WO2005056673A1 - 積層セラミック電子部品のスペーサ層用の誘電体ペースト - Google Patents
積層セラミック電子部品のスペーサ層用の誘電体ペースト Download PDFInfo
- Publication number
- WO2005056673A1 WO2005056673A1 PCT/JP2004/018627 JP2004018627W WO2005056673A1 WO 2005056673 A1 WO2005056673 A1 WO 2005056673A1 JP 2004018627 W JP2004018627 W JP 2004018627W WO 2005056673 A1 WO2005056673 A1 WO 2005056673A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ceramic green
- layer
- green sheet
- spacer layer
- weight
- Prior art date
Links
- 125000006850 spacer group Chemical group 0.000 title claims abstract description 161
- 239000000919 ceramic Substances 0.000 title abstract description 262
- 239000011230 binding agent Substances 0.000 claims abstract description 104
- 239000002904 solvent Substances 0.000 claims abstract description 96
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 claims description 40
- 238000006116 polymerization reaction Methods 0.000 claims description 35
- 229920005989 resin Polymers 0.000 claims description 31
- 239000011347 resin Substances 0.000 claims description 31
- NDTYTMIUWGWIMO-UHFFFAOYSA-N perillyl alcohol Chemical compound CC(=C)C1CCC(CO)=CC1 NDTYTMIUWGWIMO-UHFFFAOYSA-N 0.000 claims description 18
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 15
- TVVCWNIIRNPMOG-UHFFFAOYSA-N [2-hydroxy-2-(2-methoxyethoxy)cyclohexyl] acetate Chemical compound C(C)(=O)OC1C(CCCC1)(O)OCCOC TVVCWNIIRNPMOG-UHFFFAOYSA-N 0.000 claims 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 abstract description 13
- FFUIZMWDKURYNB-UHFFFAOYSA-N [2-acetyloxy-2-(2-methoxyethoxy)cyclohexyl] acetate Chemical compound C(C)(=O)OC1(C(CCCC1)OC(C)=O)OCCOC FFUIZMWDKURYNB-UHFFFAOYSA-N 0.000 abstract description 7
- 230000007547 defect Effects 0.000 abstract description 6
- KRCZYMFUWVJCLI-GUBZILKMSA-N (+)-dihydrocarveol Chemical compound C[C@H]1CC[C@H](C(C)=C)C[C@@H]1O KRCZYMFUWVJCLI-GUBZILKMSA-N 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 373
- 239000012790 adhesive layer Substances 0.000 description 77
- 239000003985 ceramic capacitor Substances 0.000 description 60
- 239000002002 slurry Substances 0.000 description 29
- 230000037303 wrinkles Effects 0.000 description 28
- 239000004020 conductor Substances 0.000 description 27
- 238000007639 printing Methods 0.000 description 26
- 239000000654 additive Substances 0.000 description 25
- 229920001577 copolymer Polymers 0.000 description 23
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 22
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 22
- 239000004925 Acrylic resin Substances 0.000 description 21
- 229920000178 Acrylic resin Polymers 0.000 description 21
- 239000002253 acid Substances 0.000 description 21
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 21
- -1 polyethylene terephthalate Polymers 0.000 description 19
- 239000000843 powder Substances 0.000 description 19
- 238000004519 manufacturing process Methods 0.000 description 17
- 239000003989 dielectric material Substances 0.000 description 16
- 230000000996 additive effect Effects 0.000 description 14
- 238000010030 laminating Methods 0.000 description 14
- 239000000203 mixture Substances 0.000 description 14
- 239000004014 plasticizer Substances 0.000 description 13
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 12
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 229920000139 polyethylene terephthalate Polymers 0.000 description 12
- 239000005020 polyethylene terephthalate Substances 0.000 description 12
- 239000002245 particle Substances 0.000 description 11
- 230000008569 process Effects 0.000 description 11
- 239000002270 dispersing agent Substances 0.000 description 10
- 239000003350 kerosene Substances 0.000 description 10
- 239000002202 Polyethylene glycol Substances 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 9
- 229920001223 polyethylene glycol Polymers 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 8
- 238000010304 firing Methods 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- 229930007631 (-)-perillyl alcohol Natural products 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 230000000295 complement effect Effects 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- 235000005693 perillyl alcohol Nutrition 0.000 description 7
- 239000011800 void material Substances 0.000 description 7
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 6
- 238000000137 annealing Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- 239000004698 Polyethylene Substances 0.000 description 5
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000012046 mixed solvent Substances 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 229920000573 polyethylene Polymers 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- 229940116411 terpineol Drugs 0.000 description 5
- 239000004215 Carbon black (E152) Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 230000032798 delamination Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000007646 gravure printing Methods 0.000 description 4
- 229930195733 hydrocarbon Natural products 0.000 description 4
- 150000002430 hydrocarbons Chemical class 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 229910019142 PO4 Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 235000011037 adipic acid Nutrition 0.000 description 3
- 239000001361 adipic acid Substances 0.000 description 3
- 239000011324 bead Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000002334 glycols Chemical class 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- AOGQPLXWSUTHQB-UHFFFAOYSA-N hexyl acetate Chemical compound CCCCCCOC(C)=O AOGQPLXWSUTHQB-UHFFFAOYSA-N 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 235000021317 phosphate Nutrition 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 2
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- VGOMXEONICCZSH-UHFFFAOYSA-N [1-(2-methoxyethoxy)cyclohexyl] acetate Chemical compound C(C)(=O)OC1(CCCCC1)OCCOC VGOMXEONICCZSH-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 235000013527 bean curd Nutrition 0.000 description 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 150000004679 hydroxides Chemical class 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 150000002823 nitrates Chemical class 0.000 description 2
- 150000002902 organometallic compounds Chemical class 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- 150000003505 terpenes Chemical class 0.000 description 2
