TWI751109B - 陣列式麥克風系統及其組裝方法 - Google Patents

陣列式麥克風系統及其組裝方法 Download PDF

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TWI751109B
TWI751109B TW105113588A TW105113588A TWI751109B TW I751109 B TWI751109 B TW I751109B TW 105113588 A TW105113588 A TW 105113588A TW 105113588 A TW105113588 A TW 105113588A TW I751109 B TWI751109 B TW I751109B
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馬修Ｔ 亞伯拉罕
大衛 葛蘭特 卡森
約翰 凱西 吉伯斯
喬治利 威廉 蘭茲
艾伯特 法蘭西斯 二世 馬克高文
布蘭特 羅伯特 舒馬德
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美商舒爾獲得控股公司
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/32—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only
    • H04R1/40—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers
    • H04R1/406—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/32—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only
    • H04R1/40—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/02—Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups
    • H04R2201/021—Transducers or their casings adapted for mounting in or to a wall or ceiling
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/40—Details of arrangements for obtaining desired directional characteristic by combining a number of identical transducers covered by H04R1/40 but not provided for in any of its subgroups
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/40—Details of arrangements for obtaining desired directional characteristic by combining a number of identical transducers covered by H04R1/40 but not provided for in any of its subgroups
    • H04R2201/401—2D or 3D arrays of transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/40—Details of arrangements for obtaining desired directional characteristic by combining a number of identical transducers covered by H04R1/40 but not provided for in any of its subgroups
    • H04R2201/405—Non-uniform arrays of transducers or a plurality of uniform arrays with different transducer spacing

