CN101910241A - 热固化性树脂组合物以及使用其的预浸料坯及层叠板 - Google Patents
热固化性树脂组合物以及使用其的预浸料坯及层叠板 Download PDFInfo
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Abstract
Description
实施例1 | 实施例2 | 实施例3 | 实施例4 | 实施例5 | 实施例6 | |
热固化性树脂组合物(质量份) | ||||||
(A)成分 | ||||||
甲基乙基次膦酸的铝盐(A-1) | 10 | 10 | 20 | 20 | 20 | |
二乙基次膦酸的铝盐(A-2) | 10 | |||||
(B)成分 | ||||||
双(4-马来酰亚胺苯基)甲烷 | 30 | 30 | ||||
2,2’-[4-(4-马来酰亚胺苯氧基)苯基]丙烷 | 30 | |||||
马来酰亚胺化合物(B-1) | 40 | |||||
马来酰亚胺化合物(B-2) | 40 | |||||
马来酰亚胺化合物(B-3) | 40 | |||||
(C)成分 | ||||||
苯并胍胺 | 10 | 10 | 10 | 10 | 10 | |
乙酰胍胺 | 10 |
2,4-二氨基-6-乙烯基-s-三嗪 | ||||||
双氰胺 | ||||||
(D)成分 | ||||||
苯酚酚醛型环氧树脂(D-1) | 60 | 60 | 60 | 50 | 50 | 50 |
双环戊二烯型环氧树脂(D-2) | ||||||
(E)成分:环氧树脂的固化剂 | ||||||
苯乙烯和马来酸酐的共聚树脂(E-1) | ||||||
异丁烯和马来酸酐的共聚树脂(E-2) | ||||||
(F)成分:无机填充剂 | ||||||
粉碎二氧化硅(F-1) | 40 | 30 | 40 | 40 | 40 | 40 |
氢氧化铝(F-2) | 10 | 20 | 10 | |||
测定、评价结果 | ||||||
(1)铜箔粘接性(铜箔剥离强度:kN/m) | 1.60 | 1.65 | 1.69 | 1.62 | 1.61 | 1.60 |
(2)玻璃化转变温度(Tg℃) | 200 | 205 | 198 | 230 | 230 | 235 |
(3)焊锡耐热性 | 良好 | 良好 | 良好 | 良好 | 良好 | 良好 |
(4)附着铜耐热性(T-288:min) | >60 | >60 | >60 | >60 | >60 | >60 |
(5)吸湿性(吸收率:%) | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 |
(6)阻燃性 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 |
(7)相对介电常数(1GHz) | 4.2 | 4.3 | 4.3 | 4.0 | 4.1 | 4.0 |
(8)介质损耗正切(1GHz) | 0.006 | 0.006 | 0.006 | 0.005 | 0.005 | 0.005 |
实施例7 | 实施例8 | 实施例9 | 实施例10 | 实施例11 | 实施例12 | |
热固化性树脂组合物(质量份) | ||||||
(A)成分 | ||||||
甲基乙基次膦酸的铝盐(A-1) | 20 | 20 | 20 | 20 | 20 | 20 |
二乙基次膦酸的铝盐(A-2) | ||||||
(B)成分 | ||||||
马来酰亚胺化合物(B-1) | ||||||
马来酰亚胺化合物(B-2) | ||||||
马来酰亚胺化合物(B-3) | ||||||
马来酰亚胺化合物(B-4) | 40 | |||||
马来酰亚胺化合物(B-5) | 40 | |||||
马来酰亚胺化合物(B-6) | 40 | |||||
马来酰亚胺化合物(B-7) | 40 | |||||
马来酰亚胺化合物(B-8) | 40 | |||||
马来酰亚胺化合物(B-9) | 40 |
马来酰亚胺化合物(B-10) | ||||||
(C)成分 | ||||||
苯并胍胺 | 10 | 10 | 10 | 10 | 10 | 10 |
乙酰胍胺 | ||||||
2,4-二氨基-6-乙烯基-s-三嗪 | ||||||
双氰胺 | ||||||
(D)成分 | ||||||
苯酚酚醛型环氧树脂(D-1) | 50 | 50 | 50 | 50 | 50 | 50 |
双环戊二烯型环氧树脂(D-2) | ||||||
(E)成分:环氧树脂的固化剂 | ||||||
苯乙烯和马来酸酐的共聚树脂(E-1) | ||||||
异丁烯和马来酸酐的共聚树脂(E-2) | ||||||
(F)成分:无机填充剂 | ||||||
粉碎二氧化硅(F-1) | 40 | 40 | 40 | 40 | 40 | 40 |
氢氧化铝(F-2) |
测定、评价结果 | ||||||
(1)铜箔粘接性(铜箔剥离强度:kN/m) | 1.60 | 1.65 | 1.65 | 1.65 | 1.65 | 1.65 |
(2)玻璃化转变温度(Tg℃) | 240 | 235 | 225 | 245 | 245 | 245 |
(3)焊锡耐热性 | 良好 | 良好 | 良好 | 良好 | 良好 | 良好 |
(4)附着铜耐热性(T-288:min) | >60 | >60 | >60 | >60 | >60 | >60 |
(5)吸湿性(吸收率:%) | 0.6 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 |
(6)阻燃性 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 |
