CN100402291C - 喷墨打印头芯片 - Google Patents

喷墨打印头芯片 Download PDF

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CN100402291C
CN100402291C CNB028290925A CN02829092A CN100402291C CN 100402291 C CN100402291 C CN 100402291C CN B028290925 A CNB028290925 A CN B028290925A CN 02829092 A CN02829092 A CN 02829092A CN 100402291 C CN100402291 C CN 100402291C
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ink
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卡·西尔弗布鲁克
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Silverbrook Research Pty Ltd
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Abstract

一种包括一个晶片衬片(116)的喷墨打印头芯片。驱动电路置于该晶片衬片上。多个喷嘴装置置于晶片衬片上。每个喷嘴装置包含置于晶片衬片上的喷嘴腔壁(132)和一个顶壁，以确定一个喷嘴腔(134)和一个顶壁中的喷墨口(124)。一个微电动机械致动器(128)与所述驱动电路连接。所述致动器包括一可移动构件(130)，所述可移动构件(130)在接收到从驱动电路传来的信号时可以移动。所述可移动构件确定了一个位移表面，该位移表面作用在喷嘴腔中的墨上使得墨从喷墨口喷出。所述位移表面的面积在喷墨口的截面面积的一半至二倍之间。

Description

喷墨打印头芯片
技术领域
本发明涉及一种喷墨打印头芯片。特别是，本发明涉及一种喷墨打印头芯片的喷墨嘴装置。
技术背景
在已经发明的许多不同类型的打印中，有许多现在还在使用。已知形式的打印机可以通过各种方法用相关的记录媒体在打印媒体上留下痕迹。常用的打印形式包括偏移打印、激光打印和复印装置、点阵型击打式打印机、热纸打印机、微缩胶片记录器、热腊打印机、染料升华打印机和喷墨打印机，后两者都是按需滴入且连续流动类型的。当考虑到价格、速度、质量、可靠性、结构简单性和操作等等因素时，每个类型的打印机都有其自身的优点和缺点。
近年来，主要由于其价廉和通用的特性，喷墨打印机领域，其中每个单个的墨的像点来源于一个或者多个喷墨嘴，越来越受到欢迎。
已经发明了许多不同的喷墨打印机技术。对于此领域的统计调查可以参考J Moore的文章，“Non-impact Printing：Introduction and HistoricalPerspective”，Output Hard Copy Devices，编辑是R Dubeck和S Sherr，207-220页(1988)。
喷墨打印机本身有许多不同的类型。在喷墨打印中采用连续墨流看起来可以至少追溯到1929年，其中，在Hansell发表的美国专利1941001号中公开了一种简单形式的连续流静电喷墨打印机。
Sweet发表的美国专利3596275也公开了一种连续流喷墨打印工艺，包括了一步骤，在此步骤中高频静电场调制喷墨流因而引起墨滴分离。几个制造厂商，包括Elmjet和Scite公司(还可以参考Sweet等的美国专利3373437号)，现在还在使用该技术。
压电喷墨打印机也是一种常用的喷墨打印机装置。压电系统由Kyser等在美国专利3946398(1970)中公开，所述压电系统采用一个隔膜式的操作；Zolten在美国专利3683212(1970)中公开了一种挤压式操作的压电晶体；Stemme在美国专利3747120(1972)中公开了一种弯曲式的压电操作；Howkins在美国专利4459601中公开了用压电推压模式来驱动喷墨流；以及Fischbeck在美国专利4584950中公开了一种剪切式的压电转换器元件。
