WO2003019988A1 - Dispositif de masque de formation a plusieurs faces pour depot sous vide - Google Patents

Dispositif de masque de formation a plusieurs faces pour depot sous vide Download PDF

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Publication number
WO2003019988A1
WO2003019988A1 PCT/JP2002/008535 JP0208535W WO03019988A1 WO 2003019988 A1 WO2003019988 A1 WO 2003019988A1 JP 0208535 W JP0208535 W JP 0208535W WO 03019988 A1 WO03019988 A1 WO 03019988A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal mask
mask
vacuum deposition
face forming
mask device
Prior art date
Application number
PCT/JP2002/008535
Other languages
English (en)
Japanese (ja)
Inventor
Terunao Tsuchiya
Takuya Sakata
Original Assignee
Dai Nippon Printing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001255233A external-priority patent/JP4862236B2/ja
Priority claimed from JP2002142179A external-priority patent/JP2003332057A/ja
Application filed by Dai Nippon Printing Co., Ltd. filed Critical Dai Nippon Printing Co., Ltd.
Priority to EP02762845A priority Critical patent/EP1437926B1/fr
Priority to CA2426641A priority patent/CA2426641C/fr
Priority to KR1020037005638A priority patent/KR100848972B1/ko
Priority to US10/399,943 priority patent/US6890385B2/en
Priority to DE60228599T priority patent/DE60228599D1/de
Publication of WO2003019988A1 publication Critical patent/WO2003019988A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

L'invention concerne un dispositif de masque de formation à plusieurs faces destiné au dépôt sous vide. Un second masque métallique (13) pourvu d'une partie d'écran à rainures (13A) avec un grand nombre de fentes fines (13a) disposées parallèlement à des intervalles très petits est placé sur une plaque de base (12) généralement utilisée comme premier masque métallique pourvu d'une pluralité de fenêtres (18) servant à restreindre une zone de dépôt. Une extrémité du second masque métallique (13) est fixée sur la plaque de base (12) au moyen d'une fixation de masque (20) et l'autre extrémité est fixée sur un curseur (23). Une tension de ressort est appliquée au curseur (23) par compression des ressorts hélicoïdaux (30), de manière à mettre sous tension la partie d'écran à rainures (13A) du second masque métallique, afin de maintenir les fentes (13a) alignées à des pas spécifiques. On peut former des motifs ultra fins sur plusieurs faces d'un substrat (17) en plaçant le substrat (17) sur le second masque métallique (13) et en effectuant le dépôt.
PCT/JP2002/008535 2001-08-24 2002-08-23 Dispositif de masque de formation a plusieurs faces pour depot sous vide WO2003019988A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP02762845A EP1437926B1 (fr) 2001-08-24 2002-08-23 Dispositif de masque de formation a plusieurs faces pour depot sous vide
CA2426641A CA2426641C (fr) 2001-08-24 2002-08-23 Dispositif de masque de formation a plusieurs faces pour depot sous vide
KR1020037005638A KR100848972B1 (ko) 2001-08-24 2002-08-23 진공증착용 다면부착 마스크장치
US10/399,943 US6890385B2 (en) 2001-08-24 2002-08-23 Multi-face forming mask device for vacuum deposition
DE60228599T DE60228599D1 (de) 2001-08-24 2002-08-23 Maskeneinrichtung zur bildung mehrerer seiten für die vakuumablagerung

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2001-255233 2001-08-24
JP2001255233A JP4862236B2 (ja) 2001-08-24 2001-08-24 有機ｅｌ素子製造に用いる真空蒸着用多面付けマスク装置
JP2002142179A JP2003332057A (ja) 2002-05-16 2002-05-16 有機ｅｌ素子製造に用いる真空蒸着用多面付けマスク装置
JP2002-142179 2002-05-16

Publications (1)

Publication Number Publication Date
WO2003019988A1 true WO2003019988A1 (fr) 2003-03-06

Family

ID=26620977

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/008535 WO2003019988A1 (fr) 2001-08-24 2002-08-23 Dispositif de masque de formation a plusieurs faces pour depot sous vide

Country Status (8)

Country Link
US (1) US6890385B2 (fr)
EP (1) EP1437926B1 (fr)
KR (1) KR100848972B1 (fr)
CN (1) CN100355104C (fr)
CA (1) CA2426641C (fr)
DE (1) DE60228599D1 (fr)
TW (1) TW558914B (fr)
WO (1) WO2003019988A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6878208B2 (en) * 2002-04-26 2005-04-12 Tohoku Pioneer Corporation Mask for vacuum deposition and organic EL display manufactured by using the same
CN100461494C (zh) * 2003-07-25 2009-02-11 大日本网目版制造株式会社 蒸镀用掩模及其制造方法
US7537798B2 (en) * 2002-11-22 2009-05-26 Samsung Mobile Display Co., Ltd. Deposition mask frame assembly, method of fabricating the same, and method of fabricating organic electroluminescent device using the deposition mask frame assembly

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* Cited by examiner, † Cited by third party
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US20040020435A1 (en) 2004-02-05
TW558914B (en) 2003-10-21
CA2426641A1 (fr) 2003-04-22
CA2426641C (fr) 2010-10-26
EP1437926A1 (fr) 2004-07-14
KR100848972B1 (ko) 2008-07-30
CN1480011A (zh) 2004-03-03
CN100355104C (zh) 2007-12-12
US6890385B2 (en) 2005-05-10
EP1437926A4 (fr) 2007-07-04
KR20040028661A (ko) 2004-04-03
EP1437926B1 (fr) 2008-08-27

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