区域201之外,诸如沿显示区域201的周边位于显示基板202的顶表面203上。
布线层212也可被定位在显示基板202的顶表面203上与多个通孔204电接触。布线层212,210A,210B和孔204,206可由用于封装应用包括金属膜、导电聚合物、导电氧化物等的任何合适导电材料形成。现在参见图3,根据本发明的实施方案,可将LED器件214和可选的微型芯片216阵列转移并键合到显示基板202。例如,LED器件214和微型芯片216阵列可与多个通孔204电连接。
根据本发明的实施方案,LED器件214为包括位于两个掺杂半导体覆层之间的一个或多个有源层(例如,量子阱层)的基于半导体的LED器件。在例示的具体实施方案中,LED器件214为各层水平位于其中并且各层垂直堆叠的垂直LED器件。顶部和底部导电接触部形成在垂直LED器件上以分别形成与布线层212和下文参照图4详述的顶部接触层220的电接触。在另一个实施方案中,LED器件214为水平LED器件,在该水平LED器件中,与掺杂覆层的接触部均形成在LED器件的底表面上以形成与布线层212的电接触。
根据本发明的实施方案,微型芯片216取代常规的有源矩阵显示器的TFT
层以切换并驱动一个或多个LED器件214。在一个实施方案中,每个微型芯片216与发出不同颜色光的一个或多个红光、绿光和蓝光led器件214耦接。在此类示例性红-绿-蓝(RGB)子像素布置方式中,每个像素包括发出红光、绿光和蓝光的三个子像素。RGB布置方式为示例性的并且实施方案并不限于此。例如,另选的子像素布置方式包括红-绿-蓝-黄(RGBY)、红-绿-蓝-黄-青(RBGYC)、红-绿-蓝-白(RGBW)或像素具有不同数量的子像素的其他子像素矩阵方案,诸如以商品名PenTile(RTM)制造的显示器。在以下描述中示出的示例性实施方案中,单个微型芯片216被描述为控制两个像素。应理解,该构型同样是示例性的并且实施方案并不限于此。例如,每个微型芯片216可切换并驱动以串联、并联或两者组合的方式布置的一个或多个LED器件214,使得多个LED器件从相同控制信号驱动。根据本发明的实施方案,可设想多种另选的构型。在其他实施方案中,传感器诸如触摸传感器或光传感器也可类似于微型芯片被定位在显示基板的位于显示区域内的前表面上。
在一个方面,本发明的实施方案描述了显示面板和显示模块封装配置,其中使用静电转移头部组件将微型LED器件和/或微型芯片转移并键合到接线212。根据本发明的实施方案,将吸合电压施加于静电转移头部以便在微型LED器件或微型芯片上生成抓持力。已注意到,在微型器件尺寸减小至真空吸盘设备的特定临界尺寸以下诸如约300μm或更小或者更具体地约100μm或更小的情况下,可能很难或不可能利用真空吸盘设备生成足以拾取微型器件的抓持力。此外,可使用根据本发明的实施方案的静电转移头部来创建比与真空吸盘设备相关联的1atm压力大很多的抓持力。例如,根据本发明的实施方案,可使用2atm或更大的抓持力,或甚至20atm或更大的抓持力。因此,在一个方面,本发明的实施方案提供了转移微型LED器件和微型芯片并将其集成到应用中的能力,其中该集成是不可能利用当前的真空吸盘设备来实现的。在一些实施方案中,术语“微型”芯片、“微型”LED器件或其他“微型”结构可指描述性尺寸,例如某些器件或结构的长度或宽度。在一些实施方案中,在许多应用中,“微型”芯片或“微型”LED器件可以在1μm到约300μm或更少或者100μm或更少的标度范围。然而,本发明的实施方案并不一定限于此,并且实施方案的某些方面可适用于更大的微型器件或结构和可能更小的尺度。
现在参见图4,在LED216和微型芯片216阵列转移和键合之后,可在LED216之间提供钝化层218并覆盖布线层212,之后沉积顶部接触层220。在一个实施方案中,顶部接触层220可以与例如可与一个或多个通孔206电连接的Vss线或Vss面电接触。另选地,Vss线或Vss面可被定位在显示基板202的顶表面203上。在顶部接触层220形成之后,可在显示基板上方形成封装层222。在一些实施方案中,封装层222可以是柔性封装层。