近来，热喷墨打印成为了一种极受欢迎的喷墨打印形式。这种喷墨打印技术包括由Endo等在GB2007162(1979)和Vaught等在美国专利44900728中公开的技术。以上提到的两个参考都公开了依赖于电热致动器的驱动的喷墨打印机技术，电热致动器的驱动导致在一个狭窄的空间内，譬如一个喷嘴内，产生一个气泡，从而引起通过一个孔隙向一个有关的打印媒体上喷墨，该孔隙与上述的狭窄空间相连。制造厂商譬如佳能和惠普生产利用电热致动器的打印装置。
由以上所述可见，现有不同类型的打印技术。理想地，一种打印技术应当具有许多有利的特性。这包括廉价的结构和操作，高速操作，安全和连续的长期操作等等。在成本、速度、质量、可靠性、电耗、结构简单性、操作、耐用和耗材领域每种技术都可能具有各自的优点和缺点。
在申请号USSN09/112,767中公开有一种打印头芯片和制造所述打印头芯片的方法。所述打印头芯片的喷嘴装置各包括一个微电动机械致动器，所述微电动机械致动器移动一个可移动的构件，所述可移动的构件作用在一个喷嘴腔内的墨上使其从一个与所述喷嘴腔液体连通的喷墨口喷出。
从下面的专利和专利申请中，本申请发现了大量不同构形的喷嘴装置：
6,227,652   6,213,588  6,213,589  6,231,163   6,247,795
09/113,099  6,244,691  6,257,704  09/112,778  6,220,694
6,257,705   6,247,794  6,234,610  6,247,793   6,264,306
6,241,342   6,247,792  6,264,307  6,254,220   6,234,611
09/112,808  6,283,582  6,239,821  09/113,083  6,247,796
09/113,122  09/112,793 09/112,794 09/113,128  09/113,127
6,227,653   6,234,609  6,238,040  6,188,415   6,227,654
6,209,989   6,247,791  09/112,764 6,217,153   09/112,767
6,243,113   6,283,581  6,247,790  6,260,953   6,267,469
09/425,419  09/425,418 09/425,194 09/425,193  09/422,892
09/422,806  09/425,420 09/422,893 09/693,703  09/693,706
09/693,313  09/693,279 09/693,727 09/693,708  09/575,141
以上专利/专利申请现引入本文中。
以上专利/专利申请的喷嘴装置使用集成电路制造技术制造。领域内普通技术人员会理解这种技术要求建立一个制造车间。这包括制造晶片组的步骤。这样做的成本极高。因此本申请人花费了成千人时模拟以上专利和专利申请中的每个结构。
所述模拟也是必要的，因为每个喷嘴装置在尺寸上都是微观的。从而，对这样许多的结构进行成百万次操作的物理检测一般是不可行的。
作为这些模拟的结果，本申请人确定，对多数结构一些共同特征提供了喷嘴装置的最佳性能。从而，本申请人构思了本发明用来确定这些共同特征。
发明内容
根据本发明提供的一种喷墨打印头芯片，所述喷墨打印头芯片包含一个晶片衬片，
置于晶片衬片上的驱动电路，和
置于晶片衬片上的多个喷嘴装置，每个喷嘴装置包含
置于晶片衬片上的喷嘴腔壁和顶壁，以确定喷嘴腔和所述顶壁中的喷墨口，
一个与所述驱动电路连接的微电动机械致动器，所述致动器包括一个可移动构件，当接收到一个从驱动电路传来的信号时此部件可以移动，所述可移动构件定义了一个位移表面，它作用在喷嘴腔内的墨上使得墨从喷墨口喷出，其中
位移表面的面积在喷墨口的面积的一半至两倍之间。
