JP4388932B2 - 電気的接続装置 - Google Patents
電気的接続装置 Download PDFInfo
- Publication number
- JP4388932B2 JP4388932B2 JP2005516934A JP2005516934A JP4388932B2 JP 4388932 B2 JP4388932 B2 JP 4388932B2 JP 2005516934 A JP2005516934 A JP 2005516934A JP 2005516934 A JP2005516934 A JP 2005516934A JP 4388932 B2 JP4388932 B2 JP 4388932B2
- Authority
- JP
- Japan
- Prior art keywords
- probe
- recess
- substrate
- connection device
- electrical connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000523 sample Substances 0.000 claims description 116
- 239000000758 substrate Substances 0.000 claims description 35
- 230000002265 prevention Effects 0.000 claims description 27
- 238000012360 testing method Methods 0.000 description 20
- 238000007689 inspection Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 3
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- A—HUMAN NECESSITIES
- A62—LIFE-SAVING; FIRE-FIGHTING
- A62B—DEVICES, APPARATUS OR METHODS FOR LIFE-SAVING
- A62B18/00—Breathing masks or helmets, e.g. affording protection against chemical agents or for use at high altitudes or incorporating a pump or compressor for reducing the inhalation effort
- A62B18/006—Breathing masks or helmets, e.g. affording protection against chemical agents or for use at high altitudes or incorporating a pump or compressor for reducing the inhalation effort with pumps for forced ventilation
-
- A—HUMAN NECESSITIES
- A62—LIFE-SAVING; FIRE-FIGHTING
- A62B—DEVICES, APPARATUS OR METHODS FOR LIFE-SAVING
- A62B7/00—Respiratory apparatus
- A62B7/10—Respiratory apparatus with filter elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
- H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
Landscapes
- Health & Medical Sciences (AREA)
- Pulmonology (AREA)
- General Health & Medical Sciences (AREA)
- Business, Economics & Management (AREA)
- Emergency Management (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Description
Claims (7)
- 被検査体の電極と基板に形成された導電性部とを電気的に接続する装置であって、
それぞれが前記電極と前記導電性部とを電気的に接続する板状の複数のプローブであって前記電極に押圧される先端を当該プローブの一端側に有すると共に湾曲された外面を当該プローブの幅方向の一方に有し、さらに前記一方の側に開放する第1の凹所を有する複数のプローブと、該プローブが厚さ方向に間隔をおきかつ前記先端が前記基板と反対側に突出した状態に、前記プローブを前記基板に組み付ける組み付け装置とを含み、
前記組み付け装置は、前記プローブの配列方向へ伸びて前記基板の側に開放する第2の凹所を有するカバーと、前記プローブの配列方向へ伸びる状態に前記第2の凹所に配置された脱落防止部材であって前記プローブが前記カバーから脱落することを防止すべく前記第1の凹所に締り嵌めの状態に嵌合された脱落防止部材と、前記プローブの配列方向へ伸びる針押えであって前記プローブの前記外面を前記導電性部に接触させるように前記第2の凹所に配置された針押えとを備え、前記プローブは前記脱落防止部材及び前記針押えにより挟まれている、電気的接続装置。 - 前記脱落防止部材は、前記第1の凹所に締まり嵌めの状態に受け入れられている、請求項1に記載の電気的接続装置。
- 前記プローブは、さらに、幅方向における他方側に開放する第3の凹所を他端側に有し、前記針押えの少なくとも一部は前記第3の凹所に嵌合されている、請求項1又は2に記載の電気的接続装置。
- 前記カバーは、さらに、前記第2の凹所に連通されていると共に前記基板の側及びそれと反対側に開放する複数のスロットであって前記プローブの配列方向に間隔をおいた複数のスロットを有し、前記プローブは、前記スロット内を伸びて前記先端を前記スロットから前記基板と反対側に突出させている、請求項1から3のいずれか1項に記載の電気的接続装置。
- 前記カバーは、さらに、前記被検査体を受け入れるべく前記基板と反対側に開放しかつ前記スロットに連通する第4の凹所を有し、前記プローブは、前記先端を前記第4の凹所に突出させている、請求項4に記載の電気的接続装置。
- 前記プローブは、前記針押えにより前記導電性部に押圧されている、請求項1から5のいずれか1項に記載の電気的接続装置。
- 前記プローブは、前記第2の凹所を形成する面に他端側を当接させている、請求項1から6のいずれか1項に記載の電気的接続装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2004/000150 WO2005069447A1 (ja) | 2004-01-13 | 2004-01-13 | 電気的接続装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2005069447A1 JPWO2005069447A1 (ja) | 2007-08-23 |