根据本发明的实施方案,钝化层218对可见波长可为透明的或半透明的以便不显著降低完整系统的取光效率。钝化层218可由多种材料形成,诸如但不限于环氧树脂、聚(甲基丙烯酸甲酯)(PMMA)、苯并环丁烯(BCB)和聚酰亚胺。在一个实施方案中,钝化层218通过围绕LED214喷墨形成。
根据特定的应用,顶部接触层220对可见波长可为不透明的、反光的、透明的或半透明的。例如,在顶部发光系统中,顶部接触层220可为透明的,并且对于底部发光系统,顶部导电接触部可为反光的。示例性透明的导电材料包括非晶硅、诸如铟锡氧化物(ITO)和铟锌氧化物(IZO)的透明导电氧化物(TCO)、碳纳米管膜、或诸如聚(3,4-亚乙二氧基噻吩)(PEDOT)、聚苯胺、聚乙炔、聚吡咯和聚噻吩的透明导电聚合物。在一个实施方案中,顶部导电接触层220为约50nm–1μm厚的ITO-银-ITO叠层。在一个实施方案中,顶部导电接触层220包括纳米粒子诸如银、金、铝、钼、钛、钨、ITO和IZO。在具体实施方案中,顶部导电接触部220通过喷墨形成。其他形成方法可包括化学气相沉积(CVD)、物理气相沉积(PVD)、旋涂。
在顶部导电层220为透明的实施方案中,顶部封装层222也可为透明或半透明的以便不降低系统的取光效率。顶部封装层222可由多种材料形成,诸如但不限于二氧化硅(SiO2)、氮化硅(SiNx)、聚(甲基丙烯酸甲酯)(PMMA)、苯并环丁烯(BCB)、聚酰亚胺和聚酯,并且可通过包括化学气相沉积(CVD)、物理气相沉积(PVD)、旋涂的多种方法形成。
仍参见图4,根据本发明的实施方案,驱动IC230和用于操作显示模块200的附加器件和IC芯片234被定位在显示面板215的显示基板102的后表面205上。例如,IC芯片234可包括功率管理IC、处理器、存储器、定时控制器、触摸感测IC、无线控制器、通信IC等。如图所示,驱动IC230和附加IC芯片234可被定位在显示基板的位于显示区域201正后方的后表面上。在一个实施方案中,电池238也可形成在后表面205上的RDL208上,或者另选地,薄膜电池238可形成在IC芯片230,234阵列上。
在一个实施方案中,驱动IC230与RDL208中的接线210A电连接,该接线与示出为在显示基板202的前表面和后表面之间延伸的通孔204的互连件电连接,互连件与显示基板202的顶表面上的布线层212电连接,布线层与LED214和可选的微型芯片216电连接。在一个实施方案中,布线层212包括通过孔204被定位在显示基板202的后表面204的耦接至一个或多个扫描驱动IC230的扫描线以及耦接至一个或多个数据驱动IC230的数据线。LED214可各自通过通孔206或多个通孔216耦接至公共Vss。
图5A为根据本发明的实施方案的包括在显示区域中的LED214和微型芯片216阵列和位于显示区域的正下方的多个通孔204,206的显示基板202的示意性前视图,其中微型芯片阵列与多个通孔重叠。如图5A所示,显示区域201可包括显示基板202的整个表面,或者至少可能用于放置LED和微型芯片的最大量的表面。通孔204可连接至显示基板202的后表面上的芯片230,234中的任一芯片。例如,通孔204可将微型芯片216连接至数据线、扫描线、Vdd、时钟等。在示出的具体实施方案中,通孔204在微型芯片阵列216正下方,并且Vss通孔206在微型芯片216之间散布在整个显示区域。图5B为根据本发明的实施方案的包括位于显示区域的正后方的显示基板的后表面上的一个或多个驱动电路230以及多个通孔204,206的显示基板202的示意性后视图。如图所示,多个附加IC芯片234和电池238也可被定位在显示区域的正后方。