(7)相对介电常数(1GHz) | 4.1 | 3.8 | 3.7 | 4.1 | 4.1 | 4.1 |
(8)介质损耗正切(1GHz) | 0.004 | 0.003 | 0.002 | 0.003 | 0.003 | 0.003 |
实施例13 | 实施例14 | 实施例15 | 实施例16 | 实施例17 | 实施例18 | 实施例19 | 实施例20 |
热固化性树脂组合物(质量份) | ||||||||
(A)成分 | ||||||||
甲基乙基次膦酸的铝盐(A-1) | 20 | 50 | 10 | 10 | 10 | 10 | ||
二乙基次膦酸的铝盐(A-2) | 20 | 20 | ||||||
(B)成分 | ||||||||
马来酰亚胺化合物(B-1) | 40 | 40 | 30 | 40 | 40 | 60 | ||
马来酰亚胺化合物(B-2) | ||||||||
马来酰亚胺化合物(B-3) | ||||||||
马来酰亚胺化合物(B-4) | 40 | |||||||
马来酰亚胺化合物(B-5) | ||||||||
马来酰亚胺化合物(B-6) | ||||||||
马来酰亚胺化合物(B-7) | ||||||||
马来酰亚胺化合物(B-8) | ||||||||
马来酰亚胺化合物(B-9) | ||||||||
马来酰亚胺化合物(B-10) | 40 | |||||||
(C)成分 | ||||||||
苯并胍胺 | 10 | 10 | ||||||
乙酰胍胺 | ||||||||
2,4-二氨基-6-乙烯基-s-三嗪 | 10 | 10 | ||||||
双氰胺 | 1 | 2 | 2 | 5 | ||||
(D)成分 | ||||||||
苯酚酚醛型环氧树脂(D-1) | 50 | 50 | 50 | 40 | 50 | 25 | ||
双环戊二烯型环氧树脂(D-2) | 50 | 50 | ||||||
(E)成分:环氧树脂的固化剂 | ||||||||
苯乙烯和马来酸酐的共聚树脂(E-1) | 29 | 8 | 10 | |||||
异丁烯和马来酸酐的共聚树脂(E-2) | 8 | |||||||
(F)成分:无机填充剂 | ||||||||
粉碎二氧化硅(F-1) | 40 | 40 | 20 | 40 | 40 | 40 | 40 | |
氢氧化铝(F-2) | 20 | 10 | 10 | 10 | 10 | |||
测定、评价结果 |
(1)铜箔粘接性(铜箔剥离强度:kN/m) | 1.60 | 1.65 | 1.65 | 1.65 | 1.60 | 1.60 | 1.60 | 1.60 |
(2)玻璃化转变温度(Tg℃) | 240 | 235 | 225 | 245 | 200 | 200 | 200 | 250 |
(3)焊锡耐热性 | 良好 | 良好 | 良好 | 良好 | 良好 | 良好 | 良好 | 良好 |
(4)附着铜耐热性(T-288:min) | >60 | >60 | >60 | >60 | >60 | >60 | >60 | >60 |
(5)吸湿性(吸收率:%) | 0.5 | 0.5 | 0.6 | 0.5 | 0.2 | 0.5 | 0.5 | 0.3 |
(6)阻燃性 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 |
(7)相对介电常数(1GHz) | 4.1 | 3.8 | 3.7 | 4.1 | 3.9 | 4.0 | 3.9 | 3.9 |
(8)介质损耗正切(1GHz) | 0.004 | 0.003 | 0.002 | 0.003 | 0.002 | 0.005 | 0.003 | 0.002 |
比较例1 | 比较例2 | 比较例3 | 比较例4 | 比较例5 | 比较例6 | 比较例7 | 比较例8 | |
热固化性树脂组合物(质量份) | ||||||||
(A)成分 | ||||||||
甲基乙基次膦酸的铝盐(A-1) | 20 | |||||||
二乙基次膦酸的铝盐(A-2) | ||||||||
(B)成分 | ||||||||
双(4-马来酰亚胺苯基)甲烷 | 30 | 40 | 30 | 30 | ||||
2,2’-[4-(4-马来酰亚胺苯氧基)苯基]丙烷 | 30 | 30 | 30 | |||||
(C)成分 | ||||||||
苯并胍胺 | 10 | 10 | ||||||
乙酰胍胺 | 10 | |||||||
2,4-二氨基-6-乙烯基-s-三嗪 | 10 | 10 | ||||||
双氰胺 | 10 | 5 | ||||||
(D)成分 | ||||||||
苯酚酚醛型环氧树脂(D-1) | 90 | 60 | 60 | 60 | ||||
双环戊二烯型环氧树脂(D-2) | 60 | 60 | 60 | 60 | ||||
(F)成分:无机填充剂 | ||||||||
粉碎二氧化硅(F-1) | 20 | |||||||
氢氧化铝(F-2) | 20 |
(磷系阻燃剂) | ||||||||
红磷(F-1) | 20 | |||||||
三苯基磷酸酯(F-2) | 20 | |||||||
磷酸酯(F-3) | 20 | 20 | 20 | |||||
测定、评价结果 | ||||||||
(1)铜箔粘接性(铜箔剥离强度:kN/m) | 0.90 | 0.90 | 0.70 | 0.45 | 0.45 | 0.45 | 0.40 | 0.45 |
(2)玻璃化转变温度(Tg℃) | 140 | 150 | 130 | 120 | 120 | 120 | 120 | 120 |
