Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B63—SHIPS OR OTHER WATERBORNE VESSELS; RELATED EQUIPMENT
  • B63B—SHIPS OR OTHER WATERBORNE VESSELS; EQUIPMENT FOR SHIPPING 
  • B63B35/00—Vessels or similar floating structures specially adapted for specific purposes and not otherwise provided for
  • B63B35/40—Vessels or similar floating structures specially adapted for specific purposes and not otherwise provided for for transporting marine vessels
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B22—CASTING; POWDER METALLURGY
  • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
  • B22D31/00—Cutting-off surplus material, e.g. gates; Cleaning and working on castings
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C44/00—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles
  • B29C44/34—Auxiliary operations
  • B29C44/3415—Heating or cooling
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B63—SHIPS OR OTHER WATERBORNE VESSELS; RELATED EQUIPMENT
  • B63B—SHIPS OR OTHER WATERBORNE VESSELS; EQUIPMENT FOR SHIPPING 
  • B63B27/00—Arrangement of ship-based loading or unloading equipment for cargo or passengers
  • B63B27/16—Arrangement of ship-based loading or unloading equipment for cargo or passengers of lifts or hoists
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B63—SHIPS OR OTHER WATERBORNE VESSELS; RELATED EQUIPMENT
  • B63B—SHIPS OR OTHER WATERBORNE VESSELS; EQUIPMENT FOR SHIPPING 
  • B63B27/00—Arrangement of ship-based loading or unloading equipment for cargo or passengers
  • B63B27/36—Arrangement of ship-based loading or unloading equipment for floating cargo
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B63—SHIPS OR OTHER WATERBORNE VESSELS; RELATED EQUIPMENT
  • B63B—SHIPS OR OTHER WATERBORNE VESSELS; EQUIPMENT FOR SHIPPING 
  • B63B3/00—Hulls characterised by their structure or component parts
  • B63B3/13—Hulls built to withstand hydrostatic pressure when fully submerged, e.g. submarine hulls
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B63—SHIPS OR OTHER WATERBORNE VESSELS; RELATED EQUIPMENT
  • B63G—OFFENSIVE OR DEFENSIVE ARRANGEMENTS ON VESSELS; MINE-LAYING; MINE-SWEEPING; SUBMARINES; AIRCRAFT CARRIERS
  • B63G8/00—Underwater vessels, e.g. submarines; Equipment specially adapted therefor
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B63—SHIPS OR OTHER WATERBORNE VESSELS; RELATED EQUIPMENT
  • B63G—OFFENSIVE OR DEFENSIVE ARRANGEMENTS ON VESSELS; MINE-LAYING; MINE-SWEEPING; SUBMARINES; AIRCRAFT CARRIERS
  • B63G8/00—Underwater vessels, e.g. submarines; Equipment specially adapted therefor
  • B63G8/001—Underwater vessels adapted for special purposes, e.g. unmanned underwater vessels; Equipment specially adapted therefor, e.g. docking stations
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B63—SHIPS OR OTHER WATERBORNE VESSELS; RELATED EQUIPMENT
  • B63G—OFFENSIVE OR DEFENSIVE ARRANGEMENTS ON VESSELS; MINE-LAYING; MINE-SWEEPING; SUBMARINES; AIRCRAFT CARRIERS
  • B63G8/00—Underwater vessels, e.g. submarines; Equipment specially adapted therefor
  • B63G8/39—Arrangements of sonic watch equipment, e.g. low-frequency, sonar
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
  • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
  • F17C1/00—Pressure vessels, e.g. gas cylinder, gas tank, replaceable cartridge
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
  • G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
  • G01S15/02—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems using reflection of acoustic waves
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
  • G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
  • G01S15/02—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems using reflection of acoustic waves
  • G01S15/06—Systems determining the position data of a target
  • G01S15/08—Systems for measuring distance only
  • G01S15/10—Systems for measuring distance only using transmission of interrupted, pulse-modulated waves
  • G01S15/102—Systems for measuring distance only using transmission of interrupted, pulse-modulated waves using transmission of pulses having some particular characteristics
  • G01S15/104—Systems for measuring distance only using transmission of interrupted, pulse-modulated waves using transmission of pulses having some particular characteristics wherein the transmitted pulses use a frequency- or phase-modulated carrier wave
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
  • G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
  • G01S15/02—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems using reflection of acoustic waves
  • G01S15/50—Systems of measurement, based on relative movement of the target
  • G01S15/58—Velocity or trajectory determination systems; Sense-of-movement determination systems
  • G01S15/588—Velocity or trajectory determination systems; Sense-of-movement determination systems measuring the velocity vector
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
  • G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
  • G01S15/02—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems using reflection of acoustic waves
  • G01S15/50—Systems of measurement, based on relative movement of the target
  • G01S15/58—Velocity or trajectory determination systems; Sense-of-movement determination systems
  • G01S15/60—Velocity or trajectory determination systems; Sense-of-movement determination systems wherein the transmitter and receiver are mounted on the moving object, e.g. for determining ground speed, drift angle, ground track
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
  • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
  • G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
  • G01S7/52004—Means for monitoring or calibrating
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
  • H01M10/00—Secondary cells; Manufacture thereof
  • H01M10/05—Accumulators with non-aqueous electrolyte
  • H01M10/052—Li-accumulators
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
  • H01M10/00—Secondary cells; Manufacture thereof
  • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
  • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
  • H01M10/4257—Smart batteries, e.g. electronic circuits inside the housing of the cells or batteries
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
  • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
  • H01M50/10—Primary casings; Jackets or wrappings
  • H01M50/138—Primary casings; Jackets or wrappings adapted for specific cells, e.g. electrochemical cells operating at high temperature
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B63—SHIPS OR OTHER WATERBORNE VESSELS; RELATED EQUIPMENT
  • B63B—SHIPS OR OTHER WATERBORNE VESSELS; EQUIPMENT FOR SHIPPING 
  • B63B27/00—Arrangement of ship-based loading or unloading equipment for cargo or passengers
  • B63B27/16—Arrangement of ship-based loading or unloading equipment for cargo or passengers of lifts or hoists
  • B63B2027/165—Deployment or recovery of underwater vehicles using lifts or hoists
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B63—SHIPS OR OTHER WATERBORNE VESSELS; RELATED EQUIPMENT
  • B63B—SHIPS OR OTHER WATERBORNE VESSELS; EQUIPMENT FOR SHIPPING 
  • B63B35/00—Vessels or similar floating structures specially adapted for specific purposes and not otherwise provided for
  • B63B35/40—Vessels or similar floating structures specially adapted for specific purposes and not otherwise provided for for transporting marine vessels
  • B63B2035/405—Vessels or similar floating structures specially adapted for specific purposes and not otherwise provided for for transporting marine vessels for carrying submarines
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B63—SHIPS OR OTHER WATERBORNE VESSELS; RELATED EQUIPMENT
  • B63G—OFFENSIVE OR DEFENSIVE ARRANGEMENTS ON VESSELS; MINE-LAYING; MINE-SWEEPING; SUBMARINES; AIRCRAFT CARRIERS
  • B63G8/00—Underwater vessels, e.g. submarines; Equipment specially adapted therefor
  • B63G8/001—Underwater vessels adapted for special purposes, e.g. unmanned underwater vessels; Equipment specially adapted therefor, e.g. docking stations
  • B63G2008/002—Underwater vessels adapted for special purposes, e.g. unmanned underwater vessels; Equipment specially adapted therefor, e.g. docking stations unmanned
  • B63G2008/004—Underwater vessels adapted for special purposes, e.g. unmanned underwater vessels; Equipment specially adapted therefor, e.g. docking stations unmanned autonomously operating
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B63—SHIPS OR OTHER WATERBORNE VESSELS; RELATED EQUIPMENT
  • B63G—OFFENSIVE OR DEFENSIVE ARRANGEMENTS ON VESSELS; MINE-LAYING; MINE-SWEEPING; SUBMARINES; AIRCRAFT CARRIERS
  • B63G8/00—Underwater vessels, e.g. submarines; Equipment specially adapted therefor
  • B63G8/001—Underwater vessels adapted for special purposes, e.g. unmanned underwater vessels; Equipment specially adapted therefor, e.g. docking stations
  • B63G2008/002—Underwater vessels adapted for special purposes, e.g. unmanned underwater vessels; Equipment specially adapted therefor, e.g. docking stations unmanned
  • B63G2008/008—Docking stations for unmanned underwater vessels, or the like
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B64—AIRCRAFT; AVIATION; COSMONAUTICS
  • B64U—UNMANNED AERIAL VEHICLES [UAV]; EQUIPMENT THEREFOR
  • B64U80/00—Transport or storage specially adapted for UAVs
  • B64U80/80—Transport or storage specially adapted for UAVs by vehicles
  • B64U80/84—Waterborne vehicles
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
  • G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
  • G01S15/02—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems using reflection of acoustic waves
  • G01S15/06—Systems determining the position data of a target
  • G01S15/08—Systems for measuring distance only
  • G01S15/10—Systems for measuring distance only using transmission of interrupted, pulse-modulated waves
  • G01S15/102—Systems for measuring distance only using transmission of interrupted, pulse-modulated waves using transmission of pulses having some particular characteristics
  • G01S15/107—Systems for measuring distance only using transmission of interrupted, pulse-modulated waves using transmission of pulses having some particular characteristics using frequency agility of carrier wave
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
  • G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
  • G01S15/88—Sonar systems specially adapted for specific applications
  • G01S15/89—Sonar systems specially adapted for specific applications for mapping or imaging
  • G01S15/8902—Side-looking sonar
  • G01S15/8904—Side-looking sonar using synthetic aperture techniques
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
  • Y02E60/10—Energy storage using batteries
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
  • Y02T70/00—Maritime or waterways transport
  • Y02T70/10—Measures concerning design or construction of watercraft hulls
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49117—Conductor or circuit manufacturing
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49826—Assembling or joining
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49826—Assembling or joining
  • Y10T29/49893—Peripheral joining of opposed mirror image parts to form a hollow body
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/4998—Combined manufacture including applying or shaping of fluent material
  • Y10T29/49988—Metal casting
  • Y10T29/49989—Followed by cutting or removing material
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
  • Y10T29/5176—Plural diverse manufacturing apparatus including means for metal shaping or assembling including machining means
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
  • Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
  • Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
  • Y10T428/1376—Foam or porous material containing

Definitions

• a method of manufacturing a pressure vessel component may comprise casting a metal to produce a gross pressure vessel component.