图5C为根据本发明的实施方案的包括在显示区域201中的LED和微型芯片阵列和位于显示区域201的正下方的多个通孔的另选布置方式的显示基板的示意性前视图,其中微型芯片阵列216不与多个通孔204,206重叠。例如,多个通孔204,206可散布在微型芯片216之间,如图5C所示。在图5C所示的示例性实施方案中,接线212被示出为将多个通孔204和LED214连接至微型芯片阵列216。
图5D为根据本发明的实施方案的包括位于显示区域201中的LED和微型芯片阵列和位于显示区域201之外的多个通孔的显示基板的示意性前视图。如图5D所示,显示区域201可小于显示基板202的前表面,并且多个通孔204、106可沿显示区域201之外的显示基板202的周边而定位。在图5D所示的示例性实施方案中,为了不使说明变模糊而未示出接线212用于将多个通孔204连接至微型芯片216。
现在参见图6A-8,将根据本发明的实施方案的封装配置应用于现有OLED显示面板315以形成显示模块300。在图6A所示的实施方案中,显示基板302为包括工作电路316和有机LED314的TFT背板。示例性TFT工作电路316可包括基于非晶硅、基于多晶硅以及基于氧化铟镓锌的技术。在一个实施方案中,通孔304可穿过通常为驱动IC和FPC保留的接触凸部区域311中的显示基板而形成。现在参见图6B,类似于之前描述并示出的实施方案,用于操作显示模块300的附加器件和IC芯片334被定位在显示基板302的后表面305上。例如,IC芯片334可包括功率管理IC、处理器、存储器、定时控制器、触摸感测IC、无线控制器、通信IC等。如图所示,附加IC芯片334可被定位在显示基板的位于显示区域301正后方的后表面上。在图7A所示的实施方案中,驱动IC330被定位在显示基板302的前表面303上。驱动IC330可与通孔330电连接,继而与显示基板302的后表面305上RDL308中的接线310电连通。在图7B所示的实施方案中,驱动IC330被定位在显示基板302的后表面305上并且与通孔304电连通。在图7A所示的实施方案中,驱动IC330形成在显示基板302的为接触凸部311保留的顶表面上。在图7B所示的实施方案中,驱动IC330至少部分地被定位在显示基板301的正后方。在任一构型中,类似于常规OLED显示器,驱动IC330与工作电路316连通。
图8为根据本发明的实施方案的包括LED阵列和多个通孔的TFT显示基板和显示模块的示意性前视图。图8所示的具体实施方案类似于之前图4所示的实施方案,利用包括工作电路316的TFT显示基板来代替微型芯片216。在一个实施方案中,穿过位于显示区域301正后方的显示基板可形成通孔304。
图9为根据本发明的实施方案的包括显示面板的可穿戴电子设备的示意性前视图。可穿戴电子设备400可为包括显示面板215,315尤其是柔性显示面板215,315的多个可穿戴附件产品中的任一种。柔性显示面板215,315可形成在上述任一显示模块中。在一个实施方案中,柔性显示面板215,315不包括接触凸部111,这就可能允许针对显示区域201增加的分配空间。
在一个实施方案中,可穿戴电子设备为包括表盘402、表带404和表扣406的智能手表。可将柔性显示面板215,315集成到智能手表中使得该面板同时跨越表盘和表带。这样,可将柔性显示面板215,315调整为用户手臂的轮廓。根据本发明的实施方案,围绕显示面板215,315的表框410宽度可被最小化,例如小于4-5mm甚至小于1mm、小于0.5mm或消除。因此,可出于审美考虑而不是作为针对接触凸部分配空间的需求来进行智能手表的表框210设计。
图10-12为根据本发明的实施方案的显示各种显示图像的可穿戴电子设备的透视图。在图10所示的实施方案中,示出可穿戴电子设备400,其中显示面板215,315的显示区域被遮挡。例如,这可能指示显示面板关闭的状态。图11-12示出了显示面板显示不同图像的状态。例如,图11可显示包括表盘和表带的手表设计A,并且图12可显示包括表盘和表带的手表设计B。任何数量的显示图像都是可能的。
