WO2010055712A1 - 電気接続装置 - Google Patents

電気接続装置 Download PDF

Info

Publication number
WO2010055712A1
WO2010055712A1 PCT/JP2009/062837 JP2009062837W WO2010055712A1 WO 2010055712 A1 WO2010055712 A1 WO 2010055712A1 JP 2009062837 W JP2009062837 W JP 2009062837W WO 2010055712 A1 WO2010055712 A1 WO 2010055712A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact
elastic member
base member
electrical connection
connection device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2009/062837
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
雄二 中村
栄治 小堀
勝己 鈴木
威之 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaichi Electronics Co Ltd
Original Assignee
Yamaichi Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaichi Electronics Co Ltd filed Critical Yamaichi Electronics Co Ltd
Publication of WO2010055712A1 publication Critical patent/WO2010055712A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2435—Contacts for co-operating by abutting resilient; resiliently-mounted with opposite contact points, e.g. C beam
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/82—Coupling devices connected with low or zero insertion force
    • H01R12/85—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures

Definitions

  • the present invention relates to a high-frequency electrical connection device, and more specifically, for example, an electrical connection device such as a semiconductor inspection socket for electrically connecting a semiconductor device to which a high-frequency signal is communicated with a wiring board.
  • the present invention relates to a connection device, which relates to an electrical connection device in which an elastic member and a contact are unitized so that the contact force and sliding amount of the contact can be easily adjusted.
  • An electrical connection device (hereinafter also referred to as “semiconductor inspection socket”) that electrically connects electronic devices that communicate signals at high frequency is well known in the art as disclosed in Japanese Patent Laid-Open No. 10-50440. Since the electrical connection device communicates high-frequency signals, the electrical connection device reduces the inductance of the contacts that constitute the electrical connection device, and also has electrical connectivity to electronic devices such as semiconductor devices and wiring boards as contacted objects.
  • Japanese Patent Laid-Open No. 10-50440 an elastic member supported by a holder constituting the socket body and a signal line length that is supported by the socket body itself, which is a separate member from the holder, are shortened.
  • a semiconductor inspection socket is disclosed as an electrical connection device having a Y-shaped contact, which is generally Y-shaped.
  • the contact is an upper contact piece extending obliquely upward and forward, a pressing piece extending obliquely upward and rearward, and a lower contact piece extending vertically downward from a portion where the upper contact piece and the pressing piece intersect.
  • the elastic member governing the displacement and sliding amount of the contact is disposed between the upper contact piece and the pressing piece.
  • the tip contact portion of the contact upper contact piece is the tip contact portion. Contacts the semiconductor device, and the upper contact piece is displaced by rotating, and the tip contact portion of the lower contact piece is displaced by the tip contact portion contacting the wiring board and pushed upward.
  • the elastic member is deformed by the displacement of the tip contact portion of each of the lower contact pieces, and the reaction force acts as a contact pressure. , Each slide horizontally relative response to the semiconductor device and the wiring board of the external contacts, to wipe the corresponding external contacts, respectively.
  • the contact is supported by the socket body only through the lower contact piece, and the elastic member contacts the upper contact piece and the pressing piece of the contact only from above. It is configured. Therefore, it is difficult to support the postures of a plurality of contacts before contact with an object to be contacted, and in particular, it is difficult to keep the position of the tip contact portion of the upper contact piece constant.
  • the contact between the tip contact portion of the semiconductor device and the semiconductor device as the contacted object is not stable.
  • the semiconductor device or wiring board as a contacted object may be changed. And according to such changes, the contact pressure between the upper contact piece and the semiconductor device as the contacted object, the contact pressure between the lower contact piece and the wiring board as the contacted object, the upper contact piece and the lower contact piece
  • the sliding amount (wiping amount) or the like needs to be changed, that is, adjusted.
  • the elastic member is configured to contact the upper contact piece and the pressing piece of the contact only from above, so that the elastic member includes the upper contact piece and the lower contact piece. Acts simultaneously on the displacement of Therefore, for example, when the contact pressure between the tip contact portion of the upper contact piece and the contacted object is adjusted, the contact pressure between the tip contact portion and the contacted portion of the lower contact piece changes, and a desired contact pressure cannot be obtained. There is a fear.
  • the object of the present invention is a simple structure, which can stably maintain the posture of the contact, can easily adjust the contact pressure and sliding amount, and can be easily replaced. To provide an apparatus.
  • an electrical connection device for electrically connecting two objects to be contacted, a first object to be contacted and a second object to be contacted.
  • a base member on which the first contact object and the second contact object are mounted, an elastic member held by the base member, and a plurality of contacts held by the elastic member Includes an upper base member and a lower base member each having an accommodating recess for accommodating the elastic member, and the elastic member includes slits that vertically penetrate the elastic member and respectively hold the plurality of contacts.
  • Each of the plurality of contacts includes at least an upper contact arm having an upper contact portion that can contact the first contacted object and a lower contact arm having a lower contact portion that can contact the second contacted object.
  • said plurality of contacts each of the upper contact arm and a lower contact arm, characterized in that it is configured to be in contact with the elastic member.
  • the lower contact arm may include the lower contact portion and include a contact protrusion that protrudes downward from the lower contact arm.
  • the elastic member includes an upper portion and a lower portion, and the upper portion and the lower portion are formed to be shifted forward and backward, and the upper portion and the lower portion overlap each other.
  • the upper portion of the elastic member is accommodated in the first concave portion of the upper base member, and the lower portion of the elastic member is formed in the second concave portion of the lower base member. It is preferable that the front part of the upper part and the rear part of the lower part of the elastic member are vertically sandwiched between the upper base member and the lower base member, respectively.
  • the electrical connection device is provided with a first protrusion and a second protrusion that contact the elastic member and press the elastic member at the tips of the upper contact arm and the lower contact arm of the contact,
  • the pressing amount of the elastic member can be adjusted by changing the presence / absence of each of the first and second protrusions and the amount of protrusion of each of the first and second protrusions.
  • a first space portion is provided behind the first concave portion of the upper base member that accommodates an upper portion of the elastic member, and the lower portion of the elastic member is accommodated.
  • a second space portion is provided in front of the second concave portion of the lower base member, and the presence or absence of each of the first and second space portions and the size of each of the first and second space portions are changed.
  • the pressing amount of the elastic member of each of the first and second protrusions of the contact can be adjusted.
  • the electrical connection device changes the shape of the slit of the elastic member so that the upper contact portion of the upper contact arm of the contact and the lower contact portion of the lower contact arm in the front-rear direction. The amount of movement can be adjusted.
  • the slit of the elastic member is formed by an upper opening, a lower opening, and a vertical portion that vertically penetrates between the upper opening and the lower opening,
  • the front side surface of the vertical portion has a first inclined surface inclined forward and upward
  • the rear side surface of the vertical portion has a second inclined surface inclined downward and rearward.
  • the present invention has the above-described configuration, so that the posture of the contact can be stably maintained with a simple structure.
  • the contact pressure between the contact and the two objects to be contacted can be easily and independently adjusted.
  • the sliding amount can be easily adjusted.
  • these assemblies can be unitized, thereby making it easy to replace the contacts.
  • FIG. 1 is an overall exploded perspective view of an electrical connecting apparatus according to a first embodiment of the present invention.
  • 2 is a partially enlarged perspective view including a cross-sectional view of the electrical connection device of FIG.