• the gross pressure vessel component may be shaped as a hemisphere, a cylinder, a cube, a rectangular prism, or any other suitable shape.
• Portions of the gross pressure vessel component may have an increased thickness located at predetermined positions on the gross pressure vessel component.
• These portions may include bosses or other designed features intended for the finalized pressure vessel component.
• the portions may occur at predetermined angles of elevation and azimuth relative to a sphere equatorial plane.
• the predetermined locations for the bosses may be based on a plurality of possible arrangements of components with a pressure vessel.
• the gross pressure vessel may be indexed to select the portions of the gross pressure vessel component for machining.
• the selected portions may comprise only a subset of the portions of the gross pressure vessel component having an increased thickness. This subset may be determined based on one of a plurality of possible component arrangements within the pressure vessel. These selected portions may then be machined to produce the pressure vessel component.
• cable pass-throughs e.g., holes
• the selected portions are machined after casting and indexing the gross pressure vessel component.
• the pressure vessel component may be made from titanium. In alternate embodiments, any other suitable materials may be used to produce the pressure vessel component, including, but not limited to, steel, aluminum, or tungsten carbide.
• Casting the metal may comprise sintering the metal followed by a hot isostatic press (HIP) process.
• casting the metal may comprise pouring the molten metal into a mold.
• the pressure vessel component may be heat treated, either before, during, or after machining.
• the pressure vessel component may be designed to mate with a second pressure vessel component.
• the pressure vessel component may comprise a hemisphere designed to mate with another hemisphere to form a full sphere.
• the pressure vessel component may use a hinge to open, close, and align with the second pressure vessel component.
• the hinge may be a clam-like hinge.
• At least a partial vacuum may be formed in the cavity formed by the mated pressure vessel component and the second pressure vessel component.
• a system for manufacturing a pressure vessel component may comprise a mold for casting a metal to produce a gross pressure vessel component. Portions of the gross pressure vessel component having an increased thickness may be located at predetermined positions on the gross pressure vessel component.
• the system may further comprise machining equipment configured to index the gross pressure vessel component to select the portions of the gross pressure vessel component for machining. The machining equipment may be used to machine the selected portions to produce a pressure vessel.
• FIG. 1 is a block diagram depicting an exemplary remote vehicle, according to an illustrative embodiment of the present disclosure.
• FIG. 2 is block diagram of an exemplary computer system for implementing at least a portion of the systems and methods described in the present disclosure.
• FIG. 3 A depicts an illustrative pressure vessel component.
• FIG. 3B depicts an illustrative pressure vessel according to one embodiment.
• FIG. 3C depicts an illustrative pressure vessel according to an alternate embodiment.
• FIG. 4 depicts a process of manufacturing a pressure vessel component according to an illustrative embodiment.
• the pressure vessel components may be any suitable shape, including spherical, hemispherical, cylindrical, or rectangular.
• the pressure vessel components may be cast from titanium designed for use in the ocean.
• the pressure vessel may be a spherical titanium pressure vessel with two hemispheres; one hemisphere may be used for supporting the internal electronics chassis assembly, while the other hemisphere may be adorned with external bosses for cable pass-through to enable access to the internal electronics.
• the two hemispheres may be sealed at the equatorial plane of the sphere with an o-ring seal that enables safe operation of the internal electronics at great depths.
• a spherical form factor pressure vessel may be designed to an appropriate wall- thickness with a factor of safety to safely operate at a pre-determined service depth (or pressure).
• the internal cavity may be evacuated to a fraction of standard atmospheric pressure (i.e., ⁇ 14.7psi).
• the spheres may be separated by removing the vacuum and subsequently separating the hemispheres. Jack screws can be used to separate the hemispheres, or the pressure inside the pressure vessel can be increased to force the two sides apart.
• the pressure vessel may or may not contain internal structure or electronics, depending on the application.
• a first pressure vessel component may be shaped as a hemisphere and may have no external features or pass-throughs. Thus, the first pressure vessel component may only require machining on the interface surface.
• a flange may be machined to a 32 RMS finish to act as a sealing surface against the o-rings.
• a second pressure vessel component may also be shaped as a hemisphere, but may have both external features and a flange with o-ring glands to enable watertight sealing during normal operation.
• the o-ring gland may be machined into the equatorial flange at a larger diameter than the nominal sphere outer diameter. This leaves the spherical structural geometry intact to support compressive loading.
• Bosses may protrude from the exterior surface of the second pressure vessel component.
• the bosses may comprise portions of increased material thickness located at predetermined angles of elevation and azimuth relative to the sphere equatorial plane. These boss locations may be chosen to minimize stress and to maximize the packing efficiency of connected cables and devices. However, not all bosses may require post-casting machining. The remaining bosses may remain as cast and left for modification at a later time.
• the pass-throughs may be machined using watertight connectors that fasten to the outer face of the sphere with threaded hardware (e.g., hex head screws). The locations of the connector bolt-holes may be chosen to minimize stress.