图13示出了可穿戴显示模块1300的实施方案的系统图。
例如,可穿戴显示模块1300可结合到图10-12的可穿戴电子设备中,并且包括本文所述的任一柔性显示面板。模块1300包括用于管理可穿戴电子设备并执行或解释可穿戴电子设备的指令和命令的处理器1302和存储器1303。处理器1302可为用于控制可穿戴电子设备的通用处理器或微控制器。存储器1303可集成在处理器1302内,或经由存储器总线耦接至处理器1302。存储器1303包括非易失性存储装置诸如闪存存储器,并且还可包括只读存储器(ROM)和易失性随机存取存储器(RAM)的形式。在一个实施方案中,处理器1302包括媒体解码功能,用于通过柔性显示面板1304显示编码内容。在一个实施方案中,模块1300包括图形用户界面(GUI)管理器1306,用于控制提供至柔性显示面板1304并显示于其上的信息。
模块1300还包括通信模块1308,该通信模块2208有利于模块1300和其他电子产品之间的通信。在一个实施方案中,通信模块1308包括用于经由通用串行总线(USB)提供连通性的模块。通信模块1308还可包括用于蓝牙或WLAN连通性的无线收发器,并且还可包括用于与包括蜂窝数据网络之类的广域网通信的一个或多个WWAN收发器。
在一个实施方案中,模块1300包括附件管理器1310,该附件管理器2210操作以验证和采集来自可耦接至模块1300的附加电子设备的数据。在一个实施方案中,模块1300为主显示设备的附件,并且附件管理器1310有利于附加电子设备与模块1300的连接。在一个实施方案中,模块1300可具有由附件管理器1310所管理的附件设备,有利于来往于附件设备的数据传输。
在一个实施方案中,存储器1303包括存储指令的非暂态计算机可读介质,该指令在由处理器1302执行时使得处理器执行调整模块1300的柔性显示面板1304的显示数据的操作。在一个实施方案中,操作包括从控制设备接收输入,该输入包括柔性显示面板的数据,解析输入以获取用于显示的数据,以及在柔性显示面板上显示所获取的数据。在一个实施方案中,操作还包括接收表盘和表带的柔性显示面板的配置,从所获取的数据接收设计(例如,包括表盘和表带的手表设计类型),以及用所接收的设计来从智能手表的表盘到表带的柔性显示面板进行更新。
在一个实施方案中,将附件管理器耦接至柔性显示基板1304以从通信地耦接到模块1300的控制设备接收输入。将图形用户界面(GUI)管理器耦接至显示基板以控制显示在显示基板上的信息,其中显示基板包括与可穿戴电子设备的表盘相关联的第一显示区域和与可穿戴电子设备的表带相关联的第二显示区域。在一个实施方案中,GUI管理器向第一显示区域提供表盘设计并向第二显示区域提供表带设计。在一个实施方案中,附件管理器经由通信模块从控制设备接收输入数据,输入数据包括GUI管理器的配置数据。
图14为根据本发明的实施方案的包括固定到卷轴1410的柔性显示面板1500的系统1400的示意性横截面侧视图。图15为根据本发明的实施方案的包括在显示基板202的前表面203上显示区域中的LED214和微型芯片216阵列的柔性显示面板1500的示意性横截面侧视图。图14-15所示的显示面板1500可类似于前述任一显示面板。在图14-15所示的实施方案中,柔性显示面板1500卷曲到外壳1420之中以及之外。在此类实施方案中,可将驱动IC1430、附加IC芯片1434和电池1438的任何组合被定位在外壳1420内,诸如被定位在卷轴1410上,而不是将这些部件定位在显示基板202的后表面205上。在其他实施方案中,还可将这些部件中的任一部件被定位在显示基板的后表面205上。例如,可将薄膜电池1438被定位在后表面上,或者可将多个电池1438被定位在后表面上。同样,可将一个或多个驱动IC1430被定位在后表面上以减小距微型芯片216的传输线距离。