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Manufacturing & Machinery (AREA)
  • Circuit For Audible Band Transducer (AREA)
  • Obtaining Desirable Characteristics In Audible-Bandwidth Transducers (AREA)
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Abstract

實施例包含一麥克風總成，其包括一陣列式麥克風及一殼體，該殼體經構形以支撐該陣列式麥克風，且經定大小及塑形以可安裝於一吊頂中而取代經包含於該吊頂中之複數個天花板塊中之至少一者。該殼體之一前面包含具有基本上類似於該複數個天花板塊之該至少一者之一大小及形狀之一可透聲螢幕。實施例亦包含一陣列式麥克風系統，其包括在一基板上經配置成圍繞該基板之一中心點之數個具有可變大小之同心嵌套環圈的複數個麥克風。各環圈包括沿該環圈之一圓周定位於預定間隔處之該複數個麥克風之一子組。

Description

陣列式麥克風系統及其組裝方法
本申請案大體上係關於一種陣列式麥克風系統及其組裝方法。特定言之，本申請案係關於一種能夠配接至一吊頂之一天花板塊中且提供具有跨語音頻率範圍最佳化之一總指向性指數之360度音訊拾取之陣列式麥克風。
會議環境，諸如董事會議、視訊會議情境及類似者，可涉及將麥克風用於自音訊源擷取聲音。例如，該等音訊源可包含人類講話者。所擷取之聲音可通過環境中之講話者、一電視廣播及/或一網路廣播傳播給一聽眾。
在一些實施例中，麥克風可放置於靠近音訊源之一桌上或講台上以擷取聲音。然而，此等麥克風可係突出的或非所要的，此係因為該等麥克風之大小及/或使用該等麥克風之環境之美觀度。另外，放置於一桌上之麥克風可偵測非所要雜訊，諸如鋼筆輕敲或紙張翻動。放置於一桌上之麥克風亦可(諸如)被紙張、布或紙巾覆蓋或阻擋，使得不可恰當或最佳地擷取聲音。
在其他環境中，麥克風可包含主要對沿一個方向之聲音敏感之槍型麥克風。該等槍型麥克風可定位於遠離一音訊源且經引導以藉由將該麥克風指向由音訊源佔據之區域而偵測來自一特定音訊源之聲 音。然而，判定指向一槍型麥克風之方向以最佳地偵測來自其音訊源之聲音可係困難且冗長的。可需要試誤以調整槍型麥克風之位置而用於最佳地偵測來自一音訊源之聲音。因而，除非且直至恰當地調整麥克風之位置，否則不可理想地偵測來自音訊源之聲音。且即使恰當地調整麥克風之位置，若音訊源移動進出麥克風之一拾取範圍(例如，若人類講話者說話時偏移其座位)則音訊偵測可係差強人意的。
在一些環境中，麥克風可安裝至會議室之一天花板或墻壁以節省出桌子空間且使得人類講話者可自由圍繞會議室移動，藉此解決關於桌上型及槍型麥克風之以上至少部分顧慮。大部分現有天花板安裝麥克風經構形以直接緊固至天花板或自安裝至該天花板之下拉式纜線懸吊。因此，此等產品要求複雜之安裝且意欲成為一永久配件。此外，儘管天花板麥克風鑒於距桌子之距離可不拾取桌上雜訊，但此等麥克風歸因於與揚聲器及HVAC系統之較緊密接近、距音訊源之一較遠距離及對空氣運動或白雜訊之一增加之敏感性而具有其等自身之音訊拾取挑戰。
據此，系統存在解決此等顧慮之一機會。更具體言之，存在達成包含一陣列式麥克風之系統之一機會，該陣列式麥克風不突出，易於安裝至一現有環境中且可使得能夠調整麥克風陣列以最佳地偵測來自一音訊源(例如，一人類講話者)之聲音且抑制非所要雜訊及反射。
本發明意欲尤其藉由提供經設計以完成以下各者之系統及方法來解決以上提出之問題：(1)提供經定大小及塑形以可安裝於一吊頂中而取代一天花板塊之一陣列式麥克風總成；且(2)提供一陣列式麥克風系統，其包括達成在聲音頻率範圍中之改良之指向性敏感度及在一指定操縱角度範圍中之一最佳主旁瓣比之麥克風之一同心構形。
在一實施例中，一陣列式麥克風系統包括一基板及在該基板上 配置成數個具有可變大小之同心嵌套環圈之複數個麥克風。在該實施例中，各環圈包括沿該環圈之一圓周定位於預定間隔處之複數個麥克風之一子組。
在另一實施例中，一麥克風總成包括一陣列式麥克風，該陣列式麥克風包括複數個麥克風及經構形以支撐該陣列式麥克風之一殼體。在該實施例中，該殼體經定大小及塑形以可安裝於一吊頂中而取代包含於該吊頂中之複數個天花板塊之至少一者。此外，該殼體之一前面包含具有基本上類似於該複數個天花板塊之該至少一者之一大小及形狀之一可透聲螢幕。