  • FIG. 3A is a partially enlarged perspective view of a base member constituting the electrical connecting device of FIG. 1, and is a partially enlarged perspective view including a cross-sectional view of an upper base member constituting the base member.
  • FIG. 3B is a partially enlarged perspective view of a base member constituting the electrical connecting device of FIG. 1, and is a partially enlarged perspective view including a cross-sectional view of a lower base member constituting the base member.
  • 4 is a partially enlarged perspective view including a cross-sectional view of an elastic member constituting the electrical connecting device of FIG.
  • FIG. 5 is a perspective view of a contact constituting the electrical connection apparatus of FIG.
  • FIG. 6 is a cross-sectional view of the main part of the electrical connection device of FIG. 1 in a state where the contacted object is not in contact with the contact.
  • FIG. 7 is a cross-sectional view of an essential part similar to FIG. 6 of the electrical connecting apparatus according to the second embodiment of the present invention.
  • FIG. 8 is a cross-sectional view of an essential part similar to FIG. 6 of the electrical connecting apparatus according to the third embodiment of the present invention.
  • FIG. 9A is a diagram for explaining an aspect of adjusting the contact pressure between the contacted object and the contact, and shows a method of adjusting the contact pressure by changing the shape of the upper contact arm of the contact.
  • FIG. 9A is a diagram for explaining an aspect of adjusting the contact pressure between the contacted object and the contact, and shows a method of adjusting the contact pressure by changing the shape of the upper contact arm of the contact.
  • FIG. 9B is a diagram for explaining a mode of adjusting the contact pressure between the contacted object and the contact, and shows the case of the upper contact arm of the contact having a shape different from that of FIG. 9A.
  • FIG. 9C is a diagram for explaining a mode of adjusting the contact pressure between the contacted object and the contact, and shows the case of the upper contact arm of the contact having a shape different from that of FIGS. 9A and 9B.
  • FIG. 10A is a diagram for explaining a mode of adjusting the contact pressure between the contacted object and the contact, and shows a method of adjusting the contact pressure by changing the shape of the lower portion of the elastic member.
  • FIG. 10B is a diagram for explaining a mode of adjusting the contact pressure between the contacted object and the contact, and shows a lower portion of the elastic member having a shape different from that in FIG. 10A.
  • FIG. 10C is a diagram for explaining a mode in which the contact pressure between the contacted object and the contact is adjusted, and shows a lower portion of the elastic member having a shape different from those in FIGS. 10A and 10B.
  • FIG. 11A is a view for explaining an aspect of adjusting the contact pressure between the contacted object and the contact, and shows a method of adjusting the contact pressure by changing the shape of the lower base member constituting the base member. Yes.
  • FIG. 10B is a diagram for explaining a mode of adjusting the contact pressure between the contacted object and the contact, and shows a lower portion of the elastic member having a shape different from that in FIGS. 10A and 10B.
  • FIG. 11A is a view for explaining an aspect of adjusting the contact pressure between the contacted object and the contact, and shows
  • FIG. 11B is a view for explaining a mode of adjusting the contact pressure between the contacted object and the contact, and shows a case of a lower base member having a shape different from that of FIG. 11A.
  • FIG. 11C is a view for explaining a mode of adjusting the contact pressure between the contacted object and the contact, and shows a case of a lower base member having a shape different from those in FIGS. 11A, 11B, and D.
  • FIG. 11D is a view for explaining a mode of adjusting the contact pressure between the contacted object and the contact, and FIG. 11B shows the case of the lower base member having a deformed shape.
  • FIG. 11C is a view for explaining a mode of adjusting the contact pressure between the contacted object and the contact, and shows a case of a lower base member having a shape different from those in FIGS. 11A, 11B, and D.
  • FIG. 11D is a view for explaining a mode of adjusting the contact pressure between the contacted object and the contact,
  • FIG. 12A is a diagram for explaining a mode of adjusting the contact pressure between the contacted object and the contact, and shows a method of adjusting the contact pressure by changing the shape of the lower contact arm of the contact.
  • FIG. 12B is a view for explaining a mode of adjusting the contact pressure between the contacted object and the contact, and shows a case of a lower contact arm of a contact having a shape different from that in FIG. 12A.
  • FIG. 12C is a diagram for explaining a mode of adjusting the contact pressure between the contacted object and the contact, and shows the case of the lower contact arm of the contact having a shape different from that in FIGS. 12A and 12B.
  • FIG. 12A is a diagram for explaining a mode of adjusting the contact pressure between the contacted object and the contact, and shows a method of adjusting the contact pressure by changing the shape of the lower contact arm of the contact.
  • FIG. 12B is a view for explaining a mode of adjusting the contact pressure between the contacted object and the contact, and
  • FIG. 13A is a diagram for explaining a mode of adjusting the contact pressure between the contacted object and the contact, and shows a method of adjusting the contact pressure by changing the shape of the upper portion of the elastic member.
  • FIG. 13B is a diagram for explaining a mode of adjusting the contact pressure between the contacted object and the contact, and shows the case of the upper portion of the elastic member having a shape different from that in FIG. 13A.
  • FIG. 13C is a view for explaining a mode of adjusting the contact pressure between the contacted object and the contact, and shows the case of the upper portion of the elastic member having a shape different from that in FIGS. 13A and 13B.
  • FIG. 13A is a diagram for explaining a mode of adjusting the contact pressure between the contacted object and the contact, and shows a method of adjusting the contact pressure by changing the shape of the upper portion of the elastic member.
  • FIG. 13B is a diagram for explaining a mode of adjusting the contact pressure between the contacted object and the contact, and shows the case
  • FIG. 14A is a diagram for explaining an aspect of adjusting the contact pressure between the contacted object and the contact, and shows a method of adjusting the contact pressure by changing the shape of the upper base member constituting the base member.
  • FIG. 14B is a diagram for explaining a mode of adjusting the contact pressure between the contacted object and the contact, and shows the case of the upper base member constituting the base member having a shape different from that of FIG. 14A.
  • FIG. 14C is a view for explaining a mode of adjusting the contact pressure between the contacted object and the contact, and the case of the upper base member constituting the base member having a shape different from those in FIGS. 14A, 14B, and D is shown. It is shown.
  • FIG. 14A is a diagram for explaining an aspect of adjusting the contact pressure between the contacted object and the contact, and shows a method of adjusting the contact pressure by changing the shape of the upper base member constituting the base member.
  • FIG. 14B is a diagram for explaining a mode of adjusting the contact
  • FIG. 14B is a view for explaining a mode of adjusting the contact pressure between the contacted object and the contact, and FIG. 14B shows a case where the upper base member constituting the base member has a deformed shape of FIG. 11B.
  • FIG. 15 is a view for explaining an aspect of adjusting the sliding amount of the contact with respect to the contacted object, and shows a method of adjusting the sliding amount by changing the shape of the slit of the elastic member.
  • FIG. 16 is a view for explaining an aspect of adjusting the sliding amount of the contact with respect to the contacted object, and shows a method of adjusting the sliding amount by changing the shape of the slit of the elastic member.
  • FIG. 17 is a view for explaining an aspect of adjusting the sliding amount of the contact with respect to the contacted object, and shows a method of adjusting the sliding amount by changing the shape of the slit of the elastic member.
  • FIG. 1 is an overall exploded perspective view of an electrical connection device according to a first embodiment of the present invention
  • FIG. 2 is a partially enlarged perspective view including a cross-sectional view of the electrical connection device of FIG. 3A is a partially enlarged perspective view of a base member constituting the electrical connecting device of FIG. 1, is a partially enlarged perspective view including a sectional view of an upper base member constituting the base member
  • FIG. 3B is a perspective view of FIG.
  • It is a partial expansion perspective view of the base member which comprises an electrical connection apparatus, and is a partial expansion perspective view including sectional drawing of the lower base member which comprises a base member.
  • 4 is a partially enlarged perspective view including a cross-sectional view of an elastic member constituting the electrical connection device of FIG.
  • FIG. 5 is a perspective view of a contact constituting the electrical connection device of FIG.
  • FIG. 6 is a cross-sectional view of the main part of the electrical connection device of FIG. 1 in a state where the contacted object is not in contact with the contact.
