WO2008075570A1 - 粘着シート - Google Patents
粘着シート Download PDFInfo
- Publication number
- WO2008075570A1 WO2008075570A1 PCT/JP2007/073644 JP2007073644W WO2008075570A1 WO 2008075570 A1 WO2008075570 A1 WO 2008075570A1 JP 2007073644 W JP2007073644 W JP 2007073644W WO 2008075570 A1 WO2008075570 A1 WO 2008075570A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sensitive adhesive
- antistatic
- adhesive sheet
- group
- film
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/327—Layered products comprising a layer of synthetic resin comprising polyolefins comprising polyolefins obtained by a metallocene or single-site catalyst
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/24—All layers being polymeric
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/21—Anti-static
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/412—Transparent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/718—Weight, e.g. weight per square meter
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/728—Hydrophilic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2405/00—Adhesive articles, e.g. adhesive tapes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2312/00—Crosslinking
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
- C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/10—Presence of homo or copolymers of propene
- C09J2423/106—Presence of homo or copolymers of propene in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2453/00—Presence of block copolymer
- C09J2453/006—Presence of block copolymer in the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2848—Three or more layers
Definitions
- the present invention relates to a releasable pressure-sensitive adhesive sheet having antistatic properties.
- the re-peelable adhesive sheet include masking tapes for building curing, masking tapes for automobile painting, masking tapes for electronic components (lead frames, printed circuit boards), masking tapes for sand blasting, Surface protective film for aluminum sash, surface protective film for optical plastic, surface protective film for optical glass, surface protective film for automobile, surface protective film for metal plate, back grind tape, for fixing pellicle Tapes, dicing tapes, lead frame fixing tapes, cleaning tapes, dust removal tapes, carrier tapes, cover tapes, and other semiconductor / electronic parts manufacturing process adhesive tapes, electronic equipment and electronic parts packaging tapes, transportation Temporary fastening tapes Examples include bundle tapes and labels.
- it is useful as a protective film for optical members such as polarizing plates and wavelength plates used in panels such as liquid crystal displays, OLED electrification luminescence, and field emission displays that require transparency.
- the film has been provided with an antistatic layer in order to prevent friction or peeling due to peeling, coated with an adhesive and dried, and after the release film is bonded to this surface, In general, it is cut according to the polarization angle and phase angle to be stored, and a predetermined number of layers are laminated and stored (for example, see Patent Document 6).
- the adhesive that protrudes from the cut surface adheres to the surface of the other protective film, which hinders product inspection and becomes sticky. It will be a hindrance.
- Patent Document 1 Japanese Patent Application Laid-Open No. 07-311160
- Patent Document 2 Japanese Patent Laid-Open No. 2003-089178
- Patent Document 3 Japanese Patent Laid-Open No. 2005-002220
- Patent Document 4 Japanese Patent Laid-Open No. 2005-125659
- Patent Document 5 Japanese Unexamined Patent Application Publication No. 2004-094012
- Patent Document 6 Japanese Patent Laid-Open No. 2001-096698
- Patent Document 7 Japanese Patent Laid-Open No. 11-256115
- the present invention is excellent in the protection performance of an adherend (particularly an optical member such as an optical sheet), and has a surface protective film (adhesive sheet) attached to the adherend (
- the object is to provide an inexpensive surface protective film that can accurately inspect defects of optical sheets).
- the present invention provides an inexpensive surface protective film that prevents the adherend (especially the optical sheet) from being charged during the processing and transport of the adherend (especially the optical sheet) and has a function of preventing contamination. The purpose is to do.
- the pressure-sensitive adhesive sheet of the present invention is a re-peelable type, and is a re-peelable pressure-sensitive adhesive sheet comprising a pressure-sensitive adhesive layer on one side of a base material layer and an antistatic layer on the other side,
- the antistatic layer contains a polymer type antistatic agent comprising an olefin block and a hydrophilic block.
- the pressure-sensitive adhesive sheet having an antistatic layer containing the above-described polymer type antistatic agent composed of an olefin block and a hydrophilic block is an adherend.
- a surface protective film that is excellent in protection performance (especially optical members such as optical sheets) and that can accurately inspect defects of adherends (especially optical sheets) with a surface protective film (adhesive sheet) attached,
- the adherend especially the optical sheet
- the adherend especially the optical sheet
- an inexpensive surface protection film having a function of preventing contamination is obtained.
- the antistatic agent in the antistatic layer, even if the treatment such as washing with water or wiping with water is performed, the antistatic ability is hardly lowered, and a stable antistatic ability is obtained. It is done.
- the pressure-sensitive adhesive sheet is characterized in that the antistatic layer contains a polymer type antistatic agent comprising an olefin block and a hydrophilic block.
- the polymer antistatic agent in the present invention is a block copolymer having an olefin block and a hydrophilic block, and the olefin block and the hydrophilic block are chemically bonded. Les, things!
- the antistatic layer preferably contains a propylene resin.
- the antistatic layer contains a propylene homopolymer and / or a propylene′-a-olefin random copolymer.
- the antistatic layer contains propylene 'a-olefin random copolymer polymerized using a metallocene catalyst.
- the base material layer is made of a propylene resin
- the base material layer is made of a propylene homopolymer and / or a propylene ′ ⁇ -olefin inrandom copolymer.
- the substrate layer is made of a propylene'-a-olefin-in random copolymer polymerized using a meta-octacene catalyst.
- the pressure-sensitive adhesive layer comprises an acrylate having an alkyl group having 1 to 14 carbon atoms and / or Alternatively, it is preferably made of a (meth) acrylic polymer having one or more of metatalates as a main component. Furthermore, it is preferable that the pressure-sensitive adhesive layer is a crosslinked structure obtained by crosslinking the (meth) acrylic polymer.
- the pressure-sensitive adhesive sheet of the present invention since the pressure-sensitive adhesive sheet of the present invention has the above-described effects, it is particularly preferably used for protecting the surface of an optical member.
- the pressure-sensitive adhesive sheet of the present invention is a re-peelable type, and is a re-peelable pressure-sensitive adhesive sheet comprising a pressure-sensitive adhesive layer on one surface of a base material layer and an antistatic layer on the other surface,
- the layer is characterized by containing a polymer type antistatic agent comprising an polyolefin block and a hydrophilic block.
- the material used for the base layer is not particularly limited as long as it is a plastic that can provide a highly transparent adhesive sheet, but polypropylene, polyester, polycarbonate, polyamide, polyimide, polyacryl, polystyrene, polyacetate. Transparent resins such as polyether sulfone and triacetyl cellulose are used. Among these, polypropylene is preferably used from the viewpoint of productivity and moldability. These may be used alone or in admixture of two or more.
- polypropylene a homotype that is a homopolymer, a random type that is a propylene ' ⁇ -olefin random copolymer, and a propylene.
- ⁇ -olefin block copolymer that has a high level and a pressure-sensitive adhesive sheet can be obtained.
- “high”, “high” and “transparency” are 88% or more, preferably 90% or more, more preferably 92% or more, and JIS K7136 as defined in JIS K7136. 1% or less, preferably 8% or less, more preferably 7% or less, particularly preferably less than 5%. These may be used alone or in combination of two or more.
- the homo-type polypropylene is not particularly limited as long as it is a resin capable of obtaining a target highly transparent adhesive sheet.
- Examples of commercially available products include ZS13 27A, F104A, F3900, J-5900 (all of which are manufactured by Prime Polymer Co., Ltd.) It is done.
- Examples of the ⁇ -olefin component of the random type propylene / ⁇ -olefin copolymer include ethylene, 1-butene, 1 pentene, 1-hexene, 1-heptene, 1-octene, and 3-methylbutene. 1, 4-methylpentene 1, 3-methylhexene 1 and the like, preferably ethylene, 1-butene, 3-methylbutene-1, 4-methylpentene1.
- Other non-conjugated gens such as 4-methylolene 1,4-hexagen, 5-methinole 1,4-hexagen, 7-methyl-1,6-octadiene, 1,9-decadiene and the like as a polymer component. Can be used.
- cyclic olefins such as norbornene can be polymerized.
- random copolymer examples include propylene / ethylene random copolymer, propylene ′ 1-butene random copolymer, propylene ′ 1 hexene random copolymer, propylene / ethylene / 1-otaten random copolymer, and the like.
- Polymer propylene.ethylene.1-butene random copolymer, and the like.
- Commercially available products include, for example, F327, J 5910, J 5710 (all of which are made by Prime Polymer), Wintech WFX6, Wintech WFX4, Wintech WFX4T, Wintech WFX4TA, Wintech WFW4 (all of these are from Japan) Polypro Corporation).
- propylene'a-olefin-in random copolymer polymerized using a meta-octacene catalyst is preferably used since a film having further excellent transparency can be obtained.
- propylene ' ⁇ -olefin random copolymer polymerized using a meta-octacene catalyst is a copolymer having a uniform composition and is preferably used because a highly transparent substrate layer is obtained. .
- ⁇ -olefin used for propylene ′ ⁇ -olefin random copolymer polymerized using a metallocene catalyst
- ethylene, 1-butene, 1 pentene, 1-hexene 1-heptene, 1-octene, 3-methylbutene-1, 4-methylpentene-1, 3-methylhexene1, etc. preferably ethylene, 1-butene, 3-methylbutene-1, 4-methylpentene1.
- non-conjugated gens such as 4-methyl-1, 4 monohexagen, 5 methyl-1, 4 monohexagen, 7 methyl-1, 6 octagen, 1, 9-decadiene should be used as part of the polymer component. Can do.
- cyclic olefins such as norbornene can be copolymerized.
- Random copolymerization Specific examples of the polymer include propylene / ethylene random copolymer, propylene / 1-butene random copolymer, propylene / 1 hexene random copolymer, propylene 'ethylene • 1 otaten random copolymer, propylene' ethylene '1-butene random copolymer.
- propylene ' ⁇ -olefin random copolymer polymerized using a metallocene catalyst has a melting point of 110 ° C to 150 ° C, particularly 110 ° C to 135 ° C.
- Those are preferably used from the viewpoint of moldability. Specific examples of these include commercial products such as Wintech WFX6, Wintech WFX4, Wintech WFX4T, Wintech WFX4TA, Wintech WFW4 (all of which are manufactured by Nippon Polypro Co., Ltd.).
- the melting point is a value obtained from the melting peak temperature of a differential scanning calorimeter.
- the meta-orthocene catalyst includes a transition metal compound of Group 4 of the periodic table containing a ligand having a cyclopentadienyl skeleton (L, so-called meta-orthocene compound), a meta-orthocene compound, There are promoters that can react to activate in a stable ionic state and, if necessary, a catalyst comprising an organoaluminum compound, and any known catalyst can be used.
- the meta-orthocene compound is preferably a cross-linked meta-orthocene compound capable of stereoregular polymerization of propylene, and more preferably a cross-linked meta-orthocene compound having biisoregularity.