(3)焊锡耐热性 | 膨胀 | 膨胀 | 膨胀 | 膨胀 | 膨胀 | 膨胀 | 膨胀 | 膨胀 |
(4)附着铜耐热性(T-288:min) | 1 | 1 | 1 | 0 | 0 | 0 | 0 | 0 |
(5)吸湿性(吸收率:%) | 1.1 | 1.1 | 0.8 | 1.1 | 1.1 | 1.1 | 1.3 | 1.5 |
(6)阻燃性 | V-1 | 燃烧 | 燃烧 | V-1 | 燃烧 | 燃烧 | 燃烧 | 燃烧 |
(7)相对介电常数(1GHz) | 4.9 | 4.9 | 5.1 | 5.1 | 5.1 | 5.1 | 5.2 | 5.3 |
8)介质损耗正切(1GHz) | 0.014 | 0.014 | 0.017 | 0.023 | 0.023 | 0.023 | 0.025 | 0.026 |
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JP2007-332857 | 2007-12-25 | ||
PCT/JP2008/061256 WO2009081601A1 (ja) | 2007-12-25 | 2008-06-19 | 熱硬化性樹脂組成物並びにこれを用いたプリプレグ及び積層板 |
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EP (1) | EP2226349B1 (zh) |
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KR (2) | KR20100105839A (zh) |
CN (2) | CN102675598A (zh) |
HK (1) | HK1151548A1 (zh) |
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-
2007
- 2007-12-25 JP JP2007332857A patent/JP2009155399A/ja not_active Withdrawn
-
2008
- 2008-06-19 CN CN2012101114551A patent/CN102675598A/zh active Pending
- 2008-06-19 US US12/810,387 patent/US20100279129A1/en not_active Abandoned
- 2008-06-19 CN CN2008801222346A patent/CN101910241B/zh active Active
- 2008-06-19 KR KR1020107013799A patent/KR20100105839A/ko active Search and Examination
- 2008-06-19 EP EP08777412.1A patent/EP2226349B1/en not_active Not-in-force
- 2008-06-19 KR KR1020157036836A patent/KR20160006248A/ko active Search and Examination
- 2008-06-19 WO PCT/JP2008/061256 patent/WO2009081601A1/ja active Application Filing
- 2008-06-25 TW TW097123721A patent/TWI481652B/zh active
- 2008-06-25 TW TW103142210A patent/TWI586731B/zh active
-
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- 2011-06-03 HK HK11105595.5A patent/HK1151548A1/xx unknown
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Also Published As
Publication number | Publication date |
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US20170022353A1 (en) | 2017-01-26 |
TW200927808A (en) | 2009-07-01 |
KR20160006248A (ko) | 2016-01-18 |
JP2009155399A (ja) | 2009-07-16 |
CN101910241B (zh) | 2012-06-20 |
EP2226349B1 (en) | 2014-01-15 |
CN102675598A (zh) | 2012-09-19 |
KR20100105839A (ko) | 2010-09-30 |
TWI586731B (zh) | 2017-06-11 |
WO2009081601A1 (ja) | 2009-07-02 |
TW201510018A (zh) | 2015-03-16 |
US10604641B2 (en) | 2020-03-31 |
HK1151548A1 (en) | 2012-02-03 |
EP2226349A1 (en) | 2010-09-08 |
TWI481652B (zh) | 2015-04-21 |
EP2226349A4 (en) | 2012-11-21 |
US20100279129A1 (en) | 2010-11-04 |
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