  • FIG. 7 is a cross-sectional view of an essential part similar to FIG. 6 of the electrical connection device according to the second embodiment of the present invention
  • FIG. 8 is a diagram of FIG. 6 of the electrical connection device according to the third embodiment of the present invention.
  • It is principal part sectional drawing similar to FIG. 9 to 14 are diagrams for explaining a mode for adjusting the contact pressure between the contacted object and the contact
  • FIGS. 15 to 17 illustrate a mode for adjusting the sliding amount of the contact with respect to the contacted object.
  • FIG. 9 to 14 are diagrams for explaining a mode for adjusting the contact pressure between the contacted object and the contact
  • FIGS. 15 to 17 illustrate a mode for adjusting the sliding amount of the contact with respect to the contacted object.
  • front and rear refer to a side closer to the central portion of the electrical connecting device and a side farther from the central portion of the electrical connecting device
  • left and right The left side and the right side are respectively referred to the central portion of the electrical connection device
  • upper and “lower” respectively refer to the upper side and the lower side with respect to the electrical connection device.
  • the electrical connection device 1 is roughly provided with a base member 10, an elastic member 40, a plurality of contacts 50, a lock member 60, and a pressing member 70.
  • Reference numeral 80 denotes a semiconductor device to be inspected as a first contacted object.
  • Reference numeral 90 denotes a wiring board such as a test board as a second contact object.
  • the semiconductor device 80 and the wiring board 90 have external contacts formed on the lower surface and the upper surface, respectively, and both are electrically connected via the electrical connection device 1.
  • the lock member 60 is a member that pushes down the semiconductor device 80 installed on the base member 10 via the pressing member 70 and holds it in a predetermined position. Prior to mounting the semiconductor device 80, the lock member 60 is integrally fixed on the wiring substrate 90 together with the base member 10 described later.
  • the lock member is formed of an electrically insulating synthetic resin, and generally includes a main body 61 and a pair of latch members 66a and 66b as shown in FIG.
  • the main body 61 is formed as a rectangular parallelepiped having a substantially horizontal cross section, and a guide hole 62 having a horizontal cross section is formed in the central portion thereof. Therefore, the main body 61 is configured by an outer wall portion surrounding the periphery (four rounds) of the guide hole 62.
  • the guide hole 62 has a size that allows the semiconductor device 80 to pass therethrough.
  • a pair of latch members 66a and 66b are rotatably provided to the main body on the upper surface 61a of a pair of outer wall portions constituting the main body 61.
  • the latch members 66a and 66b are provided with arms 67a and 67b having locking claw portions 68a and 68b that are respectively locked to the engaging recesses 72a and 72b of the pressing member.
  • the arms 67a and 67b are formed so as to protrude upward from predetermined positions of the latch members 66a and 66b opened substantially horizontally in FIG. 1 so as to be substantially perpendicular to the latch members 66a and 66b, respectively.
  • the locking claws 68a and 68b are formed to project forward from the tip positions of the arms 67a and 67b extending upward in FIG. 1 so as to be perpendicular to the arms 67a and 67b, respectively.
  • the latch members 66 a and 66 b rotate 90 degrees forward from the open state in FIG. 1, and the locking claws 68 a and 68 b are pressed by the pressing member 70. By being engaged with the engaging recesses 72a and 72b, the closed state is maintained. At this time, the semiconductor device 80 mounted on the electrical connection device 1 contacts the contact 50 with a predetermined contact pressure and is electrically connected.
  • the pressing member 70 is a member that is accommodated in the guide hole 62 of the lock member 60, presses down the semiconductor device 80, and holds the semiconductor device 80 in a predetermined position.
  • the pressing member 70 is made of an electrically insulating synthetic resin and is formed as a rectangular parallelepiped having a horizontal cross section, and the locking claws 68 a formed on the latch members 66 a and 66 b of the lock member 60 on the horizontal upper surface 71.
  • 68b includes a pair of engaging recesses 72a and 72b that can be locked.
  • the lock member 60 and the pressing member 70 are formed as separate members, but the present invention is not limited to this.
  • the lock member 60 and the pressing member 70 may be formed as an integral member, and are further rotatably attached to the base member 10. It may be.
  • the semiconductor device 80 may be pushed down by using a handler device for transporting the semiconductor device 80 to a predetermined position of the electrical connection device 1.
  • the base member 10 is made of an electrically insulating synthetic resin, and includes an upper base member 11, a lower base member 21, and a positioning member 31, as shown in FIGS. As will be described later, a unit in which a plurality of contacts 50 are arranged one by one in a plurality of third slits 44 provided in the elastic member 40 is disposed between the upper base member 11 and the lower base member 21. Is done.
  • the upper base member 11 has a rectangular parallelepiped with a horizontal section of approximately square, and includes a horizontal upper surface 11a, a horizontal lower surface 11b parallel to the horizontal upper surface 11a, and four horizontal surfaces 11a and vertical to the horizontal lower surface 11b. Includes side. Note that adjacent side surfaces are perpendicular to each other.
  • an accommodation recess 12 is formed that opens upward and has a substantially square horizontal cross section.
  • a positioning member 31 is disposed in the receiving recess 12, and the semiconductor device 80 is inserted from above the recess 12, positioned by the positioning member 31, and stored and held at a predetermined mounting position.
  • the housing recess 12 includes a substantially square bottom surface 12a formed as a horizontal plane parallel to the top surface 11a of the upper base member 11, and four side surfaces 12b surrounding the bottom surface 12a and perpendicular to the bottom surface 12a. Yes. As shown in FIGS. 2 and 3A, a plurality of elongated first slits 14 arranged along the four side surfaces 12 b are provided on the bottom surface 12 a of the housing recess 12. The plurality of first slits 14 are formed over the entire circumference of the bottom surface 12 a so as to surround the substantially square central flat portion of the bottom surface 12 a of the housing recess 12.
  • the first slits 14 along the side surfaces 12b of the housing recess 12 are parallel to each other, extend at right angles to the side surfaces 12b, penetrate the upper base member 11, and open downward. ing.
  • the elongated first slit 14 includes four side surfaces, that is, front and rear side surfaces 14a and 14b and left and right side surfaces 14c and 14d. Note that adjacent side surfaces are perpendicular to each other.
  • longitudinal length of the first slit 14 (the distance between the front side 14a and rear side 14b) is L 14.
  • the length in the horizontal direction (width) (the distance between the left side surface 14c and the right side surface 14d) is a W 14.
  • the upper contact arm 51 including the upper contact portion 51 a of each contact 50 is disposed. Therefore, the length L 14 of the elongated first slit 14 is longer than the length L 51 of the upper contact arm 51 of the arranged contact 50 in the front-rear direction, and the width W 14 of the first slit 14 is It is understood that it is slightly larger than 50 width (thickness) t.
  • the lower surface 11b of the upper base member 11 is formed with a first concave portion 16 corresponding to the first slit 14 and opening downward.
  • the first recess 16 includes a bottom surface 16c, four side surfaces perpendicular to the bottom surface, that is, front and rear side surfaces 16a and 16b, and left and right side surfaces (not shown). Accordingly, the first recess 16 communicates with the housing recess 12 via the plurality of first slits 14. Note that adjacent side surfaces are perpendicular to each other.
  • the front side surface 16a of the first recess 16 is not limited to this, but is preferably formed to be flush with the front side surface 14a of the first slit 14.
  • the rear side surface 16b of the first recess 16 is not limited to this, but the first slit 14 of the receiving recess 12 may be formed in the vicinity of the position where the corresponding side surface 12b is extended downward. preferable.
  • the first recess 16 has a L 16 (distance between the front side surface 16a and the rear side 16b) the first length L 14 longer than the length of the slit 14, a plurality of which are arranged parallel to the first
  • the width including all of the slits 14 (the length between the left side surface and the right side surface) W 16 (not shown) is at least included.
  • Four first recesses 16 are formed, and the four first recesses 16 are formed on the lower surface 11 b so as to surround a substantially square central flat portion of the lower surface 11 b of the upper base member 11.
  • the upper portion 41 of the elastic member 40 that holds the contact 50 is accommodated in the first recess 16. Accordingly, the length L 16 of the first recess 16 is the same as or longer than the length L 41 of the upper portion 41 of the elastic member 40, and the width W 16 of the second recess is equal to the upper portion 41 of the elastic member 40. it is understood somewhat the same as the width W 41 of the large. Also, H 16 (distance between the lower surface 11b and bottom surface 16c of the first recess 16 of the upper base member 11) the height of the first recess 16, the upper portion height (thickness) substantially H 41 equal.