每个致动器的可移动构件可以确定至少一部分的所述喷墨嘴腔壁和至少一部分的所述顶壁。可移动构件的移动引起喷墨嘴腔容积的减少，从而使得墨从喷墨口喷出。特别地，每个致动器的可移动构件都可以确定整个顶壁。
每个致动器可以包括一个连接到所述驱动电路的加热电路，从这个意义上来说，致动器是热动式的。致动器可以这样设计，使得在加热时，作为差动膨胀的结果，致动器相对于晶片衬片偏转，引起为了从喷墨嘴喷墨可移动构件所必需的移动。
本发明延伸到一种喷墨打印头，此打印头包括多个上述的喷墨打印头芯片。
附图说明
下面将参照附图，仅以举例的方式说明本发明的优选实施方式，尽管还有其它可以落入本发明范畴内的实施方式，在附图中
图1至图3是示意性剖面图，举例说明本发明喷墨打印头芯片的喷嘴装置的工作原理。
图4a和图4b举例说明喷嘴装置热致动器的工作原理。
图5是优选实施方式的一个单独喷嘴装置的侧视透视图。
图6是本发明一部分打印头的平面图。
图7是一个符号表，显示了图8至图16中指示的材料。
图8至图17是喷墨打印头芯片在一种构造形式中的制造步骤的剖面图。
图18是本发明的另一个喷墨打印头芯片的喷嘴装置的三维示意图。
图19至21是图18中喷嘴装置操作的一个三维示意图。
图22是部分图18中打印头芯片的三维图示。
图23是图18中打印头芯片的一个细节部分。
图24是图18中具有喷嘴保护装置的打印头芯片的三维剖视图。
图25a至25r是图18中打印头芯片喷嘴装置制造步骤的三维示图。
图26a至26r是图18中打印头芯片喷嘴装置制造步骤的侧视剖视图。
图27a至27k是在制造工艺各个步骤中使用的掩模。
图28a至28c是喷嘴装置的操作的三维示图，该喷嘴装置是根据图25和26的方法制造的。
图29a至29c是喷嘴装置的操作的侧视剖视图，该喷嘴装置是根据图25和26的方法制造的。
图30是本发明打印头喷嘴装置的一个示意的概念性侧视剖视图。
图31是图30中喷嘴装置的一个平面图。
具体实施方式
本发明的优选实施方式公开了一种由一系列喷嘴装置构成的喷墨打印头芯片。在一个实施方式中，每个喷嘴装置包括一个热表面致动器装置，所述热表面致动器装置包括一个L形横截面和一个空气呼吸边缘，使得使用非常低的能量，启动叶片致动器导致一个墨滴从一个喷嘴喷出。
首先参照图1至图3说明该优选实施方式的工作原理。在图1中示意地显示了单个喷嘴装置1的一个剖视图，所述喷嘴装置包括一个含有墨源的喷墨嘴腔2，所述墨源通过一个供墨槽路3补给。提供一个喷嘴框4以确定一个喷墨口。一个弯液面5跨过喷墨口，在静止状态带有稍微的凸起。在喷墨嘴腔的顶面上形成一个弯曲的致动器装置7，该装置包括一个大体上平行于喷墨嘴的腔壁9的侧臂8，从而形成一个“空气呼吸槽”10，所述呼吸槽有助于弯曲致动器7的低能驱动。理想地，弯曲致动器7的前表面是厌水的，从而在弯曲致动器7与腔壁9之间形成一个弯液面12，在呼吸槽10中留下一个气穴。
当希望经喷嘴框4喷射一个墨滴时，启动弯曲致动器7使其快速向下弯曲，如图2中所示。致动器7的快速向下运动导致喷墨嘴腔2内墨压的总体上升。这导致喷嘴框4周围墨的流出以及弯液面5的总体凸起。弯液面12经历少量的移动。
然后关闭致动器装置7使其缓慢地回到起始位置，如图3中所示。致动器7返回其起始位置导致喷墨嘴腔2中的压力下降，从而引起墨往喷墨嘴腔2总体上的回流。除墨15的回流之外，喷墨嘴腔外的墨的前冲力导致一个总体上的颈缩和墨滴14的断开。表面张力作用然后把墨经供墨槽路3进一步抽入喷墨嘴腔中。墨被抽入喷墨嘴腔3中，直到再次达到图1的静止位置。
致动器装置7可以是一个使电流流经导电芯线来加热的热致动器。优选的，所述热致动器有一个导电芯线，此导电芯线封在具有高热膨胀系数的材料中，例如聚四氟乙烯。如图4中所示，导电芯线23优选地是蛇形的并且封在具有高热膨胀系数的材料24中。因此，如图4b中所示，在加热导电芯线23时，材料24较大地膨胀从而按照要求向下弯曲。
图5是单个喷嘴装置在参考图2所描述的状态时的局部剖侧视图。在实践中，喷嘴装置1可以用标准的MEMS技术成形到半导晶片20上。