JP4388932B2 true JP4388932B2 (ja) | 2009-12-24 |
Family
ID=34792043
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005516934A Expired - Lifetime JP4388932B2 (ja) | 2004-01-13 | 2004-01-13 | 電気的接続装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7121842B2 (ja) |
JP (1) | JP4388932B2 (ja) |
TW (1) | TWI241055B (ja) |
WO (1) | WO2005069447A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7625219B2 (en) * | 2005-04-21 | 2009-12-01 | Kabushiki Kaisha Nihon Micronics | Electrical connecting apparatus |
JP2009043591A (ja) * | 2007-08-09 | 2009-02-26 | Yamaichi Electronics Co Ltd | Icソケット |
US7695286B2 (en) | 2007-09-18 | 2010-04-13 | Delaware Capital Formation, Inc. | Semiconductor electromechanical contact |
JP5113481B2 (ja) | 2007-10-23 | 2013-01-09 | 株式会社日本マイクロニクス | 接触子及びこれを用いる電気的接続装置 |
JP5029969B2 (ja) * | 2008-11-12 | 2012-09-19 | 山一電機株式会社 | 電気接続装置 |
JP5202275B2 (ja) * | 2008-12-15 | 2013-06-05 | 株式会社エンプラス | 電気部品用ソケット |
TW201027849A (en) * | 2009-01-13 | 2010-07-16 | Yi-Zhi Yang | Connector |
JP7067527B2 (ja) * | 2019-05-07 | 2022-05-16 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
CN111060802A (zh) * | 2019-11-28 | 2020-04-24 | 苏州韬盛电子科技有限公司 | 用于大电流测试以及高频测试的金属接触器 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2495846A1 (fr) * | 1980-12-05 | 1982-06-11 | Cii Honeywell Bull | Dispositif de connexion electrique a haute densite de contacts |
US5388996A (en) | 1991-01-09 | 1995-02-14 | Johnson; David A. | Electrical interconnect contact system |
JP2807171B2 (ja) | 1993-05-03 | 1998-10-08 | デビット エー.ジョンソン | 電気的相互接続コンタクト装置 |
US5609489A (en) * | 1994-12-21 | 1997-03-11 | Hewlett-Packard Company | Socket for contacting an electronic circuit during testing |
US5888075A (en) | 1997-02-10 | 1999-03-30 | Kabushiki Kaisha Nihon Micronics | Auxiliary apparatus for testing device |
US6019612A (en) * | 1997-02-10 | 2000-02-01 | Kabushiki Kaisha Nihon Micronics | Electrical connecting apparatus for electrically connecting a device to be tested |
JP3379897B2 (ja) * | 1997-02-10 | 2003-02-24 | 株式会社日本マイクロニクス | 被検査体試験用補助装置 |
JP2003123874A (ja) | 2001-10-16 | 2003-04-25 | Micronics Japan Co Ltd | 接触子及びその製造方法並びに電気的接続装置 |
JP4102571B2 (ja) | 2002-02-13 | 2008-06-18 | 株式会社日本マイクロニクス | 接触子及び電気的接続装置 |
JP2003297506A (ja) | 2002-04-05 | 2003-10-17 | Sanyu Kogyo Kk | 検査用電気的接続装置 |
-
2004
- 2004-01-13 US US10/542,687 patent/US7121842B2/en not_active Expired - Lifetime
- 2004-01-13 WO PCT/JP2004/000150 patent/WO2005069447A1/ja active Application Filing
- 2004-01-13 JP JP2005516934A patent/JP4388932B2/ja not_active Expired - Lifetime
- 2004-11-25 TW TW093136289A patent/TWI241055B/zh active
Also Published As
Publication number | Publication date |
---|---|
JPWO2005069447A1 (ja) | 2007-08-23 |
US20060183356A1 (en) | 2006-08-17 |
US7121842B2 (en) | 2006-10-17 |
TW200524216A (en) | 2005-07-16 |
WO2005069447A1 (ja) | 2005-07-28 |
TWI241055B (en) | 2005-10-01 |
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