- meta-cene compounds include, for example, JP-A-60-35007, JP-A-61-130314, JP-A-63-295607, JP-A-1-275609, JP-A-2-41303, Kaihei 2-131488, JP-A-2-76887, JP-A-3-163088, JP-A-4-300887, JP-A-4 211694, JP-A-5-43616, JP-A-5-209013, JP-A-6 — 239914, JP 7-504934, and JP-A-8-85708.
- the meta-octene compound may be used by being supported on an inorganic or organic compound carrier.
- an inorganic or organic porous compound is preferable. Specifically, ion-exchange layered silicate, zeolite, SiO 2, Al 2 O 3, silica alumina, MgO, Zr
- Inorganic compounds such as O, TiO, B2O, CaO, ZnO, BaO, ThO, porous polyolefin
- Examples of the co-catalyst that can be activated to a stable ionic state by reacting with the metacene compound include, for example, an organoaluminum compound (for example, an aluminoxane compound), an ion-exchange layered silicate, a Lewis acid, and boron. Containing compounds, ionic compounds, and fluorine-containing organic compounds.
- organoaluminum compound examples include trialkylaluminum, such as triethylaluminum, triisopropylamine, triisobutylaluminum, dialkylaluminum halide, alkylaluminum sesquihalide, alkylaluminum dihalide, alkylaluminum hydride, organoaluminum alkoxide. The side etc. are raised.
- Examples of the polymerization method include a slurry method using an inert solvent in the presence of the catalyst, a solution method, a gas phase method substantially using no solvent, or a Balta polymerization method using a polymerization monomer as a solvent. Can be given.
- the polymerization temperature can be adjusted by adjusting the amount of comonomer and appropriately controlling the molecular weight and crystallinity distribution, thereby obtaining a desired polymer. .
- the thickness of the substrate layer is generally 10 to 200 ⁇ m, preferably 20 to; 100 ⁇ m, more preferably 30 to 70 111.
- film substrates such as antioxidants, lubricants, anti-blocking agents, and ultraviolet absorbers are appropriately added to the above-mentioned substrate layer as long as the object of the present invention is not impaired. It is possible to add.
- the film surface can be easily contacted with acid treatment, alkali treatment, primer treatment, corona treatment, plasma treatment, ultraviolet treatment, etc. A landing process can also be performed.
- the antistatic layer of the present invention is formed of a force S containing a polymer antistatic agent, a resin used for the base material layer, and a polymer antistatic agent. Is preferred.
- polypropylene is preferably used from the viewpoints of productivity, moldability, and antifouling properties.
- Examples of the polypropylene include a homotype that is a homopolymer, a random type that is a propylene- ⁇ -olefin random copolymer, and a block type that is a propylene ' ⁇ -olefin block copolymer. From the viewpoint of force S and transparency, homotype and random type are preferably used.
- the homotype polypropylene is not particularly limited as long as it is a resin capable of obtaining a target highly transparent adhesive sheet.
- Examples of commercially available products include ZS 1327 A, F104A, F3900, and J 5900. (All of the above are manufactured by Prime Polymer Co., Ltd.).
- the ⁇ -olefin component of the random type propylene ' ⁇ -olefin copolymer includes, for example, ethylene, 1-butene, 1 pentene, 1-hexene, 1 heptene, 1-octene, 3-methylbutene 1, Examples thereof include 4-methylpentene 1, 3-methylhexene 1 and the like, and ethylene, 1-butene, 3-methylbutene 1, and 4-methylpentene 1 are preferable.
- non-conjugated gens such as 4-methylenole 1,4 monohexagen, 5-methylenole 1,4 monohexagen, 7-methyl-1,6-octadiene, 1,9-decadiene are used as part of the polymer component. be able to. It is also possible to superimpose cyclic olefins such as norbornene.
- the random type propylene 'a-olefin random copolymer includes, for example, propylene / ethylene random copolymer, propylene / 1-butene random copolymer, propylene / monohexene random copolymer, Examples thereof include propylene / ethylene / 1-otaten random copolymer and propylene / ethylene / 1-butene random copolymer.
- the ⁇ -olefin used in the propylene ′ ⁇ -olefin series random copolymer polymerized using a meta-octene catalyst is, for example, ethylene, 1-butene, 1 pentene, or 1-hexene.
- non-conjugated genes such as 4-methyl-1, 4 monohexagen, 5 methyl-1, 4 monohexagen, 7 methyl-1, 6 octagen, 1, 9-decadiene should be used as part of the polymer component.
- cyclic olefins such as norbornene can be copolymerized.
- Specific examples of the above random copolymer include propylene / ethylene random copolymer, propylene / 1-butene random copolymer, propylene / 1 hexene random copolymer, propylene / ethylene / 1 otaten random copolymer. Examples thereof include butylene / butylene / ethylene / 1 butene random copolymer.
- the propylene ' ⁇ -olefin random copolymer polymerized using a metallocene catalyst has a melting point of 110 ° C to 150 ° C, particularly 110 ° C to 135 ° C.
- a metallocene catalyst has a melting point of 110 ° C to 150 ° C, particularly 110 ° C to 135 ° C.
- these include commercial products such as Wintech WFX6, Wintech WFX4, Wintech WFX4T, Wintech WF X4TA, Wintech WFW4 (all of which are manufactured by Nippon Polypro Co., Ltd.).
- the polymer antistatic agent used in the present invention is a block copolymer having an olefin block and a hydrophilic block.
- the olefin block of the block copolymer has a function of uniformly dispersing in the resin forming the antistatic layer
- the hydrophilic block has a function of antistatic. Therefore, a copolymer containing both of these components can disperse the antistatic agent uniformly in the antistatic layer, can exhibit a stable antistatic ability, and can form a highly transparent antistatic layer.
- the antistatic composition comprising the block copolymer. By using a stopper, a stable antistatic ability can be obtained with almost no decrease in the antistatic ability even in treatments such as washing with water or wiping.
- the olefin block forming the block copolymer is a (co) polymer of ⁇ -olefin.
- the ⁇ -olefin (A1) used here is ethylene, propylene, 1-butene, 1 pentene, 1 monohexene, 1 heptene, 1-octene, 3-methylbutene 1, 4-methylpentene 1, 3-methylhexene. 1 and the like, preferably ethylene, propylene, 1-butene, 3-methylbutene 1, 4-methylpentene 1.
- non-conjugated genes such as 4-methyl-1,4 monohexagen, 5-methyl-1,4 monohexagen, 7-methyl 1,6-octadiene, 1,9-decadiene are used as part of the polymer component. I can do it. Furthermore, cyclic olefins such as norbornene can be copolymerized. Of these, low molecular weight ⁇ -olefins obtained by a thermal degradation method of ethylene and / or propylene are preferably used.
- the number average molecular weight of ⁇ -olefin is 800 to 20,000, more preferably 1,000 to 10,000, particularly preferably (or 1,200 to 6,000.
- the number average molecular weight ( Magenoreno is calculated by polystyrene conversion using one-medium chromatography (GPC).
- the olefin block is a force that is chemically bonded to the hydrophilic block.
- the bond is at least one bond selected from an ester bond, an amide bond, an ether bond, a urethane bond, an imide bond, and the like. And has a structure in which these bonds are alternately and alternately bonded through these bonds.
- the molecular terminal of the olefin block needs to be modified with a functional group having reactivity with the molecular terminal functional group of the hydrophilic block.
- these functional groups include a carboxylic acid group, a hydroxyl group, an amino group, an acid anhydride group, an oxazoline group, and an epoxy group. Among these, a carboxylic acid group is preferable because of easy modification.
- the ⁇ -olefin (A1) has an ⁇ , ⁇ unsaturated carboxylic acid and / or its anhydride
- (anhydrous) maleic acid refers to maleic acid and / or maleic anhydride
- modified polyolefin ( ⁇ 2) and the above olefin Polyolefins (A2) secondary modified with ratatam (force prolatatam, laurac ratatatam, etc.) or aminocarboxylic acids (11-aminoundecanoic acid, 12-aminododecanoic acid, etc.)
- the above ⁇ -olefin (A1) is oxygenated And / or ozone-modified polyolefin (A3), polyolefin (A3) secondarily modified with ratatam or aminocarboxylic acid, and a mixture of two or more of these.
- the amount of ⁇ , / 3 unsaturated carboxylic acid and / or anhydride thereof used is 0, based on the weight of ⁇ -olefin (A1), from the viewpoint of repetitive structure formation and antistatic properties. 5 to 40 parts by weight, preferably 1 to 30 parts by weight, and more preferably 2 to 20 parts by weight.
- Examples of a method for modifying the above ⁇ , ⁇ unsaturated carboxylic acid and / or its anhydride to ⁇ -olefin (Al) include, for example, a solution method or melting to the terminal double bond of ⁇ -olefin (A1).
- the method includes thermally adding (en reaction) ⁇ , ⁇ unsaturated carboxylic acid and / or its anhydride.
- the solution method is preferable from the viewpoint of reaction uniformity.
- an ⁇ , ⁇ unsaturated carboxylic acid and / or anhydride thereof is added to ⁇ -olefin (A1) in a hydrocarbon solvent such as xylene or toluene, and an inert gas atmosphere such as nitrogen is added.
- a method of reacting at 170 to 230 ° C is mentioned.
- ⁇ -olefin (A1) is heated and melted, then ⁇ , / 3-unsaturated carboxylic acid and / or anhydride thereof is added, and the atmosphere is 170 to 230 ° C in an inert gas atmosphere such as nitrogen.
- an inert gas atmosphere such as nitrogen. The method of making it react is mentioned.
- Examples of olefin blocks having a hydroxyl group at the end of the polymer include, for example, the above-described carboxylic acid group-modified polyolefins having 2 to 10 carbon atoms such as hydroxylamine (2-aminoethanol, 3-aminopropanol, 4 amino acid). Polyolefins modified with butanol, 6-aminohexanol, etc.) and mixtures of two or more thereof.
- the modification with hydroxylamine can be carried out, for example, by directly reacting the above-mentioned carboxylic acid group-modified polyolefin with hydroxylamine.
- the reaction temperature is 120-230 ° C.
- the amount of hydroxy groups of hydroxyamine used for modification is 0 per one residue of ⁇ , unsaturated carboxylic acid and / or anhydride thereof in the above-described carboxylic acid-modified polyolefin. ! To 2 solids, preferably 0.3 to 1.5 solids, more preferably 0.5 to 1.2 solids, and particularly preferably one.
- Examples of the olefin block having an amino group at the end of the polymer include, for example, the above-described carboxylic acid group-modified polyolefin as diamine (2 to 18 carbon atoms; ethylenediamine, ethylenediamine, hexamethylenediamine, heptamethylenediamine). Amino group-modified polyolefins modified with amine, otatamethylenediamine, decamethylenediamine, etc.) and mixtures of two or more of these.