优选地加工硅晶片20使其包括一个CMOS层21，所述CMOS层21可以包括一相关电路，该电路用于全面控制本发明的打印头芯片的一系列喷嘴装置。在CMOS层21的顶部形成一玻璃层22和一致动器7，该致动器通过电流流经封在聚四氟乙烯(PTFE)层24上部中的蛇形铜线圈23驱动。电流流经线圈23时，线圈23和PRFE层24被加热。PTFE具有非常高的热膨胀系数从而快速膨胀。蛇形线圈23能够完全随着PTFE层24一起膨胀。PTFE层24包括一个侧臂8，所述侧臂8在膨胀时以上述的舀进运动弯曲。作为这种舀进运动的一个结果，弯液面5大体上弯曲从而引起墨滴的喷出。喷墨嘴腔4后来通过表面张力作用经供墨槽3抽墨而受补给，所述供墨槽3使用高度各向同性硅的沟道蚀刻器穿透晶片蚀刻。因此，可以通过启动致动器7把墨供给到晶片的后表面并且喷出。侧臂8与腔壁9之间的间隙虑及了一种重要的呼吸作用，此呼吸作用导致墨滴喷出时所需要的能量很低。
可以看出侧臂8和致动器7一起确定了一个作用在墨上使其从喷墨口喷出的位移表面。侧臂8、致动器7和喷嘴框4的构造使得喷墨口的横截面面积接近于位移表面的面积。
大量的如图5所述装置1可以一起成形在一个晶片上，所述装置集合到打印头中，打印头可以根据要求具有不同的尺寸。
图6是一个提供三色打印的一个阵列30，每一种颜色提供间隔开的两排喷嘴装置34。这三个编组可以包含编组31、32和33，每个编组供给不同的墨色，从而提供全色打印的能力。另外，设置一系列例如36的连接垫片用于提供打印头30的TBA连接控制信号。明显地，图6的装置30只是打印头的一部分，所述打印头的长度可以按照需要来确定。
可以用以下步骤来进行详细的制造工艺，此工艺可用于制造本实施例的整体的喷墨打印头。
1.使用一个双侧抛光的晶片20，利用0.5微米、单晶、双铝CMOS工艺21完成驱动晶体管、数据分布和时钟电路。图8显示了此步骤晶片的相关特征。为了表达清楚，这些图示可能不是按比例的，并且可能不代表通过喷嘴的任一平面的横截面。图7表示了这些制造图示以及那些交叉参引喷墨结构中的各种材料。
2.用掩模1向下蚀刻CMOS氧化层直至硅或者第二金属层。该掩模确定喷嘴腔和芯片边缘。图8显示了此步骤中晶片的相关特征。
3.用氧化物作掩模等离子蚀刻硅直至20微米的深度。图9显示了此步骤示。
4.用CMP沉积23微米的牺牲材料50并且向下平面化直至氧化物。图10显示了此步骤中。
5.用掩模2把牺牲材料蚀刻到15微米的深度。此掩模确定了位于致动器端部的竖直的叶片8。图11显示了此步骤。
6.沉积一个亲水的聚合物薄层(未显示)，并且处理该聚合物表面用于粘贴PTFE。
7.沉积1.5微米的聚四氟乙烯(PTFE)51。
8.使用掩模3蚀刻PTFE和CMOS氧化层直至第二金属层。该掩模确定了加热器电极的镀通孔(contact vias)52。图12显示了此步骤。
9.使用掩模4利用提离工艺沉积一个0.5微米的金图样53。该掩模确定加热器的图样。图13显示了此步骤。
10.沉积1.5微米的PTFE54。
11.使用掩模5蚀刻1微米的PTFE。此掩模确定喷嘴框4和在喷嘴腔边缘的框4。图14显示了此步骤。
12.使用掩模6把PTFE层和所述薄亲水层都蚀刻到牺牲层。此掩模确定致动器和叶片边缘的间隙10。图15显示了此步骤。
13.使用掩模7经硅晶片反向蚀刻直至牺牲层(例如，使用SurfaceTechnology System提供的ASE高效硅蚀刻器)。此掩模确定穿透晶片蚀刻而成的墨输入口3。图16显示了此步骤。
14.蚀刻牺牲层。晶片也通过此蚀刻切成小片。
15.把打印头装入封装中，所述封装可以是一个塑料模，该塑料模含有向处于晶片背面的墨输入口提供适当颜色的墨的供墨槽。
16.把打印头连接到其互连系统。为了使连接平顺且气流扰动最小，可以使用TAB。如果打印机操作时与纸之间有足够的间距，也可以使用电线连接。
17.用墨55填满整个的打印头并且检测它们。图17显示了一个填满了墨的喷嘴。
在图18中，总体上用标号110指代一个喷嘴装置，系本发明打印头芯片的另一个实施方式。打印头芯片具有多个在硅衬片116上布置成阵列的喷嘴装置110(图22和图23)。下面详细地描述阵列114。
