WO2007083668B1 - 高周波回路部品及びこれを用いた通信装置 - Google Patents

高周波回路部品及びこれを用いた通信装置

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Publication number
WO2007083668B1
WO2007083668B1 PCT/JP2007/050607 JP2007050607W WO2007083668B1 WO 2007083668 B1 WO2007083668 B1 WO 2007083668B1 JP 2007050607 W JP2007050607 W JP 2007050607W WO 2007083668 B1 WO2007083668 B1 WO 2007083668B1
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WIPO (PCT)
Prior art keywords
terminal
antenna
communication system
high frequency
circuit component
Prior art date
Application number
PCT/JP2007/050607
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English (en)
French (fr)
Other versions
WO2007083668A1 (ja
Inventor
Kazuhiro Hagiwara
Keisuke Fukamachi
Shigeru Kemmochi
Original Assignee
Hitachi Metals Ltd
Kazuhiro Hagiwara
Keisuke Fukamachi
Shigeru Kemmochi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd, Kazuhiro Hagiwara, Keisuke Fukamachi, Shigeru Kemmochi filed Critical Hitachi Metals Ltd
Priority to US12/161,111 priority Critical patent/US8130787B2/en
Priority to JP2007554923A priority patent/JP5245413B2/ja
Priority to EP07706914.4A priority patent/EP1976133B1/en
Priority to CN2007800091117A priority patent/CN101401317B/zh
Publication of WO2007083668A1 publication Critical patent/WO2007083668A1/ja
Publication of WO2007083668B1 publication Critical patent/WO2007083668B1/ja

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
    • H04B1/0053—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band
    • H04B1/0057—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band using diplexing or multiplexing filters for selecting the desired band
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • H04B1/44—Transmit/receive switching
    • H04B1/48—Transmit/receive switching in circuits for connecting transmitter and receiver to a common transmission path, e.g. by energy of transmitter
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B7/00—Radio transmission systems, i.e. using radiation field
    • H04B7/02—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas
    • H04B7/04—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B7/00—Radio transmission systems, i.e. using radiation field
    • H04B7/02—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas
    • H04B7/04—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas
    • H04B7/08—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas at the receiving station
    • H04B7/0837—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas at the receiving station using pre-detection combining
    • H04B7/0842—Weighted combining
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12032—Schottky diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/141—Analog devices
    • H01L2924/1423—Monolithic Microwave Integrated Circuit [MMIC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/69—Spread spectrum techniques
    • H04B1/713—Spread spectrum techniques using frequency hopping

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Transceivers (AREA)
  • Radio Transmission System (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)

Abstract

　少なくとも第一及び第二のアンテナ端子、第一の通信システム用の少なくとも第一及び第二の送信端子、及び第一の通信システム用の少なくとも第一及び第二の受信端子有し、2つ以上のスイッチ回路及び2つ以上のフィルタ回路を有する高周波回路部品であって、第一の通信システム用の第一の送信端子は第一のアンテナ端子に接続可能であり、第一の通信システム用の第二の送信端子は第二のアンテナ端子に接続可能であり、第一の通信システム用の第一の受信端子は第一のアンテナ端子に接続可能であり、第一の通信システム用の第二の受信端子は第二のアンテナ端子に接続可能である高周波回路部品。

