CN101370889B - 粘合剂封装组合物膜以及有机电致发光器件 - Google Patents

粘合剂封装组合物膜以及有机电致发光器件 Download PDF

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Publication number
CN101370889B
CN101370889B CN2007800029900A CN200780002990A CN101370889B CN 101370889 B CN101370889 B CN 101370889B CN 2007800029900 A CN2007800029900 A CN 2007800029900A CN 200780002990 A CN200780002990 A CN 200780002990A CN 101370889 B CN101370889 B CN 101370889B
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film
adhesive
organic
weight
resin
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CN101370889A (zh
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藤田淳
山崎崇
南秀树
小堀奈未
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3M Innovative Properties Co
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3M Innovative Properties Co
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C09J123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C09J123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • C09J123/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefines
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C08L2666/06—Homopolymers or copolymers of unsaturated hydrocarbons; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31909—Next to second addition polymer from unsaturated monomers
    • Y10T428/31913—Monoolefin polymer
    • Y10T428/31917—Next to polyene polymer

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Sealing Material Composition (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
CN2007800029900A 2006-01-24 2007-01-23 粘合剂封装组合物膜以及有机电致发光器件 Expired - Fee Related CN101370889B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP015334/2006 2006-01-24
JP2006015334A JP2007197517A (ja) 2006-01-24 2006-01-24 接着性封止組成物、封止フィルム及び有機ｅｌ素子
PCT/US2007/001724 WO2007087281A1 (en) 2006-01-24 2007-01-23 Adhesive encapsulating composition film and organic electroluminescence device

Publications (2)

Publication Number Publication Date
CN101370889A CN101370889A (zh) 2009-02-18
CN101370889B true CN101370889B (zh) 2012-02-29

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CN2007800029900A Expired - Fee Related CN101370889B (zh) 2006-01-24 2007-01-23 粘合剂封装组合物膜以及有机电致发光器件

Country Status (6)

Country Link
US (1) US20090026934A1 (enExample)
EP (1) EP1976952A4 (enExample)
JP (2) JP2007197517A (enExample)
KR (1) KR101422856B1 (enExample)
CN (1) CN101370889B (enExample)
WO (1) WO2007087281A1 (enExample)

Cited By (2)

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TWI557964B (zh) * 2013-08-05 2016-11-11 Ｌｇ化學股份有限公司 壓敏性黏著膜及使用彼製造有機電子裝置之方法
TWI582156B (zh) * 2013-12-27 2017-05-11 Furukawa Electric Co Ltd A sealing method for an organic electric field light emitting element and a sealing method for an organic electric field light emitting element