在另一實施例中，一種組裝一陣列式麥克風之方法包括：配置第一複數個麥克風以在一基板上形成一第一構形；且配置第二複數個麥克風以在該基板上形成一第二構形，其中該第二構形同心地環繞該第一構形。該方法進一步包括將該第一複數個麥克風及該第二複數個麥克風之各者電耦合至一音訊處理器以用於處理由麥克風擷取之音訊信號。
將從以下【實施方式】及隨附圖式明白且更完全地理解此等及其他實施例及各種排列及態樣，【實施方式】及隨附圖式闡述指示其中可採用本發明之原理之各種方式之繪示性實施例。
100:麥克風陣列總成/總成/陣列式麥克風總成
101:後安裝板
102:殼體
103:纜線安裝鉤
104:陣列式麥克風/麥克風陣列/陣列/麥克風總成
105:支座
106:麥克風換能器/麥克風
106a:中心麥克風
106b:麥克風/剩餘麥克風/相鄰麥克風
107a:中心印刷電路板
107b:周邊印刷電路板/圓環形周邊印刷電路板
108:可透聲螢幕/螢幕/格柵
110:背板/支撐件/背支撐件/背部分
111:隔膜/發泡體隔膜
112:側軌
114:控制箱
116:印刷電路板/音訊印刷電路板
118:板對板連接器
120:開口
122:可移除蓋
124:外部埠/埠
126:指示器/光指示器
126a:印刷電路板/發光二極體印刷電路板
126b:光導
128:纜線
129:連接器
130:邊/板對板連接器/連接器
132:邊
134:內端部
136:外端部
600:天花板/環境/吊頂
602:金屬通道
604:輕量天花板塊/天花板塊/塊/面板
700:天花板
702:安裝柱
704:下拉式天花板纜線
900:麥克風構形/構形
902:麥克風/中心麥克風
906:麥克風/中心麥克風
910:同心環圈/第一環圈/環圈/剩餘環圈/最內環圈/內環圈
912:同心環圈/第二環圈/環圈
914:同心環圈/第三環圈/環圈
916:同心環圈/第四環圈/環圈
918:同心環圈/第五環圈/環圈
920:同心環圈/第六環圈/環圈
922:同心環圈/第七環圈/環圈/最外環圈
930:中心軸
1000:音訊系統
1030:陣列式麥克風系統/系統/麥克風陣列系統
1032:控制裝置
1034:麥克風陣列/陣列式麥克風/陣列
1036:音訊組件
1038:指示器
1040:無線通信裝置
1042:纜線
1044:電源供應器
1046:第一光源/燈/光源
1048:第二光源/燈/光源
1100:麥克風極座標圖案/極座標圖案/極座標圖
1102:瓣/主瓣
1104:旁瓣
1200:方法
圖1係根據某些實施例之一例示性陣列式麥克風總成之一前視透視圖。
圖2係根據某些實施例之圖1之陣列式麥克風總成之一後視透視圖。
圖3係根據某些實施例之圖1之陣列式麥克風總成之一分解圖。
圖4係根據某些實施例之圖3之陣列式麥克風總成之一側視剖面圖。
圖5係根據某些實施例之包含於圖3之陣列式麥克風總成中之陣列式麥克風之一俯視平面圖。
圖6係根據某些實施例之包含圖1之陣列式麥克風總成之一例示性環境。
圖7係根據某些實施例之包含圖2之陣列式麥克風總成之另一例示性環境。
圖8係根據某些實施例之包含圖2之陣列式麥克風總成之另一例示性環境。
圖9係根據某些實施例之展示另一實例性陣列式麥克風中之麥克風放置之一圖表。
圖10係根據某些實施例之描繪一實例性陣列式麥克風系統之一方塊圖。
圖11係根據某些實施例之展示圖9之陣列式麥克風之選擇極座標回應之一極座標圖。
圖12係根據某些實施例之繪示用於組裝一陣列式麥克風之一實例性程序之一流程圖。
以下描述根據本發明之原理描述、繪示及例示本發明之一或多個特定實施例。提供此描述不是為了將本發明限制於本文描述之實施例，而是以使得一般技術者能夠理解此等原理且藉助該理解，能夠應用該理解不僅實踐本文描述之實施例且能夠實踐根據此等原理想到之其他實施例之此一方式解釋且教示本發明之原理。本發明之範疇意欲涵蓋可落於隨附申請專利範圍之範疇內(不論字面上或在等效物之教義中)之所有此等實施例。
應注意，在【實施方式】及圖式中，可利用相同參考符號標記相同或基本上類似之元件。然而，有時可利用不同號碼標記此等元 件，諸如(例如)在其中此標記促進一更清楚之描述之情況中。另外，本文中闡述之圖式不必按比例繪製，且在一些例項中可誇大比例以更清楚地描繪某些特徵。此標記及圖式實踐不必表明一潛在真實目的。如以上所陳述，說明書意欲視為一整體且根據如本文所教示及一般技術者所理解之本發明之原理解譯。
相對於本文描述及繪示之例示性系統、組件及架構，應瞭解可由數個構形及組件體現實施例或在數個構形及組件中採用實施例，包含一或多個系統、硬體、軟體或韌體構形或組件或其等之任何組合，如一般技術者所理解。據此，儘管圖式繪示包含用於本文設想之實施例之一或多者之組件之例示性系統，但應瞭解相對於各實施例，一或多個組件在系統中可不存在或不必要的。