在一个实施方案中,微型芯片216可包括环境光传感器用于测量照射柔性显示面板1500的显示区域的环境光线。参考图16,其提供了根据本发明的实施方案的包括暴露于不同程度的环境光线的微型芯片的两个区域216A,216B的柔性显示面板1500的示意性前视图。在一个实施方案中,微型芯片216的区域216B比区域216A暴露于更大的光量中,例如来自展示室内窗口的炫光。在此类实施方案中,系统1400中的处理器或环境光线控制器可增加从由区域216B中微型芯片216操作的LED214发出的光量以补偿环境光线。
图17示出了包括本文所述柔性显示面板1710的显示系统(例如,电视机)的实施方案的系统图1700,包括参照图14-16所述的系统和显示面板。显示系统1700包括用于管理系统并执行指令的处理器1720和存储器1704。存储器包括非易失性存储器诸如闪存存储器,并且还可包括易失性存储器诸如静态或动态随机存取存储器(RAM)。存储器1704还可包括专用于只读存储器(ROM)的部分以存储固件和配置实用性。在一个实施方案中,处理器1720通过控制每个微型芯片216对LED器件214的输出来管理柔性显示面板1710的环境光线校正,其中光输出基于来自传感器控制器1770的光传感器数据来调节。另选地,此类环境光线校正模块1705可被定位在显示面板1710内的每个微型芯片214上。
系统还可包括电源模块1780(例如,柔性电池、有线或无线充电电路等)、外围设备接口1708以及一个或多个外部端口1790(例如,通用串行总线(USB)、HDMI、显示端口和/或其他)。在一个实施方案中,显示系统1700包括被配置为与一个或多个外部端口1790交互的通信模块1712。例如,通信模块1712可包括根据IEEE标准、3GPP标准或其他通信标准运行的一个或多个收发器并且可被配置为经由一个或多个外部端口1790接收和发送数据。通信模块1712还可包括被配置为与广域网(包括一个或多个蜂窝站)或基站通信的一个或多个WWAN收发器用于可通信地将显示系统1700连接至附加设备或部件。另外,通信模块1712可包括被配置为将电子设备1700连接至局域网和/或个人局域网诸如蓝牙网络的一个或多个WLAN和/或WPAN收发器。
显示系统1700还可包括传感器控制器1770用于管理来自一个或多个传感器诸如接近传感器、环境光传感器或红外收发器的输入。在一个实施方案中,显示面板上的微型芯片阵列216包括与传感器控制器连通的光传感器阵列。每个微型芯片216可包括光传感器,或者仅微型芯片阵列的一部分包括光传感器。例如,光传感器阵列可均匀分布在微型芯片阵列中。在一个实施方案中,系统包括音频模块1731,该音频模块包括用于音频输出的一个或多个扬声器1734和用于接收音频的一个或多个麦克风1732。在实施方案中,扬声器1734和麦克风1732可以是压电部件。电子设备1700还包括输入/输入(I/O)控制器1722、显示屏1710和附加I/O部件1718(例如,键盘、按钮、灯光、LED、光标控制设备、触觉设备及其他)。显示设备/屏1710和附加I/O部件1718可被视为形成用户界面的一部分(例如,显示系统1700的与向用户呈现信息和/或从用户接收输入相关联的一部分)。
在利用本发明的各个方面中,对本领域技术人员显而易见的是,以上实施方案的组合或变型对于形成柔性显示面板和包括柔性显示面板的系统应用是可能的。尽管以特定于结构特征和/或方法行为的语言对本发明进行了描述,但应当理解,所附权利要求中限定的本发明并不一定限于所描述的特定特征或行为。本发明所公开的特定特征和行为被理解为受权利要求书保护的本发明的特定适当实施以用于对本发明进行例示。
Claims (24)
1.一种显示模块,包括:
显示基板,所述显示基板包括前表面、后表面和位于所述前表面上的显示区域;