- the modification with diamine can be carried out, for example, by directly reacting the above-mentioned carboxylic acid group-modified polyolefin with diamine.
- the reaction temperature is 120-230 ° C.
- the amount of the amino group of the diamine used for the modification is 0.;!-2 per one residue of ⁇ , / 3-unsaturated carboxylic acid and / or anhydride thereof in the above-mentioned cambonic acid group-modified polyolefin.
- the end of the olefin block is usually obtained by using the force obtained as a mixture of the olefin block modified at both ends and the olefin block modified at one end, and using these mixtures as they are.
- the number average molecular weight of the polyolefin block is from 800 to 50,000, preferably from 1,000 to
- hydrophilic polymer of the hydrophilic block examples include polyethers, polyether-containing hydrophilic polymers, cationic polymers, and anionic polymers.
- polyether diol examples include polyether diol, polyether diamine, and modified products thereof.
- polyether diol for example, the general formula (1): ⁇ — (OA 1 ) n— O— E 1 — O
- E 1 is a residue obtained by removing a hydroxyl group from a divalent hydroxyl group-containing compound, and A 1 is carbon
- the alkylene group having 2 to 4 primes, n and n ′ represent the number of alkylene oxide additions per hydroxyl group of the divalent hydroxyl group-containing compound.
- n (OA 1 ) and n ′ ( ⁇ ⁇ ) may be the same or different, and a bond when these are composed of two or more oxyalkylene groups
- the format can be either block or random or a combination of these.
- ⁇ and ⁇ ′ are usually;! To 300, preferably 2 to 250, particularly preferably 10 to 100. Moreover, ⁇ and ⁇ ′ may be the same or different.
- Examples of the divalent hydroxyl group-containing compound include a compound containing two alcoholic or phenolic hydroxyl groups in one molecule, that is, a dihydroxy compound, specifically, a dihydric alcohol.
- a dihydroxy compound specifically, a dihydric alcohol.
- a bivalent phenol having 6 to 18 carbon atoms or a tertiary amino group-containing diol.
- aliphatic dihydric alcohol examples include alkylene glycols such as ethylene glycol and propylene glycol, 1,4 butanediol, 1,6-hexanediol, neopentyldaricol, 1,12-dodecanediol, and the like. Etc.
- Examples of the alicyclic dihydric alcohol include 1, 2 and 1, 3-cyclopentanediol, 1, 2-, 1, 3- and 1,4-cyclohexanediol, 1, 4-cyclohexanedimethanol and the like, and examples of the aromatic dihydric alcohol include xylenediol and the like.
- divalent phenol examples include, for example, monocyclic divalent phenols such as hydroquinone, catechol, resorcin, and urushiol, bisphenol ⁇ , bisphenol F, bisphenolanol S, 4, 4'-dihydroxydiphenol 2, 2 Bisphenols such as butane, dihydroxybiphenyl, dihydroxydiphenyl ether, and condensed polycyclic divalent phenols such as dihydroxynaphthalene and binaphthol.
- monocyclic divalent phenols such as hydroquinone, catechol, resorcin, and urushiol
- bisphenol ⁇ bisphenol F
- bisphenolanol S 4, 4'-dihydroxydiphenol 2
- 4'-dihydroxydiphenol 2 Bisphenols such as butane, dihydroxybiphenyl, dihydroxydiphenyl ether
- condensed polycyclic divalent phenols such as dihydroxynaphthalene and binaphthol
- E 2 is a residue obtained by removing a hydroxyl group from the divalent hydroxyl group-containing compound described in the general formula (1), and A 2 is at least partially represented by the general formula (3): —CHR—CHR ′ [wherein, one of R and R ′ is a group represented by the general formula (4): —CH 0 (A 3 0) R ⁇ , and the other is H.
- X is an integer from! To 10; R "is H or an alkyl group having 1 to 10 carbon atoms; Group, an arenoquinolealino group, an arylalkyl group or an acyl group, and A 3 is an alkylene group having 2 to 4 carbon atoms. Or a remaining alkylene group having 2 to 4 carbon atoms! /.
- m (OA 2 ) and m ′ (A 2 0) may be the same or different.
- ⁇ ′ is preferably! -300, more preferably 2-250, particularly 10-100.
- M and m ′ may be the same or different.
- the polyether diol represented by the general formula (1) can be produced by addition reaction of an alkylene oxide to a divalent hydroxyl group-containing compound.
- alkylene oxides examples include alkylene oxides having 2 to 4 carbon atoms such as ethylene oxide, propylene oxide, 1,2-butylene oxide, 1,4-butylene oxide, 2,3-butylene oxide, and 1,3-Butylene oxide and a combination of two or more of these are used.
- the bonding form may be random and / or block.
- Preferred as the alkylene oxide are block and / or random addition of ethylene oxide alone and a combination of ethylene oxide and other alkylene oxides.
- the number of alkylene oxides added is preferably from! To 300, more preferably from 2 to 250, and particularly preferably from 10 to 100, per hydroxyl group of the divalent hydroxyl group-containing compound.
- Preferred methods and production methods of the polyether diol represented by the general formula (2) include the following methods (a) and (i).
- [A 4 in general formula (5) is an alkylene group having 2 to 4 carbon atoms, p is an integer of 1 to 10, R 1 is H or an alkyl group having! To 10 carbon atoms, an aryleno group, an anolequino group A rarenole group, an arylenolealkyl group or an acyl group; Or glycidyl ether represented by A method of copolymerizing with alkylene oxide of 4.
- the polyether diamine can be obtained by changing the hydroxyl group of the polyether diol to an amino group by a known method. For example, the terminal obtained by cyanoalkylation of the hydroxyl group of polyether diol is reduced to an amino group.
- Modified products include the above-mentioned polyether diol or polyether diamine aminocarboxylic acid modified product (terminal amino group), the above polyether diol or polyether diamine isocyanate modified product (terminal isocyanate group), and the above poly diol.
- Examples thereof include an epoxy-modified product (terminal epoxy group) of ether diol or polyether diamine.
- the aminocarboxylic acid-modified product can be obtained by reacting the above polyether diol or polyether diamine with an amino carboxylic acid or ratatam.
- the modified isocyanate is obtained by reacting the polyether diol or polyether diamine with an organic diisocyanate, or by reacting the polyether diamine with phosgene.
- the organic diisocyanate is an aromatic diisocyanate having 6 to 20 carbon atoms (excluding carbon in the NCO group, the same applies hereinafter), 2 to carbon atoms; 18 aliphatic diisocyanate, 4 to carbon atoms; and 15 alicyclic ring.
- Examples thereof include diisocyanates of the formula, araliphatic diisocyanates having 8 to 15 carbon atoms, modified products of these diisocyanates, and mixtures of two or more thereof.
- the epoxy-modified product is an epoxy resin such as the above-mentioned polyether diol or polyether diamine and gepoxide (diglycidyl ether, diglycidyl ester, alicyclic diepoxide, etc.). Xyresin, epoxy equivalent: 85-600), reacting with polyether diol and epihalohydrin (epichrohydrin, etc.).
- the number average molecular weight of the polyetherol is 150 to 20,000, preferably 300 to 20,000, more preferably 1,000 to 15,000, and particularly preferably 1, 200 to 8,000.
- polyether-containing hydrophilic polymer examples include polyether ester amide having a segment of polyether diol, polyether amide imide having a segment of polyether diol, and polyether having a segment of polyether diol.
- examples include esters, polyether amides having polyether diamine segments, and polyether urethanes having polyether diol or polyether diamine segments.
- the polyether ester amide is composed of a polyamide having a carboxyl group at the terminal and the above-mentioned polyether diol.
- Polyamides include, for example, 6 to 12 ratatam ring-opened polymers, 6 to 6 carbon atoms; polycondensates of 12 to 12 aminoamino acids, diamines (aliphatic diamines having 2 to 20 carbon atoms, carbon atoms) 15 to 20 cycloaliphatic diamines, 8 to 15 carbon atoms, and 15 to 20 carbon dicarboxylic acids (aliphatic dicarboxylic acids, aromatic dicarboxylic acids, alicyclic dicarboxylic acids and Examples thereof include amides with these ester-forming derivatives [lower alkyl (1 to 6 carbon atoms) esters, anhydrides, etc.] and the like, and mixtures thereof.
- polyamide force prolatatam ring-opening polymer
- polycondensate of 12-aminododecanoic acid and amide of adipic acid and hexamethylenediamine are preferably used.
- a coalescence is particularly preferably used.
- the polyether amide imide is composed of polyamide imide having at least one imide ring and the above polyether diol.
- the polyamide-imide is a polymer comprising 6 to 12 carbon atoms of ratatam and a trivalent or tetravalent aromatic polycarboxylic acid capable of forming at least one imide ring, and having 6 to 12 carbon atoms;
- the polyether ester is composed of polyester, the above polyether diol, and force.
- the polyester include dicarboxylic acids having 4 to 20 carbon atoms and diols (for example, 2 to carbon atoms; aliphatic, alicyclic or aromatic dihydric alcohols having 12 carbon atoms, 6 to 18 carbon atoms; Polyesters composed of tertiary amino group-containing diols, etc.), polyesters composed of 6 to 12 carbon atoms or 12 to 12 carbon atoms; oxycarboxylic acids having 12 to 12 carbon atoms, and mixtures thereof.
- the polyether amide is composed of the polyamide and the polyether diamine.
- the polyether urethane is composed of the organic diisocyanate and the polyether diol or the polyether diamine and, if necessary, a chain extender (such as the dihydric alcohol and the diamine in the diol).
- the content of the polyether segment in the polyether-containing hydrophilic polymer is 30 to 80% by weight, preferably 40 to 70% by weight based on the weight of the polyether-containing hydrophilic polymer from the viewpoint of moldability. .
- the content of the oxyalkylene group in the polyether-containing hydrophilic polymer is 30 based on the weight of the polyether-containing hydrophilic polymer from the viewpoint of antistatic properties and moldability.
- the number average molecular weight of the polyether-containing hydrophilic polymer is preferably 800 or more, more preferably 1,000 or more from the viewpoint of reactivity with the above olefin block.
- cationic polymer 2 to 80, preferably, separated by a nonionic molecular chain,
- a polymer having 3 to 60 cationic groups in the molecule is used.
- Nonionic molecular chains include divalent hydrocarbon groups, ether bonds, thioether bonds, carbonyl bonds, ester bonds, imino bonds, amide bonds, imide bonds, urethane bonds, urea bonds, carbonate bonds and / or Hydrocarbon group having a siloxy bond and a hydrocarbon group having a heterocyclic structure containing a nitrogen atom or an oxygen atom. And at least one divalent organic group such as a divalent hydrocarbon group, and a combination of two or more thereof.