本文提供針對一陣列式麥克風總成之系統及方法，該陣列式麥克風總成(1)經構形以可安裝於(例如)一會議或董事會議環境之一吊頂中以取代一現有天花板，且(2)包含選擇性地定位成一自相似或類分形構形或星座圖之複數個麥克風換能器以產生具有(例如)一最佳指向性指數及一最大主旁瓣比之一高效能陣列。在實施例中，可藉由將麥克風配置成同心環圈而達成此實體構形，此允許陣列式麥克風在一個三維(例如，X-Y-Z)空間中之任何給定視角處皆具有等效波束寬度效能。因此，本文描述之陣列式麥克風可比具有線性、矩形或方形星座圖之陣列式麥克風提供一更一致之輸出。此外，假定陣列式麥克風比具有共線性定位之元件之現有陣列降低旁瓣，則麥克風之星座圖內之各同心環圈可具有自每隔一環圈之一輕微旋轉偏移以最小化旁瓣生長。此偏移構形亦可容許進一步之波束操縱，此允許陣列覆蓋一更寬之拾取區域。再者，麥克風星座圖可經諧波嵌套以最佳化一組給定不同頻帶內之波束寬度。
在實施例中，陣列式麥克風可能夠達成跨聲音頻率範圍及陣列 聚焦角度(例如視角)之一廣泛範圍中之最大旁瓣抑制，此至少部分歸因於使用相較於現有陣列允許一更大之麥克風密度及改良之振動雜訊抑制之微電機械系統(MEMS)麥克風。陣列式星座圖之麥克風密度可准許變化之波束寬度控制，而現有陣列受限於一固定波束寬度。在其他實施例中，在維持麥克風密度之情況下，可使用替代換能方案(例如，電容器、平衡電樞等等)實施麥克風系統。
圖1至圖5繪示根據實施例之包括一殼體102及一陣列式麥克風104之一例示性麥克風陣列總成100。更具體言之，圖1描繪麥克風陣列總成100之一前視透視圖；圖2描繪麥克風陣列總成100之一後視透視圖；圖3描繪麥克風陣列總成100之一分解圖，其展示殼體102及包含於殼體102中之麥克風陣列104之各種組件；圖4描繪根據實施例之麥克風陣列總成100之一側視剖面圖且圖5描繪麥克風陣列104。為了簡潔性及繪示性之目的，已自選定視圖(諸如(例如)圖3至圖5)至少部分移除一些結構支撐元件，諸如(例如)螺釘、墊圈、後安裝板101及纜線安裝鉤103、支座105。
陣列式麥克風104(在本文中亦被稱為「麥克風陣列」)包括經構形以偵測及擷取一環境中之聲音(諸如，例如由坐在圍繞一會議桌之椅子上之講話者所發出之語音)之複數個麥克風換能器106(在本文中亦被稱為「麥克風」)。聲音自音訊源(例如，人類講話者)行進至麥克風106。在一些實施例中，麥克風106可為主要對一方向敏感之單向麥克風。在其他實施例中，麥克風106可根據期望具有其他指向性或極座標圖案，諸如心形、次心形或全向。
麥克風106可係可偵測來自一音訊源之聲音且將該聲音轉換成一電音訊信號之任何適合類型之換能器。在一較佳實施例中，麥克風106為微電機械系統(MEMS)麥克風。在其他實施例中，麥克風106可為電容式麥克風、平衡電樞麥克風、駐極體麥克風、動態麥克風及/ 或其他類型之麥克風。
麥克風106可耦合至一基板107或包含於一基板107上。在MEMS麥克風之情況中，基板107可為一或多個印刷電路板(在本文中亦被稱為「麥克風PCB」)。例如，在圖5中，麥克風106經表面安裝至麥克風PCB 107且包含於一單一面板中。在(例如)其中麥克風106係電容式麥克風之其他實施例中，基板107可由碳纖維或其他適合材料製成。
如圖1及圖2中所展示，殼體102經構形以完全圍封麥克風陣列104以保護且結構支撐陣列104。更具體言之，殼體102之一第一面或前面包含一可透聲螢幕或格柵108，且殼體102之一第二面或後面包含一背板或支撐件110。如圖1中所展示，螢幕108可具有包括複數個小開口之一穿孔表面且可由鋁、塑膠、金屬絲網或其他適合材料製成。在其他實施例中，螢幕108可具有由可透聲膜或織物製成之一基本上固體表面。如圖3中所展示，殼體102亦包含一隔膜111，該隔膜111由發泡體或其他適合材料製成且定位於螢幕108與麥克風陣列104之間以保護麥克風陣列104免受外部元件之擾，如熟習相關技術者將明白。亦如圖3中所展示，殼體102進一步包含側軌112以用於將背支撐件110、發泡體隔膜111及螢幕108之各側緊固在一起而形成殼體102。殼體102可進一步包含支座105及間隔件(圖中未展示)以機械支撐麥克風總成104遠離殼體102及/或總成100之其他組件。
另外參考圖6，其展示麥克風陣列總成100安裝於其中之一實例性天花板600。天花板600可為一會議環境之一部分，諸如(例如)其中麥克風用來擷取來自音訊源或人類講話者之聲音之一董事會議。在圖6之例示性環境中，人類講話者(未展示)可坐在天花板600下方(或更具體言之，麥克風陣列總成100下方)之一桌子旁之椅子中，儘管可設想或可能有音訊源及/或麥克風陣列總成100之其他實體構形及放置。在實施例中，麥克風陣列104可經構形以(例如)根據標準天花板高度(例 如，八英尺至十英尺高)或任何其他合適高度範圍在環境之一地板上之一特定高度或高度範圍處取得最佳效能。
