CN102365310A - 热固化性树脂组合物、以及使用了该组合物的预浸料、带支撑体的绝缘膜、层叠板及印刷布线板 - Google Patents
热固化性树脂组合物、以及使用了该组合物的预浸料、带支撑体的绝缘膜、层叠板及印刷布线板 Download PDFInfo
- Publication number
- CN102365310A CN102365310A CN2010800141391A CN201080014139A CN102365310A CN 102365310 A CN102365310 A CN 102365310A CN 2010800141391 A CN2010800141391 A CN 2010800141391A CN 201080014139 A CN201080014139 A CN 201080014139A CN 102365310 A CN102365310 A CN 102365310A
- Authority
- CN
- China
- Prior art keywords
- resin
- resin composition
- compound
- maleimide
- phenyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 59
- 229920001187 thermosetting polymer Polymers 0.000 title abstract 3
- 229920005989 resin Polymers 0.000 claims abstract description 203
- 239000011347 resin Substances 0.000 claims abstract description 203
- -1 maleimide compound Chemical class 0.000 claims abstract description 141
- 150000003923 2,5-pyrrolediones Chemical class 0.000 claims description 69
- 238000001723 curing Methods 0.000 claims description 63
- 229920000647 polyepoxide Polymers 0.000 claims description 57
- 239000003822 epoxy resin Substances 0.000 claims description 55
- 239000000463 material Substances 0.000 claims description 52
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 46
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 38
- 239000002253 acid Substances 0.000 claims description 34
- 150000001875 compounds Chemical class 0.000 claims description 30
- 239000000126 substance Substances 0.000 claims description 27
- 239000011120 plywood Substances 0.000 claims description 25
- 238000011049 filling Methods 0.000 claims description 22
- 238000013007 heat curing Methods 0.000 claims description 19
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 15
- 229910052799 carbon Inorganic materials 0.000 claims description 15
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 14
- 239000004643 cyanate ester Substances 0.000 claims description 14
- 239000003063 flame retardant Substances 0.000 claims description 14
- 239000005078 molybdenum compound Substances 0.000 claims description 14
- 150000002752 molybdenum compounds Chemical class 0.000 claims description 14
- 230000002787 reinforcement Effects 0.000 claims description 11
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 10
- 125000000217 alkyl group Chemical group 0.000 claims description 9
- 125000001118 alkylidene group Chemical group 0.000 claims description 9
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims description 9
- 239000000835 fiber Substances 0.000 claims description 8
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 8
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 6
- 229920000877 Melamine resin Polymers 0.000 claims description 5
- 230000004927 fusion Effects 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229920002050 silicone resin Polymers 0.000 claims description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 4
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 3
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 claims description 3
- 239000004640 Melamine resin Substances 0.000 claims description 3
- 125000004390 alkyl sulfonyl group Chemical group 0.000 claims description 3
- 125000000746 allylic group Chemical group 0.000 claims description 3
- 229920003180 amino resin Polymers 0.000 claims description 3
- 238000000354 decomposition reaction Methods 0.000 claims description 3
- 125000005843 halogen group Chemical group 0.000 claims description 3
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 claims description 3
- 239000012948 isocyanate Substances 0.000 claims description 3
- 150000002513 isocyanates Chemical class 0.000 claims description 3
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 claims description 3
- 229920003987 resole Polymers 0.000 claims description 3
- 229920006337 unsaturated polyester resin Polymers 0.000 claims description 3
- 239000003960 organic solvent Substances 0.000 abstract description 24
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 abstract description 5
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 abstract 6
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 abstract 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 73
- 238000006243 chemical reaction Methods 0.000 description 55
- 239000002966 varnish Substances 0.000 description 50
- 239000000243 solution Substances 0.000 description 48
- 239000010410 layer Substances 0.000 description 44
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 38
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 38
- 238000000034 method Methods 0.000 description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 37
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 36
- 150000002460 imidazoles Chemical class 0.000 description 34
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 34
- 238000004519 manufacturing process Methods 0.000 description 30
- 239000000203 mixture Substances 0.000 description 29
- 239000002245 particle Substances 0.000 description 29
- 239000000758 substrate Substances 0.000 description 29
- 239000002904 solvent Substances 0.000 description 25
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 24
- 239000011889 copper foil Substances 0.000 description 24
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 23
- 230000000052 comparative effect Effects 0.000 description 22
- 229920001971 elastomer Polymers 0.000 description 21
- 238000003860 storage Methods 0.000 description 20
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 19
- 239000004305 biphenyl Chemical group 0.000 description 19
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 18
- 235000010290 biphenyl Nutrition 0.000 description 18
- 239000005060 rubber Substances 0.000 description 18
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 16
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 15
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 14
- 239000003054 catalyst Substances 0.000 description 13
- 239000004020 conductor Substances 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- 238000001035 drying Methods 0.000 description 13
- 238000011156 evaluation Methods 0.000 description 13
- 229910052698 phosphorus Inorganic materials 0.000 description 13
- 150000003457 sulfones Chemical class 0.000 description 12
- 150000002148 esters Chemical class 0.000 description 11
- 238000001879 gelation Methods 0.000 description 11
- 229920003192 poly(bis maleimide) Polymers 0.000 description 11
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 10
- 230000008859 change Effects 0.000 description 10
- 239000011521 glass Substances 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 10
- 230000007704 transition Effects 0.000 description 10
- 239000001294 propane Substances 0.000 description 9
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 8
- YVNRUPSDZZZUQJ-UHFFFAOYSA-N [O].NC1=CC=CC=C1 Chemical compound [O].NC1=CC=CC=C1 YVNRUPSDZZZUQJ-UHFFFAOYSA-N 0.000 description 8