  • the positioning member 31 in this embodiment is a member that guides the semiconductor device 80 so that an external contact of the semiconductor device 80 inserted from above the electrical connection device 1 contacts the contact 50.
  • the positioning member 3 1 is disposed in the housing recess 12 of the upper base member 11.
  • the positioning member 31 is a rectangular parallelepiped having a horizontal cross section, and is formed as a rectangular cylinder surrounded by a substantially vertical outer wall on four sides.
  • the positioning member 31 includes a horizontal upper surface 35 and a horizontal lower surface 36 of the outer wall portion, and a guide cavity 32 having a square horizontal cross section penetrating up and down surrounded by the outer wall portion.
  • the four circumferential surfaces (inner surface of the outer wall portion) of the guide cavity 32 are formed as inclined guide surfaces 33 so that the guide cavity 32 becomes narrower downward.
  • the area of the square shape of the upper end opening of the guide cavity 32 is set larger than the area of the horizontal section of the semiconductor device 80 to be guided.
  • the square area of the lower end opening is set to be substantially the same as the area of the horizontal section of the semiconductor device 80.
  • the lower portion of the inclined guide surface 33 is preferably formed as a vertical surface 33a as shown in FIG.
  • a plurality of third slits 34 that open downward and forward are formed in the horizontal lower surface 36 of the outer peripheral wall of the positioning member 31.
  • the plurality of third slits 34 the upper contact portions 51a of the upper contact arms 51 of the contacts 50 are accommodated. Accordingly, the plurality of third slits 34 correspond to the plurality of first slits 14 formed on the bottom surface 12 a of the housing recess 12 and have the same length and width as the first slit 14. It is formed.
  • the lower base member 21 has a rectangular parallelepiped shape with a horizontal section, a horizontal upper surface 21a, a horizontal lower surface 21b parallel to the horizontal upper surface 21a, and a horizontal upper surface 21a and four side surfaces perpendicular to the horizontal lower surface 21b. Is included.
  • the second recess 22 includes a bottom surface 22e, and four side surfaces perpendicular to the bottom surface 22e, that is, front and rear side surfaces 22a and 22b, and left and right side surfaces 22c and 22d. Note that adjacent side surfaces are perpendicular to each other.
  • Each of the second recesses 22 is formed corresponding to the first recess 16 formed in the lower surface 11b of the upper base member 11. That is, when the upper base member 11 and the lower base member 21 are assembled as the base member 10, the four second recesses 22 are disposed so as to face the four first recesses 16, respectively. However, the second recess 22 is disposed so as to be located rearward with respect to the first recess 16. In other words, in each of the four second recesses 22, the front side surface 22 a and the rear side surface 22 b of each second recess 22 are positioned behind the front side surface 16 a and the rear side surface 16 b of the corresponding first recess 16, respectively. It is formed to do. The left side surface 22c and the right side surface 22d of each third recess are formed to be flush with the left side surface and the right side surface of the corresponding first recess 16 respectively.
  • the height of the second recess 22 (the distance between the upper surface 21a of the lower base member 21 and the bottom surface 22e of the second recess 22) H22 is the height (thickness) of the lower portion 42 of the elastic member 40. It is almost equal to H42.
  • the front portion of the upper portion 41 and the rear portion of the lower portion 42 of the elastic member 40 are both partial, but the upper base member 11 and the lower base member 21. Thereby, the elastic member 40 is reliably and stably held in the base member 10.
  • a plurality of elongated second slits 24 arranged along the rear side surface 22b are provided on the bottom surface 22e of each second recess 22 as shown in FIG. 3B.
  • the second slits 24 are parallel to each other, extend perpendicular to the rear side surface 22b, and penetrate the lower base member 21 and open downward in this embodiment.
  • the elongated second slit 24 includes four side surfaces, that is, front and rear side surfaces 24a and 24b and left and right side surfaces 24c and 24d. Note that adjacent side surfaces are perpendicular to each other. As shown in FIG. 3B, the length of the second slit 24 in the front-rear direction (the distance between the front side surface 24a and the rear side surface 24b) is L 24 , and the length (width) in the left-right direction (left side). the distance between the surface 24c and the right side surface 24d) is a W 24.
  • a lower contact arm 53 including a lower contact portion 53a of each contact 50 is disposed.
  • the length L 24 of the elongated second slit 24 is longer than the length L 53 in the front-rear direction of the lower contact arm 53 of the arranged contact 50.
  • the width W 24 of the second slit 24 are the same as the width W 14 of the first slit 14, the width of the contact 50 (thickness) that is slightly larger understood from t.
  • the base member 10 including a plurality (four in this embodiment) of elastic members 40 and a plurality of contacts 50. It can. Specifically, first, as will be described later, a plurality of contacts 50 are arranged in a fourth slit 44 provided in each elastic member 40 to form one unit.
  • each of the four units including the elastic member 40 and the plurality of contacts 50 is disposed in the lower base member 21 so that the lower portion 42 of the elastic member 40 is accommodated in the second recess 22 of the lower base member 21. Place on top.
  • the lower contact arm 53 of each contact 50 is accommodated in the plurality of second slits 24 of the lower base member 21.
  • the plurality of contacts 50 are stably aligned and held by the elastic member 40, the lower contact arm 53 can be easily accommodated in the corresponding second slit 24.
  • the upper base member 11 is disposed on the unit so that the upper contact arm 51 of each contact 50 is accommodated in the plurality of first slits 14 of the upper base member 11.
  • the upper contact arm 51 can be easily accommodated in the corresponding first slit 14.
  • the upper portion 41 of the elastic member 40 is accommodated in the first recess 16 of the upper base member 11.
  • Assembling of the base member 10 is completed by installing the upper base member 11, and the elastic member 40 is sandwiched between the upper base member 11 and the lower base member 21 as shown in FIG.
  • the contact 50 held by the base member 10 is also securely held at a predetermined position of the base member 10 in a correct posture.
  • the easy assembly of the base member 40 including the plurality of elastic members 40 and the plurality of contacts 50 is that the base member 40 can be easily disassembled. Therefore, it is possible to easily replace the contact when the contact deteriorates.
  • the elastic member 40 is formed of a synthetic resin that is electrically insulating and flexible.
  • the elastic member 40 is a member that holds the contact 50.
  • the elastic member 40 is also a member that controls the contact pressure of the upper contact portion 51a and the lower contact portion 53a of the contact with the external contacts of the semiconductor device 80 and the wiring substrate 90.
  • the elastic member 40 has a plate-like upper portion 41 having a length L 41 and a width W 41, and a plate-like lower portion 42 having a length L 42 and a width W 42 .
  • the length L 41 of the upper portion is expressed as the distance between the front side surface 41a and the rear side surface 41b
  • the length L 42 of the lower portion is expressed as the distance between the front side surface 42a and the rear side surface 42b.
  • Width W 42 of width W 41 and a lower portion of the upper portion is equal.
  • the elastic member 40 has a stepped shape in which the upper portion 41 and the lower portion 42 are overlapped in the vertical direction in a state of being displaced in the front-rear direction, and are substantially integrally formed. Yes.
  • the length of the elastic member 40 is L 40
  • the relationship is L 41 (or L 42 ) ⁇ L 40 ⁇ L 41 + L 42
  • the elastic member 40, L 14 ⁇ L 41 ⁇ L 16, L 24 ⁇ L 42 ⁇ respective lengths so as to maintain the relationship of L 22 is set.
  • the elastic member 40 is formed such that when the elastic member 40 is incorporated into the base member 10, the front side surface 41 a of the upper portion 41 contacts the front side surface 16 a of the first recess 16 of the upper base member 11. It is preferable. Similarly, the elastic member 40 is preferably formed such that the rear side surface 42 b of the lower portion 42 contacts the rear side surface 22 b of the second recess 22 of the lower base member 21. Thereby, when the elastic member 40 is assembled in the base member 10 between the elastic member 40 and the upper base member 11 and the lower base member 21, the first space portion 18 and the second space portion 28 are formed. (See FIG. 6).
  • a fourth slit 44 is formed in a portion where the upper portion 41 and the lower portion 42 of the elastic member 40 are overlapped.
  • the fourth slit 44 is basically formed by an upper opening 44a, a lower opening 44c, and a vertical portion 44b that vertically penetrates between the upper opening 44a and the lower opening 44c.