如圖6中所展示，天花板600可為一吊頂(亦被稱為下拉天花板(dropped ceiling)或懸吊天花板)或懸吊於一主結構天花板下方之一次級天花板。如所習知，吊頂600包括自主天花板懸吊於導線(未展示)上且形成規則間隔之單元之一圖案之金屬通道602之一柵格。各單元可填充有(例如)可經移除以提供用於修復或檢測天花板塊上之區域之接達之一輕量天花板塊或面板604。在一較佳實施例中，天花板塊604係可易於安裝或移除且不干擾柵格或其他塊604之嵌入式塊。各天花板塊604通常根據柵格之一「單元大小」定尺寸及塑形。例如，在美國單元大小通常係大約兩英尺乘兩英尺之一方形或大約兩英尺乘四英尺之一矩形。舉另一實例，在歐洲，單元大小通常係大約600毫米(mm)乘600mm之一方形。舉又另一實例，在亞洲，單元大小通常係大約625mm乘625mm之一方形。
在實施例中，殼體102可經定大小及塑形以安裝於吊頂600中而取代天花板塊604中之至少一者。例如，殼體102可具有基本上等同於形成吊頂600之柵格之單元大小的長度及寬度尺寸。在一項實施例中，殼體102基本上係尺寸為大約兩英尺乘兩英尺之方形(例如，側軌112之各者係約2英尺長)，使得殼體102可取代一標準美國吊頂中之天花板塊604之任何一者。在其他實施例中，殼體102可經定大小及塑形以取代天花板塊604之兩者或兩者以上。例如，殼體102可被塑形為一大約四英尺乘四英尺之方形，以取代形成一方形之四個鄰接天花板塊604之任何群組。在其他實施例中，殼體102可經定大小以被配接至一標準歐洲吊頂(例如，600mm乘600mm)或一標準亞洲吊頂(例如，625mm乘625mm)中。藉由安裝麥克風陣列總成100以取代吊頂600之一天花板塊604(類似於將一揚聲器安裝於一揚聲器箱(諸如，例如無限阻 板)中)，總成100可獲得聲學優勢。
在一些情況中，一配接器框架(未展示)可經設置以改裝或調適殼體102，使得其與具有大於殼體102之一單元大小的吊頂相容。例如，該配接器框架可為可圍繞殼體102之一周邊耦合且具有延長殼體102之尺寸以配接一預定單元大小之一寬度之一鋁框架。在此等情況中，經定大小以用於標準美國天花板之一殼體102可經調適以配接(例如)一標準亞洲天花板。在其他情況中，殼體102可經設計以配接一最小單元大小(諸如，例如一600mm乘600mm方形)，且該配接器框架可根據需要被設置成可延長殼體102之尺寸以配接各種不同單元大小(諸如，例如一兩英尺乘兩英尺方形，一625mm乘625mm方形等等)的多個大小或寬度。
在實施例中，殼體102之全部或部分可係由一輕量堅固之鋁材料或足夠輕以允許由吊頂600之柵格支撐麥克風陣列總成100且足夠堅固以使得殼體102能夠支撐經安裝於其中之麥克風陣列104的任何其他材料製成。例如，在某些實施例中，至少背板110包括一平坦航天級鋁板，該鋁板包括一蜂巢芯(例如，如由Plascore®製造)。此外，根據某些實施例，殼體102之組件(例如，側軌112、背部分110、螢幕108、麥克風陣列104等等)可經構形以容易地配接在一起以便組裝，且容易地拆開以便拆卸。此特徵允許殼體102根據終端使用者之特定需求而客製化，需求包含：(例如)利用一不同材料(例如織物)或色彩(例如，用於匹配天花板塊604之色彩)取代螢幕108；增加或移除一配接器框架以改變殼體102之一整體大小，如以上所描述；取代側軌112以匹配吊頂600中之金屬通道602之一色彩或材料；取代或調整陣列式麥克風104(例如以提供具有更多或更少麥克風106之一陣列)；等等。
另外參考圖7及圖8，在實施例中，殼體102可經構形以提供替代安裝選項，以(例如)適應具有並非一吊頂之一天花板700的環境。在 一些情況中，麥克風陣列總成100可包含後安裝板101，如圖2中所展示。可使用一標準VESA安裝孔型樣將後安裝板101耦合至一安裝柱702，安裝柱702經構形以附接至天花板700，如圖7中所展示。如圖8中所展示，在一些情況中，麥克風陣列總成100可係藉由將下拉式天花板纜線704耦合至纜線安裝鉤103而安裝至天花板700，纜線安裝鉤103經附接至殼體102之背支撐件110，如圖2中所展示。在其他實施例中，殼體102可經構形以提供一壁式安裝選項及/或放置於一表演區域(諸如一舞台)前。