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JP2010006039A (ja) * 2007-09-05 2010-01-14 Fujifilm Corp ガスバリアフィルムおよびガスバリアフィルムを用いて表示素子を封止する方法。
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JP2010080289A (ja) * 2008-09-26 2010-04-08 Dainippon Printing Co Ltd 有機エレクトロルミネッセンスパネル、及びその製造方法
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WO2011052630A1 (ja) * 2009-10-28 2011-05-05 コニカミノルタホールディングス株式会社 有機エレクトロルミネッセンスパネルの製造方法、有機エレクトロルミネッセンスパネル
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EP2927295B1 (en) 2012-11-30 2018-04-25 LINTEC Corporation Adhesive agent composition, adhesive sheet, and electronic device
US20150299518A1 (en) 2012-11-30 2015-10-22 Lintec Corporation Adhesive agent composition, adhesive sheet, and electronic device
WO2014084349A1 (ja) 2012-11-30 2014-06-05 リンテック株式会社 接着剤組成物、接着シートおよび電子デバイス
TWI639667B (zh) 2012-11-30 2018-11-01 日商琳得科股份有限公司 Substrate composition, subsequent sheet, electronic device and method of manufacturing same
TW201436855A (zh) 2012-12-21 2014-10-01 Tesa Se 從平面結構物移除滲透物的方法
DE102012224319A1 (de) 2012-12-21 2014-06-26 Tesa Se Verfahren zum Entfernen von Permeaten aus Flächengebilden
DE102012224310A1 (de) 2012-12-21 2014-06-26 Tesa Se Gettermaterial enthaltendes Klebeband
DE102013202473A1 (de) 2013-02-15 2014-08-21 Tesa Se Verfahren zum Entfernen von Permeaten aus Flächengebilden
JP2014127575A (ja) * 2012-12-26 2014-07-07 Nitto Denko Corp 封止シート
JP2014145067A (ja) * 2013-01-30 2014-08-14 Lintec Corp 電子部品貼付用アースラベル
US9768414B2 (en) * 2013-02-18 2017-09-19 Innolux Corporation Display device
CN110372967A (zh) * 2013-03-27 2019-10-25 古河电气工业株式会社 密封用树脂组合物、密封用树脂片、有机电致发光元件、及图像显示装置
JP5503770B1 (ja) * 2013-03-29 2014-05-28 古河電気工業株式会社 封止剤組成物および該組成物から得られる封止用シート
WO2014156593A1 (ja) * 2013-03-29 2014-10-02 古河電気工業株式会社 有機電子デバイス用素子封止用樹脂組成物、有機電子デバイス用素子封止用樹脂シート、有機エレクトロルミネッセンス素子、及び画像表示装置
JP5435520B1 (ja) 2013-03-29 2014-03-05 古河電気工業株式会社 有機電子デバイス用素子封止用樹脂組成物、有機電子デバイス用素子封止用樹脂シート、有機エレクトロルミネッセンス素子、及び画像表示装置
TWI602866B (zh) * 2013-04-09 2017-10-21 Toagosei Co Ltd Active energy ray-curable resin composition
WO2014172185A1 (en) 2013-04-15 2014-10-23 3M Innovative Properties Company Adhesives comprising crosslinker with (meth)acrylate group and olefin group and methods
KR102479472B1 (ko) * 2013-04-15 2022-12-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치
KR101589372B1 (ko) * 2013-05-21 2016-01-28 주식회사 엘지화학 봉지 필름 및 이를 이용한 유기전자장치의 봉지 방법
US10050204B2 (en) 2013-07-19 2018-08-14 Lg Chem, Ltd. Encapsulation composition (as amended)
CN103440824B (zh) * 2013-08-07 2016-08-10 北京京东方光电科技有限公司 一种有机电致发光显示面板、其制造方法及显示装置
JP6152319B2 (ja) * 2013-08-09 2017-06-21 日東電工株式会社 粘着剤組成物、粘着テープ又はシート
US20150093536A1 (en) * 2013-09-27 2015-04-02 Itron, Inc. Polyisobutylene-Based Encapsulant for use with Electronic Components
WO2015052882A1 (ja) * 2013-10-07 2015-04-16 パナソニックＩｐマネジメント株式会社 有機エレクトロルミネッセンス素子及び照明装置
CN105637029A (zh) * 2013-11-08 2016-06-01 日本化药株式会社 密封用树脂组合物
DE102013223451A1 (de) 2013-11-18 2015-05-21 Tesa Se Verfahren zur Trocknung von Klebemassen
KR101717418B1 (ko) * 2013-11-27 2017-03-17 주식회사 엘지화학 점착 시트 및 이를 이용한 유기전자장치의 봉지 방법