喷嘴装置110包括一个硅衬片或者说晶片16，其上沉积一个介电层118。一个CMOS钝化层120沉积在介电层118上。每个喷嘴装置110包括一个确定一个喷墨口124的喷嘴122、一个具有杠杆臂126形式的连接构件和一个致动器128。杠杆臂126把致动器128连接到喷嘴122。
如在制图19至21中详细显示的，喷嘴122包含一个冠部130，所述冠部带有悬于该冠部130的裙部132。所述裙部132形成喷嘴腔134的周边壁的一部分(图19至21)。喷墨口124与喷墨嘴腔134流体连通。应当注意喷墨口124由一个隆起框136包绕(图19)，此隆起框“钉扎着”喷墨嘴腔134中墨体140的弯液面138。。
喷墨嘴腔134的底146内有一个墨输入口孔隙142(图23中所示最为清楚)。孔隙142与穿过衬片116的墨输入槽149流体连通。
一壁部150包绕着孔隙142并且从底部146往上延伸。如以上所述，喷嘴122的裙部132确定喷墨嘴腔134的周边壁的第一部分，壁部150确定喷墨嘴腔134的周边壁的第二部分。
壁150在其游离端具有向内指的唇部152，该唇部作为流体封口用于防止喷嘴122移动时墨的逸出，如下面详细说明中所述。可以看出，由于墨140的粘性以及唇152与裙部132之间的小间隔尺度，向内指的唇部152以及表面张力起到防止墨从喷墨腔134逸出的密封件作用。
致动器128是一种热弯致动器并且连接到一个从衬片116往上延伸-或者更加具体地说从CMOS钝化层120往上延伸的锚着件154上。锚着件154安装在与致动器128形成电连接的导电垫片156上。
致动器128包含第一主动梁158，所述第一主动梁158安放在第二被动梁160上方。在一个优选的实施方式中，两个梁158和160都是或者包括一种导电陶瓷材料，譬如氮化钛(TiN)。
两个梁158和160都具有其锚在锚着件154上的第一端部，其相对的一端连接到臂126。当使电流流经主动梁158时，梁158产生热膨胀。至于被动梁160，没有电流流过它，不以相同的程度膨胀；产生一个弯曲力矩，引起臂126-从而引起喷嘴122向下往衬片166方向位移，如图20所示。这引起经喷嘴口124喷墨，如在图20中的162处所示。从主动梁158撤走热源，也就是说停止电流时，喷嘴122返回其静态的位置，如图21中所示。当喷嘴122返回其静态位置时，由于一个小墨滴颈部断裂结果形成一个小墨滴，如图21中的166处所示。该墨小滴164然后转移到打印媒体，譬如一张纸上。作为形成小墨滴164的结果，形成一个“负的”弯液面，如图21中的168处所示。该“负的”弯液面168导致墨流140进入喷墨嘴腔134中，从而形成一个新的弯液面138(图19)以准备下一次从喷嘴装置110喷出墨滴。
可以看出，冠部130确定了一个位移表面作用在喷墨嘴腔134中的墨上。设计冠部130的结构使得位移表面的面积大于喷墨口124的横截面积的一半但是小于其两倍。
现在参考图22和图23详细地说明喷嘴阵列114。该阵列114用于一个四色打印头。因此，阵列114包括四组170喷嘴装置，每组对应一种颜色。每个组170具有安排成两排172和174的喷嘴装置110。在图23中更详细地显示了一个组170。
为了方便地紧密组装排172和174中的喷嘴装置110，排174中的喷嘴装置110相对于排172中的喷嘴装置110偏移或者说交错。还有，排172中的喷嘴装置110相互间隔开足够远，使得排174喷嘴装置110的杠杆臂126能够在排172喷嘴装置110的相邻的喷嘴122之间通过。还要注意到每个喷嘴装置110基本上是做成哑铃形状的，从而使排172中的喷嘴122排列在排174相邻喷嘴装置110的喷嘴122与致动器128之间。
而且，为了方便地紧密组装排172和174中的喷嘴122，每个喷嘴122基本上做成六边形形状。
本领域内普通技术人员可以看出，使用中，当喷嘴122向衬片166移动时，由于喷嘴口124对喷墨嘴腔134稍成角度，墨稍微偏离垂直方向地喷出。图22和23中所示的装置的一个优点是排174和172中的喷嘴装置110的致动器128沿同一个方向伸到排174和172的一侧。因此从排172中的喷嘴122中喷出的墨滴和从排174中的喷嘴1 22中喷射出的墨滴相互平行，从而提高了打印的质量。