Claims

49 補正書の請求の範囲 [2007年 7月 20日 （20.07.2007) 国際事務局受理]
[1] (補正後） 少なくとも第一及び第二のアンテナ端子と、第一の通信システム用の 少なくとも第一の送信端子及び少なくとも第一及び第二の受信端子と、 1っ以 上のスィツチ回路と、 2つ以上のフィルタ回路とを有する高周波回路部品であ つて、 前記スィッチ回路は、 アンテナ端子と送信端子との間の経路と、 アンテ ナ端子と受信端子との間の経路を切り替えるのに用いられ、前記第一の通信シ ステム用の前記第一の送信端子及び前記第一の受信端子はそれぞれ前記第一 のアンテナ端子に接続可能であり、前記第一の通信システム用の第二の受信端 子は前記第二のアンテナ端子に接続可能であることを特徴とする高周波回路 部品。
[2] 請求項 1に記載の高周波回路部品において、第二の通信システム用の少なく とも第一の送信端子及び少なくとも第一及び第二の受信端子を有し、前記第二 の通信システム用の前記第一の送信端子及び前記第一の受信端子はそれぞれ 前記第一のアンテナ端子に接続可能であり、前記第二の通信システム用の前記 第二の受信端子は前記第二のアンテナ端子に接続可能であることを特徴とす る高周波回路部品。
[3〕 （補正後） 少なくとも第一及び第二のアンテナ端子と、 第一の通信システム用 の少なくとも第一及び第二の送信端子及び少なく とも第一及び第二の受信端 子と、 2つ以上のスィッチ回路と、 2つ以上のフィルタ回路とを有する高周波 回路部品であって、 前記スィッチ回路は、 アンテナ端子と送信端子との間の経 路と、 アンテナ端子と受信端子との間の経路を切り替えるのに用いられ、 前記 第一の通信システム用の前記第一の送信端子及び前記第一の受信端子はそれ ぞれ前記第一のアンテナ端子に接続可能であり、前記第一の通信システム用の 前記第二の送信端子及び前記第二の受信端子はそれぞれ前記第二のアンテナ 端子に接続可能であることを特徴とする高周波回路部品。
[4] 請求項 3に記載の高周波回路部品において、第二の通信システム用の少なく とも第一及び第二の送信端子及び少なくとも第一及び第二の受信端子を有し、 前記第二の通信システム用の前記第一の送信端子及び前記第一の受信端子は それぞれ前記第一のアンテナ端子に接続可能であり、前記第二の通信システム
補正された用紙 （条約第 19条） 50
用の前記第二の送信端子及び前記第二の受信端子はそれぞれ前記第二のアン テナ端子に接続可能であることを特徴とする高周波回路部品。
請求項 3に記載の高周波回路部品において、第三のアンテナ端子と、前記第 一の通信システム用の第三の受信端子とを有し、前記第一の通信システム用の 前記第三の受信端子は前記第三のアンテナ端子に接続可能であることを特徴 とする高周波回
補正された用紙 （条約第 19条)

条約第 19条 (1)に基づく説明書 請求の範囲第 1項に、 「前記スィッチ回路は、 アンテナ端子と送信端子との間の経路 と、 アンテナ端子と受信端子との間の経路を切り替えるのに用いられ、」 を追加し本発 明の特徴をより明確にした。

請求の範囲第 3項に、 「前記スィッチ回路は、 アンテナ端子と送信端子との間の経路 と、 アンテナ端子と受信端子との間の経路を切り替えるのに用いられ、」 を追加し本発 明の特徴をより明確にした。

PCT/JP2007/050607 2006-01-17 2007-01-17 高周波回路部品及びこれを用いた通信装置 WO2007083668A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US12/161,111 US8130787B2 (en) 2006-01-17 2007-01-17 High-frequency circuit device, and communications apparatus comprising same
JP2007554923A JP5245413B2 (ja) 2006-01-17 2007-01-17 高周波回路部品及びこれを用いた通信装置
EP07706914.4A EP1976133B1 (en) 2006-01-17 2007-01-17 High frequency circuit component and communication apparatus using such high frequency circuit component
CN2007800091117A CN101401317B (zh) 2006-01-17 2007-01-17 高频电路部件及利用了该高频电路部件的通信装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006008343 2006-01-17
JP2006-008343 2006-01-17
JP2006202392 2006-07-25
JP2006-202392 2006-07-25

Publications (2)

Publication Number Publication Date
WO2007083668A1 WO2007083668A1 (ja) 2007-07-26
WO2007083668B1 true WO2007083668B1 (ja) 2007-11-08

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US (1) US8130787B2 (ja)
EP (1) EP1976133B1 (ja)
JP (3) JP5245413B2 (ja)
CN (1) CN101401317B (ja)
TW (1) TWI452851B (ja)
WO (1) WO2007083668A1 (ja)

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