- 150000001412 amines Chemical class 0.000 description 8
- 239000007864 aqueous solution Substances 0.000 description 8
- 125000003700 epoxy group Chemical group 0.000 description 8
- 239000005350 fused silica glass Substances 0.000 description 8
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 8
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 8
- 238000012545 processing Methods 0.000 description 8
- 239000000377 silicon dioxide Substances 0.000 description 8
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 7
- 239000011354 acetal resin Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 238000005755 formation reaction Methods 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- 239000011574 phosphorus Substances 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- 229920006324 polyoxymethylene Polymers 0.000 description 7
- 239000000843 powder Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 235000012239 silicon dioxide Nutrition 0.000 description 7
- 229960001866 silicon dioxide Drugs 0.000 description 7
- 229920002554 vinyl polymer Polymers 0.000 description 7
- XAEWLETZEZXLHR-UHFFFAOYSA-N zinc;dioxido(dioxo)molybdenum Chemical compound [Zn+2].[O-][Mo]([O-])(=O)=O XAEWLETZEZXLHR-UHFFFAOYSA-N 0.000 description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 229910001593 boehmite Inorganic materials 0.000 description 6
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 6
- 125000000524 functional group Chemical group 0.000 description 6
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 6
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 6
- MNAHQWDCXOHBHK-UHFFFAOYSA-N 1-phenylpropane-1,1-diol Chemical compound CCC(O)(O)C1=CC=CC=C1 MNAHQWDCXOHBHK-UHFFFAOYSA-N 0.000 description 5
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 5
- 125000003118 aryl group Chemical group 0.000 description 5
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical group C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 5
- 150000003949 imides Chemical group 0.000 description 5
- 150000002576 ketones Chemical class 0.000 description 5
- 239000012528 membrane Substances 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 125000004437 phosphorous atom Chemical group 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 238000010992 reflux Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 5
- MEVBAGCIOOTPLF-UHFFFAOYSA-N 2-[[5-(oxiran-2-ylmethoxy)naphthalen-2-yl]oxymethyl]oxirane Chemical compound C1OC1COC(C=C1C=CC=2)=CC=C1C=2OCC1CO1 MEVBAGCIOOTPLF-UHFFFAOYSA-N 0.000 description 4
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 4
- ALYNCZNDIQEVRV-UHFFFAOYSA-N 4-aminobenzoic acid Chemical compound NC1=CC=C(C(O)=O)C=C1 ALYNCZNDIQEVRV-UHFFFAOYSA-N 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- RTWNYYOXLSILQN-UHFFFAOYSA-N methanediamine Chemical compound NCN RTWNYYOXLSILQN-UHFFFAOYSA-N 0.000 description 4
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 4
- 238000003801 milling Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 150000003141 primary amines Chemical group 0.000 description 4
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 3
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 3
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 3
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 3
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 3
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical class [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 3
- 206010013786 Dry skin Diseases 0.000 description 3
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 239000006096 absorbing agent Substances 0.000 description 3
- SMWDFEZZVXVKRB-UHFFFAOYSA-N anhydrous quinoline Natural products N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 3
- 150000004982 aromatic amines Chemical class 0.000 description 3
- BIOOACNPATUQFW-UHFFFAOYSA-N calcium;dioxido(dioxo)molybdenum Chemical compound [Ca+2].[O-][Mo]([O-])(=O)=O BIOOACNPATUQFW-UHFFFAOYSA-N 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- MODMKKOKHKJFHJ-UHFFFAOYSA-N magnesium;dioxido(dioxo)molybdenum Chemical compound [Mg+2].[O-][Mo]([O-])(=O)=O MODMKKOKHKJFHJ-UHFFFAOYSA-N 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 125000001624 naphthyl group Chemical group 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 150000003017 phosphorus Chemical class 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 239000004848 polyfunctional curative Substances 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 238000004321 preservation Methods 0.000 description 3
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 238000013517 stratification Methods 0.000 description 3
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 3
- 150000003568 thioethers Chemical class 0.000 description 3
- AUHZEENZYGFFBQ-UHFFFAOYSA-N 1,3,5-trimethylbenzene Chemical compound CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 2
- SEULWJSKCVACTH-UHFFFAOYSA-N 1-phenylimidazole Chemical compound C1=NC=CN1C1=CC=CC=C1 SEULWJSKCVACTH-UHFFFAOYSA-N 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- JYLNVJYYQQXNEK-UHFFFAOYSA-N 3-amino-2-(4-chlorophenyl)-1-propanesulfonic acid Chemical compound OS(=O)(=O)CC(CN)C1=CC=C(Cl)C=C1 JYLNVJYYQQXNEK-UHFFFAOYSA-N 0.000 description 2
- HYBVISCYJVVEDX-UHFFFAOYSA-N 4-(4-aminophenyl)-3-chloroaniline Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1Cl HYBVISCYJVVEDX-UHFFFAOYSA-N 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- PDCMTKJRBAZZHL-UHFFFAOYSA-N 5-aminobenzene-1,3-diol Chemical compound NC1=CC(O)=CC(O)=C1 PDCMTKJRBAZZHL-UHFFFAOYSA-N 0.000 description 2
- OMIHGPLIXGGMJB-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]hepta-1,3,5-triene Chemical compound C1=CC=C2OC2=C1 OMIHGPLIXGGMJB-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 235000008733 Citrus aurantifolia Nutrition 0.000 description 2
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- 239000004606 Fillers/Extenders Substances 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical class CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 235000011941 Tilia x europaea Nutrition 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229920000800 acrylic rubber Polymers 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- RWZYAGGXGHYGMB-UHFFFAOYSA-N anthranilic acid Chemical compound NC1=CC=CC=C1C(O)=O RWZYAGGXGHYGMB-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- ZSTLPJLUQNQBDQ-UHFFFAOYSA-N azanylidyne(dihydroxy)-$l^{5}-phosphane Chemical compound OP(O)#N ZSTLPJLUQNQBDQ-UHFFFAOYSA-N 0.000 description 2
- 229940106691 bisphenol a Drugs 0.000 description 2
- 239000001273 butane Substances 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000007865 diluting Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011152 fibreglass Substances 0.000 description 2
- 238000009998 heat setting Methods 0.000 description 2
- 239000012943 hotmelt Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 125000001841 imino group Chemical group [H]N=* 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 235000012204 lemonade/lime carbonate Nutrition 0.000 description 2