  • the fourth slit 44 is formed with a first inclined surface 44d in which the front side surface of the vertical portion 44b is inclined forward and upward in the upper portion 41, and reaches the upper opening 44a.
  • the fourth slit 44 is formed with a second inclined surface 44e in which the rear side surface of the vertical portion 44b is inclined rearward and downward in the lower portion 42, and reaches the lower opening 44c.
  • the contact 50 rotates from the initial pressing stage of the semiconductor device 80, and the load on the semiconductor device 80 is gradually applied along with the pressing amount of the semiconductor device 80.
  • the semiconductor device 80 has a large pressing amount until the contact 50 rotates, and when the pressing amount reaches a certain pressing amount, the load by the contact 50 abruptly acts on the semiconductor device 80, and the semiconductor There is a risk of damaging the device 80.
  • the semiconductor device 80 is pushed down by an equal amount in the case where the inclined surfaces 44d and 44e are provided and the case where the inclined surfaces 44d and 44e are not provided after the semiconductor device 80 reaches a certain pressing amount.
  • the load applied to the device 80 is smaller when the inclined surfaces 44d and 44e are provided.
  • the range of the amount by which the semiconductor device 80 is pushed down to obtain an appropriate contact force between the semiconductor device 80 and the contact 50 is widened.
  • the dimension setting relating to the pressing amount of the lock member 60 and the pressing member 70 can be made loose, and the setting of the pressing amount of the handler device when the semiconductor device 80 is pressed using the handler device is simplified.
  • the effect can be expected.
  • when providing either one of the inclined surfaces 44d and 44e so that it may mention later it has the same effect as the above-mentioned. However, it is considered that the effect obtained is greater when both the inclined surfaces 44d and 44e are provided.
  • the fourth slit 44 is also formed such that when the elastic member 40 is incorporated in the base member 10, the front side surface 44 f thereof coincides with the front side surface 24 a of the second slit 24 of the lower base member 21. It is preferable. Similarly, the fourth slit 44 is preferably formed so that the rear side surface 44g thereof coincides with the rear side surface 14b of the first slit 14 of the upper base member 11.
  • the length L 44 in the front-rear direction of the vertical portion 44 b of the fourth slit 44 is substantially equal to the length L 52 in the front-rear direction of the holding portion 52 of the contact 50.
  • the vertical length of the vertical portion of the fourth slit 44 is equal to the height H 40 of the elastic member 40.
  • Each contact 50 is a member that electrically connects the semiconductor device 80 and the wiring substrate 90.
  • the contact 50 is formed as a substantially rigid body so as to be compatible with high-frequency signal communication, and is formed so as to shorten the signal line length.
  • each contact 50 in this embodiment includes an upper contact arm 51, a holding portion 52, and a lower contact arm 53, and has a substantially Z shape when viewed from the side.
  • the upper contact arm 51 is positioned in front of the substantially vertical holding portion 52 and extends from the upper end portion of the holding portion 52 so as to be inclined forward and upward.
  • the lower contact arm 53 is positioned substantially behind the holding portion 52 and extends from the lower end portion of the holding portion 52 so as to be slightly inclined rearward and downward.
  • the upper end (upper tip) portion of the upper contact arm 51 is in contact with an external contact (not shown) of the semiconductor device 80 as the upper contact portion 51a, and the lower end (lower tip) portion of the lower contact arm 53 is the lower contact portion 53a.
  • the upper contact arm 51 and the lower contact arm 53 are configured to be able to slightly displace the upper contact portion 51a and the lower contact portion 53a up and down by the contact 50 itself being rotatably arranged. preferable.
  • the substantially vertical holding portion 52 of the contact 50 is disposed in the vertical portion 44b of the fourth slit 44 provided in the elastic member 40 and is held by the vertical portion 44b. Furthermore, a first protrusion 51 b as an elastic member contact portion that contacts the upper surface of the upper portion 41 of the elastic member 40 may be formed at the front end portion of the upper contact arm 51 so as to protrude downward. Similarly, a second protrusion 53b as an elastic member contact portion that contacts the lower surface of the lower portion 42 of the elastic member 40 may be formed at the rear end portion of the lower contact arm 53 so as to protrude upward.
  • the contact pressure between the upper contact portion 51a and the external contact of the semiconductor device 80 can be adjusted by the presence or absence of the first protrusion 51b or the protrusion amount (h 1 ), as will be described later.
  • the contact pressure between the lower contact portion 53a and the external contact of the wiring board 90 can be adjusted by the presence / absence of the second protrusion 53b or the protrusion amount (h 2 ).
  • the formation of the first and second protrusions 51b and 53b is not limited to the present embodiment.
  • the first protrusion 51b may be formed to protrude obliquely forward and downward
  • the two protrusions 53b may be formed so as to project obliquely rearward and upward.
  • the length of the contact 50 in the front-rear direction is L 50
  • the length (height) in the vertical direction is H 50
  • the width (thickness) of the contact 50 is t.
  • the length of the upper contact arm 51 in the front-rear direction is L 51
  • the length of the holding portion 52 in the front-rear direction is L 52
  • the length of the lower contact arm 53 in the front-rear direction is L 53 . is there.
  • the size of the contact 50 is set so as to maintain the relationship of L 50 ⁇ L 40 , H 50 > H 11 + H 21 , and t ⁇ H 14 . Further, the contact 50 has L 51 ⁇ L 14 , L 52 ⁇ L 44 , L 53 ⁇ L 24 , L 51 -L 52 ⁇ (from the front side 22 of the third recess to the front side of the second slit 24. (Distance) is also maintained.
  • the signal line length of the contact 50 is approximately L 51 + H 50 .
  • contacts 150 and 250 which are modifications of the contact 50.
  • the contact 150 in the second embodiment has a vertical holding portion 152, but is shorter than in the first embodiment, and the inclination angle of the upper contact arm 151 is smaller than that in the first embodiment. ing.
  • a contact protrusion 154 is provided below the lower contact arm 153 of the contact 150.
  • the lower end portion of the contact protrusion 154 becomes the lower contact portion 154 a of the contact 150 that contacts the external contact of the wiring board 90.
  • the contact protrusion 154 is formed in the vicinity of a point where the holding portion 152 and the lower contact arm 153 intersect with each other so as to extend vertically downward from the lower contact arm 153 slightly from the rear. Has been.
  • the second slit 24 of the lower base member 21 in which the lower contact arm 153 of the contact 150 is disposed is formed as a small vertical through hole 26 whose lower portion is matched to the size of the contact protrusion 154 of the contact 150. It is preferred that Alternatively, the second slit 24 portion is formed as a single fourth recess, and only the plurality of vertical through holes 26 are penetrated from the bottom surface of the fourth recess toward the lower surface 21b of the lower base member. , And may be formed at a predetermined position along the rear side surface of the fourth recess.
  • the vertical hole 26 is preferably formed slightly larger than the length in the front-rear direction of the contact protrusion 154 so that the contact protrusion 154 can move in the front-rear direction in the vertical through-hole 26.
  • the contact protrusion 154 is not formed on the contact 150, the second slit 24 of the lower base member 21 may remain as in the first embodiment.
  • the vertical holding portion 52 in the first embodiment is omitted, and the upper contact arm 251 is directly moved upward from the front of the lower contact arm 153. It has a structure extending in a slanting direction.
  • the contact protrusion 254 is formed downward from the lower contact arm 253.
  • the contact protrusion 254 is formed to extend vertically downward from the lower contact arm 253 at a point where the upper contact arm 251 and the lower contact arm 253 intersect.
  • the lower end portion of the contact protrusion 254 becomes the lower contact portion 254a of the contact 250 that comes into contact with the external contact of the wiring board 90, as in the second embodiment.
  • the modification of the structure of the second slit 24 portion of the lower base member 21 in the present embodiment may be performed in the same manner as described in the second embodiment.
  • 9A to 17 show how the contact pressure between the contact of the present invention and the external contacts of the semiconductor device or the wiring board, and the adjustment of the sliding amount of the contact with respect to the external contacts are realized in the present invention. Will be described. The description here will be described using the first embodiment, and the second and third embodiments are the same as the first embodiment, and thus the description thereof is omitted.
  • 9A to 11D show a method of adjusting the contact pressure of the contact 50 with respect to the semiconductor device 80 as a contacted object.
  • 9A to 9C show a method of adjusting the contact pressure by changing the shape of the contact 50, more specifically, the protrusion amount h 1 of the first protrusion 51 b of the upper contact arm 51 of the contact 50. . 9A to 9C, the protrusion amount h1 of the first protrusion 51b is reduced.