- 235000007586 terpenes Nutrition 0.000 description 2
- WTXBCFKGCNWPLS-UHFFFAOYSA-N (4-prop-1-en-2-yl-1-cyclohexenyl)methyl acetate Chemical compound CC(=O)OCC1=CCC(C(C)=C)CC1 WTXBCFKGCNWPLS-UHFFFAOYSA-N 0.000 description 1
- OLRVZJLTENHULQ-UHFFFAOYSA-N 1-chlorohexyl acetate Chemical compound CCCCCC(Cl)OC(C)=O OLRVZJLTENHULQ-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical group CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 1
- HOQFGKXDFVZXKE-UHFFFAOYSA-N C(C)(=O)OC1(C(CCCC1)OCC)OCCOC Chemical compound C(C)(=O)OC1(C(CCCC1)OCC)OCCOC HOQFGKXDFVZXKE-UHFFFAOYSA-N 0.000 description 1
- 229910000807 Ga alloy Inorganic materials 0.000 description 1
- 235000010469 Glycine max Nutrition 0.000 description 1
- 244000068988 Glycine max Species 0.000 description 1
- 241001082241 Lythrum hyssopifolia Species 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- SCFQUKBBGYTJNC-UHFFFAOYSA-N heptyl prop-2-enoate Chemical compound CCCCCCCOC(=O)C=C SCFQUKBBGYTJNC-UHFFFAOYSA-N 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- MTNDZQHUAFNZQY-UHFFFAOYSA-N imidazoline Chemical compound C1CN=CN1 MTNDZQHUAFNZQY-UHFFFAOYSA-N 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 235000014347 soups Nutrition 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
- C08L29/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D129/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Coating compositions based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Coating compositions based on derivatives of such polymers
- C09D129/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Definitions
- the present invention relates to a dielectric paste for a spacer layer of a multilayer ceramic electronic component, and more particularly, to dissolving a binder contained in a layer adjacent to the spacer layer.
- the present invention relates to a dielectric paste for a spacer layer of a multilayer ceramic electronic component, which can effectively prevent a multilayer ceramic electronic component from becoming defective.
- a ceramic powder In order to manufacture a multilayer ceramic electronic component represented by a multilayer ceramic capacitor, first, a ceramic powder, a binder such as an acrylic resin and a petital resin, and phthalenolates, glycols, adipic acid, and phosphates are used. Is mixed with an organic solvent such as toluene, methyl ethyl ketone, and acetone to prepare a dielectric paste for a ceramic green sheet.
- a binder such as an acrylic resin and a petital resin
- phthalenolates glycols, adipic acid, and phosphates
- the dielectric paste is applied on a support sheet formed of polyethylene terephthalate (PET), polypropylene (PP), or the like using an etastrusion coater or a gravure coater, and heated. Then, the coating film is dried to produce a ceramic green sheet.
- PET polyethylene terephthalate
- PP polypropylene
- a conductive powder such as nickel paste and a binder are dissolved in a solvent such as terpionaire to prepare a conductive paste, and the conductive paste is placed on a ceramic green sheet by a screen printing machine or the like. Printing and drying are performed in a predetermined pattern to form an electrode layer.
- the ceramic green sheet on which the electrode layer is formed is placed on a support sheet. By peeling off, a laminate unit including the ceramic green sheet and the electrode layer is formed, a desired number of laminate units are laminated, and the laminate is pressed. Make a chip.
- the binder is removed from the green chip, the green chip is fired, and external electrodes are formed, whereby a multilayer ceramic electronic component such as a multilayer ceramic capacitor is manufactured.
- the electrode layers are formed in a predetermined pattern on the surface of the ceramic green sheet, the electrode layers on the surface of each ceramic green sheet are formed.
- a step is formed between the region and the region where the electrode layer is not formed, and therefore, it is required to laminate a large number of laminate units each including the ceramic green sheet and the electrode layer.
- it becomes difficult to bond the ceramic green sheets included in the multiple laminated units as desired, and the laminated body in which the multiple laminated units are laminated may be deformed.
- a dielectric paste is printed on the surface of the ceramic green sheet in a pattern opposite to the pattern of the electrode layer, and a spacer layer is formed between adjacent electrode layers.
- a method for eliminating a step on the surface of each ceramic green sheet has been proposed.
- the surface of the ceramic green sheet between the adjacent electrode layers is printed by printing.
- each of the laminate units includes a large number of laminates including a ceramic Darline sheet and an electrode layer.
- the laminated ceramic capacitors are manufactured by laminating the ceramic units, the ceramic green sheets included in a large number of the laminated units can be bonded as desired, and each of the ceramic green sheets can be laminated.
- a binder for ceramic green sheets a solvent for a dielectric paste for forming a spacer layer on a ceramic green sheet using an atalylic resin widely used as a binder is used.
- the prepared dielectric paste is printed by using the most commonly used tarpionell to form the spacer layer
- the ceramic green is formed by the tarpionell in the dielectric paste.
- the binder of the sheet is melted, and the ceramic green sheet swells or partially melts to form a void at the interface between the ceramic green sheet and the spacer layer, or the gap between the ceramic layer and the spacer layer.
- a hydrocarbon solvent such as kerosene or decane
- a hydrocarbon solvent such as kerosene or decane is used for a dielectric paste. Since the binder component used does not dissolve, it is not possible to completely replace the conventionally used solvent such as terpionate with a hydrocarbon-based solvent such as kerosene or decane. However, since it has a certain degree of solubility in the acrylic resin that is the binder of the ceramic green sheet, if the thickness of the ceramic green sheet is extremely thin, pinholes and cracks will form in the ceramic green sheet.