- 239000004571 lime Substances 0.000 description 2
- 229940018564 m-phenylenediamine Drugs 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 2
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- DHRLEVQXOMLTIM-UHFFFAOYSA-N phosphoric acid;trioxomolybdenum Chemical compound O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.OP(O)(O)=O DHRLEVQXOMLTIM-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000012286 potassium permanganate Substances 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 238000004062 sedimentation Methods 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 2
- 150000003462 sulfoxides Chemical class 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 125000004434 sulfur atom Chemical group 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 235000012222 talc Nutrition 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- NSGXIBWMJZWTPY-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropane Chemical compound FC(F)(F)CC(F)(F)F NSGXIBWMJZWTPY-UHFFFAOYSA-N 0.000 description 1
- LRMDXTVKVHKWEK-UHFFFAOYSA-N 1,2-diaminoanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=C(N)C(N)=CC=C3C(=O)C2=C1 LRMDXTVKVHKWEK-UHFFFAOYSA-N 0.000 description 1
- YFKBXYGUSOXJGS-UHFFFAOYSA-N 1,3-Diphenyl-2-propanone Chemical compound C=1C=CC=CC=1CC(=O)CC1=CC=CC=C1 YFKBXYGUSOXJGS-UHFFFAOYSA-N 0.000 description 1
- QLCJOAMJPCOIDI-UHFFFAOYSA-N 1-(butoxymethoxy)butane Chemical compound CCCCOCOCCCC QLCJOAMJPCOIDI-UHFFFAOYSA-N 0.000 description 1
- PYVHLZLQVWXBDZ-UHFFFAOYSA-N 1-[6-(2,5-dioxopyrrol-1-yl)hexyl]pyrrole-2,5-dione Chemical class O=C1C=CC(=O)N1CCCCCCN1C(=O)C=CC1=O PYVHLZLQVWXBDZ-UHFFFAOYSA-N 0.000 description 1
- QIJNJJZPYXGIQM-UHFFFAOYSA-N 1lambda4,2lambda4-dimolybdacyclopropa-1,2,3-triene Chemical compound [Mo]=C=[Mo] QIJNJJZPYXGIQM-UHFFFAOYSA-N 0.000 description 1
- HINKSSFMJHIJOU-UHFFFAOYSA-N 2,2-dimethyl-3-phenylpropan-1-amine Chemical compound NCC(C)(C)CC1=CC=CC=C1 HINKSSFMJHIJOU-UHFFFAOYSA-N 0.000 description 1
- IFFLKGMDBKQMAH-UHFFFAOYSA-N 2,4-diaminopyridine Chemical compound NC1=CC=NC(N)=C1 IFFLKGMDBKQMAH-UHFFFAOYSA-N 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N 2,4-diaminotoluene Chemical compound CC1=CC=C(N)C=C1N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- MJAVQHPPPBDYAN-UHFFFAOYSA-N 2,6-dimethylbenzene-1,4-diamine Chemical class CC1=CC(N)=CC(C)=C1N MJAVQHPPPBDYAN-UHFFFAOYSA-N 0.000 description 1
- YDFKZKGIKKDOEI-UHFFFAOYSA-N 2-(1,3,5-triazin-2-yl)ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC1=NC=NC=N1 YDFKZKGIKKDOEI-UHFFFAOYSA-N 0.000 description 1
- HOLGXWDGCVTMTB-UHFFFAOYSA-N 2-(2-aminophenyl)aniline Chemical group NC1=CC=CC=C1C1=CC=CC=C1N HOLGXWDGCVTMTB-UHFFFAOYSA-N 0.000 description 1
- MMEDJBFVJUFIDD-UHFFFAOYSA-N 2-[2-(carboxymethyl)phenyl]acetic acid Chemical compound OC(=O)CC1=CC=CC=C1CC(O)=O MMEDJBFVJUFIDD-UHFFFAOYSA-N 0.000 description 1
- AKCRQHGQIJBRMN-UHFFFAOYSA-N 2-chloroaniline Chemical class NC1=CC=CC=C1Cl AKCRQHGQIJBRMN-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- NUIURNJTPRWVAP-UHFFFAOYSA-N 3,3'-Dimethylbenzidine Chemical compound C1=C(N)C(C)=CC(C=2C=C(C)C(N)=CC=2)=C1 NUIURNJTPRWVAP-UHFFFAOYSA-N 0.000 description 1
- NSSINUIISUZQKS-UHFFFAOYSA-N 3-(2,4-diaminophenoxy)propane-1-sulfonic acid Chemical compound NC1=CC=C(OCCCS(O)(=O)=O)C(N)=C1 NSSINUIISUZQKS-UHFFFAOYSA-N 0.000 description 1
- LXJLFVRAWOOQDR-UHFFFAOYSA-N 3-(3-aminophenoxy)aniline Chemical compound NC1=CC=CC(OC=2C=C(N)C=CC=2)=C1 LXJLFVRAWOOQDR-UHFFFAOYSA-N 0.000 description 1
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 1
- CKOFBUUFHALZGK-UHFFFAOYSA-N 3-[(3-aminophenyl)methyl]aniline Chemical compound NC1=CC=CC(CC=2C=C(N)C=CC=2)=C1 CKOFBUUFHALZGK-UHFFFAOYSA-N 0.000 description 1
- ZSEADYMLKBVVTB-UHFFFAOYSA-N 3-[methyl(trimethylsilyloxy)silyl]propan-1-amine Chemical class C[SiH](CCCN)O[Si](C)(C)C ZSEADYMLKBVVTB-UHFFFAOYSA-N 0.000 description 1
- ZAJAQTYSTDTMCU-UHFFFAOYSA-N 3-aminobenzenesulfonic acid Chemical compound NC1=CC=CC(S(O)(=O)=O)=C1 ZAJAQTYSTDTMCU-UHFFFAOYSA-N 0.000 description 1
- GZYMMTQDXHJALZ-UHFFFAOYSA-N 3-benzylaniline Chemical compound NC1=CC=CC(CC=2C=CC=CC=2)=C1 GZYMMTQDXHJALZ-UHFFFAOYSA-N 0.000 description 1
- WECDUOXQLAIPQW-UHFFFAOYSA-N 4,4'-Methylene bis(2-methylaniline) Chemical compound C1=C(N)C(C)=CC(CC=2C=C(C)C(N)=CC=2)=C1 WECDUOXQLAIPQW-UHFFFAOYSA-N 0.000 description 1
- DCSSXQMBIGEQGN-UHFFFAOYSA-N 4,6-dimethylbenzene-1,3-diamine Chemical compound CC1=CC(C)=C(N)C=C1N DCSSXQMBIGEQGN-UHFFFAOYSA-N 0.000 description 1
- QYIMZXITLDTULQ-UHFFFAOYSA-N 4-(4-amino-2-methylphenyl)-3-methylaniline Chemical compound CC1=CC(N)=CC=C1C1=CC=C(N)C=C1C QYIMZXITLDTULQ-UHFFFAOYSA-N 0.000 description 1
- BGTSPLFSRDIANU-UHFFFAOYSA-N 4-(4-amino-2-tert-butylphenoxy)-3-tert-butylaniline Chemical compound CC(C)(C)C1=CC(N)=CC=C1OC1=CC=C(N)C=C1C(C)(C)C BGTSPLFSRDIANU-UHFFFAOYSA-N 0.000 description 1
- DVGXDSPMPDANGA-UHFFFAOYSA-N 4-(9h-fluoren-1-yl)aniline Chemical class C1=CC(N)=CC=C1C1=CC=CC2=C1CC1=CC=CC=C12 DVGXDSPMPDANGA-UHFFFAOYSA-N 0.000 description 1
- KSMVBYPXNKCPAJ-UHFFFAOYSA-N 4-Methylcyclohexylamine Chemical compound CC1CCC(N)CC1 KSMVBYPXNKCPAJ-UHFFFAOYSA-N 0.000 description 1
- HSBOCPVKJMBWTF-UHFFFAOYSA-N 4-[1-(4-aminophenyl)ethyl]aniline Chemical compound C=1C=C(N)C=CC=1C(C)C1=CC=C(N)C=C1 HSBOCPVKJMBWTF-UHFFFAOYSA-N 0.000 description 1
- HVBSAKJJOYLTQU-UHFFFAOYSA-N 4-aminobenzenesulfonic acid Chemical compound NC1=CC=C(S(O)(=O)=O)C=C1 HVBSAKJJOYLTQU-UHFFFAOYSA-N 0.000 description 1
- WDTRNCFZFQIWLM-UHFFFAOYSA-N 4-benzylaniline Chemical compound C1=CC(N)=CC=C1CC1=CC=CC=C1 WDTRNCFZFQIWLM-UHFFFAOYSA-N 0.000 description 1
- YAAFQELLFJHAHD-UHFFFAOYSA-N 4-diethylsilylaniline Chemical compound CC[SiH](CC)c1ccc(N)cc1 YAAFQELLFJHAHD-UHFFFAOYSA-N 0.000 description 1
- QYSWOQHLIDKEOL-UHFFFAOYSA-N 5,6-diamino-2-sulfanylidene-1h-pyrimidin-4-one Chemical compound NC=1NC(=S)NC(=O)C=1N QYSWOQHLIDKEOL-UHFFFAOYSA-N 0.000 description 1
- PHICKPBIPXXFIP-UHFFFAOYSA-N 5-amino-2-(4-amino-5-methyl-2-sulfophenyl)-4-methylbenzenesulfonic acid Chemical compound C1=C(N)C(C)=CC(C=2C(=CC(N)=C(C)C=2)S(O)(=O)=O)=C1S(O)(=O)=O PHICKPBIPXXFIP-UHFFFAOYSA-N 0.000 description 1
- KBZFDRWPMZESDI-UHFFFAOYSA-N 5-aminobenzene-1,3-dicarboxylic acid Chemical compound NC1=CC(C(O)=O)=CC(C(O)=O)=C1 KBZFDRWPMZESDI-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- PXKLMJQFEQBVLD-UHFFFAOYSA-N Bisphenol F Natural products C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- MEPSJVSZYBORPF-NQAUEXIDSA-N C/C=C\C=C/C=C\CN Chemical compound C/C=C\C=C/C=C\CN MEPSJVSZYBORPF-NQAUEXIDSA-N 0.000 description 1
- NHWXLFRZGMPJBF-UHFFFAOYSA-N C=CC(=O)OC1=NC(=NC(=N1)N)CCN Chemical compound C=CC(=O)OC1=NC(=NC(=N1)N)CCN NHWXLFRZGMPJBF-UHFFFAOYSA-N 0.000 description 1
- 0 CC=*c1nc(*)c[n]1C(NC*CNC(*C1C(*)=NC(*)=C1)=O)=O Chemical compound CC=*c1nc(*)c[n]1C(NC*CNC(*C1C(*)=NC(*)=C1)=O)=O 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 208000003351 Melanosis Diseases 0.000 description 1