• a pressure vessel may have a cylindrical form factor.
• the pressure vessel may consist of a main body comprised of one or more cylindrical sections with end caps.
• the end caps may be hemispheres or square-shaped. All components may be designed to the appropriate wall-thickness with a factor of safety to safely operate at a predetermined service depth (or pressure).
• the cylinder and sphere diameters may be concentric and the same length and align for assembly.
• the cylinder may be arranged such that their sealing surfaces are joined to create a watertight seal that carries the load to support compressive and bending moments.
• Hemispheres may be situated at either end of the cylinder body and may be sealed by use of an o-ring seal at a flange located at the equatorial plane of the
• the internal cavity may be evacuated to a fraction of standard atmospheric pressure (i.e., ⁇ 14.7psi).
• a fraction of standard atmospheric pressure i.e., ⁇ 14.7psi.
• the hemispheres may be separated from the cylinders by removing the vacuum and subsequently removing the band clamps.
• the pressure vessel may or may not contain internal structure or electronics, depending on the application.
• the pressure vessel may be cast with holes or bosses for windows.
• the manufacturing process may consist of casting titanium to produce the gross pressure vessel component shapes, including any boss features.
• the boss features may be cast into their final shape, or the boss features may require additional machining to achieve a final shape.
• the manufacturing process may comprise several steps: casting a metal (such as titanium), indexing the cast part for machining, and machining specific regions of the cast part. Heat treating is optional and may be unnecessary for thinner walled pressure vessels.
• the casting process chosen may depend upon the wall thickness and size of the part being cast.
• the casting process may comprise sintering a metal followed by a hot isostatic press (HIP) process.
• the casting process may comprise pouring molten metal into a mold, such as a lost-wax or a graphite mould.
• the pressure vessel may be sealed by partially evacuating the internal cavity through a dual seal vent plug valve of the sphere so that the hemisphere flanges engage under the force generated by the relative pressure difference between inside and outside the sphere.
• a "band" clamp may be affixed to the flanges of the hemispheres to provide additional clamping force, for example, during shallow water operation.
• the clamp may contain an equally-spaced hole pattern for bolting with threaded hardware.
• the spherical pressure vessel band clamp may contain eye bolts that can be shackled to straps for lifting and handling of the sphere pre and post mission. When the pressure vessel is opened, the hemispheres may need to rest securely in a holder.
• a plastic plate cut with a hole larger than the hemisphere and a finger access pattern that matches the band clamp bolt pattern may be used.
• a band clamp can be applied to both hemispheres and connected via a hinge.
• the spherical pressure vessel band clamp may double as a mounting bracket.
• a cylindrically-shaped pressure vessel may be sealed by bolting the cylindrical section flanges together to create a structurally watertight seal.
• the internal cavity may be partially evacuated through a dual seal vent plug valve, allowing the hemisphere end cap flanges to engage under the force generated by the relative pressure difference between inside and outside the housing.
• additional features may be cast into the pressure vessel component to simplify internal mounting of components.
• the internal mounts may feature slotted holes to prevent the application of stress as the pressure vessel shrinks under pressure.
• flexible standoffs may be applied to the inside of the pressure vessel component when mounting objects such as electronics to prevent the transfer of stress as the pressure vessel component shrinks under pressure. This protects the electronics from damage and protects the pressure vessel component from asymmetric loading.
• radiators may include a beryllium copper radiator for liquid cooling.
• the coolant may be a non-conducting and a non-flammable coolant, such as Fluorinert, or Opticool, rather than normal engine coolant (which conducts) or distilled water (which is non-conducting, but in the event of a leak is difficult to guarantee purity).
• FIG. 1 is a block diagram depicting an illustrative remote vehicle, according to an illustrative embodiment of the present disclosure.
• the system 100 includes a sonar unit 110 for sending and receiving sonar signals, a preprocessor 120 for conditioning a received (or reflected) signal, and a matched filter 130 for performing pulse compression and
• the system 100 is configured to allow for navigating using high-frequency (greater than about 100 kHz) sonar signals. To allow for such HF navigation, the system 100 includes a signal corrector 140 for compensating for grazing angle error and for correcting phase error. The system 100 also includes a signal detector 150 for coherently correlating a received image with a map. In some embodiments, the system 100 includes an on-board navigation controller 170, motor controller 180 and sensor controller 190. The navigation controller 170 may be configured to receive navigational parameters from a GPS/RF link 172 (when available), an accelerometer 174, a gyroscope, and a compass 176.
• the motor controller 180 may be configured to control a plurality of motors 182, 184 and 186 for steering the vehicle.
• the sensor controller 190 may receive measurements from the battery monitor 172, a temperature sensor 194 and a pressure sensor 196.
• the system 100 further includes a central control unit (CCU) 160 that may serve as a hub for determining navigational parameters based on sonar measurements and other navigational and sensor parameters, and for controlling the movement of the vehicle.
• CCU central control unit
• the CCU 160 may determine navigational parameters such as position (latitude and longitude), velocity (in any direction), bearing, heading, acceleration and altitude.
• the CCU 160 may use these navigational parameters for controlling motion along the alongtrack direction (fore and aft), acrosstrack direction (port and starboard), and vertical direction (up and down).