- Japanese Patent Application Laid-Open Nos. 5-325633, 7-21833, and 7-21832 disclose hydrogenation catalysts such as dihydrota-pioneol instead of terpioneol.
- Terpene solvents such as dihydrota-pioneer acetate and dihydrota-pioneol acetate have been proposed, but terpene-based solvents such as hydrogenated terpioneer such as dihydrota-pioneol and dihydroterpionate acetate still remain as binders for ceramic green sheets. Since it has a certain degree of solubility in certain acrylic resins, it prevents pinhole cracks in ceramic green sheets when the thickness of the ceramic green sheets is extremely small. There was a problem that it was difficult.
- the present invention effectively prevents the multilayer ceramic electronic component from having a problem in dissolving the binder contained in the layer adjacent to the spacer layer of the multilayer ceramic electronic component, thereby preventing a problem from occurring. It is an object of the present invention to provide a dielectric paste for a spacer layer of a laminated ceramic electronic component that can be used.
- the inventor of the present invention has conducted intensive studies in order to achieve the object of the present invention.
- a binder a petyral-based resin was used, and as a solvent, dihydrota-pieroxyethanol and terpinyloxy were used.
- the solvent for the spacer layer is formed using at least one solvent selected from the group consisting of ethanol, d-dihydrocarbeol, I-citroneol, I-perylyl alcohol, and aceto-methoxymethoxycyclohexanol acetate.
- the binder can be dissolved in a solvent, and the dielectric paste is printed on a ceramic green sheet using an acryl resin as a binder.
- the present invention is based on such findings, and the above-mentioned object of the present invention includes a butyral-based resin as a binder, and comprises dihydrota-pieroxyethanol, terpininoleoxyethanol, and d-dihydrocarbeol. , I-citroneol, I-perillyl alcohol and acetomethoxymethoxycyclohexanol acetate This is achieved by a dielectric paste for the spacer layer, characterized in that it contains at least one solvent selected.
- the dielectric paste for the spacer layer is prepared by kneading a dielectric material (ceramic powder) and an organic vehicle in which a petital-based resin is dissolved in a solvent.
- the degree of polymerization of the butyral-based resin contained in the dielectric paste for the spacer layer is preferably 1400 or more and 2600 or less as the binder, and the polymerization degree is preferably 1400 or more and 2600 or less.
- the dielectric paste for the spacer layer is preferably about 4 parts by weight to about 15 parts by weight, particularly preferably about 4 parts by weight to about 15 parts by weight, based on 100 parts by weight of the dielectric material powder.
- 10 parts by weight of a petyral resin preferably about 40 parts by weight to about 250 parts by weight, more preferably about 60 parts by weight to about 140 parts by weight, particularly preferably about 70 parts by weight to about 120 parts by weight.
- the dielectric paste for the spacer layer contains, as optional components, a plasticizer and a release agent in addition to the powder of the dielectric material and the butyral-based resin.
- the release agent contained in the dielectric paste for the spacer layer is not particularly limited, and examples thereof include paraffin, wax, and silicone oil.
- the dielectric paste for the spacer layer is about 0 parts by weight to about 100 parts by weight, preferably about 2 parts by weight to about 50 parts by weight, more preferably about 5 parts by weight, based on 100 parts by weight of the petyral resin. Add about 20 parts by weight of release agent.
- the electrode layer and the spacer layer are separated from each other by a separate supporting sheet. It has been found by the present inventors that it is desirable to adhere to the surface of the ceramic green sheet via an adhesive layer after being formed on the substrate and drying it.
- the spacer layer is formed on another support sheet, the same binder as that of the ceramic green sheet is applied to the surface of the support sheet so that the support sheet can be easily separated from the electrode layer and the spacer layer.
- the dielectric paste for the spacer layer contains a butyral-based resin as a binder, and includes dihydrota-pinyloxyethanol, terpinyloxyethanol, d-dihydrocarbeol, I-citroneol, A group consisting of I-perillyl alcohol and acetoxy-methoxyethoxy-cyclohexanol acetate. It contains at least one solvent selected from the group consisting of dihydrota-pinyloxyethanol, terpininoleoxyethanol, and d-dihydrocarbene.
- Solvents that can be selected from the group consisting of all, I-citroneol, I-perillyl alcohol, and acetoxy-methoxyethoxy-cyclohexanol acetate almost dissolve the acrylic resin contained in ceramic green sheets as an indica. I Therefore, when a release layer containing the same binder as the ceramic green sheet is formed and a dielectric layer is printed on the release layer to form a spacer layer, the release layer swells or is partially removed. It can be effectively dissolved to form voids at the interface between the release layer and the spacer layer, or to effectively prevent cracks and wrinkles from forming on the surface of the spacer layer. This makes it possible to effectively prevent the multilayer ceramic electronic component from being defective.
- a dielectric paste for a ceramic green sheet containing an acrylic resin as a binder is prepared, and the paste is prepared by using an etastrusion coater or a wire bar coater. Applied on a long support sheet, It is formed.
- a dielectric paste for forming a ceramic green sheet is usually prepared by kneading a dielectric material (ceramic powder) and an organic vehicle in which an acrylic resin is dissolved in an organic solvent.
- the weight average molecular weight of the acrylic resin is preferably 250,000 or more and 500,000 or less.
- the acid value of the acrylic resin is preferably 5 mgKOHZg or more and 10 mgKgH / g or less.
- a dielectric paste for a ceramic green sheet having a desired viscosity can be prepared.
- the dispersibility of the dielectric paste can be improved.