JP6247916B2 (ja) * 2013-12-03 2017-12-13 古河電気工業株式会社 樹脂組成物、有機電子デバイス素子封止用樹脂シート、有機エレクトロルミネッセンス素子および画像表示用装置
JP6360680B2 (ja) * 2013-12-20 2018-07-18 リンテック株式会社 封止シート、封止体および装置
TWI648892B (zh) * 2013-12-26 2019-01-21 日商琳得科股份有限公司 Sheet-like sealing material, sealing sheet, electronic device sealing body, and organic EL element
JP5667282B1 (ja) * 2013-12-27 2015-02-12 古河電気工業株式会社 有機電界発光素子用充填材料及び有機電界発光素子の封止方法
DE102014200948A1 (de) 2014-01-20 2015-07-23 Tesa Se Verfahren zum Entfernen von Permeaten aus Flächengebilden
JP5914778B2 (ja) * 2014-01-23 2016-05-11 株式会社ダイセル 封止用組成物
WO2015129624A1 (ja) * 2014-02-25 2015-09-03 リンテック株式会社 接着剤組成物、接着シート及び電子デバイス
KR20160125353A (ko) * 2014-02-25 2016-10-31 린텍 가부시키가이샤 접착제 조성물, 접착 시트 및 전자 디바이스
US20180170022A1 (en) 2014-03-27 2018-06-21 Lintec Corporation Sealing sheet, and sealing structure and device
JP6410446B2 (ja) * 2014-03-28 2018-10-24 古河電気工業株式会社 有機電子デバイス用素子封止用樹脂組成物、有機電子デバイス用素子封止用樹脂シート、有機エレクトロルミネッセンス素子、及び画像表示装置
JP5764687B1 (ja) * 2014-03-31 2015-08-19 古河電気工業株式会社 有機電子デバイス素子封止用樹脂組成物、有機電子デバイス素子封止用樹脂シート、有機エレクトロルミネッセンス素子、及び画像表示装置
DE102014207074A1 (de) 2014-04-11 2015-10-15 Tesa Se Klebeband für die Kapselung einer organischen elektronischen Anordnung
DE102014207792A1 (de) 2014-04-25 2015-10-29 Tesa Se Dünnglasverbund und Verfahren zum Lagern einer Dünnglasfolie
DE102014208111A1 (de) 2014-04-29 2015-10-29 Tesa Se Verfahren zur Herstellung einer Verklebung auf Permeat sensiblen Oberflächen
DE102014208109A1 (de) 2014-04-29 2015-10-29 Tesa Se Spaltbares Klebend mit dosierfähigen spaltbaren Flüssigklebstoff
KR101738731B1 (ko) * 2014-06-26 2017-05-23 주식회사 엘지화학 광학용 점착제 조성물 및 점착필름
KR101907237B1 (ko) * 2014-07-15 2018-10-12 주식회사 엘지화학 광학용 점착제 조성물 및 점착 필름
JP6450148B2 (ja) * 2014-07-17 2019-01-09 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子封止用樹脂組成物、有機エレクトロルミネッセンス表示素子封止用樹脂シート、及び、有機エレクトロルミネッセンス表示素子
TWI679259B (zh) * 2014-08-11 2019-12-11 德商漢高智慧財產控股公司 光學透明的熱熔黏著劑及其用途
CN107001892B (zh) 2014-10-29 2019-09-06 德莎欧洲股份公司 包含多官能性硅氧烷水清除剂的胶粘剂
JP6461189B2 (ja) 2014-11-14 2019-01-30 リンテック株式会社 封止シート、電子デバイス用部材および電子デバイス
KR102342312B1 (ko) * 2014-12-29 2021-12-22 삼성디스플레이 주식회사 플렉서블 표시 장치
KR101741891B1 (ko) 2015-02-04 2017-05-30 주식회사 엘지화학 점착제 조성물, 이의 제조 방법, 이를 포함하는 점착 필름 및 이를 이용한 유기전자장치의 제조방법
KR101822254B1 (ko) 2015-02-04 2018-01-25 주식회사 엘지화학 점착제 조성물
US10336919B2 (en) 2015-03-24 2019-07-02 Lg Chem, Ltd. Adhesive composition
US11267995B2 (en) 2015-03-24 2022-03-08 Lg Chem, Ltd. Adhesive composition
KR101917081B1 (ko) 2015-03-24 2018-11-09 주식회사 엘지화학 접착제 조성물, 이를 포함하는 접착 필름, 이를 포함하는 유기전자장치 및 상기 유기전자장치의 제조 방법
JP6636040B2 (ja) 2015-03-24 2020-01-29 エルジー・ケム・リミテッド 接着剤組成物
KR102261689B1 (ko) 2015-03-24 2021-06-07 주식회사 엘지화학 접착제 조성물, 이를 포함하는 접착 필름, 이를 포함하는 유기전자장치 및 상기 유기전자장치의 제조 방법
CN107636104B (zh) 2015-03-24 2020-09-15 株式会社Lg化学 粘合剂组合物
EP3275944B1 (en) 2015-03-24 2023-09-27 LG Chem, Ltd. Adhesive composition, organic electronic device and method of manufacturing organic electronic device
KR102024481B1 (ko) 2015-06-03 2019-09-23 쓰리엠 이노베이티브 프로퍼티즈 컴파니 가요성 디스플레이용 조립체 층
WO2016200179A1 (ko) * 2015-06-09 2016-12-15 주식회사 엘지화학 접착제 조성물, 이를 포함하는 접착 필름 및 이를 포함하는 유기전자장치