• the CCU 160 may use these navigational parameters for controlling motion to yaw, pitch, roll or otherwise rotate the vehicle.
• a vehicle such as an AUV may receive high-frequency real aperture sonar images or signals at sonar unit 110, which may then be processed, filtered, corrected, and correlated against a synthetic aperture sonar (SAS) map of the terrain.
• SAS synthetic aperture sonar
• the CCU may then determine the AUV's position, with high-precision and other navigational parameters to assist with navigating the terrain.
• the precision may be determined by the signal and spatial bandwidth of the SAS map and/or the acquired sonar image.
• the envelope would be about one -half the element size. Consequently, in certain embodiments, the peak of the envelope may be identified with high-precision, including down to the order of about 1/100 th of the
• the resolution may be less than 2.5 cm, or less than 1 cm or less than and about 0.1 mm in the range direction.
• the system 100 includes a sonar unit 110 for transmitting and receiving acoustic signals.
• the sonar unit includes a transducer array 112 having a one or more transmitting elements or projectors and a plurality of receiving elements arranged in a row.
• the transducer array 112 includes separate projectors and receivers.
• the transducer array 112 may be configured to operate in SAS mode (either stripmap or spotlight mode) or in a real aperture mode.
• the transducer array 112 is configured to operate as a multibeam echo sounder, sidescan sonar or sectorscan sonar.
• the transmitting elements and receiving elements may be sized and shaped as desired and may be arranged in any configuration, and with any spacing as desired without departing from the scope of the present disclosure.
• the number, size, arrangement and operation of the transducer array 112 may be selected and controlled to insonify terrain and generate high-resolution images of a terrain or object.
• One example of an array 112 includes a 16 channel array with 5 cm elements mounted in a 12 3 ⁇ 4 inch vehicle.
• the sonar unit 110 further includes a receiver 114 for receiving and processing electrical signals received from the transducer, and a transmitter 116 for sending electrical signals to the transducer.
• the sonar unit 110 further includes a transmitter controller 118 for controlling the operation of the transmitter including the start and stop, and the frequency of a ping.
• the signals received by the receiver 114 are sent to a preprocessor for conditioning and compensation.
• the preprocessor 120 includes a filter conditioner 122 for eliminating outlier values and for estimating and compensating for hydrophone variations.
• the preprocessor further includes a Doppler compensator 124 for estimating and
• the preprocessed signals are sent to a matched filter 130.
• the matched filter 130 includes a pulse compressor 132 for performing matched filtering in range, and a beamformer 134 for performing matched filtering in azimuth and thereby perform direction estimation.
• the signal corrector 140 includes a grazing angle compensator 142 for adjusting sonar images to compensate for differences in grazing angle.
• a sonar images a collection of point scatterers the image varies with observation angle.
• the grazing angle compensator 142 is configured to generate grazing angle invariant images.
• One such grazing angle compensator is described in U.S. Patent Application Serial Number 12/802,454 titled "Apparatus and Method for Grazing Angle Independent Signal Detection," the contents of which are incorporated herein by reference in their entirety.
• the signal corrector 140 includes a phase error corrector 144 for correcting range varying phase errors.
• the phase error corrector 144 breaks the image up into smaller pieces, each piece having a substantially constant phase error. Then, the phase error may be estimated and corrected for each of the smaller pieces.
• the system 100 further includes a signal detector 150 having a signal correlator 152 and a storage 154.
• the signal detector 150 may be configured to detect potential targets, estimate the position and velocity of a detected object and perform target or pattern recognition.
• the storage 154 may include a map store, which may contain one or more previously obtained SAS images real aperture images or any other suitable sonar image.
• the signal correlator 152 may be configured to compare the received and processed image obtained from the signal corrector 140 with one or more prior images from the map store 154.
• the system 100 may include other components, not illustrated, without departing from the scope of the present disclosure.
• the system 100 may include a data logging and storage engine.
• the data logging and storage engine may be used to store scientific data which may then be used in post-processing for assisting with navigation.
• the system 100 may include a security engine for controlling access to and for authorizing the use of one or more features of system 100.
• the security engine may be configured with suitable encryption protocols and/or security keys and/or dongles for controlling access.
• the security engine may be used to protect one or more maps stored in the map store 154. Access to one or more maps in the map store 154 may be limited to certain individuals or entities having appropriate licenses, authorizations or clearances.
• Security engine may selectively allow these individuals or entities access to one or more maps once it has confirmed that these individuals or entities are authorized.
• the security engine may be configured to control access to other components of system 100 including, but not limited to, navigation controller 170, motor controller 180, sensor controller 190, transmitter controller 118, and CCU 160.
• FIG. 2 is a functional block diagram of a general purpose computer accessing a network according to an illustrative embodiment of the present disclosure.
• the holographic navigation systems and methods described in this application may be
• the exemplary system 200 includes a processor 202, a memory 208, and an interconnect bus 218.
• the processor 202 may include a single microprocessor or a plurality of microprocessors for configuring computer system 200 as a multi-processor system.
• the memory 208 illustratively includes a main memory and a read-only memory.
• the system 200 also includes the mass storage device 210 having, for example, various disk drives, tape drives, etc.