- the organic solvent used for the organic vehicle is not particularly limited, and an organic solvent such as butyl carbitol, acetone, toluene, and ethyl acetate is used.
- the dielectric material is appropriately selected from composite oxides and various compounds that become oxides, for example, carbonates, nitrates, hydroxides, organometallic compounds, and the like. S can.
- the dielectric material is usually used as a powder having an average particle size of about 0.1 ⁇ to about 3 ⁇ . Preferably, the particle size of the dielectric material is smaller than the thickness of the ceramic green sheet.
- the content of each component in the dielectric paste is not particularly limited. For example, about 2.5 parts by weight to about 10 parts by weight of an acrylic resin with respect to 100 parts by weight of a dielectric material,
- the dielectric paste can be prepared to include about 50 parts to about 300 parts by weight of the organic solvent.
- the dielectric paste may contain additives such as various dispersants, plasticizers, charge aids, release agents, and wetting agents, if necessary.
- additives such as various dispersants, plasticizers, charge aids, release agents, and wetting agents.
- the total content is desirably less than about 20 parts by weight.
- the support sheet to which the dielectric paste is applied for example, polyethylene terephthalate film or the like is used, and in order to improve the releasability, the surface thereof is coated with a silicone resin, phenolic resin, or the like. Let's do it. [0038] Next, the coating film is dried at a temperature of, for example, about 50 ° C to about 100 ° C for about 1 minute to about 20 minutes to form a ceramic green sheet on the support sheet. .
- the thickness of the ceramic green sheet after drying is preferably 3 ⁇ m or less, more preferably 1.5 ⁇ m or less.
- a conductive paste for an electrode layer is printed in a predetermined pattern on a ceramic green sheet formed on the surface of the long support sheet using a screen printing machine or a gravure printing machine. Thus, an electrode layer is formed.
- the electrode layer is preferably formed to a thickness of about 0.1 x m to about 1 x m after drying, and more preferably from about 0.1 x m to about 1.5 x m.
- the conductive paste for the electrode layer includes a conductive material made of various conductive metals and alloys, and various oxides and organic metal compounds that become conductive materials made of various conductive metals and alloys after firing. Alternatively, it is prepared by kneading a resinate or the like and an organic vehicle in which a butyral-based resin is dissolved in a solvent.
- the conductive paste contains a butyral-based resin as a binder, and includes dihydrota-pinyloxyethanol, terpinyloxyethanol, d-dihydroforce norebeol, I-citrononeol, and I perillyl. It contains at least one solvent selected from the group consisting of alcohol and acetomethoxymethoxyethoxycyclohexanol acetate.
- the solvent selected from the group consisting of dihydrota-pinyloxyethanol, terpinyloxyethanol, d-dihydrocarbeol, I-citroneol, I perillyl alcohol, and acetomethoxymethoxyethoxycyclohexanol acetate is ceramic green. Since the acrylic resin contained as a binder in the sheet hardly dissolves, even when the conductive paste is printed on an extremely thin ceramic green sheet to form an electrode layer, the solvent contained in the conductive paste is also used. Thus, the binder contained in the ceramic green sheet can be effectively prevented from being dissolved, and therefore, even when the thickness of the ceramic green sheet is extremely small, the ceramic green sheet has pinholes and the like. Kula It is possible to effectively prevent the occurrence of a lock.
- the degree of polymerization of the butyral resin contained in the conductor paste is 1400 or more and 2600 or less. It is preferable that the butyral-based resin has a degree of butyralization of 64 mol% or more and 78 mol% or less.
- the conductive material used for producing the conductive paste Ni, a Ni alloy, or a mixture thereof is preferably used.
- the shape of the conductive material is not particularly limited, and may be spherical, scaly, or a mixture of these shapes.
- the average particle size of the conductive material is not particularly limited, it is generally about 0.1 ⁇ m, preferably 2 ⁇ m, preferably 0.2 ⁇ m.
- the conductive S material layer has a thickness of about 1 ⁇ m.
- the conductive paste preferably contains about 2.5 parts by weight and about 20 parts by weight of a binder with respect to 100 parts by weight of the conductive material.
- the content of the solvent is preferably about 40% by weight to about 40% by weight based on the entire conductive paste.
- the conductor paste preferably contains a plasticizer.
- the plasticizer contained in the conductor paste is not particularly limited, and examples thereof include phthalate, adipic acid, phosphate, and glycols.
- the conductor paste preferably contains about 10 parts by weight to about 300 parts by weight, more preferably about 10 parts by weight to about 200 parts by weight, based on 100 parts by weight of the binder. If the amount of the plasticizer is too large, the strength of the electrode layer tends to be significantly reduced, which is not preferable.
- the spacer layer on the surface of the ceramic green sheet with a pattern complementary to the pattern of the electrode layer, the surface of the electrode layer and the ceramic without the electrode layer are formed.
- a step can be prevented from forming between the surface of the green sheet and a multilayer ceramic capacitor manufactured by stacking a number of multilayer units each including a ceramic green sheet and an electrode layer. It is possible to effectively prevent the multilayer electronic component from being deformed, and to effectively prevent the occurrence of delamination.
- the dielectric paste for the spacer layer is prepared in the same manner as the dielectric paste for the ceramic green sheet, except that a different binder and a different solvent are used.
- the degree of polymerization of the butyral-based resin contained in the dielectric paste for forming the spacer layer is preferably 1400 or more and 2600 or less, and the degree of butyralization of the butyral-based resin is preferably 64 mol% or more. It is preferably at most 78 mol%.
- the electrode layer and the spacer layer are dried to produce a laminated unit in which the ceramic Darrieen sheet, the electrode layer, and the spacer layer are laminated on the support sheet.