- Examples of the divalent hydrocarbon group include a linear or branched aliphatic hydrocarbon group having 1 to 8 carbon atoms, an aromatic hydrocarbon group having 6 to 20 carbon atoms, and an alicyclic ring having 4 to 15 carbon atoms; Formula hydrocarbon group and the like.
- divalent hydrocarbon group having an ether bond, a thioether bond, a carbonyl bond, an ester bond, an imino bond, an amide bond, an imide bond, a urethane bond, a urea bond, a carbonate bond and / or a siloxane bond (Poly) oxyalkylene group, residue of polyetherolene, residue of monoetherenodiole, residue of polythioetherol, residue of polyester, residue of polyamide, residue of polyurethane, Polyurea residues, polycarbonate residues, polyorganosiloxane residues, and the like.
- a divalent hydrocarbon group and a divalent hydrocarbon group having an ether bond more preferably an alkylene group having 1 to 8 carbon atoms, a phenyl group, a (poly) oxyethylene group, and a (poly) oxypropylene group.
- Groups are preferred as nonionic molecular chains.
- the number average molecular weight of the nonionic molecular chain is 28 to 10,000, preferably 300 to 5,000.
- Examples of the cationic group include groups having a quaternary ammonium salt or a phosphonium salt.
- the group having a quaternary ammonium salt is preferably a divalent quaternary ammonium salt-containing heterocyclic group.
- a divalent quaternary ammonium salt-containing heterocyclic group includes a divalent tertiary amino group-containing heterocyclic group [for example, a divalent imidazole ring group (1,4-imidazolene group, 2-phenylenoyl group, 1, 4--imidazolene group), divalent piperidine ring group (2, 3, piperidylene group, 3, 4 piperidylene group, 2, 6 piperidylene group, etc.), and divalent aromatic heterocyclic group (2, 3 Pyridylene group, 2, 4 Pyridylene group, 2, 5 Pyridylene group, 2, 6 Pyridylene group, 3, 4 Pyridylene group, 3, 5 Pyridylene group, 2, 5 Pyrimidinylene group, 3, 6 Pyridazinylene group, and 2, 5 -Pyradrene group etc.)] is quaternized.
- a divalent imidazole ring group (1,4-imidazolene group, 2-phenylenoyl group, 1, 4--imidazolene group
- anions for the cationic group include super strong acid anions and other anions.
- Super strong acid anion is induced by the combination of protonic acid and Lewis acid
- examples include super strong acids (such as tetrafluoroboric acid and hexafluorophosphoric acid) and strong acids such as trifluoromethanesulfonic acid.
- Other anions include halogen ions (F_, CI, Br, I), OH, PO, CIO, NO, CH COO, CH OSO, CH O
- the terminal structure of the cationic polymer is preferably a carbonyl group, a hydroxyl group, or an amino group from the viewpoint of reactivity with the olefin block.
- the number average molecular weight of the cationic polymer is 500 to 20,000, preferably 1, 0.
- anionic polymer a dicarboxylic acid having a sulfonyl group and a diol or a polyether are essential structural units, and preferably 2 to 80, more preferably 3 to 60 in one molecule. And anionic polymers having a sulfonyl group.
- dicarboxylic acid having a sulfonyl group examples include aromatic dicarboxylic acids having a sulfonyl group, aliphatic dicarboxylic acids having a sulfonyl group, and those in which only the sulfonyl group is converted into a salt. can give. Of these, aromatic dicarboxylic acids having a sulfonyl group are preferably used.
- aromatic dicarboxylic acids having a sulfonyl group examples include 2-sulfoisophthalic acid, 4-sulfoisophthalic acid, 5-sulfoisophthalic acid, 4-sulfo-2,6-naphthalene dicarboxylic acid, and ester derivatives thereof [ Lower alkyl (1 to 4 carbon atoms) ester
- Examples of the aliphatic dicarboxylic acid having a sulfonyl group include sulfosuccinic acid and ester derivatives thereof.
- salts such as alkali metal salts, alkaline earth metal salts, ammonium salts, compounds having hydroxyalkyl (2 to 4 carbon atoms) groups, or Examples include amine salts such as triamine, quaternary ammonium salts of these amines, and combinations of two or more of these.
- alkanediols having 2 to 10 carbon atoms, ethylene glycol, polyethylene glycol (degree of polymerization 2 to 20), bisphenol ethylene oxide.
- Additives additional moles 2 to 60
- the number average molecular weight of the anionic polymer is 500 to 20,000, preferably 1,000 to
- the polymer antistatic agent of the present invention can be obtained by polymerizing the polyolefin block and the hydrophilic polymer block by a known method.
- the force S can be used to produce an polyolefin block and a hydrophilic block by carrying out a polymerization reaction at 200 to 250 ° C under reduced pressure.
- a tin-based catalyst such as monobutyltin oxide, an antimony-based catalyst such as antimony trioxide and antimony dioxide, and a titanium such as tetrabutyl titanate. 1 type or a combination of 2 or more types selected from dinoconium-based catalysts such as zirconium catalyst, zirconium hydroxide, dinoleconium oxide, dinoleconium acetate, and barley organic acid catalyst.
- the number average molecular weight of the block copolymer composed of the olefin block and the hydrophilic block is from the viewpoint of antistatic lifetime, force, 2,000-60,000, preferably 5,000-40. , 000, more preferably 8,000-30,000.
- the content of the hydrophilic block constituting the block copolymer is preferably 10 to 90% by weight, more preferably 20 to 80% by weight, based on the weight of the block copolymer. S is more preferable.
- the force, block copolymer can be produced, for example, by the method described in JP-A-2001-278985 and JP-A-2003-48990, and the antistatic agent of the present invention includes: Available as 300, 303, and 230 (trade names) of the Pelestat 300 series manufactured by Sanyo Chemical Industries.
- the amount of the polymeric antistatic agent used in the present invention is based on the total weight of the resin and the antistatic agent forming the antistatic layer;! To 50% by weight, preferably 3 to 40% by weight, More preferably, it is 5 to 35% by weight, particularly preferably 10 to 30% by weight. If it is less than 1% by weight, the antistatic property is inferior, and if it exceeds 50% by weight, the appearance of the film tends to deteriorate.
- the method of mixing the synthetic resin and the antistatic agent is not particularly limited.
- the resin and the antistatic agent are mixed with a tumble mixer, a ribbon blender, a Henschel mixer, or the like.
- Dry blending of resin and antistatic agent, then melt blending with an extruder and pelletizing 3) Reactor and batch preparation of resin and antistatic agent
- the master batch, the resin, and, if necessary, other additives may be dry blended with the above mixer and mixed.
- an alkali metal salt or an alkaline earth metal salt can be contained. These components can be contained before or during the polymerization of the polymer type antistatic agent, and can be incorporated after the polymerization or when the antistatic layer of the present invention is produced. It can also be contained by a method combining these.
- alkali metal and / or alkaline earth metal salts include organic acids, sulfonic acids, inorganics of alkali metals such as lithium, sodium and potassium and / or alkali earth metals such as magnesium and calcium. Examples include acid salts and nonogenated products.
- alkali metal and / or alkaline earth metal salts halogens of alkali metals such as lithium chloride, sodium chloride, potassium chloride, lithium bromide, sodium bromide, potassium bromide, etc.
- Alkali metal inorganic acid salt such as lithium perchlorate, sodium perchlorate and potassium perchlorate, Organic acid salt of alkali metal such as potassium acetate and lithium stearate; Octyl sulfonic acid, dodecyl sulfonic acid, tetradecyl sulfonic acid
- Alkali metal salts of alkyl sulfonic acids having 8 to 24 carbon atoms such as stearyl sulfonic acid, tetracosyl sulfonic acid, 2-ethylhexyl sulfonic acid, etc .
- aromatics such as phenyl sulfonic acid, naphthyl sulfonic acid, etc.
- Alkali metal salts of sulfonic acids Alkali metal salts of sulfonic acids; octyl phenyl sulfonic acid, dodecyl sulfonic acid Alkali metal salts of alkyl benzene sulfonic acids having 6 to 18 carbon atoms in the alkyl group, such as phenyl sulfonic acid, dibutyl phenyl sulfonic acid, and dinoyl phenyl sulfonic acid; dimethyl naphthyl sulfonic acid, diisopropyl naphthyl sulfonic acid, dibutyl naphthyl sulfone
- An alkyl group such as an acid such as an alkyl group having 2 to 2 carbon atoms; an alkyl group having an alkyl group such as 18 alkylnaphthalene sulfonic acid having 2 to 2 carbon atoms; an alkali metal salt of an alky
- the metal salt is preferably in the range of 0.00;! To 10 wt%, more preferably 0.0;! To 5 wt% with respect to the polymeric antistatic agent of the present invention. Can be used.
- the thickness of the antistatic layer is generally 1 to 100 m, preferably 2 to 80 m, more preferably 3 to 70 ⁇ , still more preferably 5 to 50 ⁇ 111, and particularly preferably 5 to 30 ⁇ m. It is.
- the method for forming the base material layer and the antistatic layer is not particularly limited, and a known film forming method such as an extrusion method, an inflation method, or a tubular method is used.
- the resin is laminated with a die that can be co-extruded to form a film, or an antistatic layer is laminated on the base material layer, or the base material layer and the antistatic layer are bonded with an adhesive or an adhesive. It is formed by bonding using layers.
- the base material layer may have a multilayer structure of two or more layers. In the present invention, film formation by a coextrusion method is preferable in order to exhibit transparency.
- the temperature of the resin forming the base layer is, for example, 85 to 280 ° C
- the temperature of the resin forming the antistatic layer is, for example, 85 to 230 ° C
- the temperature of the die is, for example, 180 to 280.
- each layer may be laminated and then thermocompression bonded, or each layer may be preheated and then crimped.
- an adhesive for example, an ethylene acetate butyl copolymer, a methyl methacrylate polymer elastomer or the like can be used as an adhesive.
- the pressure-sensitive adhesive used in the pressure-sensitive adhesive layer of the present invention is not particularly limited as long as it has a property capable of being removably adhered to the panel surface or the like of the liquid crystal panel without causing adhesive residue or contamination. it can.
- adhesives include acrylic, natural rubber, synthetic rubber, ethylene acetate butyl copolymer, ethylene acrylate ester, styrene isoprene block copolymer, styrene butadiene block copolymer, polyurethane, and polyester. And various adhesives.
- acrylic pressure-sensitive adhesives are preferably used because they are highly transparent and easily obtain pressure-sensitive adhesives that exhibit good adhesion properties with optical sheets.
- the acrylic pressure-sensitive adhesive the number of carbon atoms as a monomer component;! (Meth) having an alkyl group of to 14 50 to Atari rate; 100 weight 0/0 containing (meth) acrylic based polymer Used as a polymer.
- the (meth) acrylic polymer used in the present invention is not particularly limited as long as it is a (meth) acrylic polymer having adhesive properties corresponding to those described above.
