HK1151548A1 - Thermosetting resin composition and prepreg and laminate both made with the same - Google Patents
Thermosetting resin composition and prepreg and laminate both made with the sameInfo
- Publication number
- HK1151548A1 HK1151548A1 HK11105595.5A HK11105595A HK1151548A1 HK 1151548 A1 HK1151548 A1 HK 1151548A1 HK 11105595 A HK11105595 A HK 11105595A HK 1151548 A1 HK1151548 A1 HK 1151548A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- prepreg
- laminate
- same
- resin composition
- thermosetting resin
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5317—Phosphonic compounds, e.g. R—P(:O)(OR')2
- C08K5/5333—Esters of phosphonic acids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3415—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/04—Epoxynovolacs
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/04—Epoxynovolacs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2363/04—Epoxynovolacs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Reinforced Plastic Materials (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007332857A JP2009155399A (ja) | 2007-12-25 | 2007-12-25 | 熱硬化性樹脂組成物並びにこれを用いたプリプレグ及び積層板 |
PCT/JP2008/061256 WO2009081601A1 (ja) | 2007-12-25 | 2008-06-19 | 熱硬化性樹脂組成物並びにこれを用いたプリプレグ及び積層板 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1151548A1 true HK1151548A1 (en) | 2012-02-03 |
Family
ID=40800918
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK11105595.5A HK1151548A1 (en) | 2007-12-25 | 2011-06-03 | Thermosetting resin composition and prepreg and laminate both made with the same |
Country Status (8)
Country | Link |
---|---|
US (2) | US20100279129A1 (xx) |
EP (1) | EP2226349B1 (xx) |
JP (1) | JP2009155399A (xx) |
KR (2) | KR20160006248A (xx) |
CN (2) | CN102675598A (xx) |
HK (1) | HK1151548A1 (xx) |
TW (2) | TWI586731B (xx) |
WO (1) | WO2009081601A1 (xx) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009155399A (ja) | 2007-12-25 | 2009-07-16 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物並びにこれを用いたプリプレグ及び積層板 |
JP5407679B2 (ja) * | 2009-09-04 | 2014-02-05 | 日立化成株式会社 | 熱硬化性絶縁樹脂組成物、並びにこれを用いた支持体付絶縁フィルム、プリプレグ、積層板及び多層プリント配線板 |
JP5407678B2 (ja) * | 2009-09-04 | 2014-02-05 | 日立化成株式会社 | 熱硬化性絶縁樹脂組成物、並びにこれを用いた支持体付絶縁フィルム、プリプレグ、積層板及び多層プリント配線板 |
JP5540611B2 (ja) * | 2009-09-04 | 2014-07-02 | 日立化成株式会社 | 熱硬化性絶縁樹脂組成物、並びにこれを用いた支持体付絶縁フィルム、プリプレグ、積層板及びプリント配線板 |
WO2011078339A1 (ja) * | 2009-12-25 | 2011-06-30 | 日立化成工業株式会社 | 熱硬化性樹脂組成物、樹脂組成物ワニスの製造方法、プリプレグ及び積層板 |
CN105315435A (zh) * | 2010-03-02 | 2016-02-10 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料及层压板 |
US20120129414A1 (en) * | 2010-11-24 | 2012-05-24 | Chung-Hao Chang | Thermosetting resin composition and prepreg or laminate using the same |
JP5772189B2 (ja) * | 2011-04-27 | 2015-09-02 | 日立化成株式会社 | 熱硬化性樹脂組成物並びにこれを用いたプリプレグ、積層板及び配線板 |
CN106922088A (zh) * | 2011-10-11 | 2017-07-04 | 日立化成株式会社 | 具有导体电路的结构体及其制造方法以及热固化性树脂组合物 |
WO2014067095A1 (en) * | 2012-10-31 | 2014-05-08 | Dow Global Technologies Llc | Curable compositions |
JP5682664B2 (ja) * | 2013-07-01 | 2015-03-11 | 日立化成株式会社 | 熱硬化性樹脂組成物並びにこれを用いたプリプレグ及び積層板 |
JP6311922B2 (ja) * | 2014-03-06 | 2018-04-18 | 日立化成株式会社 | 熱硬化性樹脂組成物及びそれを用いたプリプレグ、積層板、並びにプリント配線板 |
KR101468005B1 (ko) * | 2014-05-09 | 2014-12-03 | 주식회사 신아티앤씨 | 고내열성 난연 화합물 및 이의 제조방법 |