- a support sheet is peeled from a ceramic Darline sheet of a multilayer unit, cut into a predetermined size, and a predetermined number of the multilayer units are stacked on the outer layer of the multilayer ceramic capacitor. Stacked on top of each other, The other outer layer is laminated on the sheet, and the obtained laminate is press-molded and cut into a predetermined size to produce a large number of ceramic green chips.
- the ceramic green chip thus produced is placed in a reducing gas atmosphere, the binder is removed, and the chip is fired.
- each of the multilayer units including the ceramic green sheet and the electrode layer is formed by stacking the stacked units. It is possible to effectively prevent the deformation of laminated electronic components such as ceramic capacitors and to prevent the occurrence of delamination.
- a petyral-based resin is contained as a binder on a ceramic line sheet containing an acrylic resin, and dihydrota-pinyloxyethanol, terpinyloxyethanol, and d-dihydrocarboeol are used.
- a spacer layer comprising dihydrota-pinyloxyethanol, terpinyloxyethanol, d-dihydroforce olebeol, I-citroneol, I perillyl alcohol and acetoxy-methoxy ethoxylate.
- Air gaps at the interface with the spacer layer or cracks and wrinkles on the surface of the spacer layer can be reliably prevented. Therefore, by laminating a large number of laminate units including ceramic green sheets and electrode layers, it is possible to reliably prevent voids from being generated in the produced multilayer ceramic capacitor, and to form a spacer layer. Partial force S of cracks and wrinkles generated on the surface, laminated unit is laminated, and in the process of manufacturing a laminated body, it is missing and mixed as foreign matter in the laminated body, causing internal defects in the laminated ceramic capacitor It can be surely prevented from being performed.
- a petyral-based resin is contained as a binder on a ceramic daline sheet containing an acrylic resin, and dihydroterpinyloxetetano mono, terpinyloxyethanol,
- Electrode layer comprising dihydroterpinyloxetanol, terpinyloxyethanol, d-dihydrocarboeol, I-citrononeol, I-perillyl alcohol and acetomethoxymethoxyethoxy.
- the solvent contained in the paste can effectively prevent the binder contained in the ceramic green sheet from being dissolved, and therefore, even when the thickness of the ceramic green sheet is extremely small, It is possible to effectively prevent the occurrence of pinholes and cracks in the green sheet, and to effectively prevent the multilayer ceramic electronic component from being short-circuited.
- a second support sheet different from the long support sheet used to form the ceramic green sheet is provided, and the second long support sheet is provided.
- a dielectric paste containing particles of a dielectric material having substantially the same composition as the dielectric material contained in the ceramic green sheet, and a binder identical to the binder contained in the ceramic green sheet, on the surface of the support sheet described above. Is applied and dried using a wire bar coater or the like to form a release layer.
- the second support sheet for example, a polyethylene terephthalate film or the like is used, and in order to improve the releasability, a silicone resin, an alkyd resin or the like is coated on the surface thereof.
- the thickness of the release layer is preferably not more than the thickness of the electrode layer, more preferably not more than about 60% of the thickness of the electrode layer, and more preferably not more than about 30% of the thickness of the electrode layer. It is as follows.
- the conductive paste for the electrode layer prepared in the same manner as described above is applied onto the surface of the release layer by using a screen printing machine, a gravure printing machine, or the like. It is printed in a predetermined pattern and dried to form an electrode layer.
- the electrode layer is preferably formed to a thickness of about 0.1 ⁇ m to about 5 ⁇ m, more preferably, to a thickness of 1.5 x 1.5 mm. is there.
- the conductive paste contains a butyral-based resin as a binder, and contains dihydrota-pinyloxyethanol, terpinyloxyethanol, d-dihydrocarbeol, I-citrononeol, I-perillyl alcohol, and acetoxy. It contains at least one solvent selected from the group consisting of methoxyethoxycyclohexanol acetate.
- the degree of polymerization of the butyral resin contained in the conductor paste is preferably 1400 or more and 2600 or less, and the butyral degree of the butyral resin is preferably 64 mol% or more and 78 mol% or less. .
- the electrode layer Prior to formation of the electrode layer, or after forming the electrode layer and drying, it contains a butyral-based resin as a binder, and comprises dihydrota-pinyloxyethanol and terpinyl- It contains at least one solvent selected from the group consisting of xyethanol, d-dihydrocarbeol, I-citroneol, I perillyl alcohol and acetomethoxymethoxycyclohexanol acetate, and is prepared in the same manner as described above.
- the dielectric paste for the spacer layer is printed on the surface of the second support sheet using a screen printing machine or a gravure printing machine in a pattern complementary to the pattern of the electrode layer. A spacer layer is formed.
- the spacer layer on the surface of the ceramic green sheet with a pattern complementary to the pattern of the electrode layer, the surface of the electrode layer and the ceramic without the electrode layer are formed.
- a step can be prevented from forming between the surface of the green sheet and a multilayer ceramic capacitor manufactured by stacking a number of multilayer units each including a ceramic green sheet and an electrode layer. It is possible to effectively prevent the multilayer electronic component from being deformed, and to effectively prevent the occurrence of delamination.
- the solvent selected from the group consisting of anol acetate hardly dissolves the acrylic resin contained in the ceramic green sheet as a binder, it forms a release layer containing the same binder as the ceramic green sheet and forms a dielectric layer on the release layer. Even when the body paste is printed to form the spacer layer, the release layer swells, and some are partially dissolved to form voids at the interface between the release layer and the spacer layer. Alternatively, it is possible to effectively prevent generation of cracks and wrinkles on the surface of the spacer layer.