- the (meth) acrylic polymer in the present invention refers to an acrylic polymer and / or a methacrylic polymer.
- alkyl (meth) acrylate refers to alkyl acrylate and / or alkyl methacrylate
- (meth) acrylate refers to acrylate and / or metatalylate! /.
- (meth) acrylate having an alkyl group having 1 to 14 carbon atoms include, for example, methyl (meth) acrylate, ethyl (meth) acrylate, and n-butyl (meth) acrylate.
- hexyl (meth) acrylate when used for the re-peelable pressure-sensitive adhesive sheet of the present invention, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-octyl (meth) acrylate, isoota Til (meth) atarylate, n-nonyl (meth) atarylate, isononyl (meth) atarylate, n
- a (meth) acrylate having an alkyl group of 6 to 14 is preferably used.
- a (meth) acrylic polymer composed of a (meth) acrylate having an alkyl group having 6 to 14 carbon atoms as a main component, it becomes easy to control the adhesive force to the adherend to a low level. Excellent peelability.
- the (meth) acrylate having an alkyl group having 1 to 14 carbon atoms described above may be used alone or in combination of two or more. 50 to 100% by weight of the total monomer component of the polymer. / 0, it is preferred instrument 60-99. 5 wt% and more preferably implement 70 99% by weight is more preferred.
- a functional group-containing monomer capable of reacting with a crosslinking agent or a (meth) acrylic group in addition to the above-mentioned (meth) acrylate having an alkyl group having 1 to 14 carbon atoms, a functional group-containing monomer capable of reacting with a crosslinking agent or a (meth) acrylic group.
- Other polymerizable monomer components for adjusting the glass transition point and peelability of the polymer can be used.
- Examples of the functional group-containing monomer include a carboxyl group-containing monomer, an acid anhydride group-containing monomer, a hydroxyl group-containing monomer, an amino group-containing monomer, an epoxy group-containing monomer, an isocyanate group-containing monomer, and an aziridine group-containing monomer.
- a component having a functional group that serves as a bridging base point such as can be used as appropriate.
- Examples of the carboxyl group-containing monomer include (meth) acrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, and isocrotonic acid. can give.
- Examples of the acid anhydride group-containing monomer include maleic anhydride, itaconic anhydride, and acid anhydride bodies of the above carboxyl group-containing monomers.
- hydroxyl group-containing monomer for example, 2-hydroxyethyl (meth) ataryl
- amino group-containing monomers include aminoethyl (meth) acrylate, N, N-dimethylaminoethyl (meth) acrylate, N, N-dimethylaminopropyl (meth) acrylate. It is done.
- epoxy group-containing monomer examples include glycidyl (meth) acrylate, methyl daricidyl (meth) acrylate, and aryl glycidyl ether.
- Examples of the isocyanate group-containing monomer include 2-methacryloyloxychetyl isocyanate.
- the above-mentioned functional group-containing (meth) acrylate may be used alone or as a mixture of two or more kinds, but the total content is the total of (meth) acrylic polymer. It is preferable that the content of the monomer is 0.;! To 15% by weight, more preferably 0.2 to 12% by weight, and particularly preferably 0.3 to 10% by weight. .
- the content of the functional group-containing (meth) acrylate is less than 0.1% by weight, the crosslinking formation by the crosslinking agent becomes insufficient, and the cohesive force of the adhesive composition becomes small, causing the adhesive residue. Tend to be.
- a glass transition point of the (meth) acrylic polymer, a polymerizable monomer for adjusting the peelability, and the like are not impaired. Can be used in.
- polymerizable monomer components include, for example, cohesive strength heat resistance improving components such as sulfonic acid group-containing monomers, phosphoric acid group-containing monomers, cyano group-containing monomers, bull esters, and aromatic bull compounds.
- a component having a functional group that acts as a crosslinking base point can be used as appropriate, such as an amide group-containing monomer, an imide group-containing monomer, N-attalyloylmorpholine, and butyl ether.
- sulfonic acid group-containing monomer examples include styrene sulfonic acid, aryl sulfonic acid, 2- (meth) acrylamide-2-methylpropanesulfonic acid, (meth) acrylamide prosulfonic acid, sodium vinyl sulfonate, and the like.
- Examples of the phosphoric acid group-containing monomer include 2-hydroxyethyl allyloyl phosphate.
- Examples of the cyano group-containing monomer include acrylonitrile and methacrylonitrile. It is.
- bur esters examples include butyl acetate, butyl propionate and laurate.
- aromatic bur compound examples include styrene, chlorostyrene, chloromethylstyrene, ⁇ -methylstyrene, and other substituted styrene.
- Examples of the amide group-containing monomer include acrylamide, methacrylamide, jetyl atalinoleamide, ⁇ ⁇ -bulylpyrrolidone, ⁇ , ⁇ dimethylacrylamide, ⁇ , ⁇ ⁇ ⁇ ⁇ dimethyl methacrylamide, ⁇ , ⁇ ⁇ jetyl acrylamide, ⁇ , ⁇
- Examples include jetyl methacrylamide, ⁇ , ⁇ , monomethylene bisacrylamide, ⁇ , ⁇ ⁇ ⁇ ⁇ dimethylaminopropyl acrylamide, ⁇ , ⁇ -dimethylaminopropyl methacrylamide, and diacetone acrylamide.
- Examples of the imide group-containing monomer include cyclohexylmaleimide, isopropylmaleimide, cyclohexylmaleimide, and itaconimide.
- butyl ethers include methyl butyl ether, ethyl butyl ether, isobutyl butyl ether, and the like.
- the other polymerizable monomer components described above may be used alone or in admixture of two or more, but the total content is that of the (meth) acrylic polymer. It is preferably 0 to 35% by weight of the total monomer components, more preferably 0 to 30% by weight, and particularly preferably 0 to 25% by weight. By using the other polymerizable monomer components described above, good adhesiveness can be appropriately adjusted.
- the glass transition temperature (Tg) of the (meth) acrylic polymer as the base polymer is usually preferably 1 100 ° C 0 ° C, more preferably 80 ° C 10 ° C. . If the glass transition temperature is higher than 0 ° C, it may be difficult to obtain sufficient adhesive strength.
- the glass transition temperature (Tg) of the (meth) acrylic polymer can be adjusted within the above range by appropriately changing the monomer components used and their composition ratios.
- the (meth) acrylic polymer may be misaligned, such as random copolymer, block copolymer, and graft copolymer! /.
- the acrylic polymer can be obtained by a polymerization method generally used as a synthesis method of an acrylic polymer, such as solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization.
- solution polymerization is relatively easy because the intended pressure-sensitive adhesive composition can be obtained.
- Emulsion polymerization is preferably used.
- solution polymerization a conventionally known method is used as a solution polymerization method of the pressure-sensitive adhesive.
- the monomers and copolymer monomers described above are mixed, a polymerization initiator and a solvent are added, and solution polymerization is performed.
- polymerization initiator used in the present invention an azo compound or a peroxide is used.
- azo compounds include 2,2'-azobisisobutyronitrile, 2,2 'azobisisovaleronitrile, 2,2'-azobis (4-methoxy 2,4 dimethylvaleronitrile) 2, 2, '-azobis (2,4 dimethylvaleronitrile), 2, 2, azobis (2 methylbutyronitrile), 1, 1, azobis (cyclohexane 1 carbonitryl), 2, 2, 1 azobi (2,4,4 trimethylpentane), dimethyl-2,2, azobis (2-methylpropionate) and the like.
- peroxides include benzoyl peroxide, t-butyl hydride peroxyside, di-tert-butylenoide peroxyside, tert-butinoreperoxybenzoate, dicumyl peroxide, 1, 1 bis ( (t-butylperoxy) -3,3,5-trimethylsic hexane, 1,1-bis (t-butylperoxy) cyclododecane and the like.
- solvents are used as the solvent.
- esters such as ethyl acetate and n-butyl acetate
- aromatic hydrocarbons such as toluene and benzene
- aliphatic hydrocarbons such as n-hexane and n-heptane
- alicyclic rings such as cyclohexane and methylcyclohexane
- hydrocarbons such as formula hydrocarbons, methyl ethyl ketone, and methyl isobutyl ketone.
- Solvents can be used alone or in combination.
- the polymerization initiator may be used alone or in combination of two or more.
- the content of 1S as a whole is preferably 0.001 to 0.4 parts by weight and 0.002 to 0.2 parts by weight based on 100 parts by weight of the monomer.
- the emulsion polymerization for example, the above-mentioned monomers and copolymerization monomers are first mixed, and an emulsifier and water are added thereto, followed by emulsification to prepare emulsion. At this time, the monomer should be blended in whole or part of the total amount used, and the rest should be dropped during the polymerization. Is also possible. Next, a polymerization initiator and, if necessary, water are added to the emulsion to carry out emulsion polymerization (emulsion polymerization).
- the emulsifier, the polymerization initiator and the like used in the present invention are not particularly limited, and can be appropriately selected and used.
- Examples of the emulsifier used in the present invention include anionic emulsifiers such as alkyl sulfates, alkylbenzene sulfonates, alkylsulfosuccinates, polyoxyethylene alkyl sulfates, polyoxyethylene alkyl phosphates, and polyoxyethylenes.
- anionic emulsifiers such as polyethylene alkyl ethers, polyoxyethylene alkyl phenyl ethers, polyoxyethylene polyoxypropylene block polymers, sorbitan fatty acid esters, and polyoxyethylene fatty acid esters. These emulsifiers may be used alone or in admixture of two or more.
- an emulsifier into which a radical polymerizable functional group (reactive functional group) such as a propenyl group, a allyl group, a (meth) attaloyl group, or a allyl ether group is introduced may be used.
- a radical polymerizable functional group reactive functional group
- Specific examples include those described in JP-A-4-53802, Aqualon HS-10, HS-20, KH-10, BC-05, BC-10, BC-20 ( Daiichi Kogyo Seiyaku Co., Ltd.), Adekaria Soap SE-10N (Asahi Denka Kogyo Co., Ltd.), Latem PD-104 (Kao Co., Ltd.).
- the amount of the emulsifier used is preferably from 0.3 to 10 parts by weight, more preferably from 0.3 to 5 parts by weight, based on 100 parts by weight of the monomer in view of polymerization stability and mechanical stability.
- the water used in the present invention may be blended only at the time of preparing the emulsion, or may be blended further thereafter, and can be appropriately selected according to the polymerization method described later.
- the amount of water is not particularly limited, but the solid content concentration of (meth) acrylic polymer after emulsion polymerization (emulsion polymerization) is 30 to 75% by weight, preferably 35 to 70% by weight. Prepare as follows.