• the main memory 208 also includes dynamic random access memory (DRAM) and high-speed cache memory. In operation and use, the main memory 208 stores at least portions of instructions for execution by the processor 202 when processing data (e.g., model of the terrain) stored in main memory 208.
• DRAM dynamic random access memory
• the system 200 may also include one or more input/output interfaces for communications, shown by way of example, as interface 212 for data communications via the network 216.
• the data interface 212 may be a modem, an Ethernet card or any other suitable data communications device.
• the data interface 212 may provide a relatively high-speed link to a network 216, such as an intranet, internet, or the Internet, either directly or through another external interface.
• the communication link to the network 216 may be, for example, any suitable link such as an optical, wired, or wireless (e.g., via satellite or 802.11 Wi-Fi or cellular network) link.
• communications may occur over an acoustic modem. For instance, for AUVs, communications may occur over such a modem.
• the system 200 may include a mainframe or other type of host computer system capable of web-based communications via the network 216.
• the system 200 also includes suitable input/output ports or may use the Interconnect Bus 218 for interconnection with a local display 204 and user interface 206 (e.g., keyboard, mouse, touchscreen) or the like serving as a local user interface for programming and/or data entry, retrieval, or manipulation purposes.
• user interface 206 e.g., keyboard, mouse, touchscreen
• server operations personnel may interact with the system 200 for controlling and/or programming the system from remote terminal devices (not shown in the Figure) via the network 216.
• a system requires a processor, such as a navigational controller 170, coupled to one or more coherent sensors (e.g., a sonar, radar, optical antenna, etc.) 214.
• a processor such as a navigational controller 170
• coherent sensors e.g., a sonar, radar, optical antenna, etc.
• Data corresponding to a model of the terrain and/or data corresponding to a holographic map associated with the model may be stored in the memory 208 or mass storage 210, and may be retrieved by the processor 202.
• Processor 202 may execute instructions stored in these memory devices to perform any of the methods described in this application, e.g., grazing angle compensation, or high frequency holographic navigation.
• the system may include a display 204 for displaying information, a memory 208 (e.g., ROM, RAM, flash, etc.) for storing at least a portion of the aforementioned data, and a mass storage device 210 (e.g., solid-state drive) for storing at least a portion of the aforementioned data.
• a display 204 for displaying information
• a memory 208 e.g., ROM, RAM, flash, etc.
• mass storage device 210 e.g., solid-state drive
• Any set of the aforementioned components may be coupled to a network 216 via an input/output (I/O) interface 212.
• I/O input/output
• Each of the aforementioned components may communicate via interconnect bus 218.
• the system requires a processor coupled to one or more coherent sensors (e.g., a sonar, radar, optical antenna, etc.) 214.
• the sensor array 214 may include, among other components, a transmitter, receive array, a receive element, and/or a virtual array with an associated phase center/virtual element.
• Data corresponding to a model of the terrain, data corresponding to a holographic map associated with the model, and a process for grazing angle compensation may be performed by a processor 202.
• the system may include a display 204 for displaying information, a memory 208 (e.g., ROM, RAM, flash, etc.) for storing at least a portion of the
• aforementioned data e.g., solid-state drive
• mass storage device 210 e.g., solid-state drive
• Any set of the aforementioned components may be coupled to a network 216 via an input/output (I/O) interface 212.
• I/O input/output
• Each of the aforementioned components may communicate via interconnect bus 218.
• a processor 202 receives a position estimate for the sensor(s) 214, a waveform or image from the sensor(s) 214, and data corresponding to a model of the terrain, e.g., the sea floor. In some embodiments, such a position estimate may not be received and the process performed by processor 202 continues without this information.
• the processor 202 may receive navigational information and/or altitude information, and a processor 202 may perform a coherent image rotation algorithm.
• the output from the system processor 202 includes the position to which the vehicle needs to move to.
• the components contained in the system 200 are those typically found in general purpose computer systems used as servers, workstations, personal computers, network terminals, portable devices, and the like. In fact, these components are intended to represent a broad category of such computer components that are well known in the art.
• a computer program product that includes a non-transitory computer usable and/or readable medium.
• a computer usable medium may consist of a read only memory device, such as a CD ROM disk, conventional ROM devices, or a random access memory, a hard drive device or a computer diskette, a flash memory, a DVD, or any like digital memory medium, having a computer readable program code stored thereon.
• the system may include an inertial navigation system, a Doppler sensor, an altimeter, a gimbling system to fixate the sensor on a populated portion of a holographic map, a global positioning system (GPS), a long baseline (LBL) navigation system, an ultrashort baseline (USBL) navigation, or any other suitable navigation system.
• FIG. 3 A depicts an illustrative pressure vessel component.
• Pressure vessel component 300 may comprise gross pressure vessel component 302 and one or more bosses 304.
• gross pressure vessel component 302 may be shaped as any suitable shape, including a sphere, a cylinder, an ellipsoid, a cube, or a rectangular prison.
• Gross pressure vessel component 302 may be made from titanium or any other suitable material.
• the gross pressure vessel component 302 may be cast by sintering the metal followed by a HIP process.
• the gross pressure vessel component 302 may be cast by pouring molten metal into a mold.