- the butyral-based resin contained in the dielectric paste for forming the spacer layer preferably has a degree of polymerization of 1400 or more and 2600 or less, and the degree of butyralization of the butyral-based resin is preferably 64 mol% or more. It is preferably at most 78 mol%.
- a long third support sheet is prepared, and the adhesive solution is applied to the surface of the third support sheet by a bar coater, an extension coating coater, a reverse coater, a dip coater, a kiss coater, or the like. And dried to form an adhesive layer.
- the adhesive solution is a dielectric base for forming a ceramic green sheet.
- a dielectric material having substantially the same composition as the binder of the binder contained in the strike and having substantially the same composition as the particles of the dielectric material contained in the ceramic green sheet, and having a particle size equal to or less than the thickness of the adhesive layer , A plasticizer, an antistatic agent, and a release agent.
- the adhesive layer formed on the long third support sheet is formed on the electrode layer and the spacer layer or the support sheet formed on the long second support sheet.
- the third support sheet is adhered to the surface of the formed ceramic green sheet, and after adhesion, the third support sheet is peeled off from the adhesive layer, and the adhesive layer is transferred.
- the adhesive layer was transferred to the surface of the ceramic green sheet of the laminate unit thus obtained in the same manner as the adhesive layer was transferred to the surface of the electrode layer and the spacer layer.
- the laminate unit to which the adhesive layer has been transferred is cut into a predetermined size.
- the second support sheet is peeled off by the release layer force, and the laminate unit is laminated on the support.
- a new laminate unit is positioned such that the adhesive layer formed on the surface thereof is in contact with the surface of the ceramic green sheet of the laminate unit laminated on the support.
- a new laminate unit is laminated via an adhesive layer on the ceramic green sheet of the laminate unit that is pressed and laminated on the support, and then the support sheet is formed from the ceramic of the new laminate unit. Is peeled off.
- the electrode layer and the spacer layer formed on the second support sheet adhere to the surface of the ceramic green sheet via the adhesive layer.
- a conductive paste is printed on the surface of the ceramic green sheet to form an electrode layer
- a dielectric paste is printed on the surface of the ceramic green sheet to form a conductive layer.
- the electrode layer and the spacer layer can be laminated on the ceramic green sheet as desired, so that the body paste and the dielectric paste do not soak into the ceramic green sheet.
- the composition contains a butyral-based resin as a binder, and comprises dihydrota-pinyloxyethanol, terpinyloxyethanol, d-dihydrocarboeol, I-citroneol, 1_perillyl alcohol, and acetoxyl -Methoxyethoxy-cyclohexanol acetate is used to form an electrode layer using a conductor base containing at least one solvent selected from the group consisting of dihydrota-pinoxy alcohol, terpinoxy ethanol, d -Solvents selected from the group consisting of dihydrocarbeol, I-citroneol, I-perillyl alcohol and aceethoxy-methoxyethoxy-cyclohexanol acetate are used to remove the acrylic resin contained in ceramic green sheets as an indica.
- a butyral-based resin as a binder, and comprises dihydrota-pinyloxyethanol, terpinyloxyethanol,
- a laminated unit set in which a predetermined number of laminated units are laminated is produced, and further, a third surface of the ceramic line sheet positioned on the surface of the laminated unit set is placed on the third surface. After the adhesive layer formed on the support sheet is transferred, the laminate is cut into a predetermined size to produce a laminate block.
- the adhesive layer is transferred to the surface of the ceramic green sheet, the ceramic green sheet, the adhesive layer, the electrode layer, the spacer layer, and the release layer are formed on the long support sheet.
- the laminated unit is cut into an adhesive layer that is not cut, and is formed on the long second support sheet.
- the release layer, the electrode layer and the spacer layer, the adhesive layer, and the ceramic green sheet are laminated, the ceramic green sheets of the formed laminate unit are bonded, and the second support sheet is released from the release layer.
- two laminate units are laminated on the long support sheet.
- a laminate unit set including a predetermined number of laminate units is formed by sequentially laminating the laminate units on the long second support sheet or the support sheet. After that, the laminate unit set is cut into a predetermined size to create a laminate block, so the laminate units cut into the predetermined size are laminated one by one, Compared with the case of manufacturing a laminate block, it is possible to greatly improve the production efficiency of the laminate block.
- the release layer and the electrode are formed on the long second support sheet.
- the laminated unit is cut after the adhesive layer is transferred to the surface of the ceramic green sheet of the formed laminate unit in which the layer and the spacer layer, the adhesive layer, and the ceramic green sheet are laminated.
- the electrode layer and the spacer layer formed on the second support sheet are adhered to the adhesive layer, and the second support sheet is separated from the release layer, and the electrode layer, the spacer layer, and the release layer Is transferred to the surface of the adhesive layer.
- a multilayer ceramic capacitor is manufactured using the multilayer block thus manufactured in the same manner as in the above embodiment.
- BaTiO powder manufactured by Sakai Danigaku Kogyo Co., Ltd .: trade name "BT-02": particle size 0.2 m
- the obtained dielectric paste was applied on a polyethylene terephthalate film at a coating speed of 50 m / min using a die coater to form a coating film, which was obtained in a drying oven maintained at 80 ° C.
- the coated film was dried to form a ceramic green sheet having a thickness of 1 zm.
- a slurry was prepared by mixing 3 parts by weight of dihydrota-pieroxyethanol with 1.5 parts by weight of a polyethylene glycol-based dispersant, and a mill “LMZ0.6” manufactured by Ashiza Finetech Co., Ltd. (product) ) was used to grind the additives in the slurry.
- the median diameter of the crushed additive was 0.1 m.
- the peripheral speed of Lumir was 45 m / min.