JP6519307B2 (ja) * | 2015-05-11 | 2019-05-29 | 日立化成株式会社 | 熱硬化性絶縁樹脂組成物、並びにそれを用いた支持体付絶縁フィルム、プリプレグ、積層板及び多層プリント配線板 |
JP6701630B2 (ja) * | 2015-06-02 | 2020-05-27 | 日立化成株式会社 | 熱硬化性樹脂組成物、プリプレグ、積層板及びプリント配線板 |
JP6676884B2 (ja) * | 2015-06-02 | 2020-04-08 | 日立化成株式会社 | 熱硬化性樹脂組成物、プリプレグ、積層板及びプリント配線板 |
JP6801652B2 (ja) * | 2015-06-02 | 2020-12-16 | 昭和電工マテリアルズ株式会社 | 熱硬化性樹脂組成物、プリプレグ、積層板及びプリント配線板 |
JP6635415B2 (ja) * | 2015-06-30 | 2020-01-22 | パナソニックIpマネジメント株式会社 | 硬化性組成物、プリプレグ、組成物付き金属箔、金属張積層板、及び配線板 |
EP3377578A4 (en) * | 2015-11-17 | 2019-05-08 | Henkel IP & Holding GmbH | RESIN COMPOSITIONS FOR SUBSTITUTING LAYER FOR THREE-DENSITY THROUGH SILICA VIA (TSV) PACKAGING AND FOR THE PRODUCTION OF SUITABLE COMPOSITIONS |
JP6850539B2 (ja) * | 2016-02-25 | 2021-03-31 | 藤森工業株式会社 | 電池外装用積層体、電池外装体及び電池 |
US10940674B2 (en) | 2016-12-07 | 2021-03-09 | Showa Denko Materials Co., Ltd. | Resin varnish, prepreg, laminate, and printed wiring board |
MY181060A (en) * | 2016-12-07 | 2020-12-16 | Showa Denko Materials Co Ltd | Thermosetting resin composition and its production method, prepreg, laminate, and printed wiring board |
US11104788B2 (en) * | 2016-12-20 | 2021-08-31 | Dic Corporation | Composition, cured product and laminate |
WO2018181514A1 (ja) * | 2017-03-28 | 2018-10-04 | 日立化成株式会社 | コアレス基板用プリプレグ、コアレス基板及び半導体パッケージ |
JP6992333B2 (ja) * | 2017-09-06 | 2022-01-13 | 味の素株式会社 | 樹脂組成物 |
MX2020002460A (es) | 2017-09-13 | 2020-07-20 | Hexion Inc | Sistemas de resina epoxi. |
KR20210016389A (ko) * | 2018-06-01 | 2021-02-15 | 미츠비시 가스 가가쿠 가부시키가이샤 | 수지 조성물, 프리프레그, 금속박 피복 적층판, 수지 시트, 및 프린트 배선판 |
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-
2007
- 2007-12-25 JP JP2007332857A patent/JP2009155399A/ja not_active Withdrawn
-
2008
- 2008-06-19 EP EP08777412.1A patent/EP2226349B1/en not_active Not-in-force
- 2008-06-19 CN CN2012101114551A patent/CN102675598A/zh active Pending
- 2008-06-19 US US12/810,387 patent/US20100279129A1/en not_active Abandoned
- 2008-06-19 WO PCT/JP2008/061256 patent/WO2009081601A1/ja active Application Filing
- 2008-06-19 KR KR1020157036836A patent/KR20160006248A/ko active Search and Examination
- 2008-06-19 KR KR1020107013799A patent/KR20100105839A/ko active Search and Examination
- 2008-06-19 CN CN2008801222346A patent/CN101910241B/zh active Active
- 2008-06-25 TW TW103142210A patent/TWI586731B/zh active
- 2008-06-25 TW TW097123721A patent/TWI481652B/zh active
-
2011
- 2011-06-03 HK HK11105595.5A patent/HK1151548A1/xx unknown
-
2016
- 2016-10-03 US US15/284,022 patent/US10604641B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW201510018A (zh) | 2015-03-16 |
US20100279129A1 (en) | 2010-11-04 |
CN102675598A (zh) | 2012-09-19 |
TWI481652B (zh) | 2015-04-21 |
EP2226349B1 (en) | 2014-01-15 |
CN101910241A (zh) | 2010-12-08 |
WO2009081601A1 (ja) | 2009-07-02 |
US20170022353A1 (en) | 2017-01-26 |
TWI586731B (zh) | 2017-06-11 |
KR20100105839A (ko) | 2010-09-30 |
JP2009155399A (ja) | 2009-07-16 |
EP2226349A1 (en) | 2010-09-08 |
KR20160006248A (ko) | 2016-01-18 |
TW200927808A (en) | 2009-07-01 |
CN101910241B (zh) | 2012-06-20 |
US10604641B2 (en) | 2020-03-31 |
EP2226349A4 (en) | 2012-11-21 |
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