• the gross pressure vessel component 302 may be optionally heat treated.
• Bosses 304 may be portions of the gross pressure vessel component 302 having an increased thickness. Bosses 304 may be located at predetermined positions on the gross pressure vessel component 302. Although the bosses 304 are depicted in FIG. 3A as holes, bosses 304 may comprise any designed features intended for the finalized pressure vessel component. In some embodiments, the bosses 304 may occur at predetermined angles of elevation and azimuth relative to a sphere equatorial plane. In some embodiments, the bosses 304 may comprise cable pass-throughs (e.g., holes).
• FIG. 3B depicts an illustrative pressure vessel according to one embodiment.
• Pressure vessel 310 includes top hemisphere 312, bottom hemisphere 314, bosses 316, 318, 320, 322, 324, and 326, and o-ring 328.
• Top hemisphere 312 may be a pressure vessel component similar to component 302 discussed in relation to FIG. 3 A. Although top hemisphere 312 is depicted in FIG. 3B as having bosses 316, 318, and 320, these bosses are shown merely for illustrative purposes. Top hemisphere 312 may have any number of bosses located at any suitable location, and in some embodiments, top hemisphere 312 may not have any bosses at all and comprise a smooth hemisphere with no features. In some embodiments, the top hemisphere 312 may be adorned with external bosses 316, 318, and 320 for cable pass-through to enable access to internal electronics.
• Top hemisphere 312 may include a flange (not shown) to act as a sealing surface against an o-ring. In some embodiments, the flange on the top hemisphere 312 is machined to a 32 RMS finish.
• Bottom hemisphere 314 may be a pressure vessel component similar to component 302 discussed in relation to FIG. 3A. Although bottom hemisphere 314 is depicted in FIG. 3B as having bosses 322, 324, and 326, these bosses are shown merely for illustrative purposes.
• Bottom hemisphere 314 may have any number of bosses located at any suitable location, and in some embodiments, bottom hemisphere 314 may not have any bosses at all and comprise a smooth hemisphere with no features. In some embodiments, the bottom hemisphere 314 may be used for supported an internal electronics chassis assembly. Bottom hemisphere 314 may include a flange (not shown) machined to a 32 RMS finish to act as a sealing surface against an o-ring.
• Bosses 316, 318, 320, 322, 324, and 326 may be portions of top hemisphere 312 or bottom hemisphere 314 having an increased thickness. Bosses 316, 318, 320, 322, 324, and 326 may be located at predetermined positions on the top hemisphere 312 or the bottom hemisphere 314. Although the bosses 316, 318, 320, 322, 324, and 326 are depicted in FIG. 3B as holes, bosses 316, 318, 320, 322, 324, and 326 may comprise any designed features intended for the finalized pressure vessel component.
• the bosses 316, 318, 320, 322, 324, and 326 may occur at predetermined angles of elevation and azimuth relative to a sphere equatorial plane. In some embodiments, the bosses 316, 318, 320, 322, 324, and 326 may comprise cable pass-throughs (e.g., holes).
• the top hemisphere 312 and bottom hemisphere 314 may be sealed at the equatorial plane of the sphere with an o-ring seal 328 that enables safe operation of the internal electronics at great depths.
• the o-ring seal 328 may be any suitable o-ring for sealing the pressure vessel from water ingress.
• the top hemisphere 312 and bottom hemisphere 314 may be joined by one or more hinges, such as a clam-like hinge.
• the top hemisphere 312 and the bottom hemisphere 314 may be designed to an appropriate wall-thickness with a factor of safety to safely operate at a predetermined service depth (or pressure).
• the internal cavity may be evacuated to a fraction of standard atmospheric pressure (i.e., ⁇ 14.7psi).
• the hemispheres 312 and 314 may be separated by removing the vacuum and subsequently separating the hemispheres 312 and 314.
• the pressure vessel may or may not contain internal structure or electronics, depending on the application.
• FIG. 3C depicts an illustrative pressure vessel according to an alternate embodiment.
• Pressure vessel 350 includes cylinder 352, top hemisphere 354, bottom hemisphere 356, bosses 358, 360, and 362, and o-rings 364 and 366.
• Cylinder 352 may be a pressure vessel component similar to component 302 discussed in relation to FIG. 3A. Although cylinder 352 is depicted in FIG. 3C as having bosses 358, these bosses are shown merely for illustrative purposes. Cylinder 352 may have any number of bosses located at any suitable location, and in some embodiments, Cylinder 352 may not have any bosses at all and comprise a smooth hemisphere with no features.
• Cylinder 352 may include a flange (not shown) machined to a 32 RMS finish to act as a sealing surface against an o-ring.
• Pressure vessel 350 uses top hemisphere 354 and bottom hemisphere 356 as endcaps. Although the endcaps are depicted as hemispheres 354 and 356 in FIG. 3C, the endcaps could be any suitable shape, such as circular disks or square-shaped.
• the cylinder 352 and hemispheres 354 and 356 may have concentric diameters and/or the same length to align for assembly.