还有，如图22中所示，衬片16具有布置于其上的连接垫片176，所述连接垫片经垫片156对喷嘴装置110的致动器128提供电连接。这些电连接经CMOS层(未示)形成。
参考图24，图中显示了本发明的一个发展。参考以前的各图，除非另有说明，相同的标号指代相同的部分。
在此发展中，一个喷嘴护板180安装在阵列114的衬片116上。喷嘴护板180包括一个体部构件182，多个通道184通过此构件。通道184与阵列144的喷嘴装置110的喷嘴口124对齐，从而，当从喷嘴口124之一喷墨时，墨先通过相应通道184而后落射打印媒体上。
体部构件182相对于喷嘴安装置110通过臂或者说支柱186间隔起来安装。支柱186之一具有位于其中的空气入口188。
在使用中，当操作阵列114时，经入口孔188充以空气，空气被迫入通道184中，与墨一起穿过通道184移动。
由于空气以与小墨滴164不同的速度充入通道184，墨并不夹带于空气中。例如，以约3m/s的速度从喷嘴122喷出墨滴164。以约1m/s的速度经通道184充入空气。
空气的用途是保持通道184不存在异物颗粒。存在诸如尘土之类的异物颗粒会落在喷嘴装置110上的危险，这会对操作造成不利的影响。在喷嘴护板180中设置空气入口188，在较大的程度上避免了此问题。
下面参见图25至27，描述了制造喷嘴装置110的一种工艺。
从硅衬片或者说晶片116开始，在晶片116的一个表面上沉积一个介电层118，所述介电层118为大约1.5微米的CVD氧化物。在层118上旋涂阻蚀剂，并且把层118暴露于掩模200并且接着显影。
在显影以后，把层118向下等离子蚀刻直至硅层116。然后剥去阻蚀剂并且清洁层118。此步骤确定了墨入口孔隙142。
在图25b中，在层118上沉积约0.8微米的铝202。旋涂阻蚀剂，并且把铝202暴露于掩模204并且接着显影。把铝202向下等离子蚀刻直至氧化物层118，剥去阻蚀剂并且清洁所述装置。此步骤提供了连接垫片和对喷墨致动器128的相互连接。此相互连接是对于一个NMOS驱动晶体管和一个带有CMOS层(未示)内连接线路的电源层的。
沉积约0.5微米的PECVD氮化物作为CMOS钝化层120。旋涂阻蚀剂并且把层120暴露于掩模206然后把它显影。显影后把氮化物向下等离子蚀刻直至铝层202以及入口孔隙142区域中的硅层116。剥去阻蚀剂并且清洁所述装置。
在层120上旋涂牺牲材料层208。材料208是6微米的光敏聚酰亚胺或者约4微米的高温阻蚀剂。软烘烤(softbake)层208并且把它暴露于掩模210，此后把它显影。然后，把层208在400℃下硬烘烤(hardbake)一个小时，层208包含光敏聚酰亚胺或者在高于300℃时层208是高温阻蚀的。应当注意在附图中，在掩模210的设计中考虑了由于绉缩引起的聚酰亚胺层208的图样依从性畸变。
在下一个步骤中，示于图25e中，镀一个第二牺牲层212。层212或者是一个旋涂的2微米光敏聚酰亚胺，或者是约1.3微米的高温阻蚀剂。把层212软烘烤并且暴露于掩模214。在暴露于掩模214后把层212显影。在层212是聚酰亚胺的情况下，把层212在400℃下硬烘烤一个小时。层212是阻蚀物时，在高于300℃的温度下硬烘烤约一个小时。
然后沉积一个0.2微米的多层金属层216。此层216的部分形成致动器128的被动梁160。
层216通过在300℃左右喷涂1000埃氮化钛(TiN)接着喷涂50埃氮化钽(TaN)形成。再喷涂上另一个1000埃的氮化钛TiN，接着喷涂50埃氮化钽TaN，然后再喷涂1000埃的氮化钛TiN。
可以用来代替TiN的其它材料是TiB2、MoSi2或者(Ti，Al)N。
然后把层216暴露于掩模218，显影并且向下等离子蚀刻到层212，此后湿剥层216的阻蚀剂，小心不要去掉硬化了的层208或者212。