- 229910039444 MoC Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 1
- NSOXQYCFHDMMGV-UHFFFAOYSA-N Tetrakis(2-hydroxypropyl)ethylenediamine Chemical compound CC(O)CN(CC(C)O)CCN(CC(C)O)CC(C)O NSOXQYCFHDMMGV-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- AHZMUXQJTGRNHT-UHFFFAOYSA-N [4-[2-(4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)(C)C1=CC=C(OC#N)C=C1 AHZMUXQJTGRNHT-UHFFFAOYSA-N 0.000 description 1
- NOHQTLHHNIKWBA-UHFFFAOYSA-N [SiH4].NC(=O)N Chemical compound [SiH4].NC(=O)N NOHQTLHHNIKWBA-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 125000000218 acetic acid group Chemical group C(C)(=O)* 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000008360 acrylonitriles Chemical class 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 229910000329 aluminium sulfate Inorganic materials 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- GPBUGPUPKAGMDK-UHFFFAOYSA-N azanylidynemolybdenum Chemical compound [Mo]#N GPBUGPUPKAGMDK-UHFFFAOYSA-N 0.000 description 1
- RCMWGBKVFBTLCW-UHFFFAOYSA-N barium(2+);dioxido(dioxo)molybdenum Chemical compound [Ba+2].[O-][Mo]([O-])(=O)=O RCMWGBKVFBTLCW-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- DMVOXQPQNTYEKQ-UHFFFAOYSA-N biphenyl-4-amine Chemical compound C1=CC(N)=CC=C1C1=CC=CC=C1 DMVOXQPQNTYEKQ-UHFFFAOYSA-N 0.000 description 1
- YXTPWUNVHCYOSP-UHFFFAOYSA-N bis($l^{2}-silanylidene)molybdenum Chemical compound [Si]=[Mo]=[Si] YXTPWUNVHCYOSP-UHFFFAOYSA-N 0.000 description 1
- TUQQUUXMCKXGDI-UHFFFAOYSA-N bis(3-aminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(N)C=CC=2)=C1 TUQQUUXMCKXGDI-UHFFFAOYSA-N 0.000 description 1
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- LGLOITKZTDVGOE-UHFFFAOYSA-N boranylidynemolybdenum Chemical compound [Mo]#B LGLOITKZTDVGOE-UHFFFAOYSA-N 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 229940043232 butyl acetate Drugs 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- LNEUSAPFBRDCPM-UHFFFAOYSA-N carbamimidoylazanium;sulfamate Chemical compound NC(N)=N.NS(O)(=O)=O LNEUSAPFBRDCPM-UHFFFAOYSA-N 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 description 1
- FUPMSLTYEIZSLZ-UHFFFAOYSA-N cobalt;naphthalene-1-carboxylic acid Chemical compound [Co].C1=CC=C2C(C(=O)O)=CC=CC2=C1 FUPMSLTYEIZSLZ-UHFFFAOYSA-N 0.000 description 1
- 238000011284 combination treatment Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- UKJLNMAFNRKWGR-UHFFFAOYSA-N cyclohexatrienamine Chemical group NC1=CC=C=C[CH]1 UKJLNMAFNRKWGR-UHFFFAOYSA-N 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- SOCTUWSJJQCPFX-UHFFFAOYSA-N dichromate(2-) Chemical compound [O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O SOCTUWSJJQCPFX-UHFFFAOYSA-N 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- XQRLCLUYWUNEEH-UHFFFAOYSA-L diphosphonate(2-) Chemical compound [O-]P(=O)OP([O-])=O XQRLCLUYWUNEEH-UHFFFAOYSA-L 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000002296 dynamic light scattering Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 150000002220 fluorenes Chemical class 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 150000004693 imidazolium salts Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000012796 inorganic flame retardant Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- CPTIBDHUFVHUJK-NZYDNVMFSA-N mitopodozide Chemical compound C1([C@@H]2C3=CC=4OCOC=4C=C3[C@H](O)[C@@H](CO)[C@@H]2C(=O)NNCC)=CC(OC)=C(OC)C(OC)=C1 CPTIBDHUFVHUJK-NZYDNVMFSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910021343 molybdenum disilicide Inorganic materials 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- JKQOBWVOAYFWKG-UHFFFAOYSA-N molybdenum trioxide Chemical compound O=[Mo](=O)=O JKQOBWVOAYFWKG-UHFFFAOYSA-N 0.000 description 1
- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical compound CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 description 1
- OKBVMLGZPNDWJK-UHFFFAOYSA-N naphthalene-1,4-diamine Chemical compound C1=CC=C2C(N)=CC=C(N)C2=C1 OKBVMLGZPNDWJK-UHFFFAOYSA-N 0.000 description 1
- GOGZBMRXLADNEV-UHFFFAOYSA-N naphthalene-2,6-diamine Chemical compound C1=C(N)C=CC2=CC(N)=CC=C21 GOGZBMRXLADNEV-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- VMPITZXILSNTON-UHFFFAOYSA-N o-anisidine Chemical compound COC1=CC=CC=C1N VMPITZXILSNTON-UHFFFAOYSA-N 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 150000002916 oxazoles Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 229920001596 poly (chlorostyrenes) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006389 polyphenyl polymer Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920000137 polyphosphoric acid Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical class COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- MIROPXUFDXCYLG-UHFFFAOYSA-N pyridine-2,5-diamine Chemical compound NC1=CC=C(N)N=C1 MIROPXUFDXCYLG-UHFFFAOYSA-N 0.000 description 1
- VHNQIURBCCNWDN-UHFFFAOYSA-N pyridine-2,6-diamine Chemical compound NC1=CC=CC(N)=N1 VHNQIURBCCNWDN-UHFFFAOYSA-N 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- TVXXNOYZHKPKGW-UHFFFAOYSA-N sodium molybdate (anhydrous) Chemical compound [Na+].[Na+].[O-][Mo]([O-])(=O)=O TVXXNOYZHKPKGW-UHFFFAOYSA-N 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- 229950000244 sulfanilic acid Drugs 0.000 description 1
- LTURHSAEWJPFAA-UHFFFAOYSA-N sulfuric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OS(O)(=O)=O.NC1=NC(N)=NC(N)=N1 LTURHSAEWJPFAA-UHFFFAOYSA-N 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- QQOWHRYOXYEMTL-UHFFFAOYSA-N triazin-4-amine Chemical compound N=C1C=CN=NN1 QQOWHRYOXYEMTL-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000006839 xylylene group Chemical group 0.000 description 1
- 235000014692 zinc oxide Nutrition 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C09D179/085—Unsaturated polyimide precursors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/325—Layered products comprising a layer of synthetic resin comprising polyolefins comprising polycycloolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4042—Imines; Imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08L79/085—Unsaturated polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
- B32B2260/023—Two or more layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/102—Oxide or hydroxide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/536—Hardness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/726—Permeability to liquids, absorption
- B32B2307/7265—Non-permeable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
- Y10T442/2631—Coating or impregnation provides heat or fire protection
- Y10T442/2721—Nitrogen containing
Abstract
Description
实施例1 | 实施例2 | 实施例3 | 实施例4 | 实施例5 | 实施例6 | |
热固化性树脂组合物(质量份) | ||||||
(A)具有不饱和马来酰亚胺基的树脂组合物 | ||||||
A-1 | 50 | 49 | ||||
A-2 | 50 | 50 | ||||
A-3 | 50 | |||||
A-4 | 49 | |||||
(B)热固化性树脂 | ||||||
酚醛清漆型氰酸酯树脂(PT-30) | 49.5 | 49.5 | ||||
双酚A二氰酸酯预聚物(BA230) | 49.5 | |||||
4官能萘型环氧树脂(EXA-4710) | 49.5 | |||||
联苯芳烷基型环氧树脂(NC-3000-H) | 49.5 | 49.5 | ||||
(C)改性咪唑 | ||||||