多个互连件,所述多个互连件从所述前表面延伸穿过所述显示基板至所述后表面;
发光二极管(LED)阵列,所述发光二极管阵列位于所述显示区域中并且与所述多个互连件电连接;和
一个或多个驱动电路,所述一个或多个驱动电路位于所述显示基板的所述前表面或所述后表面上。
2.根据权利要求1所述的显示模块,其中所述多个互连件从所述前表面延伸穿过所述显示基板至所述显示区域正后方的所述后表面,并且所述一个或多个驱动电路位于所述显示基板的所述后表面上。
3.根据权利要求1所述的显示模块,其中所述多个互连件为从所述前表面延伸穿过所述显示基板至所述后表面的通孔。
4.根据权利要求1所述的显示模块,还包括位于所述显示基板的所述后表面上的电池。
5.根据权利要求2所述的显示模块,其中柔性印刷电路不将所述一个或多个驱动电路连接至所述显示基板。
6.根据权利要求1所述的显示模块,还包括穿过所述显示基板的接地孔。
7.根据权利要求2所述的显示模块,还包括位于所述显示基板的所述前表面上并位于所述显示区域内的微型芯片阵列。
8.根据权利要求7所述的显示模块,其中所述微型芯片阵列与所述多个互连件和所述LED阵列电连接。
9.根据权利要求8所述的显示模块,其中所述微型芯片阵列与所述多个互连件重叠。
10.根据权利要求8所述的显示模块,其中所述微型芯片阵列与所述多个互连件不重叠。
11.根据权利要求8所述的显示模块,其中所述微型芯片阵列包括环境光传感器阵列。
12.根据权利要求8所述的显示模块,还包括环境光传感器在所述微型芯片阵列中的均匀分布。
13.根据权利要求2所述的显示模块,其中所述显示模块被结合到可穿戴电子设备中。
14.根据权利要求13所述的显示模块,其中所述可穿戴电子设备为智能手表。
15.根据权利要求14所述的显示模块,其中所述显示基板的所述显示区域跨越所述智能手表的表盘和表带。
16.根据权利要求2所述的显示模块,其中所述显示基板被固定到卷轴。
17.根据权利要求16所述的显示模块,其中所述卷轴包括与所述多个互连件电接触的一个或多个驱动电路。
18.根据权利要求17所述的显示模块,其中所述显示模块被结合到电视机中。
19.一种存储有指令的非暂态计算机可读介质,所述指令当由处理器执行时使得所述处理器执行用于调节可穿戴电子设备的显示区域的显示数据的操作,所述操作包括:
从控制设备接收输入,所述输入包括用于所述可穿戴电子设备的所述显示区域的数据;
解析所述输入以获取用于显示的所述数据;以及
在所述显示区域上显示所获取的数据,其中所述显示区域位于跨越所述可穿戴电子设备的面和带的柔性显示基板上。
20.根据权利要求19所述的介质,其中所述可穿戴电子设备为智能手表。
21.根据权利要求20所述的介质,还包括用于执行附加操作的指令,所述附加操作包括:
接收所述表盘和所述表带的所述显示区域的配置;
从所获取的数据接收设计,所述设计包括表盘和表带;以及
利用所接收的设计来更新所述显示区域。
22.一种用于可穿戴电子设备的显示模块,包括:
柔性显示基板,所述柔性显示基板跨越所述可穿戴电子设备的面和带;
附件管理器,所述附件管理器耦接至所述显示基板,以从通信地耦接到所述显示模块的控制设备接收输入;和
图形用户界面(GUI)管理器,所述图形用户界面管理器用于控制被显示在所述显示基板上的信息,其中所述显示基板包括与所述可穿戴电子设备的面相关联的第一显示区域和与所述可穿戴电子设备的带相关联的第二显示区域。
23.根据权利要求22所述的显示模块,其中所述GUI管理器进一步向所述第一显示区域提供表盘设计并向所述第二显示区域提供表带设计。
24.根据权利要求23所述的显示模块,其中所述附件管理器进一步经由通信模块来从控制设备接收输入数据,所述输入数据包括所述GUI管理器的配置数据。
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