  • the first protrusion 51b comes into contact with the upper surface of the elastic member 40 and deforms it.
  • the reaction force from the elastic member 40 to the first protrusion 51b is increased. Therefore, as the protrusion amount h1 of the first protrusion 51b increases, the contact pressure of the upper contact portion 51a with respect to the external contact (not shown) of the semiconductor device 80 increases. Therefore, by changing the first amount of projection size of h 1 of the protrusions 51b of the upper contact arms 51 of the contacts 50, it is understood that the contact pressure can be easily adjusted.
  • FIGS. 10A to 10C show a method of adjusting the contact pressure by changing the shape of the elastic member 40, more specifically, the shape of the lower portion 42 of the elastic member 40.
  • FIG. 10A to 10C sequentially, the lower portion 42 of the elastic member 40 reduces the portion filled in the second recess 22 of the lower base member 21 to be accommodated. That is, the front side surface 42 a of the lower portion 42 of the elastic member 40 approaches the front side surface 22 a of the second recess 22 of the lower base member 21, and the second space portion 28 formed by the elastic member 40 and the base member 10. Reduce the size of.
  • the first protrusion 51b comes into contact with the upper surface of the elastic member 40 and deforms it.
  • the deformation of the elastic member 40 is absorbed by the space portion 28, thereby reducing the reaction force from the elastic member 40 to the first protrusion 51 b. Therefore, the larger the size of the space portion 28, the smaller the contact pressure of the upper contact portion 51a with respect to the external contact of the semiconductor device. From this, it is understood that the contact pressure can be easily adjusted by changing the size of the space portion 28 formed by the elastic member 40 and the base member 10.
  • the lower surface of the upper part 41 of the elastic member 40 is the bottom face 22e of the 2nd recessed part 22 of the lower base member 21. You may make it approach. Moreover, the method combined with such an approach method and the above-mentioned approach method may be sufficient.
  • 11A to 11D show a method of adjusting the contact pressure by changing the shape of the base member 10, more specifically, the shape of the lower base member 21 of the base member 10.
  • the method uses substantially the same principle as the method shown in FIGS. 10A-10C above. That is, the contact pressure is adjusted by changing the size of the space portion 28 formed by the base member 10 and the elastic member 40. That is, the front side surface 22 a of the second recess 22 of the lower base member 21 approaches the front side surface 42 a of the lower portion 42 of the elastic member 40, and the second space portion 28 formed by the elastic member 40 and the base member 10. The size of is reduced.
  • the contact pressure adjustment operation is the same as that in FIGS.
  • the method is not limited to the approach method described above, and the bottom surface 22e of the second recess 22 of the lower base member 21 is formed on the lower surface of the upper portion 41 of the elastic member 40. You may make it approach. Moreover, the method (refer FIG. 11D) which combined such an approach method and the above-mentioned approach method may be sufficient.
  • FIGS. 12A to 14D show a method of adjusting the contact pressure of the contact 50 with respect to the wiring board 90 as the contacted object.
  • FIG 12A-12C the shape of the contacts 50, more specifically, a method of adjusting the contact pressure by changing the projecting amount h 2 of the second projection 53b of the lower contact arms 53 of the contacts 50 is shown . Sequentially As Turning to 12C from FIG 12A, and to reduce the amount of projection h 1 of the second protrusion 53b.
  • the second protrusion 53b contacts the lower surface of the elastic member 40 and deforms it.
  • the protrusion amount h 2 of the second protrusion 53b is large, the deformation amount of the elastic member 40 is increased, whereby the reaction force from the elastic member 40 to the second protrusion 53b is increased.
  • the protrusion amount h 2 of the second protrusion 53b is large, the contact pressure against the external contact of the wiring board 90 of the lower contact portion 53a is increased. Therefore, by changing the second protrusion amount magnitude of h 2 of the protrusions 53b of the lower contact arms 53 of the contacts 50, it is understood that the contact pressure can be easily adjusted.
  • 13A to 13C show a method of adjusting the contact pressure by changing the shape of the elastic member 40, more specifically, the shape of the upper portion 41 of the elastic member 40.
  • the upper portion 41 of the elastic member 40 reduces the portion that fills the first recess 16 of the upper base member 11 to be accommodated. That is, the rear side surface 41 b of the upper portion 41 of the elastic member 40 approaches the rear side surface 16 b of the first recess 16 of the upper base member 11, and the first space portion 18 formed by the elastic member 40 and the base member 10. Reduce the size of.
  • the second protrusion 53b comes into contact with the lower surface of the elastic member 40 and deforms it.
  • the deformation of the elastic member 40 is absorbed by the space portion 18, thereby reducing the reaction force from the elastic member 40 to the second protrusion 53 b. Therefore, the larger the size of the space portion 18, the smaller the contact pressure of the lower contact portion 53a with respect to the external contact of the wiring board 90. From this, it is understood that the contact pressure can be easily adjusted by changing the size of the space portion 18 formed by the elastic member 40 and the base member 10.
  • FIGS. 14A to 14D show a method of adjusting the contact pressure by changing the shape of the base member 10, more specifically, the shape of the upper base member 11 of the base member 10.
  • the method uses substantially the same principle as the method shown in FIGS. 13A-13C above. That is, the contact pressure is adjusted by changing the size of the space portion 18 formed by the base member 10 and the elastic member 40. That is, the rear side surface 16 b of the first recess 16 of the upper base member 21 approaches the rear side surface 41 b of the upper portion 41 of the elastic member 40, and the second space portion 18 formed by the elastic member 40 and the base member 10. The size of is reduced.
  • the contact pressure adjustment operation is the same as in FIGS.
  • the method is not limited to the approach method described above, and the bottom surface of the first concave portion 16 of the upper base member 11 approaches the upper surface of the lower portion 42 of the elastic member 40. You may make it do. Moreover, the method (refer FIG. 14D) which combined such an approach method and the above-mentioned approach method may be sufficient.
  • FIGS. 15 to 17 show a method of adjusting the sliding amount (wiping amount) of the contact 50 with respect to the semiconductor device 80 and the wiring board 90 as the contacted objects. More specifically, FIGS. 15 to 17 show a method of adjusting the amount of movement of the upper contact portion 51a and the lower contact portion 53a of the contact 50 in the front-rear direction with respect to the semiconductor device 80 and the wiring board 90, respectively.
  • the sliding amount of the contact can be adjusted by changing the shape of the elastic member 40, more specifically, the shape of the slit 44 of the elastic member 40.
  • FIG. 15 shows the electrical connecting device 1 having the shape of the slit 44 of the elastic member 40 described in the first embodiment shown in FIGS. 1 to 6.
  • FIG. 15 shows a state where the electrical connection device 1 is attached to the wiring board 90 and the semiconductor device 80 is mounted on the electrical connection device.
  • the upper contact arm 51 of the contact 50 rotates counterclockwise when the semiconductor device 80 is pushed down, and wipes the external contact of the semiconductor device 80.
  • the lower contact arm 53 of the contact 50 similarly rotates counterclockwise when the wiring board 90 is pushed up, and wipes the external contact of the wiring board 90.
  • FIG. 16 shows a shape in which the first inclined surface 44d formed in the upper portion 41 and the second inclined surface 41e formed in the lower portion 42 are moved upward substantially in parallel with respect to the slit 44 of the elastic member 40.
  • An elastic member 40 is shown.
  • the slit 44 of the elastic member 40 is such that the first inclined surface 44d is omitted, this portion is a vertical front side surface 44f, and the second inclined surface 41e is positioned at the upper portion 41 of the elastic member 40. Is formed.
  • the first inclined surface 44 d formed on the upper portion 41 and the second inclined surface 41 e formed on the lower portion 42 are substantially parallel.
  • An elastic member 40 having a shape moved downward is shown.
  • the slit 44 of the elastic member 40 is formed so that the first inclined surface 44d is positioned in the lower portion 42, and the second inclined surface 41e is omitted, and this portion is connected to the vertical rear side surface 44g. It is formed to be.
  • the sliding amount of the contact can be easily adjusted by changing the shape of the slit 44 of the elastic member 40.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
  • Measuring Leads Or Probes (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
PCT/JP2009/062837 2008-11-12 2009-07-15 電気接続装置 Ceased WO2010055712A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008-289872 2008-11-12
JP2008289872A JP5029969B2 (ja) 2008-11-12 2008-11-12 電気接続装置