- BaTiO powder manufactured by Sakai Danigaku Kogyo Co., Ltd .: trade name “BT_02”: particle size 0.2 ⁇ m
- Dioctyl phthalate (plasticizer) 2. 61 parts by weight
- acetone was evaporated from the slurry thus obtained and removed from the mixture using a stirring device equipped with an evaporator and a heating mechanism to obtain a dielectric paste.
- the dielectric paste thus prepared is printed in a predetermined pattern on a ceramic green sheet using a screen printer, dried at 90 ° C for 5 minutes, and placed on a ceramic green sheet. A spacer layer was formed.
- the median diameter of the pulverized additive was 0.1 m.
- the peripheral speed of the ball mill was set to 45m / min.
- BaTiO powder manufactured by Sakai Chemical Industry Co., Ltd .: particle diameter 0.05 urn
- Polyethylene glycol dispersant 1.19 parts by weight
- Dioctyl phthalate (plasticizer) 2.25 parts by weight
- the prepared dielectric paste is applied to the surface of a polyethylene terephthalate film using a die coater to form a coating film, and the coating film is dried to obtain a ceramic having a thickness of 10 xm. A green sheet was formed.
- the ceramic green sheet having a thickness of 10 ⁇ m was peeled from the polyethylene terephthalate film, cut, and the cut five ceramic green sheets were placed on the laminated unit.
- a lower cover layer having a thickness of 50 ⁇ Laminated, a lower cover layer having a thickness of 50 ⁇ , a ceramic green sheet having a thickness of 1 / im, an electrode layer having a thickness of 1 am and a spacer having a thickness of 1 ⁇ m
- a laminate was prepared in which an effective layer having a thickness of 100 ⁇ m, in which 50 laminate units including the layers were laminated, and an upper cover layer having a thickness of 50 ⁇ m, were laminated.
- Heating rate 50 ° C / hour
- each ceramic green chip was treated and fired under the following conditions in an atmosphere of a mixed gas of nitrogen gas and hydrogen gas controlled at a dew point of 20 ° C.
- the contents of nitrogen gas and hydrogen gas in the mixed gas were 95% by volume and 5% by volume.
- Heating rate 300 ° C / hour
- Cooling rate 300 ° C / hour
- Example 2 Further, in the same manner as in Example 1, 50 multilayer ceramic capacitor samples were manufactured, and the resistance value of the 50 multilayer ceramic capacitor samplers was measured with a multimeter to obtain a multilayer ceramic capacitor sampler. When the short ratio was measured, the short ratio was 18%.
- a mixed solvent of terpionyl and kerosene is used instead of dihydrota-pinyloxyethanol.
- a spacer layer and an electrode layer were formed on a ceramic green sheet in the same manner as in Example 1 except that (mixing ratio (mass ratio) 50:50) was used. Observe the surface of the electrode layer and spacer layer As a result, cracks and wrinkles were observed on the surfaces of the electrode layer and the spacer layer.
- Example 2 50 multilayer ceramic capacitor samples were prepared, and the resistance values of the 50 multilayer ceramic capacitor samplers were measured with a multimeter. When the short ratio was measured, the short ratio was 44%.
- Polyvinyl butyral (polymerization degree 2400, butyralization degree 69%, residual acetyl group content) (12%) as a binder, and a conductive paste containing a mixed solvent of terpionel and kerosene (mixing ratio (mass ratio) 50:50) as a solvent to form an electrode layer
- a conductive paste containing a mixed solvent of terpionel and kerosene mixture (mass ratio) 50:50) as a solvent to form an electrode layer
- a copolymer of heptyl acrylate (weight ratio 82: 18, weight average molecular weight 450,000) on the ceramic green sheet formed by using a dielectric paste containing polyvinyl butyral (weight Godo 2400, butyralization degree 69 mol 0/0 the residue Asechiru group content 12 mol 0/0) includes as a binder, by printing a dielectric paste containing terpineol as a solvent, to form a spacer layer, poly Bulle butyral (polymerization degree 2400, butyralization degree 69 mole 0/0, contain residual ⁇ Se methyl group amount 12 mole 0/0) as a binder, by printing a conductive paste containing terpineol as a solvent, in the case of forming the electrode layer, the spacer layer Cracks and wrinkles were formed on the surface of the electrode
- Voids are generated in the manufactured ceramic green chip, or cracks or wrinkles are generated in the process of laminating the laminate units.
- the ceramic green chip after sintering voids were apt to be generated due to the lack of the layer part, whereas in Examples 1 to 6, it was used as a solvent for the dielectric paste for the spacer layer.
- Dihydrota-vinyloxyethanol, ta-vinyloxyethanol, d-dihydrocarbeol, I-citroneole, I-perinole alcohol, and acetomethoxy-methoxyethoxycyclohexanol acetate form a ceramic green sheet Hardly dissolves the copolymer of methyl methacrylate and butyl acrylate contained in the dielectric paste used for this purpose, thus effectively preventing cracks and wrinkles from being formed on the surface of the spacer layer and firing. It is thought that voids were prevented in the later ceramic green chip. It is.
- a binder a copolymer of methyl methacrylate and butyl acrylate having an acid value of 5 mgK / H / g (weight ratio 82:18, weight average molecular weight 450,000) ) on the ceramic green sheet formed by using a dielectric paste containing, include polyvinyl butyral (polymerization degree 2400, butyralization degree 69 mol%, the residual Asechiru group content 12 mol 0/0) as a binder, terpineol and kerosene Dielectric paste and conductive paste containing a mixed solvent (mixing ratio (mass ratio) of 50:50) as a solvent are printed to produce a laminate unit, and 50 laminate units are laminated and laminated.
- polyvinyl butyral polymerization degree 2400, butyralization degree 69 mol%, the residual Asechiru group content 12 mol 0/0
- a polybutyl butyral was formed on a ceramic green sheet formed using a dielectric paste containing a copolymer of methyl methacrylate and butyl acrylate (acid ratio: 5 mgKOH / g, weight ratio: 82:18, weight average molecular weight: 450,000).
- a dielectric Bae one strike comprising, seen containing poly Bulle butyral (polymerization degree 2400, butyralization degree 69 mol 0/0, the residual Asechiru group content 12 mol 0/0) as a binder
- a laminated ceramic unit is manufactured by printing a dielectric paste and a conductive paste containing dihydrota-pinoxylethanol as a solvent, a laminated ceramic capacitor is produced by laminating 50 laminated units.
- a paste and conductive paste are printed to produce a laminated unit, and 50 laminated units are laminated to produce a laminated ceramic capacitor, methyl methacrylate with an acid value of 5 mg KOH / g is used as a binder.
- a copolymer of butyl acrylate (weight ratio 82: 18, weight average molecular weight 450,000) on the ceramic green sheet formed by using a dielectric paste containing a poly Bulle butyral (polymerization degree 2400, butyralization degree 69 mol 0 / 0, containing residual Asechiru group content 12 mol 0/0) comprises a binder, a d- Jihidorokaru base ol as the solvent Printing a dielectric paste and conductive paste, to prepare a multi-layered unit, by laminating 50 sheets of the stack unit, in the case of manufacturing a multilayer ceramic capacitor, as a binder, acid value Polyvinyl butyral (degree of polymerization 2400) was placed on a ceramic green sheet formed using a dielectric paste containing 5 mg KOH / g of a copolymer of methyl methacrylate and butyl acrylate (weight ratio 82:18, weight average molecular weight 450,000).
- butyralization degree 69 mol 0/0 contain residual ⁇ cetyl group content 12 mol 0/0) as a binder, printing a Yuden paste and conductive paste including I Shitoroneoru as a solvent, producing a laminate unit Then, when a multilayer ceramic capacitor is manufactured by laminating 50 laminate units, the binder is a copolymer of methyl methacrylate and butyl acrylate with an acid value of 5 mgKOHZg (weight ratio 82:18, weight average molecular weight 450,000).
- Polybutyral (degree of polymerization 2400, butyral) on a ceramic daline sheet formed using a dielectric paste containing Degree 69 mole 0/0 includes a residual Asechiru group content 12 mol 0/0) as a binder, by printing a dielectric paste and conductive paste including I one perillylalcohol as a solvent, producing a laminate unit Then, when a laminated ceramic capacitor was fabricated by laminating 50 laminate units, and as a binder, a copolymer of methyl methacrylate and butyl acrylate with an acid value of 5 mgK ⁇ H / g (weight ratio 82:18, on the ceramic green sheet formed by using a dielectric paste containing a weight average molecular weight 450,000), polyvinyl butyral (polymerization degree 2400, butyralization degree 69 mol 0/0, the residual Asechiru group content 12 mol 0/0) a binder And printing a dielectric paste and a conduct
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- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/582,995 US7572477B2 (en) | 2003-12-15 | 2004-12-14 | Dielectric paste for spacer layer of a multi-layered ceramic electronic component |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2003-416157 | 2003-12-15 | ||
JP2003416157A JP4662298B2 (ja) | 2003-12-15 | 2003-12-15 | 積層セラミック電子部品のスペーサ層用の誘電体ペースト |
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WO2005056673A1 true WO2005056673A1 (ja) | 2005-06-23 |
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PCT/JP2004/018627 WO2005056673A1 (ja) | 2003-12-15 | 2004-12-14 | 積層セラミック電子部品のスペーサ層用の誘電体ペースト |
Country Status (6)
Country | Link |
---|---|
US (1) | US7572477B2 (ja) |
JP (1) | JP4662298B2 (ja) |
KR (1) | KR100766316B1 (ja) |
CN (1) | CN100506906C (ja) |
TW (1) | TWI246093B (ja) |
WO (1) | WO2005056673A1 (ja) |
Families Citing this family (3)
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EP2765153B1 (en) * | 2013-02-12 | 2017-03-29 | Heraeus Precious Metals North America Conshohocken LLC | Sealing glass composition and methods of applying it |
US9809720B2 (en) * | 2015-07-06 | 2017-11-07 | University Of Massachusetts | Ferroelectric nanocomposite based dielectric inks for reconfigurable RF and microwave applications |
US10839992B1 (en) | 2019-05-17 | 2020-11-17 | Raytheon Company | Thick film resistors having customizable resistances and methods of manufacture |
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2003
- 2003-12-15 JP JP2003416157A patent/JP4662298B2/ja not_active Expired - Fee Related
-
2004
- 2004-12-14 KR KR1020067010060A patent/KR100766316B1/ko not_active IP Right Cessation
- 2004-12-14 WO PCT/JP2004/018627 patent/WO2005056673A1/ja active Application Filing
- 2004-12-14 TW TW093138778A patent/TWI246093B/zh not_active IP Right Cessation
- 2004-12-14 US US10/582,995 patent/US7572477B2/en not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
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JP4662298B2 (ja) | 2011-03-30 |
CN1890318A (zh) | 2007-01-03 |
US7572477B2 (en) | 2009-08-11 |
KR20060094981A (ko) | 2006-08-30 |
TWI246093B (en) | 2005-12-21 |
KR100766316B1 (ko) | 2007-10-12 |
JP2005171177A (ja) | 2005-06-30 |
TW200523960A (en) | 2005-07-16 |
CN100506906C (zh) | 2009-07-01 |
US20070149668A1 (en) | 2007-06-28 |
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