現在參考圖2至圖4，麥克風陣列總成100包含安裝於背支撐件110上之一控制箱114。如圖3及圖4中所展示，控制箱114含納電耦合至麥克風陣列104之一印刷電路板116(在本文中亦被稱為「音訊PCB」)。例如，音訊PCB 116可穿過自麥克風陣列104穿過背支撐件110中之一開口120垂直延伸之一板對板連接器118耦合至麥克風陣列104，或更具體言之，耦合至基板107，如圖3及圖4中所展示。在實施例中，音訊PCB 116可經構形為一音訊處理器(例如，通過硬體及/或軟體元件)以處理自麥克風陣列104接收且由麥克風陣列104擷取之音訊信號並產生一對應音訊輸出，如本文更詳細之討論。如所繪示，控制箱114可包含一可移除蓋122以提供至音訊PCB 116及/或控制箱114內之其他組件之接達。
在實施例中，麥克風陣列總成100包含機械耦合至控制箱114且經構形以將一纜線(未展示)電耦合至音訊PCB 116之一外部埠124。該纜線可為一資料、音訊及/或電力纜線，此取決於傳遞通過埠124之資訊類型。例如，在將纜線耦合至音訊PCB 116之一外部埠124之後，外部埠124可旋即經構形以自一外部控制裝置(例如，一音訊混合器、一音訊記錄器/放大器、一會議處理器、一橋接件等等)接收控制信號且將該等控制信號提供至音訊PCB 116。此外，埠124可經構形以將在音訊 PCB 116處自麥克風陣列104接收之音訊信號傳輸或輸出至外部控制裝置。在一些情況中，外部埠124可經構形以將來自一外部電源供應器(例如，一電池、壁式插座等等)之電力提供至音訊PCB 116及/或麥克風陣列104。在一較佳實施例中，外部埠124係經構形以接收一乙太網路纜線(例如，CAT5、CAT6等等)且將電力、音訊及控制連接性提供至麥克風陣列總成100之一乙太網路埠。在其他實施例中，外部埠124可包含數個埠及/或可包含任何其他類型之資料、音訊及/或電力埠，包含(例如)一通用串列匯流排(USB)埠、一迷你USB埠、一PS/2埠、一HDMI埠、一串列埠、一VGA埠等等。
現在參考圖1及圖3，麥克風陣列總成100進一步包含視覺上指示麥克風陣列104之一操作模式或狀態(例如，電源開啟、電源關閉、靜音、偵測到音訊等等)之一指示器126。如圖1中所展示，指示器126可整合至螢幕108中，使得指示器126在殼體102之前面之一外部上可見以為會議環境中之人類講話者或其他人自外部指示麥克風陣列104之操作模式。在實施例中，指示器126(在本文中亦被稱為「外部指示器」)包括至少一個光源(未展示)，諸如(例如)根據陣列式麥克風總成100之一操作模式(例如，電源開啟或關閉)而接通或切斷之一發光二極體(LED)。在一些實施例中，光指示器126可接通一第一光源以指示麥克風陣列總成100之一第一操作模式(例如，電源開啟)，接通一第二光源以指示一第二操作模式(例如，偵測到音訊)，使得在一些例項中，可同時接通兩個光源。在一較佳實施例中，指示器126包含安裝至一PCB 126a(在本文中亦被稱為「LED PCB」)之至少一個LED(未展示)及經構形以將光自LED光學引導至螢幕108外之一光導126b，如圖3中所展示。LED可經由將LED PCB 126a連接至麥克風PCB 107上之一連接器129之一纜線128而電耦合至麥克風陣列104，如圖3及圖5中所展示。
現在參考圖3及圖5，在實施例中，麥克風陣列總成100之基板107可包含一中心PCB 107a及圍繞該中心板定位以增加用於安裝麥克風106之一可用空間之一或多個周邊PCB 107b。例如，麥克風106之一部分可安裝於中心PCB 107a上且麥克風106之一剩餘部分可安裝於周邊PCB 107b上，如下文將更詳細之解釋。可使用一或多個板對板連接器130將周邊PCB 107b之各者耦合至中心PCB 107a。在一較佳實施例中，麥克風106皆安裝於基板107之一個平面中，如圖4中所展示。
一或多個周邊PCB 107b之數目、大小及形狀可取決於(例如)邊130之數目、中心PCB 107a之大小及/或形狀以及基板107之一總體形狀而改變。例如，在所繪示之實施例中，中心PCB 107a係具有七個一致邊132之一多邊形，且基板107包含在各周邊PCB 107b之一內端部134處分別耦合至各邊132之七個周邊PCB 107b。如所繪示，內端部134係一致地經定大小以匹配七個邊132之任何一者之平坦表面。各周邊PCB 107b可進一步包含相對於內端部134之一外端部136。在所繪示之實施例中，基板107經塑形為一圓圈，且因此彎曲各周邊PCB 107b之外端部136。
