CN206584958U - 一种双层封装胶的led器件及led显示屏 - Google Patents

一种双层封装胶的led器件及led显示屏 Download PDF

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CN206584958U
CN206584958U CN201621299020.4U CN201621299020U CN206584958U CN 206584958 U CN206584958 U CN 206584958U CN 201621299020 U CN201621299020 U CN 201621299020U CN 206584958 U CN206584958 U CN 206584958U
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徐虎
刘传标
秦快
彭壮
丁涛
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Foshan NationStar Optoelectronics Co Ltd
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Abstract

本实用新型涉及一种双层封装胶的LED器件及LED显示屏。一种双层封装胶的LED器件，包括LED支架、LED芯片和封装胶；所述LED支架包括金属支架和包裹该金属支架的杯罩，所述杯罩中上设有中空腔，所述LED芯片固定在所述中空腔内，所述封装胶填充在所述中空腔内，所述封装胶包括底胶和面胶，所述底胶覆盖所述LED芯片，所述面胶覆盖在所述底胶上；所述底胶为透光层，所述面胶为哑光层。底胶为透光率较高的封装胶，光强损失低，采用具有磨砂效果的封装胶作为面胶，具有哑光作用，面胶虽磨砂颗粒较多，但其分量较少，固化速率快，保证磨砂颗粒浮在上层，固胶面一致性较好；使LED器件得以兼顾高亮度、低应力及哑光的多种效果，本实用新型还提供了一种显示屏，实现高亮度及哑光等效果。

Description

一种双层封装胶的LED器件及LED显示屏
技术领域
本实用新型涉及一种发光器件，尤其涉及一种LED器件及LED显示屏。
背景技术
现有技术中的TOP-LED器件包括LED支架，固定在LED支架上的LED芯片以及封装胶，该LED支架包括杯罩和嵌入该杯罩的金属支架，该杯罩设有一中空腔，该封装胶填充在杯罩的中空腔内，并包裹LED芯片。
现有技术中LED器件，由于封装胶为一种材料制成，其主要成分为环氧树脂，其亮度、应力等参数唯一。若选择透明胶，则胶体没有哑光效果；若选择具有磨砂效果的胶体，由于磨砂胶体中的磨砂颗粒较多，在固化过程中受热不均匀，溶剂挥发不均匀，固化后胶面一致性较差。若采用单一的材料，多种不同效果间无法兼顾，降低了LED器件的使用效果。
实用新型内容
为了解决上述技术问题，本实用新型提供了一种高亮度及哑光效果的LED器件及显示屏
本实用新型所采用的技术方案是：
一种双层封装胶的LED器件，包括LED支架、LED芯片和封装胶；所述LED支架包括金属支架和包裹该金属支架的杯罩，所述杯罩中设有中空腔，所述LED芯片固定在所述中空腔内，所述封装胶填充在所述中空腔内，其特征在于：所述封装胶包括底胶和面胶，所述底胶覆盖所述LED芯片，所述面胶覆盖在所述底胶上；所述底胶为透光层，所述面胶为哑光层。
优选的，所述面胶厚度与所述底胶厚度之比为1/2～2/3。
优选的，所述哑光层为磨砂层。
优选的，所述底胶和面胶的交界面为平面或弧面。
优选的，所述底胶和面胶的交界面为朝向面胶方向弯曲的弧面。
优选的，所述LED支架的中空腔的深度为D，所述底胶厚度小于或等于3/4D。
优选的，所述底胶厚度小于或等于4/7D。
优选的，所述LED芯片为红光LED芯片、绿光LED芯片或蓝光LED芯片中的任意一种、两种或三种组合。
优选的，所述底胶的透光率为大于或等于70％。
一种双层封装胶的LED显示屏，包括PCB板、驱动IC和上述任一项所述的LED器件，多个所述LED器件固定在所述PCB板上，所述驱动IC固定在所述PCB板的另一面上。
与现有技术相比，本实用新型具有如下优点：
本实用新型提供的一种双层封装胶的LED器件及LED显示屏，采用底胶和面胶双层封装胶，底胶为透光率较高的封装胶层，光强损失低，同时采用具有磨砂效果的封装胶作为面胶，具有哑光作用，面胶虽磨砂颗粒较多，但由于其分量较少，可确保在固化过程中受热均匀，溶剂挥发均匀，固化速率快，保证磨砂颗粒浮在上层，固化后胶面一致性较好；本实用新型采用双层封装胶的方案，使LED器件得以兼顾高亮度、低应力及哑光的多种效果。
为了更好地理解和实施，下面结合附图详细说明本实用新型。
附图说明
图1是本实用新型的一种双层封装胶的LED器件的结构示意图；
图2是本实用新型的一种双层封装胶的LED器件的结构示意图。
具体实施方式
请参阅图1，其为本实用新型的LED器件的结构示意图。本实用新型的LED器件包括LED支架、LED芯片30、焊线以及封装胶40，该LED支架包括金属支架20和包裹该金属支架20的杯罩10。金属支架20包括嵌入杯罩内的金属引脚和外露在杯罩外的金属管脚。所述杯罩中设置于所述金属引脚顶部的部分为反射杯，反射杯设有一中空腔，该金属引脚位于该中空腔的底面的部分为焊盘。该LED芯片30固定在中空腔中，LED芯片30的电极通过焊线与焊盘电连接，该封装胶40填充在杯罩10的中空腔内，并覆盖所述LED芯片30。该LED芯片30为红光LED芯片、绿光LED芯片或蓝光LED芯片中的任意一种、两种或三种组合，在本实施例中，优选红绿蓝光各一片。该杯罩10优选采用黑色PPA树脂制作，高亮度、低应力。
请参阅图2，其为本实用新型的LED器件的局部示意图。该封装胶40包括底胶41和面胶42，底胶41覆盖所有LED芯片30以及焊线，面胶42覆盖在底胶41上。该底胶41为透光层，具体采用透光率较高的封装胶制成，所述底胶的透光率为大于或等于70％，该面胶42为哑光层，具体采用具有磨砂效果的封装胶制成。面胶42与底胶41的交界面可以是平面或弧面，在本实施例中，优选交界面为朝向面胶方向弯曲的弧面，起到聚光作用。面胶厚度和底胶厚度之比为1/2～2/3，此时能达到全哑光效果，同时可以保证面胶能够覆盖底胶并流满杯面，批量一致性及平整度较好。具体地，将LED支架的中空腔的深度表示为D，底胶41的厚度应至少覆盖所有LED芯片30以及焊线，同时所述底胶厚度小于或等于3/4D，进一步地，底胶的厚度应小于或等于4/7D。
本实用新型还提供一种LED显示屏，包括PCB板、驱动IC和LED器件，多个LED器件固定在PCB板上，驱动IC固定在PCB板的另一面上。
本实用新型的LED显示屏的制作方法是，将铜带或铁带等金属带材进行冲切，然后在其表面电镀金属或合金材料，电镀后将PPA材料注塑在金属带材上，使其形成杯罩，注塑后将金属带材围绕着杯罩进行弯折，完成LED支架的制作；将LED芯片固定在LED支架的焊盘的固晶区上，然后将焊线分别焊接在LED芯片和焊盘的焊线区上，最后填充封装胶，首先通过喷胶或点胶的方法将所述底胶填充在所述LED支架的中空腔中，所述底胶固化后，再将所述面胶通过喷胶的方法覆盖在所述底胶上，面胶固化后，冲切，完成LED器件的制作；将制作好的LED器件焊接在PCB板上，并将驱动IC的相关电路元件焊接在PCB板的另一面上，完成LED显示屏的制作。
本实用新型的LED器件，采用底胶和面胶双层封装胶，底胶为透光率较高的封装胶层，光强损失低，同时采用具有磨砂效果的封装胶作为面胶，具有哑光作用，面胶虽磨砂颗粒较多，但由于其分量较少，可确保在固化过程中受热均匀，溶剂挥发均匀，固化速率快，保证磨砂颗粒浮在上层，固化后胶面一致性较好；本实用新型采用双层封装胶的方案，使LED器件得以兼顾高亮度、低应力及哑光的多种效果，本实用新型还提供了一种显示屏，采用所述LED器件，具有高亮度、哑光等效果。
本实用新型并不局限于上述实施方式，如果对本实用新型的各种改动或变形不脱离本实用新型的精神和范围，倘若这些改动和变形属于本实用新型的权利要求和等同技术范围之内，则本实用新型也意图包含这些改动和变形。