• Top hemisphere 354 may be a pressure vessel component similar to component 302 discussed in relation to FIG. 3A. Although top hemisphere 354 is depicted in FIG. 3C as having bosses 360, these bosses are shown merely for illustrative purposes. Top hemisphere 354 may have any number of bosses located at any suitable location, and in some
• top hemisphere 354 may not have any bosses at all and comprise a smooth hemisphere with no features.
• the top hemisphere 354 may be adorned with external bosses 360 for cable pass-through to enable access to internal electronics. These boss locations may be chosen to minimize stress and to maximize the packing efficiency of connected cables and devices.
• Top hemisphere 354 may include a flange (not shown) machined to a 32 RMS finish to act as a sealing surface against an o-ring.
• Bottom hemisphere 362 may be a pressure vessel component similar to component 302 discussed in relation to FIG. 3A. Although bottom hemisphere 362 is depicted in FIG. 3C as having bosses 362, these bosses are shown merely for illustrative purposes. Bottom hemisphere 362 may have any number of bosses located at any suitable location, and in some embodiments, bottom hemisphere 362 may not have any bosses at all and comprise a smooth hemisphere with no features. In some embodiments, the bottom hemisphere 362 may be used for supported an internal electronics chassis assembly. Bottom hemisphere 362 may include a flange (not shown) machined to a 32 RMS finish to act as a sealing surface against an o- ring.
• Bosses 358, 360, and 362 may be portions of top hemisphere 354 or bottom hemisphere 356 having an increased thickness. Bosses 358, 360, and 362 may be located at predetermined positions on the top hemisphere 354 or the bottom hemisphere 356. Although the bosses 358, 360, and 362 are depicted in FIG. 3C as holes, bosses 358, 360, and 362 may comprise any designed features intended for the finalized pressure vessel component. In some embodiments, the bosses 358, 360, and 362 may occur at predetermined angles of elevation and azimuth relative to a sphere equatorial plane. In some embodiments, the bosses 358, 360, and 362 may comprise cable pass-throughs (e.g., holes).
• the cylinder 352, top hemisphere 354, and bottom hemisphere 362 may be sealed with o-rings seal 364 and 366 to enable safe operation of the internal electronics at great depths.
• the o-ring seals 364 and 366 may be any suitable o-ring for sealing the pressure vessel from water ingress.
• the cylinder 352 and the hemispheres 354 and 356 may be joined by one or more hinges, such as a clam-like hinge.
• the cylinder 352, top hemisphere 354, and the bottom hemisphere 356 may be designed to an appropriate wall-thickness with a factor of safety to safely operate at a pre-determined service depth (or pressure).
• the internal cavity may be evacuated to a fraction of standard atmospheric pressure (i.e., ⁇ 14.7psi).
• the cylinder 352 and hemispheres 354 and 356 may be separated by removing the vacuum and subsequently separating the cylinder 352 and hemispheres 354 and 356.
• the pressure vessel may or may not contain internal structure or electronics, depending on the application.
• FIG. 4 depicts a process of manufacturing a pressure vessel component according to an illustrative embodiment.
• Process 400 may include casting a metal to produce a gross pressure vessel component where casting includes forming portions of the gross pressure vessel component having an increased thickness and being located at predetermined positions on the gross pressure vessel component (Step 402). The positions are "predetermined” because the locations are determined before casting or forming the gross pressure vessel. Then, indexing the gross pressure vessel component to select the portions of the gross pressure vessel component for machining (Step 404). Finally, machining the gross pressure vessel component to produce a pressure vessel component, including machining the selected portions (Step 406).
• a metal may be cast to produce a gross pressure vessel component.
• the metal may be any suitable metal for pressure vessels, including, but not limited to, titanium, steel, aluminum, or tungsten carbide.
• the gross pressure vessel component may be cast by sintering the metal followed by a HIP process.
• the gross pressure vessel component may be cast by pouring molten metal into a mold.
• the pressure vessel component may be optionally heat treated, either before or after machining.
• the gross pressure vessel may be indexed to select the portions of the gross pressure vessel component for machining.
• the portions may include bosses having an increased thickness located at predetermined positions on the gross pressure vessel component.
• the bosses may occur at predetermined angles of elevation and azimuth relative to a sphere equatorial plane.
• the bosses may comprise cable pass-throughs (e.g., holes).
• the gross pressure vessel component may be machined to produce a pressure vessel component, including machining the selected portions. As discussed above, some of the selected portions may not require additional machining. However, some of the selected portions may require machining to remove extraneous material to produce a finalized boss shape.
• a pressure vessel component such as, for example, pressure vessel component 302, top hemisphere 312, bottom hemisphere 314, or cylinder 352, is machined after the vessel component 302 has been cast with various bosses 304, 316, 318, 320, 322, 324, or 326.
• bosses 304 is machined at the time of casting a pressure vessel component 302 .
• a standard set of bosses may be formed efficiently, but then the manufacturer can determine which ones of the cast bosses 304 are to be machined into portals or holes depending on the configuration and/or arrangement of the components within the pressure vessel component 302. This can be particularly advantageous when the pressure vessel includes a metal such as titanium.
• a common mold may be used for all pressure vessels, and bosses, holes, supports, flanges, and other features may be machined after casting/forging in order to produce a custom pressure vessel.
• bosses 304 are formed to enable hole machining for multiple possible

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• 2014
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