在其他實施例中，中心PCB 107a可具有其他總體形狀，包含(例如)其他類型之多邊形(例如，方形、矩形、三角形、五邊形等等)、一圓圈或一橢圓形。在此等情況中，周邊PCB 107b之內端部134可根據中心PCB 107a之邊132之大小及形狀定大小及塑形。例如，在一項實施例中，中心PCB 107可具有一圓形形狀使得彎曲邊132之各者且因此亦可彎曲周邊PCB 107b之內端部134。同樣地，在其他實施例中，基板107可具有其他總體形狀，包含(例如)一橢圓形或一多邊形，且據此可塑形周邊PCB 107b之外端部136。在其他實施例中，基板107可包含環繞一圓形中心PCB 107a之一圓環形周邊PCB 107b或包括全 部麥克風換能器106之一單一連續板107。
如圖5中所展示，在實施例中，該複數個麥克風106包含定位於中心PCB 107a之一中心點處之一中心麥克風106a及配置成環繞中心麥克風106a且定位於中心PCB 107a或周邊PCB 107b上之一分形或自相似構形之麥克風106b之一剩餘組合。至少部分歸因於麥克風106之類分形放置，陣列式麥克風104可達成跨語音頻率範圍之改良之指向性敏感度及一指定操縱角度範圍內之最大主旁瓣比。因此，麥克風陣列104可更精確地「聽到」來自一單一方向之信號且抑制非所要雜訊及/或干擾聲音，且可更有效地區分毗鄰人類講話者之間之差異。另外，麥克風構形之分形性質藉由添加更多麥克風及/或產生一較大尺寸之麥克風陣列104而允許陣列104之指向性可易於延伸至一更廣頻率範圍(例如，較低及/或較高頻率)。
更具體言之，在實施例中，麥克風106可配置成具有可變大小之同心圓形環圈以避免非所要拾取型樣(例如，歸因於光柵瓣)且適應一寬廣範圍之音訊頻率。如本文所使用，術語「環圈」可包含任何類型之圓形構形(例如，正圓、近乎正圓、勉強正圓等等)以及任何類型之橢圓形構形或其他橢圓形環。如圖5中所展示，環圈可定位於距中心麥克風106a或基板107之一中心點之各種徑向距離處以形成可漸進處置較低音訊頻率之一嵌套構形，其中最外之環圈經構形而最佳地以預定操作範圍中之最低頻率操作。可藉由使用諧波嵌套技術將同心環圈用於覆蓋操作頻率之一範圍內之一特定頻帶。
在實施例中，各環圈含有剩餘麥克風106b之一不同子組，且麥克風106b之各子組可沿對應環圈之一圓周定位於預定間隔處。一給定環圈內之相鄰麥克風106b之間之預定間隔或間距可取決於該環圈之一大小或直徑、包含於指派至該環圈之子組中之麥克風106b之數目及/或環圈中之麥克風106b之一所要敏感度或總聲音壓力。增加麥克風 106之數目及環圈之一麥克風密度(例如，歸因於環圈之嵌套)可幫助移除光柵瓣，且藉此利用跨預設範圍內之所有頻率之一接近恒定頻率回應產生一改良之波束寬度。
如將明白，圖5僅展示陣列式麥克風104之一例示性實施例且根據本文揭示之原理設想麥克風106之其他構形。例如，在一些實施例中，該複數個麥克風106可配置成圍繞一中心點之同心環圈，但無任何麥克風定位於中心點處(例如，無中心麥克風106a)。在其他實施例中，僅麥克風106之一部分可配置成同心環圈且麥克風106之剩餘部分可定位於離散環圈外或之間之各種點處、基板107上之隨機位置處或任何其他適合之配置中。
圖9通過圖表描繪根據某些實施例之可存在於一陣列式麥克風中之一例示性麥克風構形900。麥克風構形900可基本上類似於包含於麥克風陣列104中之麥克風106之自相似構形，除包含於陣列104之一最內環圈中之麥克風106b之數目外。如所展示，麥克風構形900包含定位於構形900之一中心處之一個麥克風902(例如，中心麥克風106a)及配置成七個同心環圈910至922之複數個麥克風906(例如，麥克風106b之剩餘組合)。為了便於解釋及繪示，繪製通過形成麥克風構形900之環圈之麥克風906之各群組之一圓圈。
為了容納麥克風906，麥克風構形900可安裝於複數個印刷電路板(未展示)上，類似於中心PCB 107a及複數個周邊PCB 107b。例如，現在亦參考圖5，麥克風906可包含：(i)麥克風902之一第一子組，其安裝於中心PCB 107a上以形成環繞中心麥克風906之一第一環圈910；(ii)麥克風906之一第二子組，其安裝於中心PCB 107a上以形成環繞第一環圈910之一第二環圈912；(iii)麥克風906之一第三子組，其安裝於中心PCB 107a上以形成環繞第二環圈912之一第三環圈914；(iv)麥克風906之一第四子組，其安裝於中心PCB 107a上以形成環繞 第三環圈914之一第四環圈916；(v)麥克風906之一第五子組，其安裝於周邊PCB 107b上以形成環繞第四環圈916之一第五環圈918；(vi)麥克風906之一第六子組，其安裝於周邊PCB 107b上以形成環繞第五環圈918之一第六環圈920；及(vii)麥克風906之一第七子組，其安裝於周邊PCB 107b上且靠近周邊PCB 107b之一邊緣以形成環繞第六環圈920之一第七環圈922。