通过旋涂4微米光敏聚酰亚胺或者是约2.6微米的高温阻蚀剂形成一个第三牺牲层220。把层220软烘烤，此后暴露于掩模222。然后把暴露层显影，接着是硬烘烤。在聚酰亚胺层的情况下，把层220在400℃下硬烘烤约一个小时，或者在层212是阻蚀物时在高于300℃的温度下硬烘烤。
然后在层220上镀第二多层金属层224。层224的构成与层216的构成相同，并且用相同的方式镀层。可以看出，两个层216和224都是导电的层。
把层224暴露于掩模226然后显影。把层224向下等离子蚀刻到聚酰亚胺或者高温阻蚀剂层220，此后湿剥层224的阻蚀剂，小心不要去掉硬化了的层208、212或者220。可以注意到层224的余留部分确定了致动器128的主动梁158。
通过旋涂上4微米的光敏聚酰亚胺或者是约2.6微米的高温阻蚀剂形成第四牺牲层228。把层228软烘烤、暴露于掩模230，然后显影以留下图25k所示小岛部分。把层228的余留部分硬烘烤，在聚酰亚胺的情况下于400℃时烘烤约一个小时，在阻蚀剂时在高于300℃的温度下硬烘烤。
如图251中所示，沉积一个高杨氏模量的介电层232。层232由约1微米氮化硅或者氧化铝构成。层232在低于牺牲层208、212、220、220、226的硬烘烤温度下沉积。对于该介电层232所要求的主要特性是高弹性模量、高化学惰性和对TiN良好的粘附性。
通过旋涂2微米光敏聚酰亚胺或者是约1.3微米的高温阻蚀剂形成一个第五牺牲层234。把层234软烘烤，暴露于掩模236并且显影。把层228的余留部分硬烘烤，在聚酰亚胺的情况下于400℃硬烘烤一个小时，在阻蚀剂的情况下在高于300℃的温度下硬烘烤。
把层232向下等离子蚀刻到牺牲层228，小心不要去掉任何牺牲层234。
该步骤确定了喷嘴装置110的喷墨口124、杠杆臂126和锚着件154。
沉积一个高杨氏模量的介电层238。所述层238通过在低于牺牲层208、212、220、220和228的硬烘烤温度下沉积约0.2微米氮化硅或者氧化铝形成。
然后，如图25p所示，把层238各向异性地向下等离子蚀刻到一个0.35微米的深度。此蚀刻旨在从除介电层232和牺牲层234的侧壁以外的整个表面清除介电质。该步骤产生围绕喷嘴口124的喷嘴框136，如前所述，此喷嘴框“牵制”墨的弯液面的。
形成一个紫外线(UV)松解带240。在硅晶片116上旋涂0.4微米的阻蚀剂。把晶片116暴露于掩模242，反向蚀刻晶片116以确定墨输入槽148。然后从晶片116剥去阻蚀剂。
在晶片16的后部形成另一个紫外线松解带(未示)并且去除带240。用氧等离子剥去牺牲层208、212、220、220、228和234，以提供如图25r和26r中所示的最终喷嘴装置110。为了便于参照，这两个图中的参考标号与图18中的标号相同，用来指代喷嘴装置110的相关部分。图28和29显示了喷嘴装置110的操作，此装置依据参照图25和26说明的上述工艺制造，并且这些图与图19至21对应。
在图30和图31中，标号250总体上指代本发明打印头芯片的喷嘴装置。关于前面各图，除非另有说明，相同的参考标号指代相同的部分。
图30和图31旨在指出一空间关系，适用于具有置于喷墨嘴腔中用来从喷墨嘴腔喷墨的移动构件的所有喷嘴装置类型。这些喷嘴装置的具体细节在参引的专利/专利中给出。因此这些细节不在本说明中给出。
喷嘴装置250包括一个硅晶片衬片252。一个二氧化硅的驱动电路层254置于晶片衬片252上。一个钝化层256置于驱动电路层254上以保护该驱动电路层254。
喷嘴装置250包括具有一对对置的侧壁258、一个远端壁260和一个近端壁262形式的喷墨嘴腔壁。一个顶部264跨越壁258、260、262。顶部264和壁258、260、262确定一个喷墨嘴腔266。在顶部264中确定了一个喷墨口268。
穿透晶片252、和层254、256确定了一个墨输入槽路290。在大体上与喷墨口268对齐的位置上，墨输入槽路290开口于喷墨嘴腔266。