Publications (1)

Publication Number Publication Date
WO2010055712A1 true WO2010055712A1 (ja) 2010-05-20

Family

ID=42165616

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2009/062837 Ceased WO2010055712A1 (ja) 2008-11-12 2009-07-15 電気接続装置

Country Status (4)

Country Link
US (1) US7914295B2 (enExample)
JP (1) JP5029969B2 (enExample)
TW (1) TWI392153B (enExample)
WO (1) WO2010055712A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012520461A (ja) * 2009-03-10 2012-09-06 ジョンステック インターナショナル コーポレーション マイクロ回路テスタ用の導電ピン
US20130002285A1 (en) 2010-03-10 2013-01-03 Johnstech International Corporation Electrically Conductive Pins For Microcircuit Tester
TWI534432B (zh) 2010-09-07 2016-05-21 瓊斯科技國際公司 用於微電路測試器之電氣傳導針腳
US9007082B2 (en) 2010-09-07 2015-04-14 Johnstech International Corporation Electrically conductive pins for microcircuit tester
JP5836113B2 (ja) * 2011-12-28 2015-12-24 株式会社エンプラス 電気部品用ソケット
WO2014073368A1 (ja) 2012-11-07 2014-05-15 オムロン株式会社 接続端子およびこれを用いた導通検査器具
US9274141B1 (en) * 2013-01-22 2016-03-01 Johnstech International Corporation Low resistance low wear test pin for test contactor
US9425529B2 (en) * 2014-06-20 2016-08-23 Xcerra Corporation Integrated circuit chip tester with an anti-rotation link
US9343830B1 (en) * 2015-06-08 2016-05-17 Xcerra Corporation Integrated circuit chip tester with embedded micro link
JP2019046643A (ja) * 2017-09-01 2019-03-22 モレックス エルエルシー コネクタ、コネクタ組立体、及びコネクタの製造方法
EP3499653B1 (en) * 2017-12-12 2021-08-18 Rasco GmbH Contactor spring and contactor socket
KR102566041B1 (ko) * 2019-11-05 2023-08-16 주식회사 프로웰 반도체 소자 테스트 장치
KR20240104127A (ko) 2021-11-03 2024-07-04 존스테크 인터내셔널 코포레이션 수직 백스톱을 갖는 하우징
USD1075695S1 (en) 2022-04-05 2025-05-20 Johnstech International Corporation Contact pin for integrated circuit testing
USD1042345S1 (en) 2022-04-05 2024-09-17 Johnstech International Corporation Test pin
USD1042346S1 (en) 2022-04-05 2024-09-17 Johnstech International Corporation Contact pin for integrated circuit testing

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04137373A (ja) * 1989-12-05 1992-05-12 Rogers Corp 領域アレイコネクタ装置
JPH08162238A (ja) * 1994-12-01 1996-06-21 Japan Aviation Electron Ind Ltd パッケージ用ソケットコネクタ
JPH09148016A (ja) * 1995-11-17 1997-06-06 Tesetsuku:Kk 電子部品用コネクタ
JPH09167663A (ja) * 1995-07-05 1997-06-24 Johnstech Internatl Corp インピーダンス制御相互連結装置
JPH10177886A (ja) * 1996-07-02 1998-06-30 Johnstech Internatl Corp 電気的接続装置
JPH10326653A (ja) * 1997-05-26 1998-12-08 Japan Aviation Electron Ind Ltd コネクタ
JP2001524256A (ja) * 1997-05-06 2001-11-27 グリフィクス インコーポレーティッド マルチモードコンプライアンスのコネクタと当該コネクタを用いる取り替え可能なチップモジュール
JP2002280137A (ja) * 2001-03-19 2002-09-27 Micronics Japan Co Ltd 電気的接続装置
JP2003217777A (ja) * 2002-01-25 2003-07-31 Micronics Japan Co Ltd 電気的接続装置