JP2018529803A (ja) * 2015-08-17 2018-10-11 スリーエム イノベイティブ プロパティズ カンパニー ナノ粘土充填バリア接着剤組成物
JP6725373B2 (ja) 2015-09-16 2020-07-15 日東電工株式会社 粘着剤組成物、粘着剤層、粘着剤層付光学フィルム、光学部材、及び画像表示装置
KR20170037070A (ko) 2015-09-25 2017-04-04 주식회사 엘지화학 점착제 조성물
KR102056598B1 (ko) 2015-09-25 2019-12-17 주식회사 엘지화학 점착제 조성물
KR20170037086A (ko) 2015-09-25 2017-04-04 주식회사 엘지화학 점착제 조성물
KR102034441B1 (ko) 2015-09-25 2019-10-21 주식회사 엘지화학 점착제 조성물
KR102041816B1 (ko) 2015-09-25 2019-11-07 주식회사 엘지화학 점착제 조성물
US11046046B2 (en) * 2015-09-28 2021-06-29 Zeon Corporation Laminate, method for producing same, and flexible printed circuit board
DE102015222027A1 (de) 2015-11-09 2017-05-11 Tesa Se Barriereklebemasse mit polymerem Gettermaterial
CN106711346B (zh) * 2015-11-13 2019-02-05 群创光电股份有限公司 显示装置
DE102015119939A1 (de) * 2015-11-18 2017-05-18 ALTANA Aktiengesellschaft Vernetzbare polymere Materialien für dielektrische Schichten in elektronischen Bauteilen
TWI751989B (zh) * 2015-12-01 2022-01-11 日商琳得科股份有限公司 接著劑組成物、封密板片及封密體
JP6873682B2 (ja) 2015-12-25 2021-05-19 日東電工株式会社 ゴム系粘着剤組成物、ゴム系粘着剤層、ゴム系粘着剤層付光学フィルム、光学部材、画像表示装置、及びゴム系粘着剤層の製造方法
KR102097808B1 (ko) 2016-03-31 2020-04-07 주식회사 엘지화학 점착제 조성물
KR102071904B1 (ko) 2016-03-31 2020-01-31 주식회사 엘지화학 점착제 조성물
CN108883617B (zh) 2016-04-01 2020-09-15 3M创新有限公司 多层含氟聚合物膜
KR102322016B1 (ko) * 2016-06-01 2021-11-09 삼성디스플레이 주식회사 디스플레이 장치 및 그 제조방법
KR102159502B1 (ko) 2016-06-07 2020-09-25 주식회사 엘지화학 점착제 조성물
US10894903B2 (en) * 2016-06-16 2021-01-19 3M Innovative Properties Company Nanoparticle filled barrier adhesive compositions
DE102016213840A1 (de) 2016-07-27 2018-02-01 Tesa Se Klebeband zur Verkapselung elektronischer Aufbauten
DE102016213911A1 (de) 2016-07-28 2018-02-01 Tesa Se OLED kompatible Klebemassen mit cyclischen Azasilanwasserfängern
KR102146529B1 (ko) 2016-08-22 2020-08-20 주식회사 엘지화학 점착제 조성물
KR102159497B1 (ko) 2016-08-22 2020-09-25 주식회사 엘지화학 점착제 조성물
KR102166465B1 (ko) 2016-08-22 2020-10-16 주식회사 엘지화학 점착제 조성물
JP6792382B2 (ja) 2016-09-05 2020-11-25 日東電工株式会社 ゴム系粘着剤組成物、ゴム系粘着剤層、粘着フィルム、ゴム系粘着剤層付光学フィルム、光学部材、及び画像表示装置
EP3511386B1 (en) * 2016-09-07 2021-08-25 Lintec Corporation Adhesive composition, sealing sheet, and sealed body
JP6746777B2 (ja) 2016-09-23 2020-08-26 エルジー・ケム・リミテッド 接着剤組成物
KR102602159B1 (ko) * 2016-11-22 2023-11-14 (주)이녹스첨단소재 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재
CN110062697A (zh) 2016-12-09 2019-07-26 3M创新有限公司 聚合物多层膜
WO2018106560A1 (en) 2016-12-09 2018-06-14 3M Innovative Properties Company Article comprising multilayer film
WO2018106557A1 (en) 2016-12-09 2018-06-14 3M Innovative Properties Company Polymeric multilayer film
EP3551456A1 (en) 2016-12-09 2019-10-16 3M Innovative Properties Company Polymeric multilayer film
WO2018106559A1 (en) 2016-12-09 2018-06-14 3M Innovative Properties Company Polymeric multilayer film
CN110337601A (zh) * 2017-02-28 2019-10-15 日东电工株式会社 偏振片及偏振片的制造方法
WO2018181664A1 (ja) 2017-03-31 2018-10-04 味の素株式会社 封止用の組成物
CN110536945B (zh) 2017-04-21 2022-04-29 3M创新有限公司 阻隔性粘合剂组合物和制品
JP7142008B2 (ja) * 2017-05-31 2022-09-26 三井化学株式会社 組成物、コーティング剤、接着剤及び積層体
US11795314B2 (en) 2017-09-12 2023-10-24 Lg Chem, Ltd. Encapsulating composition