异氰酸酯掩蔽的咪唑(G8009L) | 0.5 | 0.5 | 0.5 | 0.5 | ||
环氧基掩蔽的咪唑(P200H50) | 0.5 | 0.5 | ||||
(D)具有酸性取代基的胺化合物 | ||||||
对氨基苯酚 | 1 | 1 | ||||
(E)无机填充材料 | ||||||
熔融二氧化硅(SC2050-KC) | 50 | |||||
氢氧化铝(HP-360) | ||||||
薄水铝矿(BMT-3LV) | ||||||
(F)钼化合物 | ||||||
钼酸锌(KEMGAR1100) | 10 | |||||
测定评价结果 | ||||||
清漆 | ||||||
(1)固化性(直发生凝胶化的时间:T0秒) | 420 | 450 | 500 | 470 | 400 | 450 |
(2)保存稳定性(在40℃保管3天后:T1秒) | 415 | 446 | 498 | 466 | 398 | 445 |
保存稳定率(%)=T1/T0 | 98.8 | 99.1 | 99.6 | 99.1 | 99.5 | 98.9 |
覆铜层压板 | ||||||
(1)耐热性(玻璃化温度:℃) | 220 | 210 | 220 | 220 | 220 | 210 |
(2)热膨胀率(ppm/℃) | 50 | 50 | 50 | 50 | 50 | 28 |
(3)铜箔粘接性(kN/m) | 1.3 | 1.2 | 1.3 | 1.3 | 1.2 | 1.2 |
(4)吸湿性(吸水率:%) | 0.6 | 0.6 | 0.6 | 0.6 | 0.5 | 0.5 |
(5)耐化学药品性(重量变化率:质量%) | ||||||
18质量%盐酸 | -0.006 | -0.006 | -0.006 | -0.006 | -0.006 | -0.007 |
10质量%NaOH水溶液 | -0.006 | -0.008 | -0.008 | -0.008 | -0.008 | -0.009 |
实施例7 | 实施例8 | 实施例9 | 实施例10 | 实施例11 | 实施例12 | |
热固化性树脂组合物(质量份) | ||||||
(A)具有不饱和马来酰亚胺基的树脂组合物 | ||||||
A-2 | 49 | 48 | ||||
A-3 | 49 | 49 | ||||
A-4 | 49 | |||||
A-5 | 49 | |||||
(B)热固化性树脂 | ||||||
酚醛清漆型氰酸酯树脂(PT-30) | ||||||
双酚A二氰酸酯预聚物(BA230) | 20 | |||||
4官能萘型环氧树脂(EXA-4710) | 49.5 | 29.5 | 20 | 49 | ||
联苯芳烷基型环氧树脂(NC-3000-H) | 29.5 | 49.5 | 49 | |||
(C)改性咪唑 | ||||||
异氰酸酯掩蔽的咪唑(G8009L) | 0.5 | 0.5 | 0.5 | 0.5 | 1.0 | 1.0 |
环氧基掩蔽的咪唑(P200H50) | ||||||
(D)具有酸性取代基的胺化合物 | ||||||
对氨基苯酚 | 1 | 1 | 1 | 2 | 1 | 1 |
(E)无机填充材料 | ||||||
熔融二氧化硅(SC2050-KC) | 50 | 50 | 50 | 50 | 50 | 50 |
氢氧化铝(HP-360) | 50 | 50 | ||||
薄水铝矿(BMT-3LV) | 50 | 50 | 50 | 60 | ||
(F)钼化合物 | ||||||
钼酸锌(KEMGAR1100) | 10 | 10 | 10 | 10 | 10 | |
测定评价结果 | ||||||
清漆 | ||||||
(1)固化性(直至发生凝胶化的时间:T0秒) | 450 | 450 | 440 | 440 | 400 | 400 |
(2)保存稳定性(在40℃保管3天后:T1秒) | 447 | 447 | 436 | 435 | 396 | 396 |
保存稳定率(%)=T1/T0 | 99.3 | 99.3 | 99.1 | 98.9 | 99.0 | 99.0 |
覆铜层压板 | ||||||
(1)耐热性(玻璃化温度:℃) | 210 | 230 | 230 | 220 | 220 | 230 |
(2)热膨胀率(ppm/℃) | 24 | 23 | 21 | 23 | 22 | 22 |
(3)铜箔粘接性(kN/m) | 1.2 | 1.3 | 1.3 | 1.4 | 1.4 | 1.2 |
(4)吸湿性(吸水率:%) | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 |
(5)耐化学药品性(重量变化率:质量%) | ||||||
18质量%盐酸 | -0.007 | -0.007 | -0.006 | -0.007 | -0.006 | -0.007 |
10质量%NaOH水溶液 | -0.008 | -0.008 | -0.008 | -0.009 | -0.007 | -0.008 |
比较例1 | 比较例2 | 比较例3 | 比较例4 | 比较例5 | 比较例6 | |
热固化性树脂组合物(质量份) | ||||||
(A)具有不饱和马来酰亚胺基的树脂组合物 | ||||||
A-1 | 50 | 50 | ||||
A-2 | 49 | 49 | ||||
A-5 | 50 | |||||
A-6 | 49 | |||||
(B)热固化性树脂 | ||||||
酚醛清漆型氰酸酯树脂(PT-30) | 50 | |||||
双酚A二氰酸酯预聚物(BA230) | 49.5 | |||||
4官能萘型环氧树脂(EXA-4710) | 49.5 | 49.5 | ||||
联苯芳烷基型环氧树脂(NC-3000-H) | 49.5 | 49 | ||||
(D)具有酸性取代基的胺化合物 | ||||||
对氨基苯酚 | 1 | 1 | 1 | |||
(E)无机填充材料 | ||||||
熔融二氧化硅(SC2050-KC) | 50 | 50 | 50 | 50 | ||
氢氧化铝(HP-360) | 50 | |||||
薄水铝矿(BMT-3LV) | 50 | 50 | ||||
(F)钼化合物 | ||||||
钼酸锌(KEMGAR1100) | 10 | 10 | 10 | 10 | 10 | |
固化促进剂(未改性咪唑) | ||||||
2-苯基咪唑(2PZ) | 0.5 | 0.5 | ||||
2-乙基-4-甲基咪唑(2E4MZ) | 0.5 | 0.5 | 0.5 | |||
测定评价结果 | ||||||
清漆 | ||||||
(1)固化性(直至发生凝胶化的时间:T0秒) | 600 | 400 | 550 | 400 | 350 | 350 |
(2)保存稳定性(在40℃保管3天后:T1秒) | 550 | 250 | 500 | 220 | 200 | 180 |
保存稳定率(%)=(T0-T1)/T0 | 91.7 | 62.5 | 90.9 | 50.0 | 57.1 | 51.4 |
覆铜层压板 | ||||||
(1)耐热性(玻璃化温度:℃) | 180 | 180 | 170 | 180 | 140 | 150 |
(2)热膨胀率(ppm/℃) | 66 | 59 | 40 | 35 | 40 | 40 |
(8)铜箔粘接性(kN/m) | 1.0 | 1.2 | 1.2 | 1.1 | 0.8 | 1.0 |
(4)吸湿性(吸水率:%) | 0.7 | 0.6 | 0.5 | 0.5 | 0.8 | 0.7 |
(5)耐化学药品性(重量变化率:质量%) | ||||||
18质量%盐酸 | -0.015 | -0.007 | -0.015 | -0.007 | -0.020 | -0.015 |
10质量%NaOH水溶液 | -0.020 | -0.008 | -0.040 | -0.009 | -0.040 | -0.032 |
实施例13 | 实施例14 | 实施例15 | 实施例16 | 实施例17 | 实施例18 | |
热固化性树脂组合物(质量份) | ||||||
(A)具有不饱和马来酰亚胺基的树脂组合物 | ||||||
A-7 | 50 | |||||
A-8 | 50 | 50 | ||||
A-9 | 50 | 70 | ||||
A-10 | 50 | |||||
(B)热固化性树脂 | ||||||
联苯芳烷基型环氧树脂(NC-3000-H) | 30 | |||||
HP-4032D | 49.5 | |||||
HSN-175 | 30 | |||||
EP-806 | 20 | |||||
N-770 | 30 | |||||
YX-8800 | 30 | |||||
(C)改性咪唑 | ||||||
异氰酸酯掩蔽的咪唑(G8009L) | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 |
(E)无机填充材料 | ||||||
熔融二氧化硅(SC2050-KC) | 40 | 40 | 40 | 40 | 40 | 40 |
(G)含磷化合物 | ||||||
HCA-HQ | 3 | 3 | 3 | 3 | 3 | 3 |
(H)可化学粗化的化合物 | ||||||
XER-91 | 1 | 1 | 1 | 1 | 1 | 1 |
(1)环氧固化剂 | ||||||
LA-3018 | 15 | 19.5 | 18.5 | 4.5 | 4.5 | |
双氰胺 | 1 | |||||
苯并胍胺 | 4.5 | 5 | 5 | |||
磷原子含有率 | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 |
测定评价结果 | ||||||
清漆 | ||||||
(1)固化性(直至发生凝胶化的时间:T0秒) | 480 | 530 | 500 | 550 | 580 | 560 |
(2)保存稳定性(在40℃保管3天后:T1秒) | 479 | 528 | 497 | 549 | 578 | 559 |
保存稳定率(%)=T1/T0 | 99.6 | 99.6 | 99.4 | 99.8 | 99.7 | 99.8 |
覆铜层压板 | ||||||
(1)耐热性(玻璃化温度:℃) | 240 | 260 | 260 | 260 | 270 | 240 |
(2)热膨胀率(ppm/℃) | 20 | 26 | 28 | 30 | 31 | 33 |
(3)铜箔粘接性(kN/m) | 1.3 | 1.3 | 1.3 | 1.3 | 1.2 | 1.3 |
(4)吸湿性(吸水率:%) | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 |
(5)耐化学药品性(重量变化率:质量%) | ||||||
18质量%盐酸 | -0.008 | -0.009 | -0.008 | -0.008 | -0.008 | -0.009 |
10质量%NaOH水溶液 | -0.025 | -0.020 | -0.020 | -0.015 | -0.025 | -0.020 |
实施例19 | 实施例20 | 实施例21 | 实施例22 | 实施例23 | 实施例24 | |
热固化性树脂组合物(质量份) | ||||||
(A)具有不饱和马来酰亚胺基的树脂组合物 | ||||||
A-10 | 50 | 70 | ||||
A-11 | 50 | |||||
A-12 | 50 | |||||
A-13 | 50 | |||||
A-14 | 50 | |||||
(B)热固化性树脂 | ||||||
HP-4032D | 35 | |||||
HSN-175 | 30 | |||||
HSN-375 | 20 | 30 | ||||
YX-4000 | 30 | |||||
YX-8800 | 30 | |||||
(C)改性咪唑 | ||||||
异氰酸酯掩蔽的咪唑(G8009L) | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 |
(E)无机填充材料 | ||||||
熔融二氧化硅(SC2050-KC) | 40 | 40 | 40 | 40 | 40 | 40 |
(G)含磷化合物 | ||||||
HCA-HQ | 3 | 3 | 5 | 3 | 3 | |
ZX-1548-3 | 10 | |||||
(H)可化学粗化的化合物 | ||||||
XER-91 | 1 | 1 | 1 | 1 | 1 | 1 |
AC3832 | 1 | |||||
(I)环氧固化剂 | ||||||
LA-3018 | 13.5 | 9.5 | 19.5 | 19.5 | 15 | |
双氰胺 | 1 | 5 | 4.5 | |||
苯并胍胺 | 5 | |||||
磷原子含有率 | 0.3 | 0.3 | 0.3 | 0.5 | 0.3 | 0.3 |
测定评价结果 | ||||||
清漆 | ||||||
(1)固化性(直至发生凝胶化的时间:T0秒) | 530 | 600 | 530 | 470 | 500 | 480 |
(2)保存稳定性(在40℃保管3天后:T1秒) | 528 | 597 | 526 | 468 | 497 | 477 |
保存稳定率(%)=T1/T0 | 99.6 | 99.5 | 99.2 | 99.6 | 99.4 | 99.4 |
覆铜层压板 | ||||||
(1)耐热性(玻璃化温度:℃) | 240 | 260 | 260 | 260 | 260 | 240 |
(2)热膨胀率(ppm/℃) | 32 | 28 | 28 | 26 | 26 | 32 |
(3)铜箔粘接性(kN/m) | 1.3 | 1.2 | 1.3 | 1.3 | 1.3 | 1.3 |
(4)吸湿性(吸水率:%) | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 |
(5)耐化学药品性(重量变化率:质量%) | ||||||
18质量%盐酸 | -0.010 | -0.009 | -0.009 | -0.008 | -0.008 | -0.008 |
10质量%NaOH水溶液 | -0.020 | -0.025 | -0.025 | -0.020 | -0.020 | -0.020 |
实施例25 | 实施例26 | 实施例27 | 实施例28 | 实施例29 | 实施例30 | 实施例31 | |
热固化性树脂组合物(质量份) | |||||||
(A)具有不饱和马来酰亚胺基的树脂组合物 | |||||||
A-14 | 90 | ||||||
A-15 | 50 | 50 | 50 | ||||
A-16 | 50 | 70 | |||||
A-17 | 50 | ||||||
(B)热固化性树脂 | |||||||
联苯芳烷基型环氧树脂(NC-3000-H) | 49.5 | 30 | |||||
HP-4032D | 5 | 35 | 20 | ||||
HSN-175 | 30 | 30 | |||||
HSN-375 | |||||||
(C)改性咪唑 | |||||||
异氰酸酯掩蔽的咪唑(G8009L) | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 |
(E)无机填充材料 | |||||||
熔融二氧化硅(SC2050-KC) | 40 | 40 | 40 | 40 | 40 | 40 | |
(G)含磷化合物 | |||||||
HCA-HQ | 3 | 5 | 3 | 3 | |||
ZX-1548-3 | 10 | ||||||
OP-930 | 3 | 3 | |||||
(H)可化学粗化的化合物 | |||||||
XER-91 | 1 | 1 | 1 | 1 | |||
KS-23Z | 1 | 1 | |||||
(I)环氧固化剂 | |||||||
LA-3018 | 19.5 | 19.5 | 19.5 | ||||
苯并胍胺 | 4.5 | 4.5 | |||||
磷原子含有率 | 0.3 | 0.7 | 0.3 | 0.7 | 0.5 | 0.3 | 0.3 |