- Examples of the polymerization initiator for emulsion polymerization used in the present invention include 2,2'-azobisisobutyronitrile, 2,2, -azobis (2-amidinopropane) dihydrochloride, 2,2, -azobis [2- ( 5 methyl-2 imidazoline-2-inole) propane] dihydrochloride, 2, 2, 1 Azobis (2-methylpropionamidine) disulfate, 2, 2, 1-azobis (N, N, 1-dimethylene isobutinoreamidine), 2, 2, -azobis [N- (2-force Norebochetinore) 2-methylpropionamidine] hydroxide initiators such as hydrates, persulfates such as potassium persulfate and ammonium persulfate, di (2-ethylhexyl) peroxydicarbonate, di (4 t-butylenocyclohexane) Xinole) peroxydicarbonate, di-sec butinoleperoxyd
- the polymerization initiator may be used alone or as a mixture of two or more thereof.
- the total content is usually 0.001 to 100 parts by weight of the monomer. -0. 1 part by weight, 0.002-0.05
- the method of emulsion polymerization is not particularly limited, and is a batch polymerization method (batch charging method), a continuous dropping method (monomer dropping method, monomer emulsion dropping method), or a polymerization method that combines these methods. It can be appropriately selected from the above.
- a monomer mixture, an emulsifier, and water are charged in a reaction vessel and emulsified by stirring and mixing to prepare emulsion, and then a polymerization initiator and, if necessary, water are added to the reaction vessel.
- emulsion polymerization emulsion polymerization
- a monomer mixture for example, an emulsifier and water are first added and emulsified by stirring and mixing to prepare a dropping solution, and then a polymerization initiator and water are charged into a reaction vessel, and then The dropping solution is dropped into the reaction vessel and emulsion polymerization (emulsion polymerization) is performed.
- additives after emulsion polymerization for example, pH buffering agent, neutralizing agent, foaming Known agents such as inhibitors and stabilizers can be used as appropriate.
- a chain transfer agent may be used in the polymerization.
- chain transfer agents By using these chain transfer agents, the molecular weight of the (meth) acrylic polymer can be adjusted.
- chain transfer agent examples include lauryl mercaptan, glycidyl mercaptan, menolecaptoacetic acid, 2-mercaptoethanol, thioglycolic acid, 2-ethylhexyl thioglycolate, and 2,3-dimercapto 1 propanol. can give.
- chain transfer agents may be used alone or in admixture of two or more, but the total content is 0.01 to 100 parts by weight of the monomer. ⁇ ;! It is preferable to be parts by weight.
- a pressure-sensitive adhesive sheet further excellent in heat resistance and low contamination can be obtained by appropriately crosslinking the (meth) acrylic polymer.
- Specific means of the crosslinking method include, for example, an isocyanate compound, an epoxy compound, a melamine compound, an aziridine compound, a carpositimide compound, a metal chelate compound, and the like, a carboxyl group appropriately included in the (meth) acrylic polymer as a crosslinking base point.
- a so-called crosslinking agent in which a compound having a group capable of reacting with a hydroxyl group, an amino group, an amide group or the like is added and reacted.
- These compounds may be used alone or in admixture of two or more.
- an isocyanate compound and an epoxy compound are particularly preferably used mainly from the viewpoint of obtaining an appropriate cohesive force.
- isocyanate compounds include aromatic isocyanates such as tolylene diisocyanate and xylene diisocyanate, alicyclic isocyanates such as isophorone diisocyanate, and fats such as hexamethylene diisocyanate. Group isocyanate, etc.
- Examples of the isocyanate compound include lower aliphatic polyisocyanates such as butylene diisocyanate and hexamethylene diisocyanate, cyclopentylene diisocyanate, and cyclohexylene diisocyanate.
- Cycloaliphatic isocyanates such as isophorone diisocyanate, 2, 4 tolylene diisocyanate, 4, 4'-diphenylmethane diiso Aromatic diisocyanates such as cyanate and xylylene diisocyanate, trimethylol propane / tolylene diisocyanate trimer adduct (trade name Coronate L), trimethylol propane / hexamethylene diisocyanate trimer Isocyanate adducts such as adducts (trade name Coronate HU, isocyanurate of hexamethylene diisocyanate (trade name Coronate HX) [both of which are manufactured by Nippon Polyurethane Industry Co., Ltd.], and the like.
- the compounds may be used alone or in admixture of two or more.
- Examples of the epoxy compound include N, N, ⁇ , N, 1-tetraglycidyl-1m-xylenediamine (trade name TETRAD-X) and 1,3-bis (N, N-diglycidylaminomethyl) cyclohexane. (Trade name: TETRAD-C) [all of which are manufactured by Mitsubishi Gas Chemical Co., Ltd.]. These compounds may be used alone or in combination of two or more.
- Examples of the melamine compound include hexamethylol melamine.
- Examples of aziridin derivatives include the commercial names HDU, TAZM, TAZO (all manufactured by Mutual Yakuhin Co., Ltd.). These compounds may be used alone or in admixture of two or more.
- water-soluble crosslinking agent examples include epoxy compounds such as polyethylene glycol diglycidyl ether, water-dispersed isocyanate compounds, oxazoline compounds, aziridin compounds, hydrophilized carpositimide compounds, active methylol compounds, active alkoxymethyl compounds, A metal chelate etc. can be mention
- the amount of the crosslinking agent to be used is appropriately selected depending on the balance with the acrylic polymer to be crosslinked, and further depending on the intended use as the pressure-sensitive adhesive sheet. In order to obtain sufficient heat resistance due to the cohesive strength of the acrylic pressure-sensitive adhesive, it is generally preferred that it is contained in an amount of 0.0;! To 15 parts by weight with respect to 100 parts by weight of the acrylic polymer. 5 to 10 parts by weight are more preferable. When the content is less than 0.01 parts by weight, the crosslinking formation by the crosslinking agent becomes insufficient, the cohesive force of the pressure-sensitive adhesive composition becomes small, and sufficient heat resistance may not be obtained. It tends to cause glue residue. On the other hand, the content exceeds 15 parts by weight In this case, the cohesive force of the polymer is large, the fluidity is lowered, the wettability to the adherend is insufficient, and there is a tendency to cause peeling.
- a polyfunctional monomer having two or more radiation-reactive unsaturated bonds may be added and crosslinked by radiation or the like.
- the polyfunctional monomer having two or more radiation-reactive unsaturated bonds one or more that can be crosslinked (cured) by irradiation with radiation such as a bur group, an attalyloyl group, a methacryloyl group, or a burbendyl group, or A polyfunctional monomer component having two or more kinds of radiation reactivity is used. In general, those having 10 or less radiation-reactive unsaturated bonds are preferably used. Two or more polyfunctional monomers can be used in combination.
- polyfunctional monomers include ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 1, 6 Xanthandiol di (meth) acrylate, trimethylol propane tri (meth) acrylate, pentaerythritol nortri (meth) acrylate, dipentaerythritol hex (meth) acrylate, dibutenebenzene, N, N, -methylene Bisatalinoleamide is exemplified.
- the amount of the polyfunctional monomer to be used is appropriately selected depending on the balance with the acrylic polymer to be crosslinked, and further depending on the intended use as the pressure-sensitive adhesive sheet. In order to obtain sufficient heat resistance due to the cohesive strength of the acrylic pressure-sensitive adhesive, it is generally preferable to add 0.;! To 30 parts by weight with respect to 100 parts by weight of the acrylic polymer. From the viewpoint of flexibility and adhesiveness, it is more preferable to add 10 parts by weight or less based on 100 parts by weight of the acrylic polymer.
- UV rays for example, ultraviolet rays, laser rays, a rays, zero rays, tangential rays, X rays, electron rays, and the like can be used.
- Ultraviolet rays are preferable from the viewpoints of controllability and ease of handling, and cost. Used for. More preferably, ultraviolet rays having a wavelength of 200 to 400 nm are used. Ultraviolet rays can be irradiated with an appropriate light source S such as a high-pressure mercury lamp, a microwave excitation lamp, or a chemical lamp.
- any substance that generates radicals or cations when irradiated with ultraviolet rays of an appropriate wavelength can be used.
- a radical photopolymerization initiator any substance that generates radicals or cations when irradiated with ultraviolet rays of an appropriate wavelength can be used.
- Benzoynes such as benzoinethyl ether, benzoin isopropyl ether, ⁇ -methylbenzoin, etc.
- acetophenones such as benzyldimethyl ketal, trichloracetophenone, 2,2-jetoxyacetophenone, 1-hydroxycyclohexyl phenyl ketone, etc.
- photopower thione polymerization initiators include ionium salts such as aromatic diazonium salts, aromatic ododonium salts, and aromatic sulfonium salts, iron allene complexes, titanocene complexes, and arylsilanol aluminum complexes.
- ionium salts such as aromatic diazonium salts, aromatic ododonium salts, and aromatic sulfonium salts, iron allene complexes, titanocene complexes, and arylsilanol aluminum complexes.
- the photopolymerization initiator may be used in combination of two or more.
- the photopolymerization initiator is usually blended in an amount of 0.;! To 10 parts by weight, preferably 0.2 to 7 parts by weight with respect to 100 parts by weight of the acrylic polymer! /.
- a photoinitiated polymerization aid such as amines may be used in combination.
- the photoinitiator include 2-dimethylaminoethylbenzoate, dimethylaminoacetophenone, p-dimethylaminobenzoic acid ethyl ester, p-dimethylaminobenzoic acid isoamyl ester, and the like.
- the above photopolymerization initiation aid can be used in combination of two or more. It is.
- the polymerization initiation assistant is preferably blended in the range of 0.05 to 10 parts by weight, more preferably 0 to 7 parts by weight with respect to 100 parts by weight of the acrylic polymer.
- the pressure-sensitive adhesive composition used in the pressure-sensitive adhesive sheet of the present invention includes various conventionally known tackifiers, surface lubricants, surfactants, leveling agents, antioxidants, corrosion inhibitors, Various conventionally known additives such as light stabilizers, ultraviolet absorbers, polymerization inhibitors, silane coupling agents, inorganic or organic fillers, powders such as metal powders and pigments, particles, and foils are used. It can add suitably according to the use to be used.
- the pressure-sensitive adhesive layer of the present invention is obtained by crosslinking the pressure-sensitive adhesive composition as described above.
- the pressure-sensitive adhesive sheet of the present invention is formed by forming a pressure-sensitive adhesive layer on a base material layer (support film).
- crosslinking of the pressure-sensitive adhesive composition is generally performed after application of the pressure-sensitive adhesive composition, and it is also possible to transfer a pressure-sensitive adhesive layer comprising the pressure-sensitive adhesive composition after crosslinking to a support film or the like. is there.
- the method of forming the pressure-sensitive adhesive layer on the film is not particularly limited.
- the pressure-sensitive adhesive composition is applied to a support film, and the polymerization solvent (organic solvent, water, or aqueous solution) is removed by drying. It is produced by forming an agent layer on a support film. After that, curing may be performed for the purpose of adjusting the component transfer of the adhesive layer or adjusting the crosslinking reaction.