Claims (10)

1.一种双层封装胶的LED器件，包括LED支架、LED芯片和封装胶；所述LED支架包括金属支架和包裹该金属支架的杯罩，所述杯罩中设有中空腔，所述LED芯片固定在所述中空腔内，所述封装胶填充在所述中空腔内，其特征在于：所述封装胶包括底胶和面胶，所述底胶覆盖所述LED芯片，所述面胶覆盖在所述底胶上；所述底胶为透光层，所述面胶为哑光层。
2.根据权利要求1所述的双层封装胶的LED器件，其特征在于：所述面胶厚度与所述底胶厚度之比为1/2～2/3。
3.根据权利要求1所述的双层封装胶的LED器件，其特征在于：所述哑光层为磨砂层。
4.根据权利要求1至3中任一项所述的双层封装胶的LED器件，其特征在于：所述底胶和面胶的交界面为平面或弧面。
5.根据权利要求4所述的双层封装胶的LED器件，其特征在于：所述底胶和面胶的交界面为朝向面胶方向弯曲的弧面。
6.根据权利要求1至3中任一项所述的双层封装胶的LED器件，其特征在于：所述LED支架的中空腔的深度为D，所述底胶厚度小于或等于3/4D。
7.根据权利要求6所述的双层封装胶的LED器件，其特征在于：所述底胶厚度小于或等于4/7D。
8.根据权利要求6所述的双层封装胶的LED器件，其特征在于：所述LED芯片为红光LED芯片、绿光LED芯片或蓝光LED芯片中的任意一种、两种或三种组合。
9.根据权利要求1所述的双层封装胶的LED器件，其特征在于：所述底胶的透光率为大于或等于70％。
10.一种双层封装胶的LED显示屏，其特征在于：包括PCB板、驱动IC和根据权利要求1-9中任一项所述的LED器件，多个所述LED器件固定在所述PCB板上，所述驱动IC固定在所述PCB板的另一面上。
CN201621299020.4U 2016-11-30 2016-11-30 一种双层封装胶的led器件及led显示屏 Active CN206584958U (zh)

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CN201621299020.4U CN206584958U (zh) 2016-11-30 2016-11-30 一种双层封装胶的led器件及led显示屏
JP2017005137U JP3214616U (ja) 2016-11-30 2017-11-10 Ｌｅｄデバイス及びｌｅｄ表示モジュール
US15/816,126 US10297730B2 (en) 2016-11-30 2017-11-17 LED device, method for manufacturing an LED device, and LED display module
KR1020170155886A KR20180062365A (ko) 2016-11-30 2017-11-21 Led 소자, led 소자의 제조방법 및 led 디스플레이 모듈

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