测定评价结果 | |||||||
清漆 | |||||||
(1)固化性(直至发生凝胶化的时间:T0秒) | 560 | 400 | 390 | 370 | 380 | 400 | 370 |
(2)保存稳定性(在40℃保管3天后:T1秒) | 556 | 396 | 366 | 366 | 377 | 398 | 365 |
保存稳定率(%)=T1/T0 | 99.3 | 99.0 | 99.0 | 98.9 | 99.2 | 99.5 | 98.6 |
覆铜层压板 | |||||||
(1)耐热性(玻璃化温度:℃) | 290 | 210 | 230 | 220 | 230 | 240 | 220 |
(2)热膨胀率(ppm/℃) | 24 | 38 | 38 | 39 | 37 | 35 | 40 |
(3)铜箔粘接性(kN/m) | 1.1 | 1.0 | 1.0 | 1.1 | 1.1 | 1.2 | 1.1 |
(4)吸湿性(吸水率:%) | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.6 | 0.5 |
(5)耐化学药品性(重量变化率:质量%) | |||||||
18质量%盐酸 | -0.010 | -0.009 | -0.010 | -0.010 | -0.008 | -0.009 | -0.008 |
10质量%NaOH水溶液 | -0.030 | -0.025 | -0.020 | -0.025 | -0.020 | -0.025 | -0.015 |
Claims (12)
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009080424 | 2009-03-27 | ||
JP2009-080424 | 2009-03-27 | ||
JP2010-012543 | 2010-01-22 | ||
JP2010012543A JP5149917B2 (ja) | 2009-03-27 | 2010-01-22 | 熱硬化性樹脂組成物、並びにこれを用いたプリプレグ、積層板及び多層プリント配線板 |
JP2010021457A JP5614048B2 (ja) | 2010-02-02 | 2010-02-02 | 熱硬化性絶縁樹脂組成物、並びにこれを用いたプリプレグ、積層板及び多層プリント配線板 |
JP2010-021457 | 2010-02-02 | ||
PCT/JP2010/055392 WO2010110433A1 (ja) | 2009-03-27 | 2010-03-26 | 熱硬化性樹脂組成物、並びにこれを用いたプリプレグ、支持体付絶縁フィルム、積層板及びプリント配線板 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310506675.9A Division CN103626959A (zh) | 2009-03-27 | 2010-03-26 | 热固化性树脂组合物、以及使用了该组合物的预浸料、带支撑体的绝缘膜、层叠板及印刷布线板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102365310A true CN102365310A (zh) | 2012-02-29 |
CN102365310B CN102365310B (zh) | 2013-11-20 |
Family
ID=44814083
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010800141391A Active CN102365310B (zh) | 2009-03-27 | 2010-03-26 | 热固化性树脂组合物、以及使用了该组合物的预浸料、带支撑体的绝缘膜、层叠板及印刷布线板 |
CN201310506675.9A Pending CN103626959A (zh) | 2009-03-27 | 2010-03-26 | 热固化性树脂组合物、以及使用了该组合物的预浸料、带支撑体的绝缘膜、层叠板及印刷布线板 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310506675.9A Pending CN103626959A (zh) | 2009-03-27 | 2010-03-26 | 热固化性树脂组合物、以及使用了该组合物的预浸料、带支撑体的绝缘膜、层叠板及印刷布线板 |
Country Status (7)
Country | Link |
---|---|
US (2) | US20120077401A1 (zh) |
EP (1) | EP2412743B1 (zh) |
KR (2) | KR101733646B1 (zh) |
CN (2) | CN102365310B (zh) |
HK (1) | HK1165816A1 (zh) |
TW (2) | TWI488841B (zh) |
WO (1) | WO2010110433A1 (zh) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103493341A (zh) * | 2011-04-18 | 2014-01-01 | 三菱电机株式会社 | 旋转机线圈及其制造方法 |
CN103731980A (zh) * | 2014-01-24 | 2014-04-16 | 上海全可国际贸易有限公司 | 一种覆铜板 |
CN104066265A (zh) * | 2013-03-22 | 2014-09-24 | 叶云照 | 多层印刷电路板结构 |
CN104364312A (zh) * | 2012-03-30 | 2015-02-18 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料以及层叠板 |
CN104379635A (zh) * | 2012-05-11 | 2015-02-25 | 阿克隆聚合物系统有限公司 | 一种应用于电子设备的具有热稳定性的柔性基板 |
CN107109055A (zh) * | 2015-01-16 | 2017-08-29 | 日立化成株式会社 | 热固性树脂组合物、层间绝缘用树脂膜、复合膜、印刷布线板及其制造方法 |
CN111393854A (zh) * | 2012-10-19 | 2020-07-10 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料、层压板、以及印刷电路板 |
WO2020177167A1 (zh) * | 2019-03-01 | 2020-09-10 | 广东生益科技股份有限公司 | 无卤阻燃热固性树脂组合物、印刷电路用预浸料及覆金属层压板 |
TWI707928B (zh) * | 2017-07-10 | 2020-10-21 | 日商迪愛生股份有限公司 | 積層體、使用其之印刷配線板、可撓性印刷配線板及成形品 |
CN111886293A (zh) * | 2018-03-28 | 2020-11-03 | 太阳油墨制造株式会社 | 固化性树脂组合物、干膜、固化物和电子部件 |
CN111936575A (zh) * | 2018-03-30 | 2020-11-13 | 太阳油墨制造株式会社 | 固化性树脂组合物、干膜、固化物和电子部件 |
CN112106450A (zh) * | 2018-05-11 | 2020-12-18 | 昭和电工材料株式会社 | 导体基板、伸缩性配线基板及配线基板用伸缩性树脂膜 |
CN112105677A (zh) * | 2018-04-26 | 2020-12-18 | 琳得科株式会社 | 树脂组合物、树脂片及层叠体 |
CN112513142A (zh) * | 2018-07-18 | 2021-03-16 | 琳得科株式会社 | 树脂片及层叠体 |
CN112852257A (zh) * | 2016-05-25 | 2021-05-28 | 三菱铅笔株式会社 | 氟系树脂的非水系分散体、使用其的含氟系树脂的热固化树脂组合物和其固化物 |
CN113321888A (zh) * | 2016-07-05 | 2021-08-31 | 昭和电工材料株式会社 | 树脂组合物、树脂膜、预浸渍体、层叠板、多层印刷线路板及多层印刷线路板的制造方法 |
CN115819317A (zh) * | 2022-12-27 | 2023-03-21 | 苏州生益科技有限公司 | 活性酯化合物、树脂组合物 |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102656234B (zh) * | 2009-12-25 | 2015-06-17 | 日立化成工业株式会社 | 热固化性树脂组合物、树脂组合物清漆的制造方法、预浸料及层叠板 |
JP5576930B2 (ja) | 2010-03-26 | 2014-08-20 | パナソニック株式会社 | プリプレグ用エポキシ樹脂組成物、プリプレグ、及び多層プリント配線板 |
JP2012111930A (ja) * | 2010-11-01 | 2012-06-14 | Hitachi Chemical Co Ltd | 熱硬化性樹脂組成物、該熱硬化性樹脂組成物を用いたプリプレグ、積層板、及びプリント配線板 |
US8693203B2 (en) * | 2011-01-14 | 2014-04-08 | Harris Corporation | Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices |
WO2012099133A1 (ja) * | 2011-01-18 | 2012-07-26 | 日立化成工業株式会社 | 変性シリコーン化合物、これを用いた熱硬化性樹脂組成物、プリプレグ、積層板及びプリント配線板 |
US8735733B2 (en) * | 2011-01-18 | 2014-05-27 | Hitachi Chemical Company, Ltd. | Resin composition, prepreg laminate obtained with the same and printed-wiring board |
KR102127581B1 (ko) * | 2011-01-18 | 2020-06-26 | 히타치가세이가부시끼가이샤 | 수지 조성물 및 이것을 이용한 프리프레그, 적층판, 인쇄 배선판 |
CN103328578B (zh) * | 2011-01-18 | 2015-06-17 | 日立化成株式会社 | 树脂组合物、使用其的预浸料坯、层叠板及印刷布线板 |
JP5830718B2 (ja) * | 2011-05-02 | 2015-12-09 | パナソニックIpマネジメント株式会社 | 熱硬化性樹脂組成物、プリプレグ、積層板、金属箔張積層板、及び回路基板 |
JP5736944B2 (ja) * | 2011-05-11 | 2015-06-17 | 日立化成株式会社 | 熱硬化性樹脂組成物、プリプレグ及び積層板 |
US10645804B2 (en) * | 2011-07-07 | 2020-05-05 | Hitachi Chemical Company, Ltd. | Adhesive film, multilayer printed wiring board using adhesive film, and method for manufacturing multilayer printed wiring board |
CN102276961A (zh) * | 2011-07-22 | 2011-12-14 | 苏州生益科技有限公司 | 无卤无磷环氧树脂组合物及使用其制作的半固化片及层压板 |
JP6019883B2 (ja) * | 2012-07-25 | 2016-11-02 | 日立化成株式会社 | 熱硬化性樹脂組成物、これを用いたプリプレグ、積層板及び多層プリント配線板 |
US9819026B2 (en) * | 2013-01-31 | 2017-11-14 | Sanyo Electric Co., Ltd. | Positive electrode for non-aqueous electrolyte secondary battery and non-aqueous electrolyte secondary battery |
KR101513350B1 (ko) * | 2013-06-18 | 2015-04-17 | 삼성전기주식회사 | 인쇄회로기판용 절연필름 및 이를 이용한 제품 |
CN105408418B (zh) * | 2013-09-30 | 2017-04-26 | 株式会社Lg化学 | 用于半导体封装物的热固性树脂组合物以及使用其的半固化片和覆金属层压板 |
WO2015046921A1 (ko) * | 2013-09-30 | 2015-04-02 | 주식회사 엘지화학 | 반도체 패키지용 열경화성 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판 |
EP3056539B1 (en) * | 2013-10-11 | 2020-03-04 | Shengyi Technology Co., Ltd. | Thermosetting resin composition and use thereof |
TWI499627B (zh) * | 2013-10-11 | 2015-09-11 | Nanya Plastics Corp | A surface-coated inorganic filler molybdenum compound and use thereof |
KR20160106225A (ko) * | 2014-01-06 | 2016-09-12 | 주식회사 서울금속 | 절연기능을 갖는 나사 |
DE102014210483A1 (de) | 2014-06-03 | 2015-12-03 | Conti Temic Microelectronic Gmbh | Verfahren zum Herstellen einer Folienanordnung und entsprechende Folienanordnung |
KR102455920B1 (ko) * | 2015-01-13 | 2022-10-17 | 쇼와덴코머티리얼즈가부시끼가이샤 | 수지 조성물, 수지층 부착 지지체, 프리프레그, 적층판, 다층 프린트 배선판 및 밀리미터파 레이더용 프린트 배선판 |
JP6770509B2 (ja) | 2015-03-31 | 2020-10-14 | ナミックス株式会社 | 樹脂組成物、導電性樹脂組成物、接着剤、導電性接着剤、電極形成用ペースト、半導体装置 |
CN107710336A (zh) * | 2015-08-03 | 2018-02-16 | 古河电气工业株式会社 | 导电性组合物 |
CN108291122B (zh) | 2015-08-08 | 2021-01-05 | 设计分子有限公司 | 阴离子可固化组合物 |
US9931820B2 (en) * | 2015-12-21 | 2018-04-03 | Intel Corporation | Mold material for direct metallization |
CN107848081B (zh) * | 2015-12-25 | 2021-01-08 | 松下知识产权经营株式会社 | 膏状热固化性树脂组合物、半导体部件、半导体安装品、半导体部件的制造方法、半导体安装品的制造方法 |
JP7310944B2 (ja) * | 2016-07-20 | 2023-07-19 | 株式会社レゾナック | 樹脂組成物、樹脂層付き支持体、プリプレグ、積層板、多層プリント配線板及びミリ波レーダー用プリント配線板 |