喷嘴装置250包括一个热致动器270。所述热致动器包括一个伸入喷墨嘴腔266中的致动臂272形式的可移动构件。所述致动臂272的尺寸做得可以跨越喷墨嘴腔266的从近端壁262至远端壁260的一个区域。致动臂272置于墨输入槽路290与喷墨口268之间。致动臂272延伸通过确定在近端壁262上的开口274，安装在喷墨嘴腔266的外侧的一个锚着结构276上。一个密封装置278置于开口274中以阻止喷墨嘴腔266中墨的外溢。
致动器272包括一个体部280，该体部材料的热膨胀系数是如此之高，以至于可以利用材料受热时的热膨胀来作功。这样一种材料的例子是聚四氟乙烯(PTFE)。在钝化层256与上侧282之间，体部280确定了一个上侧282和一个下侧284。一个加热元件288置于体部280中且接近于下侧284。所述加热元件288确定了一个加热电路，此加热电路用锚着结构276中的镀通孔连接到层254中的驱动电路(未示)。在使用中，驱动电路的电信号加热所述加热元件288。加热件288的位置导致体部280接近下侧284的部分膨胀的程度比体部280的其余部分大。因此，致动臂272向顶部264偏转，引起从喷墨口268喷墨。信号终止时，体部280冷却并且导致差动收缩(differential contraction)，使得致动臂272返回到静止状态。
可以看出，致动臂272的上侧282确定了一个作用在墨上使得墨从喷墨口268喷出的位移表面292。位移表面292大于喷墨口268的面积的一半，但是小于喷墨口268的面积的两倍。本申请人经过成千上万次模拟发现这样的相对尺度提供了喷嘴装置250的最佳性能。本申请人也发现，这样的相对尺度最好做到了对芯片物尽所用，这之所以很重要是因为芯片资源是非常昂贵的。所述尺度保证喷嘴装置250提供最小的热容积。从而优化了喷嘴装置250的效率并且确保了足够的喷射墨滴的力量。
在此公开的喷墨打印技术可适用于广泛的打印系统，包括：彩色和单色办公室打印机、短程数字打印机、高速数字打印机、偏移压力补充打印机、低成本扫描打印机、高速页宽打印机、带有内装页宽打印机的笔记本、便携彩色和单色打印机、彩色和单色复印机、彩色和单色传真机、打印传真和复印组合机、标签打印机、大格式描绘器、照片拷贝机、数字照片“微实验室”用打印机、录像打印机，PHOTO CD(PHOTO CD是Eastman Kodak公司的注册商标)打印机、PDA的便携打印机、蜡纸打印机、室内标签打印机、广告牌打印机、编织物打印机、照像机打印机和容错商用打印机系统。
本领域内普通技术人员可以看出，可以对特定实施方式中所示的本发明进行改变和/或修改，而不偏离泛泛说明的本发明的主旨和范畴。因此，这些实施例认为在所有方面都是示例性的而不是限制性的。

Claims (4)

1.一种喷墨打印头芯片，所述喷墨打印头芯片包含
一个晶片衬片，
置于所述晶片衬片上的驱动电路，以及
置于所述晶片衬片上的多个喷嘴装置，每个喷嘴装置包含
置于所述晶片衬片上的喷嘴腔壁和一个顶壁，以确定一个喷嘴腔和一个在所述顶壁中的喷墨口，
一个与所述驱动电路连接的微电动机械致动器，所述致动器包括一个可移动构件，所述可移动构件在接收到从所述驱动电路传来的信号时可以移动，所述可移动构件确定了一个位移表面，该位移表面作用在喷嘴腔内的墨上使得墨从喷墨口喷出，其中
每个致动器的可移动构件确定了喷嘴腔壁的至少一部分以及顶壁的至少一部分，从而，可移动构件的移动的作用是使喷嘴腔的容积减少，从而使得墨从喷墨口喷出，
其中位移表面的面积在喷墨口的面积的一半至两倍之间。
2.如权利要求1所述的喷墨打印头芯片，其特征在于：每个致动器的可移动构件确定整个顶壁。
3.如权利要求1所述的喷墨打印头芯片，其特征在于：每个致动器是热动式的，包括一个连接到所述驱动电路的加热电路，设计所述致动器的构造使得在加热时，作为差动膨胀的结果，所述致动器相对晶片衬片偏转，该偏转引起从喷墨嘴喷墨所需要的可移动构件的移动。
4.一种喷墨打印头，包括多个如权利要求1所述的喷墨打印头芯片。
CNB028290925A 2002-06-28 2002-08-29 喷墨打印头芯片 Expired - Fee Related CN100402291C (zh)

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