- the composition contains a polymerization solvent and / or a polymerization solvent other than the polymerization solvent so that it can be uniformly applied on the support film. The above solvent may be newly added.
- a known method used for the production of pressure-sensitive adhesive sheets is used. Specific examples include roll coating, gravure coating, reverse coating, roll brushing, spray coating, air knife coating, impregnation and curtain coating, and extrusion coating using a die coater.
- the pressure-sensitive adhesive layer has a thickness of usually 3 to; 100 m, preferably 5 to 50.
- the length is about 11 m, and is in the form of a sheet or tape.
- the pressure-sensitive adhesive sheet of the present invention is preferably used for plastic products and the like that are particularly prone to static electricity.
- polarizing plates used for liquid crystal displays, etc. It is very useful as a surface protective film used for the purpose of protecting the surface of an optical member such as a wave plate, a phase difference plate, an optical compensation film, a reflection sheet, and a brightness enhancement film.
- the molecular weight was measured using a GPC apparatus (HLC-8220GPC, manufactured by Tosoichi Co., Ltd.).
- the measurement conditions are as follows.
- the molecular weight was determined in terms of polystyrene.
- the glass transition temperature Tg (° C) of the obtained (meth) acrylic polymer was obtained by the following formula using the following literature values as the glass transition temperature Tg (° C) of the homopolymer of each monomer.
- Tg (° C) is the glass transition temperature (° C) of the copolymer
- W (one) is the weight fraction of each monomer
- Tg (° C) is the glass transition temperature of the homopolymer of each monomer ( ° C)
- n represents the type of each monomer.
- the melting point (° C) of each resin (polymer) used for the antistatic film was measured using a differential scanning calorimeter (DSC) manufactured by Seiko Denshi Kogyo. As measurement conditions, about 5 mg of a sample was taken, held at 200 ° C for 5 minutes, cooled to 40 ° C at a temperature decrease rate of 10 ° C / min, and then melted at a temperature increase rate of 10 ° C / min. . The peak temperature of the melting curve obtained at this time was determined as the melting point (° C).
- DSC differential scanning calorimeter
- Random polypropylene (Nippon Polypro, Wintech WFX4, melting point: 12) polymerized with a meta-octane catalyst using this resin composition as an antistatic layer 5 ° C) as a base layer, co-extrusion with a T-die (die temperature: 220 ° C) and co-extrusion through a 20 ° C cast roll at a take-up speed of 5m / min. A 50 Hm film was obtained. The surface of the obtained film opposite to the surface of the antistatic layer was subjected to corona discharge treatment to obtain an antistatic film (B).
- T-die die temperature: 220 ° C
- a 50 Hm film was obtained.
- the surface of the obtained film opposite to the surface of the antistatic layer was subjected to corona discharge treatment to obtain an antistatic film (B).
- a film having an antistatic layer of 10 ⁇ m and a base material layer of 50 ⁇ m was obtained at a take-up speed of 5 m / min through a 20 ° C. cast roll.
- the surface of the obtained film opposite to the surface of the antistatic layer was subjected to corona discharge treatment to obtain an antistatic film (C).
- the part was melt-kneaded with a twin-screw extruder (cylinder setting temperature: 220 ° C) and pelletized.
- This resin composition is used as an antistatic layer, and the above-mentioned homopolypropylene (manufactured by Prime Polymer Co., Ltd., ZS1327A, melting point: 162 ° C) is used as a base layer, and two layers are coextruded by a T die (die temperature: 220 ° C). And a film having an antistatic layer of 10 ⁇ m and a base material layer of 50 ⁇ m was obtained at a take-up speed of 5 m / min through a 20 ° C. cast roll. The surface of the obtained film opposite to the surface of the antistatic layer was subjected to edge discharge treatment to obtain an antistatic film (F).
- Random polypropylene (Nippon Polypro Corp., Wintec WFX4, melting point: 125 ° C) polymerized with a meta-catalyst catalyst is used as a base layer and single layer extrusion is performed with a T die (die temperature: 220 ° C).
- a film having a base layer of 60 ⁇ was obtained at a take-up speed of 5 m / min through a 20 ° C. cast roll.
- One side of the obtained film was subjected to corona discharge treatment to obtain an antistatic film (G).
- Non-static film (1) Random polypropylene (Prime Polymer Co., F327, melting point: 138 ° C) polymerized with a catalyst other than meta-mouth is used as a base layer and T-die (die temperature: 220 ° C) is used for single layer extrusion. 20 A film having a base layer of 60 ⁇ was obtained at a take-up speed of 5 m / min through a cast roll at ° C. One side of the obtained film was subjected to corona discharge treatment to obtain an antistatic film (I).
- Single layer extrusion is performed with a T-die (die temperature: 220 ° C) using a homopolypropylene (Prime Polymer Co., Ltd., ⁇ S 1327A, melting point: 162 ° C) polymerized with a catalyst other than meta-mouth sens.
- a film having a base layer of 60 ⁇ was obtained at a take-up speed of 5 m / min through a 20 ° C. cast roll.
- One side of the obtained film was subjected to corona discharge treatment to obtain an antistatic film (J).
- a film having an antistatic layer of 10 Hm and a base material layer of 50 Hm was obtained at a take-up speed of 5 m / min.
- the surface of the resulting film opposite to the surface of the antistatic layer was subjected to corona discharge treatment to obtain an antistatic film (K).
- the mixture was melt kneaded and pelletized with a machine (cylinder setting temperature: 220 ° C).
- This resin composition is used as an antistatic layer, and the above block polypropylene (manufactured by Nippon Polypro Co., Ltd., NEWSTREN SB8000) is used as a base layer, and two layers are coextruded by a T-die (die temperature: 220 ° C), and 20 ° C
- a film having an antistatic layer of 10 ⁇ m and a base material layer of 50 ⁇ m was obtained at a take-up speed of 5 m / min through a cast roll.
- the surface of the obtained film opposite to the surface of the antistatic layer was subjected to corona discharge treatment to obtain an antistatic film (U).
- Antistatic film (M) Antistatic film (M))
- An antistatic polyester film (Mitsubishi Chemical Polyester Film, T1 00G, thickness: 38 m) was used as the antistatic film (N).
- Random polypropylene (Nippon Polypro, Wintech WFX4, melting point: 12) polymerized with a meta-octane catalyst using this resin composition as an antistatic layer 5 ° C) as a base material layer, co-extrusion by T-die (die temperature: 220 ° C) and co-extrusion through a cast roll at 20 ° C, take-up speed of 5m / min, antistatic layer 10 ⁇ m, base A film with a material layer of 50 ⁇ m was obtained. The surface of the obtained film opposite to the surface of the antistatic layer was subjected to corona discharge treatment to obtain an antistatic film (P).
- T-die die temperature: 220 ° C
- co-extrusion through a cast roll at 20 ° C take-up speed of 5m / min
- antistatic layer 10 ⁇ m base A film with a material layer of 50 ⁇ m was obtained.
- the surface of the obtained film opposite to the surface of the antistatic layer was subjected to corona discharge
- This resin composition is used as an antistatic layer, and T-die (die temperature: 220 °) with random polypropylene (Nippon Polypro Co., Ltd., Wintech WFX4, melting point: 125 ° C) polymerized with a meta-octane catalyst as a base layer.
- T-die die temperature: 220 °
- random polypropylene Nippon Polypro Co., Ltd., Wintech WFX4, melting point: 125 ° C
- Two layers were coextruded by C), and a film having an antistatic layer 10 111 and a base layer 50 m was obtained at a take-up speed of 5 m / min through a 20 ° C. cast roll.
- the surface of the obtained film opposite to the surface of the antistatic layer was subjected to corona discharge treatment to obtain an antistatic film (R).
- This resin composition is used as an antistatic layer, and T-die (die temperature: 220 °) with random polypropylene (Nippon Polypro Co., Ltd., Wintech WFX4, melting point: 125 ° C) polymerized with a meta-octane catalyst as a base layer.
- T-die die temperature: 220 °
- random polypropylene Nippon Polypro Co., Ltd., Wintech WFX4, melting point: 125 ° C
- Two layers were coextruded by C), and a film having an antistatic layer 10 111 and a base layer 50 m was obtained at a take-up speed of 5 m / min through a 20 ° C. cast roll.
- the surface opposite to the surface of the antistatic layer of the obtained film was subjected to corona discharge treatment to obtain an antistatic film (S).
- a monomer mixture consisting of 50 parts by weight of 2-ethylhexyl acrylate, 50 parts by weight of n-butyl methacrylate, 2 parts by weight of acrylic acid, 1.5 parts by weight of polyoxyethylene nouryl ether as an emulsifier and polyoxy Emulsify and disperse 1.5 parts by weight of ethylenenoylphenyl ether ammonium sulfate and 80 parts by weight of water.
- This emulsion was charged into a four-necked flask equipped with a thermometer, stirrer, nitrogen gas inlet tube and reflux condenser, and 2, 2'-azobis (2-amidinopropionamidine) dihydride neck chloride was used as a polymerization initiator.
- emulsion polymerization was carried out at 50 ° C for 7 hours. Thereafter, aqueous ammonia and water were added to adjust the solid content to 40% by weight and ⁇ 18.0 to obtain an acrylic polymer (B) aqueous dispersion.
- the particle size of the obtained aqueous dispersion was 0.2 m.
- the acrylic polymer (B) has a solvent-insoluble content of 92%, a solvent-soluble molecular weight of 600,000, and a glass transition temperature (Tg) of -31 ° C. I got it.
- the acrylic polymer (A) solution (40% by weight) is diluted to 20% by weight with ethyl acetate, and isocyanurate of hexamethylene diisocyanate (Coronate HX, manufactured by Nippon Polyurethane Industry Co., Ltd.) is added to 100 parts by weight of this solution.
- isocyanurate of hexamethylene diisocyanate (Coronate HX, manufactured by Nippon Polyurethane Industry Co., Ltd.)
- dibutyltin dilaurate 1% by weight ethyl acetate solution
- Add 0.4 parts by weight and mix and stir at room temperature (25 ° C) for about 1 minute.
- An adhesive solution (1) was prepared.
- the acrylic pressure-sensitive adhesive solution (1) was applied to the silicone-treated surface of a polyethylene terephthalate film (thickness 25 m) that had been siliconized on one side, heated at 110 ° C for 3 minutes, and a thickness of 20 ⁇ The pressure-sensitive adhesive layer was formed. The pressure-sensitive adhesive layer was bonded to the corona-treated surface of the antistatic film ( ⁇ ) produced as described above to produce a pressure-sensitive adhesive sheet.
- An adhesive sheet was prepared in the same manner as in Example 1 except that the antistatic film ( ⁇ ⁇ ) was used in place of the antistatic film ( ⁇ ).