DE102017219310A1 (de) 2017-10-27 2019-05-02 Tesa Se Plasmarandverkapselung von Klebebändern
JP7007157B2 (ja) * 2017-10-27 2022-01-24 アイカ工業株式会社 封止用樹脂組成物
WO2019111182A1 (en) 2017-12-06 2019-06-13 3M Innovative Properties Company Barrier adhesive compositions and articles
KR102014801B1 (ko) * 2017-12-12 2019-08-27 엘지전자 주식회사 이동 단말기
WO2019117442A1 (en) * 2017-12-12 2019-06-20 Lg Electronics Inc. Mobile terminal
KR102212139B1 (ko) 2018-01-11 2021-02-03 주식회사 엘지화학 온도가변형 점착 시트 및 이를 이용한 온도가변형 점착 시트 제조방법
KR102212135B1 (ko) 2018-01-11 2021-02-03 주식회사 엘지화학 온도가변형 점착 시트 및 이를 이용한 온도가변형 점착 시트 제조방법
KR102232412B1 (ko) 2018-01-11 2021-03-25 주식회사 엘지화학 온도가변형 점착 시트 및 이를 이용한 온도가변형 점착 시트 제조방법
US11417857B2 (en) 2018-01-24 2022-08-16 Samsung Display Co., Ltd. Heterocyclic compound and electronic apparatus
CN111727231B (zh) * 2018-02-16 2023-07-04 三井化学株式会社 图像显示装置密封材料及图像显示装置密封片
US11349103B2 (en) * 2018-03-15 2022-05-31 Dell Products L.P. Display assembly apparatus and methods for information handling systems
DE102018208168A1 (de) 2018-05-24 2019-11-28 Tesa Se Kombination einer transparenten vollflächigen Verkapselung mit einer (intransparenten) Randverkapselung mit hohem Gettergehalt
JP2018168378A (ja) * 2018-05-30 2018-11-01 リンテック株式会社 シート状封止材、封止シート及び電子デバイス
EP3820920B1 (en) 2018-07-12 2025-05-14 3M Innovative Properties Company Composition comprising styrene isobutylene block copolymer and ethylenically unsaturated monomer
JP7124256B2 (ja) * 2018-07-26 2022-08-24 東洋インキＳｃホールディングス株式会社 接着性樹脂組成物、それを用いたシート、蓋材、密封容器用部材セット、及び開封可能な容器
WO2020067488A1 (ja) 2018-09-28 2020-04-02 リンテック株式会社 ガスバリア性積層体
KR102335253B1 (ko) 2018-11-05 2021-12-03 주식회사 엘지화학 봉지 필름
TWI826589B (zh) 2018-11-14 2023-12-21 日商電化股份有限公司 暫時固定組成物、暫時固定接著劑、硬化體、黏著片、接著體、及薄型晶圓的製造方法
CN113166492B (zh) * 2018-12-07 2023-07-28 株式会社Lg化学 封装组合物
US11940651B2 (en) 2018-12-26 2024-03-26 3M Innovative Properties Company Ultraviolet C light guides
JP7347087B2 (ja) * 2019-09-30 2023-09-20 味の素株式会社 粘着シート
US11634613B2 (en) 2019-12-19 2023-04-25 3M Innovative Properties Company Composite cooling film comprising an organic polymeric layer, a UV-absorbing layer, and a reflective metal layer
EP4079120A4 (en) 2019-12-19 2024-01-03 3M Innovative Properties Company COMPOSITE COOLING FILM COMPRISING A REFLECTIVE MICROPOROUS LAYER AND A UV-ABSORBING LAYER
CN111205779B (zh) * 2020-01-09 2022-05-10 江苏雨中情防水材料有限责任公司 一种双层复合压敏自粘型tpo防水卷材及其制备方法
US11654664B2 (en) 2020-01-16 2023-05-23 3M Innovative Properties Company Composite cooling film comprising a reflective nonporous organic polymeric layer and a UV-protective layer
US20230172035A1 (en) * 2020-05-18 2023-06-01 Sharp Kabushiki Kaisha Display device
KR102806056B1 (ko) 2020-05-21 2025-05-12 덴카 주식회사 조성물
WO2021236914A1 (en) * 2020-05-22 2021-11-25 Avient Corporation Vibration damping thermoplastic elastomer blends
WO2021241517A1 (ja) * 2020-05-29 2021-12-02 日本ゼオン株式会社 接合体及びその製造方法
CN113733696B (zh) * 2020-05-29 2023-07-28 利诺士尖端材料有限公司 有机电子装置用封装材料及包括其的可卷曲有机电子装置
US20240218215A1 (en) 2021-04-26 2024-07-04 Denka Company Limited Composition
TW202407025A (zh) * 2022-06-08 2024-02-16 日商東洋紡Ｍｃ股份有限公司 樹脂組成物及熱熔黏接劑組成物