JP7055994B2 (ja) * | 2016-07-20 | 2022-04-19 | 昭和電工マテリアルズ株式会社 | 樹脂組成物、樹脂層付き支持体、プリプレグ、積層板、多層プリント配線板及びミリ波レーダー用プリント配線板 |
US11214660B2 (en) | 2017-02-17 | 2022-01-04 | Showa Denko Materials Co., Ltd. | Prepreg, laminate, printed wiring board, coreless substrate, semiconductor package and method for producing coreless substrate |
JP6354884B1 (ja) | 2017-03-13 | 2018-07-11 | 横浜ゴム株式会社 | シアネートエステル樹脂組成物およびプリプレグ |
TWI765998B (zh) * | 2017-03-28 | 2022-06-01 | 日商昭和電工材料股份有限公司 | 無芯基板用預浸體、無芯基板及半導體封裝體 |
JP6421897B1 (ja) | 2017-05-10 | 2018-11-14 | 東レ株式会社 | エポキシ樹脂組成物、プリプレグ、繊維強化複合材料およびその製造方法 |
JP6934637B2 (ja) * | 2017-06-08 | 2021-09-15 | パナソニックIpマネジメント株式会社 | 樹脂組成物、プリプレグ、金属張積層板、プリント配線板、及び金属張積層板の製造方法 |
CN109082118B (zh) * | 2017-06-14 | 2021-02-09 | 台光电子材料(昆山)有限公司 | 一种树脂组合物及其制品 |
WO2018236993A1 (en) * | 2017-06-21 | 2018-12-27 | Lord Corporation | ALUMINUM COATING |
CN109111739B (zh) * | 2017-06-26 | 2020-12-01 | 中山台光电子材料有限公司 | 树脂组合物及由其制成的物品 |
CN111372579B (zh) | 2017-10-30 | 2023-08-22 | 神经孔疗法股份有限公司 | 取代的苯基磺酰基苯基三唑硫酮和其用途 |
KR20210007978A (ko) * | 2018-05-09 | 2021-01-20 | 쇼와덴코머티리얼즈가부시끼가이샤 | 지지체 부착 층간 절연층용 수지 필름, 다층 프린트 배선판 및 다층 프린트 배선판의 제조 방법 |
WO2020106678A1 (en) * | 2018-11-19 | 2020-05-28 | Bright Lite Structures Llc | High-strength low-heat release composites cross-reference to related applications |
EP3950149A4 (en) * | 2019-03-29 | 2022-12-07 | Kansai Paint Co., Ltd | COMPOSITION OF CATIONIC ELECTRODEPOSITION COATING MATERIAL |
EP4130094A4 (en) * | 2020-03-31 | 2024-04-17 | Namics Corp | CURING CATALYST, RESIN COMPOSITION, SEALANT MATERIAL, ADHESIVE AND CURED PRODUCT |
CN112724793B (zh) * | 2021-02-04 | 2021-11-30 | 浙江荣泰科技企业有限公司 | 一种绝缘水性环氧自粘漆及其制备方法 |
WO2024080195A1 (ja) * | 2022-10-12 | 2024-04-18 | 株式会社レゾナック | プリプレグ、積層板、プリント配線板及び半導体パッケージ |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6377928A (ja) * | 1986-09-22 | 1988-04-08 | Mitsubishi Petrochem Co Ltd | 熱硬化性樹脂組成物 |
JPH04351629A (ja) * | 1991-05-30 | 1992-12-07 | Hitachi Chem Co Ltd | 半導体封止用樹脂組成物 |
JPH07278258A (ja) * | 1994-04-11 | 1995-10-24 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物、接着剤シート、接着剤付き金属はく、ポリイミドフィルム及び金属はく張りポリイミドフィルム |
JP2001316564A (ja) * | 2000-04-28 | 2001-11-16 | Hitachi Chem Co Ltd | 絶縁樹脂組成物、銅箔付き絶縁材及び銅張り積層板 |
JP2004115552A (ja) * | 2002-09-24 | 2004-04-15 | Taoka Chem Co Ltd | 一液型液状エポキシ樹脂組成物 |
JP2007231125A (ja) * | 2006-02-28 | 2007-09-13 | Kaneka Corp | 熱硬化性樹脂組成物およびその利用 |
JP2007254709A (ja) * | 2005-11-29 | 2007-10-04 | Ajinomoto Co Inc | 多層プリント配線板の絶縁層用樹脂組成物 |
JP2007302843A (ja) * | 2006-05-15 | 2007-11-22 | Hitachi Chem Co Ltd | 硬化剤の製造法,及びこれを用いた熱硬化性樹脂組成物 |
WO2008153208A1 (ja) * | 2007-06-14 | 2008-12-18 | Ajinomoto Co., Inc. | 多層プリント配線板の層間絶縁用樹脂組成物 |
Family Cites Families (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6377927A (ja) * | 1986-09-19 | 1988-04-08 | Fujitsu Ltd | 半導体封止用成形材料 |
US4797455A (en) * | 1987-08-06 | 1989-01-10 | W. R. Grace & Co.-Conn. | Isocyanates blocked with 1-amino-alkyl imidazoles as epoxy curing agents |
JP2803055B2 (ja) | 1989-12-04 | 1998-09-24 | 東芝ケミカル株式会社 | 成形用耐熱性樹脂組成物 |
JP2803056B2 (ja) | 1989-12-04 | 1998-09-24 | 東芝ケミカル株式会社 | 耐熱性摺動用成形材料 |
JP2776056B2 (ja) | 1991-06-04 | 1998-07-16 | 日立化成工業株式会社 | ポリアミノビスマレイミド樹脂組成物及びそれを用いた銅張積層板の製造方法 |
JP2740990B2 (ja) | 1991-11-26 | 1998-04-15 | 株式会社日立製作所 | 低熱膨張性加圧成形用樹脂組成物 |
JP2956379B2 (ja) * | 1992-09-21 | 1999-10-04 | 日立化成工業株式会社 | エポキシ樹脂組成物、エポキシ樹脂プリプレグ及びエポキシ樹脂積層板 |
JP3372982B2 (ja) | 1993-03-12 | 2003-02-04 | 三井化学株式会社 | 熱硬化性樹脂組成物並びにそれを用いたプリプレグおよび積層板 |
JPH08134351A (ja) | 1994-11-02 | 1996-05-28 | Showa Highpolymer Co Ltd | 耐熱性樹脂組成物 |
JPH10212364A (ja) * | 1996-11-26 | 1998-08-11 | Ajinomoto Co Inc | 積層板用プリプレグ及びこれを用いたプリント配線板の製造方法 |
JP2000017148A (ja) | 1998-07-01 | 2000-01-18 | Ajinomoto Co Inc | 熱硬化性樹脂組成物及びこれを用いたプリント配線板用層間接着フィルム |
JP2000114727A (ja) | 1998-10-09 | 2000-04-21 | Ibiden Co Ltd | 多層プリント配線板 |
JP2000243864A (ja) | 1999-02-18 | 2000-09-08 | Seiko Epson Corp | 半導体装置及びその製造方法、回路基板並びに電子機器 |
JP3953234B2 (ja) * | 1999-06-30 | 2007-08-08 | 三井化学株式会社 | フレキシブルプリント配線板用接着剤組成物 |
WO2001018115A1 (en) | 1999-09-06 | 2001-03-15 | Sumitomo Bakelite Company Limited | Epoxy resin composition and semiconductor device |
JP2002212390A (ja) * | 2001-01-19 | 2002-07-31 | Hitachi Chem Co Ltd | 絶縁樹脂組成物、銅箔付き絶縁材および銅張積層板 |
JP4783984B2 (ja) | 2001-02-15 | 2011-09-28 | 日立化成工業株式会社 | 樹脂組成物およびその用途ならびにそれらの製造方法 |
US6492437B1 (en) * | 2001-06-21 | 2002-12-10 | National Starch And Chemical Investment Holding Corporation | Solvent-based process for manufacturing latent curing catalysts |
JP2003011269A (ja) * | 2001-06-28 | 2003-01-15 | Hitachi Chem Co Ltd | 銅箔付き絶縁材の製造方法 |
JP2003147171A (ja) | 2001-11-15 | 2003-05-21 | Hitachi Chem Co Ltd | 絶縁樹脂組成物の製造方法、絶縁樹脂組成物、該絶縁樹脂組成物を用いた銅箔付き絶縁材及び銅張積層板 |
JP3946626B2 (ja) | 2002-12-03 | 2007-07-18 | 住友ベークライト株式会社 | 樹脂組成物、プリプレグおよびそれを用いたプリント配線板 |
CN1823359A (zh) | 2003-07-14 | 2006-08-23 | 皇家飞利浦电子股份有限公司 | 电泳显示面板 |
JP2005248164A (ja) | 2004-02-02 | 2005-09-15 | Tamura Kaken Co Ltd | 熱硬化性樹脂組成物およびフィルム付き製品 |
KR101182026B1 (ko) * | 2004-02-25 | 2012-09-11 | 가부시키가이샤 가네카 | 열경화성 수지 조성물 및 그 용도 |
CN1938357A (zh) * | 2004-04-19 | 2007-03-28 | 株式会社钟化 | 热固性树脂组合物、以及使用该组合物形成的叠层体、电路基板 |
WO2005118604A1 (en) | 2004-05-28 | 2005-12-15 | Dow Global Technologies Inc. | Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers |
US20080200636A1 (en) * | 2005-02-25 | 2008-08-21 | Masataka Nakanishi | Epoxy Resin, Hardenable Resin Composition Containing the Same and Use Thereof |
US20070237092A1 (en) | 2005-09-19 | 2007-10-11 | Krishna Balachandran | Method of establishing and maintaining distributed spectral awareness in a wireless communication system |
KR101288703B1 (ko) | 2005-09-30 | 2013-07-22 | 스미토모 베이클리트 컴퍼니 리미티드 | 반도체 봉지용 에폭시 수지 조성물 및 반도체 장치 |
CN101277992A (zh) * | 2005-09-30 | 2008-10-01 | 住友电木株式会社 | 环氧树脂组合物和半导体器件 |
TWI410442B (zh) | 2005-11-29 | 2013-10-01 | Ajinomoto Kk | A resin composition for an insulating layer of a multilayer printed circuit board |
JP5298462B2 (ja) * | 2006-06-06 | 2013-09-25 | 日立化成株式会社 | 酸性置換基と不飽和マレイミド基を有する硬化剤の製造法並びに熱硬化性樹脂組成物、プリプレグ及び積層板 |
WO2007142140A1 (ja) * | 2006-06-06 | 2007-12-13 | Hitachi Chemical Company, Ltd. | 酸性置換基と不飽和マレイミド基を有する硬化剤の製造法並びに熱硬化性樹脂組成物、プリプレグ及び積層板 |
JP5352891B2 (ja) * | 2006-06-29 | 2013-11-27 | 住友化学園芸株式会社 | 害虫忌避剤 |
CN102558505A (zh) | 2006-09-29 | 2012-07-11 | 日立化成工业株式会社 | 热固性树脂组合物及用其形成的预浸料及层叠板 |
CN102176808B (zh) | 2007-01-29 | 2014-04-09 | 住友电木株式会社 | 层叠体、基板的制造方法、基板及半导体装置 |
JP5293292B2 (ja) * | 2008-03-12 | 2013-09-18 | 日立化成株式会社 | 導電性接着ペースト及び電子部品搭載基板 |
JP6547478B2 (ja) * | 2014-09-02 | 2019-07-24 | 東レ株式会社 | エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 |
-
2010
- 2010-03-26 KR KR1020117022298A patent/KR101733646B1/ko active
- 2010-03-26 TW TW099109322A patent/TWI488841B/zh active
- 2010-03-26 US US13/258,763 patent/US20120077401A1/en not_active Abandoned
- 2010-03-26 CN CN2010800141391A patent/CN102365310B/zh active Active
- 2010-03-26 CN CN201310506675.9A patent/CN103626959A/zh active Pending
- 2010-03-26 WO PCT/JP2010/055392 patent/WO2010110433A1/ja active Application Filing