- An adhesive sheet was prepared in the same manner as in Example 1 except that the antistatic film (C) was used in place of the antistatic film ( ⁇ ⁇ ).
- a pressure-sensitive adhesive sheet was produced in the same manner as in Example 1 except that the antistatic film (D) was used in place of the antistatic film ( ⁇ ).
- a pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1.
- a pressure-sensitive adhesive sheet was produced in the same manner as in Example 1 except that the antistatic film (F) was used in place of the antistatic film (A).
- the acrylic polymer (B) aqueous dispersion (40% by weight) was used as it was, and 100 parts by weight of the polymer solid content was added to 4 parts by weight of an oxazoline group-containing water-soluble crosslinking agent (Eppoclos WS500, manufactured by Nippon Shokubai Co., Ltd.) Oxazoline number: 220) was added and mixed and stirred at room temperature (25 ° C) for about 1 minute to prepare an acrylic adhesive aqueous dispersion (2).
- an oxazoline group-containing water-soluble crosslinking agent Eppoclos WS500, manufactured by Nippon Shokubai Co., Ltd.
- the acrylic adhesive aqueous dispersion (2) is applied to the corona-treated surface of the antistatic film (A) prepared as described above, heated at 90 ° C for 3 minutes, and a 5 m thick adhesive layer Formed. Next, an untreated polyethylene film (thickness 60 m) was bonded to the surface of the pressure-sensitive adhesive layer to prepare a pressure-sensitive adhesive sheet.
- a pressure-sensitive adhesive sheet was produced in the same manner as in Example 7 except that the antistatic film (B) was used in place of the antistatic film (A).
- a pressure-sensitive adhesive sheet was produced in the same manner as in Example 7 except that the antistatic film (C) was used in place of the antistatic film (A).
- a pressure-sensitive adhesive sheet was produced in the same manner as in Example 7 except that the antistatic film (D) was used in place of the antistatic film (A). [Example 11]
- a pressure-sensitive adhesive sheet was produced in the same manner as in Example 7 except that the antistatic film (E) was used in place of the antistatic film (A).
- a pressure-sensitive adhesive sheet was produced in the same manner as in Example 7 except that the antistatic film (F) was used in place of the antistatic film (A).
- a pressure-sensitive adhesive sheet was produced in the same manner as in Example 1 except that the antistatic film (O) was used in place of the antistatic film (A).
- a pressure-sensitive adhesive sheet was produced in the same manner as in Example 1 except that the antistatic film (P) was used in place of the antistatic film (A).
- a pressure-sensitive adhesive sheet was produced in the same manner as in Example 1 except that the antistatic film (K) was used in place of the antistatic film (A).
- An adhesive sheet was produced in the same manner as in Example 1 except that an antistatic film (U was used in place of the antistatic film (A).
- a pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that the antistatic film (M) was used in place of the antistatic film (A). [Example 18]
- a pressure-sensitive adhesive sheet was produced in the same manner as in Example 1 except that the antistatic film (Q) was used in place of the antistatic film (A).
- the acrylic pressure-sensitive adhesive solution (1) was applied to a silicone-treated surface of a polyethylene terephthalate film (thickness 25 m) with one side treated with silicone, heated at 110 ° C for 3 minutes to obtain a thickness of 20 ⁇ .
- the pressure-sensitive adhesive layer was formed.
- the pressure-sensitive adhesive layer was bonded to the corona-treated surface of the antistatic film (G) produced as described above to produce a pressure-sensitive adhesive sheet.
- a pressure-sensitive adhesive sheet was produced in the same manner as in Comparative Example 1, except that the non-static film (G) was used in place of the non-static film (G).
- a pressure-sensitive adhesive sheet was produced in the same manner as in Comparative Example 1 except that the antistatic film (I) was used in place of the antistatic film (G).
- a pressure-sensitive adhesive sheet was produced in the same manner as in Comparative Example 1 except that the non-static film (J) was used in place of the non-static film (G).
- the acrylic pressure-sensitive adhesive solution (1) was applied to the silicone-treated surface of a polyethylene terephthalate film (thickness 25 m) that had been siliconized on one side, heated at 110 ° C for 3 minutes, and a thickness of 20 ⁇ The pressure-sensitive adhesive layer was formed. The pressure-sensitive adhesive layer was bonded to the surface opposite to the antistatic surface of the antistatic film ( ⁇ ) prepared as described above, to prepare a pressure-sensitive adhesive sheet.
- a pressure-sensitive adhesive sheet was produced in the same manner as in Comparative Example 1 except that the antistatic film (R) was used in place of the nonstatic film (G).
- a pressure-sensitive adhesive sheet was produced in the same manner as in Comparative Example 1 except that the antistatic film (S) was used in place of the nonstatic film (G).
- the total light transmittance was measured using a haze meter (Murakami Color Research Laboratory, Model HM 150) according to the method specified in JIS K7361 “Testing method for total light transmittance of plastic single transparent material”. .
- the initial surface resistivity is measured according to the method specified in JIS K6911 “General Thermosetting Plastics Test Method” using a measuring instrument (DSM-8103, manufactured by Toa DKK Corporation). ( ⁇ / mouth) was measured. The applied voltage was 500 V, and the value 30 seconds after application was measured. The measurement environment was 23 ° C and relative humidity 50% RH.
- the pressure-sensitive adhesive sheet was immersed in warm water at 40 ° C for 30 minutes, then wiped with waste cloth, and then left for 2 hours in an environment at a temperature of 23 ° C and a relative humidity of 50% RH to obtain a sample for evaluation.
- the above sample was measured according to the method specified in JIS K6911 “General Thermosetting Plastics Test Method”.
- the resistance value ( ⁇ / port) on the surface of the antistatic layer was measured using a measuring instrument (DSM-8103, manufactured by Toa DKK Corporation).
- the applied voltage was 500 V, and the value 30 seconds after application was measured.
- the measurement environment was 23 ° C and relative humidity 50% RH.
- the adhesive sheet is cut to a width of 25 mm and bonded to an acrylic resin plate (Mitsubishi Rayon, “Atarilite L”) at a linear pressure of 78.5 N / cm. After 30 minutes, the tensile speed is 300 mm / minute, and the peel angle is 180 °. The adhesive strength was measured with a tensile tester under the following conditions.
- Example 1 92. 6 2. 1 2. 2. 10 10 0.3
- Example ⁇ Example 5 92. 3. 8.1 9. off 10 9 3 o
- Example ⁇ Example 92. 1.o
- Example ⁇ Example ⁇ Example 10 1. 1 ⁇ Example ”2. ⁇ Example F ⁇ Example 13 1. ⁇ Example ⁇ Example ⁇ Example 91. 10. 10 10 0.o
- Example 18 Comparative example or more Not measured ⁇ Comparative example 1. or more Not measured ⁇ Comparative example 3 92. 6 2.4 1. or more Not measured 3 ⁇ Comparative example above Not measured ⁇ Comparative example 5 90.1 4. Not measured 0.
- Comparative Example 4 ⁇ Comparative Example 91. o From the results of Tables 1 and 2 above, when the pressure-sensitive adhesive sheet prepared according to the present invention was used (Examples 1 to 18), transparency was improved in any of the Examples. It can be seen that it is particularly excellent and has excellent antistatic properties. Furthermore, it can be seen that in any of the examples, the anti-staining function is excellent.
Abstract
Description
Claims
Priority Applications (4)
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CN200780040873.3A CN101535435B (zh) | 2006-12-18 | 2007-12-07 | 粘合片 |
EP07850249.9A EP2093268B1 (en) | 2006-12-18 | 2007-12-07 | Pressure-sensitive adhesive sheet |
KR1020097014391A KR101437709B1 (ko) | 2006-12-18 | 2007-12-07 | 점착 시트 |
US12/519,572 US20100028671A1 (en) | 2006-12-18 | 2007-12-07 | Pressure-sensitive adhesive sheet |
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JP2006-340237 | 2006-12-18 | ||
JP2006340237 | 2006-12-18 |
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PCT/JP2007/073644 WO2008075570A1 (ja) | 2006-12-18 | 2007-12-07 | 粘着シート |
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US (1) | US20100028671A1 (ja) |
EP (1) | EP2093268B1 (ja) |
JP (2) | JP5863157B2 (ja) |
KR (1) | KR101437709B1 (ja) |
CN (1) | CN101535435B (ja) |
TW (1) | TWI479005B (ja) |
WO (1) | WO2008075570A1 (ja) |
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- 2007-12-07 US US12/519,572 patent/US20100028671A1/en not_active Abandoned
- 2007-12-07 EP EP07850249.9A patent/EP2093268B1/en not_active Not-in-force
- 2007-12-07 KR KR1020097014391A patent/KR101437709B1/ko active IP Right Grant
- 2007-12-07 WO PCT/JP2007/073644 patent/WO2008075570A1/ja active Application Filing
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WO2011034045A1 (ja) * | 2009-09-15 | 2011-03-24 | 三井化学東セロ株式会社 | 表面保護フィルム |
CN102470652A (zh) * | 2009-09-15 | 2012-05-23 | 三井化学东赛璐株式会社 | 表面保护膜 |
US20130029146A1 (en) * | 2010-04-20 | 2013-01-31 | Nitto Denko Corporation | Water-dispersible acrylic pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet |
US20130040137A1 (en) * | 2010-04-20 | 2013-02-14 | Nitto Denko Corporation | Water-dispersible acrylic pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet |
US20120263948A1 (en) * | 2011-04-13 | 2012-10-18 | Nitto Denko Corporation | Removable water-dispersible acrylic pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet |
US20140030511A1 (en) * | 2011-04-15 | 2014-01-30 | Nitto Denko Corporation | Pressure-sensitive adhesive sheet |
US20140037911A1 (en) * | 2011-04-15 | 2014-02-06 | Nitto Denko Corporation | Pressure-sensitive adhesive sheet |
US20140037950A1 (en) * | 2011-04-15 | 2014-02-06 | Nitto Denko Corporation | Pressure-sensitive adhesive sheet |
Also Published As
Publication number | Publication date |
---|---|
CN101535435B (zh) | 2015-05-06 |
JP5863157B2 (ja) | 2016-02-16 |
TW200842176A (en) | 2008-11-01 |
EP2093268A4 (en) | 2012-06-13 |
KR101437709B1 (ko) | 2014-09-03 |
JP2013241614A (ja) | 2013-12-05 |
CN101535435A (zh) | 2009-09-16 |
JP5678140B2 (ja) | 2015-02-25 |
EP2093268B1 (en) | 2015-03-25 |
US20100028671A1 (en) | 2010-02-04 |
EP2093268A1 (en) | 2009-08-26 |
JP2008174727A (ja) | 2008-07-31 |
KR20090094029A (ko) | 2009-09-02 |
TWI479005B (zh) | 2015-04-01 |
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