Family Cites Families (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5207584A (en) 1991-01-09 1993-05-04 Johnson David A Electrical interconnect contact system
US5634801A (en) 1991-01-09 1997-06-03 Johnstech International Corporation Electrical interconnect contact system
US5069629A (en) 1991-01-09 1991-12-03 Johnson David A Electrical interconnect contact system
US5749738A (en) 1991-01-09 1998-05-12 Johnstech International Corporation Electrical interconnect contact system
US5388996A (en) 1991-01-09 1995-02-14 Johnson; David A. Electrical interconnect contact system
US5254834A (en) 1992-06-02 1993-10-19 Johnstech International Corporation Method of forming closely-spaced, generally parallel slots through a thin wall and product formed thereby
JP2807171B2 (ja) 1993-05-03 1998-10-08 デビット エー．ジョンソン 電気的相互接続コンタクト装置
US5336094A (en) 1993-06-30 1994-08-09 Johnstech International Corporation Apparatus for interconnecting electrical contacts
US5360348A (en) 1993-08-16 1994-11-01 Johnstech International Corporation Integrated circuit device test socket
US5639247A (en) 1994-05-09 1997-06-17 Johnstech International Corporation Contacting system for electrical devices
US5645433A (en) 1994-05-09 1997-07-08 Johnstech International Corporation Contacting system for electrical devices
US5899755A (en) 1996-03-14 1999-05-04 Johnstech International Corporation Integrated circuit test socket with enhanced noise imminity
JP2849070B2 (ja) 1996-08-02 1999-01-20 山一電機株式会社 Ｉｃソケット
US6019612A (en) 1997-02-10 2000-02-01 Kabushiki Kaisha Nihon Micronics Electrical connecting apparatus for electrically connecting a device to be tested
US5888075A (en) 1997-02-10 1999-03-30 Kabushiki Kaisha Nihon Micronics Auxiliary apparatus for testing device
JP3379897B2 (ja) 1997-02-10 2003-02-24 株式会社日本マイクロニクス 被検査体試験用補助装置
US5938451A (en) 1997-05-06 1999-08-17 Gryphics, Inc. Electrical connector with multiple modes of compliance
US6409521B1 (en) 1997-05-06 2002-06-25 Gryphics, Inc. Multi-mode compliant connector and replaceable chip module utilizing the same
US5913687A (en) 1997-05-06 1999-06-22 Gryphics, Inc. Replacement chip module
US6570393B2 (en) 1997-09-17 2003-05-27 Johnstech International Corporation Test apparatus improved test connector
US6529025B1 (en) 1997-09-18 2003-03-04 Johnstech International Corporation Electrical continuity enhancement for sockets/contactors
JPH11102764A (ja) 1997-09-25 1999-04-13 Sony Corp アダプターボード
JP3577416B2 (ja) 1997-11-25 2004-10-13 株式会社日本マイクロニクス 電気的接続装置
JPH11242974A (ja) 1998-02-25 1999-09-07 Sony Corp 半導体装置用測定ソケット
JP4404987B2 (ja) 1998-05-27 2010-01-27 株式会社日本マイクロニクス プローブカード
AU2637400A (en) 1999-02-02 2000-08-25 Gryphics, Inc. Low or zero insertion force connector for printed circuit boards and electrical devices
JP2001035619A (ja) 1999-07-27 2001-02-09 Sony Corp ソケット装置
JP2001135441A (ja) 1999-11-02 2001-05-18 Sony Corp ソケット装置
JP2001237037A (ja) 2000-02-22 2001-08-31 Sony Corp Ｉｃソケット
JP2001235510A (ja) 2000-02-25 2001-08-31 Sony Corp Ｉｃソケット
JP2001257049A (ja) 2000-03-13 2001-09-21 Sony Corp Ｉｃソケット
JP2001305184A (ja) 2000-04-25 2001-10-31 Sony Corp 電気コネクタ
JP2001319749A (ja) 2000-05-02 2001-11-16 Sony Corp Ｉｃソケット
JP3498040B2 (ja) 2000-05-18 2004-02-16 株式会社日本マイクロニクス 電気的接続装置
JP2002181881A (ja) 2000-12-08 2002-06-26 Sony Corp 電子回路装置の測定装置および測定方法
JP2002246128A (ja) 2001-02-19 2002-08-30 Micronics Japan Co Ltd 電気的接続装置
JP2002328149A (ja) 2001-04-27 2002-11-15 Sony Corp Ｉｃソケット
JP2003045593A (ja) 2001-07-30 2003-02-14 Micronics Japan Co Ltd 電気的接続装置
JP3822539B2 (ja) 2001-08-09 2006-09-20 山一電機株式会社 Ｉｃソケット
US20030068908A1 (en) * 2001-08-31 2003-04-10 Brandt Jeffrey J. Electrical contact for improved wiping action
JP2003086313A (ja) 2001-09-07 2003-03-20 Yamaichi Electronics Co Ltd Ｉｃソケット
JP2003123874A (ja) 2001-10-16 2003-04-25 Micronics Japan Co Ltd 接触子及びその製造方法並びに電気的接続装置
JP4102571B2 (ja) 2002-02-13 2008-06-18 株式会社日本マイクロニクス 接触子及び電気的接続装置
US6854981B2 (en) 2002-06-03 2005-02-15 Johnstech International Corporation Small pin connecters
US6861667B2 (en) 2002-07-15 2005-03-01 Johnstech International Corporation Grounding inserts
JP4195588B2 (ja) 2002-07-31 2008-12-10 株式会社日本マイクロニクス 接触子の製造方法及び接触子
JP2004247194A (ja) 2003-02-14 2004-09-02 Sony Corp 半導体装置用ソケット及び同ソケットを備えた検査装置
US7040902B2 (en) * 2003-03-24 2006-05-09 Che-Yu Li & Company, Llc Electrical contact
US7059866B2 (en) 2003-04-23 2006-06-13 Johnstech International Corporation integrated circuit contact to test apparatus
WO2005011060A2 (en) 2003-07-16 2005-02-03 Gryphics, Inc. Electrical interconnect assembly with interlocking contact system
US7537461B2 (en) 2003-07-16 2009-05-26 Gryphics, Inc. Fine pitch electrical interconnect assembly
US7297003B2 (en) 2003-07-16 2007-11-20 Gryphics, Inc. Fine pitch electrical interconnect assembly
JP4388932B2 (ja) 2004-01-13 2009-12-24 株式会社日本マイクロニクス 電気的接続装置
EP1753100A4 (en) 2004-06-03 2008-05-07 Nihon Micronics Kk CONTACTOR AND ELECTRICAL CONNECTOR
WO2006006248A1 (ja) 2004-07-12 2006-01-19 Kabushiki Kaisha Nihon Micronics 電気的接続装置
JP2008527649A (ja) 2005-01-04 2008-07-24 グリフィクス インコーポレーティッド ファインピッチの電気相互接続組立品
JP4505342B2 (ja) 2005-02-04 2010-07-21 株式会社日本マイクロニクス 電気的接続装置
WO2006085388A1 (ja) 2005-02-08 2006-08-17 Kabushiki Kaisha Nihon Micronics 電気的接続装置
JP2006351474A (ja) 2005-06-20 2006-12-28 Micronics Japan Co Ltd 電気的接続装置
JP2007017189A (ja) 2005-07-05 2007-01-25 Micronics Japan Co Ltd 電気的接続装置
US7445465B2 (en) 2005-07-08 2008-11-04 Johnstech International Corporation Test socket
JP2007225599A (ja) 2006-01-17 2007-09-06 Johnstech Internatl Corp 信号および電力接点のアレイを有するパッケージを備えた集積回路を試験するための試験接点システム
US7639026B2 (en) 2006-02-24 2009-12-29 Johnstech International Corporation Electronic device test set and contact used therein
US7737708B2 (en) 2006-05-11 2010-06-15 Johnstech International Corporation Contact for use in testing integrated circuits
JP5134803B2 (ja) 2006-10-05 2013-01-30 株式会社日本マイクロニクス 電気的接続装置
JP5134805B2 (ja) 2006-10-12 2013-01-30 株式会社日本マイクロニクス 電気的接続装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04137373A (ja) * 1989-12-05 1992-05-12 Rogers Corp 領域アレイコネクタ装置
JPH08162238A (ja) * 1994-12-01 1996-06-21 Japan Aviation Electron Ind Ltd パッケージ用ソケットコネクタ
JPH09167663A (ja) * 1995-07-05 1997-06-24 Johnstech Internatl Corp インピーダンス制御相互連結装置
JPH09148016A (ja) * 1995-11-17 1997-06-06 Tesetsuku:Kk 電子部品用コネクタ
JPH10177886A (ja) * 1996-07-02 1998-06-30 Johnstech Internatl Corp 電気的接続装置
JP2001524256A (ja) * 1997-05-06 2001-11-27 グリフィクス インコーポレーティッド マルチモードコンプライアンスのコネクタと当該コネクタを用いる取り替え可能なチップモジュール
JPH10326653A (ja) * 1997-05-26 1998-12-08 Japan Aviation Electron Ind Ltd コネクタ
JP2002280137A (ja) * 2001-03-19 2002-09-27 Micronics Japan Co Ltd 電気的接続装置
JP2003217777A (ja) * 2002-01-25 2003-07-31 Micronics Japan Co Ltd 電気的接続装置

Also Published As

Publication number Publication date
TW201019546A (en) 2010-05-16
JP5029969B2 (ja) 2012-09-19
US7914295B2 (en) 2011-03-29
US20100120265A1 (en) 2010-05-13
JP2010118220A (ja) 2010-05-27
TWI392153B (zh) 2013-04-01

Similar Documents

Publication Publication Date Title
JP5029969B2 (ja) 電気接続装置
US8613631B2 (en) Electrical connector
JP6345287B1 (ja) 可動コネクタ
US20150031248A1 (en) Terminal
US20110312202A1 (en) Connector
JP2008198608A (ja) 弾性レバー付きコネクタ
JP6000811B2 (ja) コネクタ
CN101197475A (zh) 电连接器
WO2012153472A1 (ja) コネクタ端子及びこのコネクタ端子を含むカードエッジ型コネクタ
KR101357439B1 (ko) 전기 커넥터
JP5157651B2 (ja) 電気コネクタ
KR20160123214A (ko) 커넥터 어셈블리
JP2011049142A (ja) コネクタ
KR101457065B1 (ko) 가요성 케이블 커넥터의 설치구조 및 설치방법
JP7068252B2 (ja) 電気接続箱ユニット
JP4960324B2 (ja) 嵌合型コネクタ
WO2021220781A1 (ja) コネクタおよびコネクタの製造方法
EP3211721B1 (en) Electric connector
JP5411803B2 (ja) 光モジュール用コネクタ
WO2023062869A1 (ja) 筐体構造
JP2015079568A (ja) 電気コネクタ
CN222636493U (zh) 图像形成装置
JP2012014862A (ja) コネクタ
KR100962501B1 (ko) 반도체 시험용 커넥터 어셈블리
JP2021106188A (ja) 電子機器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09825965

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09825965

Country of ref document: EP

Kind code of ref document: A1