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1031799C (zh) * 1990-07-18 1996-05-15 崔建民 聚烯烃纤维有机溶剂型胶粘剂

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3554940A (en) * 1968-01-04 1971-01-12 Arakawa Rinsan Kagaku Kogyo Kk Pressure-sensitive adhesives
GB2129952B (en) * 1982-11-05 1986-03-19 Letraset International Ltd 'peel apart' coloured photosensitive materials
WO1992002118A1 (en) 1991-05-07 1992-02-20 Exxon Chemical Patents Inc Radiation crosslinked conjugated diene butyl psas
JP3145743B2 (ja) * 1991-09-19 2001-03-12 日東電工株式会社 感圧性接着剤ないし接着シ―トの製造法
JPH09148066A (ja) * 1995-11-24 1997-06-06 Pioneer Electron Corp 有機ｅｌ素子
US6049167A (en) * 1997-02-17 2000-04-11 Tdk Corporation Organic electroluminescent display device, and method and system for making the same
JP4399044B2 (ja) * 1998-10-14 2010-01-13 久光製薬株式会社 吸収促進剤及び該吸収促進剤を有してなる経皮吸収製剤
EP1269999B1 (en) * 2000-03-17 2013-05-01 Hisamitsu Pharmaceutical Co. Inc. Ultraviolet-shielding patch
DE10056012A1 (de) * 2000-11-11 2002-05-16 Beiersdorf Ag Flexible Barrierefolie für ein Trägermaterial für medizinische Zwecke
WO2003106582A1 (ja) * 2002-01-10 2003-12-24 積水化学工業株式会社 有機エレクトロルミネッセンス素子封止用接着剤及びその応用
JP2003268351A (ja) * 2002-03-12 2003-09-25 Hitachi Chem Co Ltd 防湿シール材、実装体、防湿シール材の製造方法及び実装体の製造方法
JP3969524B2 (ja) * 2002-04-09 2007-09-05 株式会社クレハ プラスチック多層構造体
CN1678639A (zh) * 2002-07-24 2005-10-05 粘合剂研究公司 可转换的压敏粘合剂胶带及其在显示屏上的用途
JP2004111380A (ja) * 2002-08-29 2004-04-08 Toray Ind Inc 有機電界発光素子封止用樹脂組成物、有機電界発光素子及び有機電界発光素子の封止方法
JP5062648B2 (ja) * 2004-04-08 2012-10-31 双葉電子工業株式会社 有機ｅｌ素子用水分吸収剤
KR100683674B1 (ko) * 2004-06-29 2007-02-20 삼성에스디아이 주식회사 유기 전계 발광 소자 및 이의 제조 방법
JP4582770B2 (ja) * 2004-06-29 2010-11-17 スタンレー電気株式会社 発光ダイオード用封止樹脂及びそれを使用した発光ダイオード
EP1874885B1 (en) * 2005-04-04 2008-11-05 National Starch and Chemical Investment Holding Corporation Radiation-curable desiccant-filled adhesive/sealant
WO2006132183A1 (ja) * 2005-06-06 2006-12-14 Sekisui Chemical Co., Ltd. 表面保護フィルム
JP2007126512A (ja) * 2005-11-01 2007-05-24 Sekisui Chem Co Ltd 表面保護フィルム

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1031799C (zh) * 1990-07-18 1996-05-15 崔建民 聚烯烃纤维有机溶剂型胶粘剂

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
US 2006/0003139 ,全文.

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI557964B (zh) * 2013-08-05 2016-11-11 Ｌｇ化學股份有限公司 壓敏性黏著膜及使用彼製造有機電子裝置之方法
US9803112B2 (en) 2013-08-05 2017-10-31 Lg Chem, Ltd. Pressure sensitive adhesive film and method of manufacturing organic electronic device using the same
TWI582156B (zh) * 2013-12-27 2017-05-11 Furukawa Electric Co Ltd A sealing method for an organic electric field light emitting element and a sealing method for an organic electric field light emitting element

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