- 2010-03-26 EP EP10756229.0A patent/EP2412743B1/en active Active
- 2010-03-26 KR KR1020177011785A patent/KR102142753B1/ko active IP Right Grant
- 2010-03-26 TW TW103143351A patent/TWI551587B/zh active
-
2012
- 2012-06-29 HK HK12106371.2A patent/HK1165816A1/xx unknown
-
2015
- 2015-03-31 US US14/675,023 patent/US10119047B2/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6377928A (ja) * | 1986-09-22 | 1988-04-08 | Mitsubishi Petrochem Co Ltd | 熱硬化性樹脂組成物 |
JPH04351629A (ja) * | 1991-05-30 | 1992-12-07 | Hitachi Chem Co Ltd | 半導体封止用樹脂組成物 |
JPH07278258A (ja) * | 1994-04-11 | 1995-10-24 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物、接着剤シート、接着剤付き金属はく、ポリイミドフィルム及び金属はく張りポリイミドフィルム |
JP2001316564A (ja) * | 2000-04-28 | 2001-11-16 | Hitachi Chem Co Ltd | 絶縁樹脂組成物、銅箔付き絶縁材及び銅張り積層板 |
JP2004115552A (ja) * | 2002-09-24 | 2004-04-15 | Taoka Chem Co Ltd | 一液型液状エポキシ樹脂組成物 |
JP2007254709A (ja) * | 2005-11-29 | 2007-10-04 | Ajinomoto Co Inc | 多層プリント配線板の絶縁層用樹脂組成物 |
JP2007231125A (ja) * | 2006-02-28 | 2007-09-13 | Kaneka Corp | 熱硬化性樹脂組成物およびその利用 |
JP2007302843A (ja) * | 2006-05-15 | 2007-11-22 | Hitachi Chem Co Ltd | 硬化剤の製造法,及びこれを用いた熱硬化性樹脂組成物 |
WO2008153208A1 (ja) * | 2007-06-14 | 2008-12-18 | Ajinomoto Co., Inc. | 多層プリント配線板の層間絶縁用樹脂組成物 |
Cited By (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103493341A (zh) * | 2011-04-18 | 2014-01-01 | 三菱电机株式会社 | 旋转机线圈及其制造方法 |
US9331536B2 (en) | 2011-04-18 | 2016-05-03 | Mitsubishi Electric Corporation | Rotator coil and method of manufacturing the same |
TWI572651B (zh) * | 2012-03-30 | 2017-03-01 | 三菱瓦斯化學股份有限公司 | 樹脂組成物、預浸體及疊層板 |
US9944787B2 (en) | 2012-03-30 | 2018-04-17 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg and laminate |
CN104364312A (zh) * | 2012-03-30 | 2015-02-18 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料以及层叠板 |
CN104364312B (zh) * | 2012-03-30 | 2017-03-01 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料以及层叠板 |
CN104379635A (zh) * | 2012-05-11 | 2015-02-25 | 阿克隆聚合物系统有限公司 | 一种应用于电子设备的具有热稳定性的柔性基板 |
CN111393854A (zh) * | 2012-10-19 | 2020-07-10 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料、层压板、以及印刷电路板 |
CN111393854B (zh) * | 2012-10-19 | 2022-02-25 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料、层压板、以及印刷电路板 |
CN104066265A (zh) * | 2013-03-22 | 2014-09-24 | 叶云照 | 多层印刷电路板结构 |
CN103731980A (zh) * | 2014-01-24 | 2014-04-16 | 上海全可国际贸易有限公司 | 一种覆铜板 |
CN107109055A (zh) * | 2015-01-16 | 2017-08-29 | 日立化成株式会社 | 热固性树脂组合物、层间绝缘用树脂膜、复合膜、印刷布线板及其制造方法 |
US10544305B2 (en) | 2015-01-16 | 2020-01-28 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and method for producing same |
TWI696661B (zh) * | 2015-01-16 | 2020-06-21 | 日商日立化成股份有限公司 | 熱硬化性樹脂組成物、層間絕緣用樹脂薄膜、複合薄膜、印刷線路板及其製造方法 |
CN112852257A (zh) * | 2016-05-25 | 2021-05-28 | 三菱铅笔株式会社 | 氟系树脂的非水系分散体、使用其的含氟系树脂的热固化树脂组合物和其固化物 |
CN112852257B (zh) * | 2016-05-25 | 2022-06-07 | 三菱铅笔株式会社 | 氟系树脂的非水系分散体、使用其的含氟系树脂的热固化树脂组合物和其固化物 |
CN113321888A (zh) * | 2016-07-05 | 2021-08-31 | 昭和电工材料株式会社 | 树脂组合物、树脂膜、预浸渍体、层叠板、多层印刷线路板及多层印刷线路板的制造方法 |
CN113321888B (zh) * | 2016-07-05 | 2022-12-23 | 昭和电工材料株式会社 | 树脂组合物、树脂膜、预浸渍体、层叠板、多层印刷线路板及多层印刷线路板的制造方法 |
TWI707928B (zh) * | 2017-07-10 | 2020-10-21 | 日商迪愛生股份有限公司 | 積層體、使用其之印刷配線板、可撓性印刷配線板及成形品 |
CN111886293A (zh) * | 2018-03-28 | 2020-11-03 | 太阳油墨制造株式会社 | 固化性树脂组合物、干膜、固化物和电子部件 |
CN111936575A (zh) * | 2018-03-30 | 2020-11-13 | 太阳油墨制造株式会社 | 固化性树脂组合物、干膜、固化物和电子部件 |
CN112105677A (zh) * | 2018-04-26 | 2020-12-18 | 琳得科株式会社 | 树脂组合物、树脂片及层叠体 |
CN112105677B (zh) * | 2018-04-26 | 2023-03-28 | 琳得科株式会社 | 树脂组合物、树脂片及层叠体 |
CN112106450A (zh) * | 2018-05-11 | 2020-12-18 | 昭和电工材料株式会社 | 导体基板、伸缩性配线基板及配线基板用伸缩性树脂膜 |
CN112513142A (zh) * | 2018-07-18 | 2021-03-16 | 琳得科株式会社 | 树脂片及层叠体 |
CN112513142B (zh) * | 2018-07-18 | 2023-08-18 | 琳得科株式会社 | 树脂片及层叠体 |
WO2020177167A1 (zh) * | 2019-03-01 | 2020-09-10 | 广东生益科技股份有限公司 | 无卤阻燃热固性树脂组合物、印刷电路用预浸料及覆金属层压板 |
CN115819317A (zh) * | 2022-12-27 | 2023-03-21 | 苏州生益科技有限公司 | 活性酯化合物、树脂组合物 |
CN115819317B (zh) * | 2022-12-27 | 2024-03-08 | 苏州生益科技有限公司 | 活性酯化合物、树脂组合物 |
Also Published As
Publication number | Publication date |
---|---|
CN103626959A (zh) | 2014-03-12 |
EP2412743A4 (en) | 2015-04-01 |
US20120077401A1 (en) | 2012-03-29 |
CN102365310B (zh) | 2013-11-20 |
TW201509910A (zh) | 2015-03-16 |
US10119047B2 (en) | 2018-11-06 |
TWI488841B (zh) | 2015-06-21 |
KR20120012782A (ko) | 2012-02-10 |
KR101733646B1 (ko) | 2017-05-10 |
EP2412743B1 (en) | 2020-08-19 |
HK1165816A1 (en) | 2012-10-12 |
WO2010110433A1 (ja) | 2010-09-30 |
KR20170051537A (ko) | 2017-05-11 |
TW201105632A (en) | 2011-02-16 |
US20150203715A1 (en) | 2015-07-23 |
KR102142753B1 (ko) | 2020-09-14 |
TWI551587B (zh) | 2016-10-01 |
EP2412743A1 (en) | 2012-02-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102365310B (zh) | 热固化性树脂组合物、以及使用了该组合物的预浸料、带支撑体的绝缘膜、层叠板及印刷布线板 | |
JP5149917B2 (ja) | 熱硬化性樹脂組成物、並びにこれを用いたプリプレグ、積層板及び多層プリント配線板 | |
EP3246352B1 (en) | Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar | |
CN103328543B (zh) | 改性硅酮化合物,使用其的热固化性树脂组合物、预浸料坯、层叠板和印刷布线板 | |
JP5614048B2 (ja) | 熱硬化性絶縁樹脂組成物、並びにこれを用いたプリプレグ、積層板及び多層プリント配線板 | |
CN104812805A (zh) | 硅氧烷化合物、改性酰亚胺树脂、热固性树脂组合物、预浸渍坯、带有树脂的膜、层叠板、多层印刷布线板及半导体封装件 | |
TW202003691A (zh) | 樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片及印刷配線板 | |
TW201829584A (zh) | 樹脂組成物、積層板及多層印刷配線板 | |
JP6756108B2 (ja) | 樹脂フィルム、支持体付き樹脂フィルム、プリプレグ、金属張積層板及び多層印刷配線板 | |
CN109988288B (zh) | 树脂组合物以及使用该组合物所制得的预浸渍片、金属箔积层板与印刷电路板 | |
CN108047718B (zh) | 马来酰亚胺树脂组合物、预浸料、层压板和印刷电路板 | |
KR20120079986A (ko) | 수지 조성물, 이를 이용한 프리프레그 및 프린트 배선판 | |
CN109415551A (zh) | 树脂组合物、树脂膜、层叠板、多层印刷线路板及多层印刷线路板的制造方法 | |
KR20200060498A (ko) | 말레이미드 수지 조성물, 프리프레그, 적층판과 인쇄회로기판 | |
JP6819921B2 (ja) | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板 | |
JP5914988B2 (ja) | 熱硬化性樹脂組成物を用いたプリプレグ、積層板、及びプリント配線板 | |
TW201139549A (en) | Resin composition, prepreg, and metal-clad laminate | |
CN106751518B (zh) | 一种高频树脂组合物及使用其制作的半固化片和层压板 | |
JP5736944B2 (ja) | 熱硬化性樹脂組成物、プリプレグ及び積層板 | |
JP2007273616A (ja) | 多層プリント配線板の製造方法 | |
JP6299433B2 (ja) | 熱硬化性樹脂組成物、プリプレグ、樹脂付フィルム、積層板、多層プリント配線板及び半導体パッケージ | |
JP7102682B2 (ja) | 樹脂組成物、樹脂層付き支持体、プリプレグ、積層板、多層プリント配線板及びミリ波レーダー用プリント配線板 | |
JP5407678B2 (ja) | 熱硬化性絶縁樹脂組成物、並びにこれを用いた支持体付絶縁フィルム、プリプレグ、積層板及び多層プリント配線板 | |
JP6829808B2 (ja) | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板 | |
JP2003246016A (ja) | プリプレグシートと積層構造体 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
REG | Reference to a national code |
Ref country code: HK Ref legal event code: DE Ref document number: 1165816 Country of ref document: HK |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
REG | Reference to a national code |
Ref country code: HK Ref legal event code: GR Ref document number: 1165816 Country of ref document: HK |
|
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Patentee after: Showa electrical materials Co.,Ltd. Address before: Tokyo, Japan Patentee before: HITACHI CHEMICAL Co.,Ltd. Address after: Tokyo, Japan Patentee after: Lishennoco Co.,Ltd. Address before: Tokyo, Japan Patentee before: Showa electrical materials Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder |