DE69635566T2 - Monolithisches Keramikbauelement und seine Herstellung - Google Patents

Monolithisches Keramikbauelement und seine Herstellung Download PDF

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Publication number
DE69635566T2
DE69635566T2 DE69635566T DE69635566T DE69635566T2 DE 69635566 T2 DE69635566 T2 DE 69635566T2 DE 69635566 T DE69635566 T DE 69635566T DE 69635566 T DE69635566 T DE 69635566T DE 69635566 T2 DE69635566 T2 DE 69635566T2
Authority
DE
Germany
Prior art keywords
manufacture
ceramic component
monolithic ceramic
monolithic
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69635566T
Other languages
English (en)
Other versions
DE69635566D1 (de
Inventor
Hiroyuki Kawakami
Yoshiaki Kohno
Noriyuki Kubodera
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP7912095A external-priority patent/JP3152098B2/ja
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of DE69635566D1 publication Critical patent/DE69635566D1/de
Application granted granted Critical
Publication of DE69635566T2 publication Critical patent/DE69635566T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H01G4/308—Stacked capacitors made by transfer techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1142—Conversion of conductive material into insulating material or into dissolvable compound
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
DE69635566T 1995-03-16 1996-03-15 Monolithisches Keramikbauelement und seine Herstellung Expired - Lifetime DE69635566T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5730395 1995-03-16
JP7912095A JP3152098B2 (ja) 1995-04-04 1995-04-04 セラミック積層電子部品の製造方法

Publications (2)

Publication Number Publication Date
DE69635566D1 DE69635566D1 (de) 2006-01-19
DE69635566T2 true DE69635566T2 (de) 2006-06-14

Family

ID=26398325

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69635566T Expired - Lifetime DE69635566T2 (de) 1995-03-16 1996-03-15 Monolithisches Keramikbauelement und seine Herstellung

Country Status (5)

Country Link
US (2) US5769985A (de)
EP (1) EP0732735B1 (de)
KR (1) KR100230122B1 (de)
CN (1) CN1132203C (de)
DE (1) DE69635566T2 (de)

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JP3654409B2 (ja) * 1998-03-24 2005-06-02 住友精密工業株式会社 オゾン発生装置用放電セル及びその製造方法
US6672502B1 (en) * 2000-11-28 2004-01-06 The State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State University Method for making devices having intermetallic structures and intermetallic devices made thereby
TWI237834B (en) * 2003-03-31 2005-08-11 Tdk Corp A method for manufacturing a multi-layered ceramic electronic component
US20070007700A1 (en) * 2003-09-30 2007-01-11 Tdk Corporation Method for Preparing Dielelectric Paste for Multi-Layer Ceramic Electronic Component
JP4487542B2 (ja) * 2003-11-27 2010-06-23 Ｔｄｋ株式会社 積層セラミック電子部品用の導電体ペーストおよび積層セラミック電子部品用の積層体ユニットの製造方法
JP4662298B2 (ja) * 2003-12-15 2011-03-30 Ｔｄｋ株式会社 積層セラミック電子部品のスペーサ層用の誘電体ペースト
JP4487595B2 (ja) * 2004-02-27 2010-06-23 Ｔｄｋ株式会社 積層セラミック電子部品用の積層体ユニットの製造方法
JP4487596B2 (ja) * 2004-02-27 2010-06-23 Ｔｄｋ株式会社 積層セラミック電子部品用の積層体ユニットの製造方法
JP4412013B2 (ja) * 2004-03-16 2010-02-10 Ｔｄｋ株式会社 積層セラミック電子部品用の誘電体ペーストおよび積層セラミック電子部品用の積層体ユニットの製造方法
JPWO2005117040A1 (ja) * 2004-05-31 2008-04-03 Tdk株式会社 電子部品、積層セラミックコンデンサおよびその製造方法
KR100863398B1 (ko) 2004-06-28 2008-10-14 티디케이가부시기가이샤 적층형 전자부품의 제조방법
US20080053593A1 (en) * 2004-06-28 2008-03-06 Tdk Corporation Production Method of Multilayer Electronic Device
KR100863399B1 (ko) 2004-06-28 2008-10-14 티디케이가부시기가이샤 적층형 전자 부품의 제조 방법
US7955504B1 (en) 2004-10-06 2011-06-07 State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State University Microfluidic devices, particularly filtration devices comprising polymeric membranes, and method for their manufacture and use
US8679587B2 (en) * 2005-11-29 2014-03-25 State of Oregon acting by and through the State Board of Higher Education action on Behalf of Oregon State University Solution deposition of inorganic materials and electronic devices made comprising the inorganic materials
US20080108122A1 (en) * 2006-09-01 2008-05-08 State of Oregon acting by and through the State Board of Higher Education on behalf of Oregon Microchemical nanofactories
US20090211977A1 (en) * 2008-02-27 2009-08-27 Oregon State University Through-plate microchannel transfer devices
US8236599B2 (en) 2009-04-09 2012-08-07 State of Oregon acting by and through the State Board of Higher Education Solution-based process for making inorganic materials
US20100326914A1 (en) * 2009-06-24 2010-12-30 State of Oregon acting by and through the State Board of Higher Education on behalf of Oregon Microfluidic devices
US8801922B2 (en) * 2009-06-24 2014-08-12 State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State University Dialysis system
US8753515B2 (en) 2009-12-05 2014-06-17 Home Dialysis Plus, Ltd. Dialysis system with ultrafiltration control
US20110189048A1 (en) * 2009-12-05 2011-08-04 Curtis James R Modular dialysis system
US8580161B2 (en) 2010-05-04 2013-11-12 State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State University Fluidic devices comprising photocontrollable units
US8501009B2 (en) 2010-06-07 2013-08-06 State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State University Fluid purification system
KR20120102319A (ko) * 2011-03-08 2012-09-18 삼성전기주식회사 금속 증착 필름, 및 이를 이용한 금속 분말
ES2640953T3 (es) 2011-10-07 2017-11-07 Outset Medical, Inc. Purificación de líquido de intercambio de calor para un sistema de diálisis
TW201344749A (zh) * 2012-04-23 2013-11-01 Nanocrystal Asia Inc 以塡膠燒結方式製造選擇性成長遮罩之方法
EP3137128B1 (de) 2014-04-29 2021-02-24 Outset Medical, Inc. Dialysesysteme und -verfahren
JP6463936B2 (ja) * 2014-10-01 2019-02-06 日本特殊陶業株式会社 半導体製造装置用部品の製造方法
CN106032329B (zh) * 2015-03-20 2019-10-22 深圳光启高等理工研究院 陶瓷基超材料及其制造方法
CN107365151B (zh) * 2016-05-12 2021-01-01 中国科学院宁波材料技术与工程研究所 一种致密亚微米晶β″‐Al2O3制品、其制备方法与应用
ES2908601T3 (es) 2016-08-19 2022-05-03 Outset Medical Inc Sistema y métodos de diálisis peritoneal

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JPS62276894A (ja) * 1986-02-21 1987-12-01 株式会社メイコー スル−ホ−ル付導体回路板の製造方法
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Also Published As

Publication number Publication date
EP0732735A3 (de) 1997-10-01
CN1149750A (zh) 1997-05-14
EP0732735B1 (de) 2005-12-14
DE69635566D1 (de) 2006-01-19
CN1132203C (zh) 2003-12-24
US5769985A (en) 1998-06-23
KR100230122B1 (ko) 1999-11-15
US5985068A (en) 1999-11-16
EP0732735A2 (de) 1996-09-18
KR960035778A (ko) 1996-10-28

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