在實施例中，包含於麥克風陣列中之環圈910至922之數目、各環圈之一直徑及/或相鄰環圈之間之徑向距離可取決於陣列式麥克風經構形以在其內操作之所要頻率範圍及將由各環圈覆蓋之該範圍之百分比而改變。在實施例中，麥克風陣列中之各環圈之直徑界定該環圈內之麥克風之子組可操作且不拾取非所要信號(例如，歸因於光柵瓣)之最低頻率。因而，最外環圈922之直徑可判定麥克風陣列之操作頻率範圍之一低端，且剩餘環圈直徑可藉由細分剩餘頻率範圍而判定。例如但不限制，在一些實施例中，麥克風陣列可經構形以覆蓋至少100赫茲(Hz)至至少10千赫(KHz)之一操作頻率範圍，其中各環圈覆蓋或促進覆蓋此範圍內之一不同倍頻帶或其他頻帶。舉一進一步實例而言，在此等實施例中，最外環圈922可經構形以覆蓋最低頻帶(例如，100Hz)，且剩餘環圈910至920(單獨或與一或多個其他環圈組合)可促進覆蓋剩餘倍頻帶或頻帶(例如，開始於200Hz、400Hz、800Hz、1600Hz、3200Hz及/或6400Hz之頻帶)。
如將明白，除陣列波束之一主瓣外，旁瓣亦可存在於一麥克風陣列之一極座標回應中，旁瓣係由在除所要波束角度外之角度處之非所要、無關拾取敏感度而引起。由於當操縱陣列波束時可改變旁瓣之量值及頻率敏感度，所以一旦將波束操縱至一不同方向時，相對於一主瓣通常具有十分小之旁瓣之一波束可具有一大得多之旁瓣回應。在一些情況中，處於某些頻率之旁瓣敏感度可甚至與主瓣敏感度匹敵。 然而，在實施例中，在麥克風陣列內包含更多麥克風906可增強一給定波束之主瓣且藉此減少旁瓣敏感度與主瓣敏感度之比率。
在實施例中，環圈910至922可相對於通過陣列之一中心(例如，中心麥克風902)之一中心軸930至少被輕微地旋轉，以最佳化該麥克風陣列之指向性。在此等情況中，麥克風陣列可經構形以約束對主瓣之麥克風敏感度，藉此最大化主瓣回應且減少旁瓣回應。在一些實施例中，環圈910至922可(例如)藉由將各環圈旋轉數個不同角度而彼此旋轉地偏置(offset)，使得軸向對準不超過任何兩個麥克風906。例如，在具有較少數目個麥克風之麥克風陣列中，此旋轉偏移可有利於減少當對準兩個以上麥克風時可發生之一非所要聲學信號拾取。在其他實施例中，例如，在具有大量麥克風之陣列中，可更任意地實施旋轉偏移(如果有)，及/或可利用其他方法來最佳化麥克風陣列之總體指向性。
返回參考圖5，在實施例中，周邊PCB 107b之各者可經一致地設計以流線製造及組裝。例如，如圖5中所展示，各周邊PCB 107b可具有一個一致形狀，且麥克風106b可被放置於各板107b上之等同位置中。依此方式，周邊PCB 107b之任何者可被耦合至連接器130之任何者，以將周邊PCB 107b電耦合至中心PCB 107a。例如，在所繪示之實施例中，麥克風PCB 107包含七個周邊PCB 107b，使得周邊PCB 107b之各者可包含一致位置中之八個麥克風。剩餘64個麥克風係包含於中心PCB 107a上，使得麥克風陣列104包含總共120個麥克風。
在實施例中，中心PCB 107a及/或周邊PCB 107b之各者上之麥克風106的總數目及/或麥克風106b的數目可取決於(例如)諧波嵌套之構形、陣列104之一預設操作頻率範圍、麥克風陣列104之一總體大小以及其他考量而改變。例如，在圖9中，麥克風構形900僅包含113個麥克風，或更具體言之，由112個麥克風906環繞一個中心麥克風，此係因為環圈910包含比圖5中之麥克風陣列104之對應環圈少七個麥克風 906。在某些實施例中，可利用極少至無頻率覆蓋或麥克風敏感度損耗來達成將此等七個麥克風自第一或最內環圈910移除。
在實施例中，可選擇經包含於環圈910至922之各者中之麥克風906的數目，以在麥克風構形900中產生一自相似或重複圖案。此可允許麥克風構形900易於藉由添加一或多個環圈以覆蓋更多音訊頻率而延伸，或易於藉由移除一或多個環圈以覆蓋更少頻率而減少。例如，在圖5及圖9之所繪示之實施例中，藉由將7個、14個或21個(例如，7之一倍數)麥克風106b/906放置於七個環圈910至922之各者中來形成一分形或自相似構形。其他實施例可包含麥克風106b/906之其他可重複配置(諸如，例如另一大於1之整數的倍數)或可簡化陣列式麥克風104之製造的任何其他圖案。例如，但不限制，在一項實施例中，內環圈910至920之各者中之麥克風906的數目可在兩個數之間(例如8與16之間)交替，而最外環圈922可包含任何數目之麥克風906(例如20個)。
如將明白，在其他實施例中，取決於(例如)各環圈之間之一所要距離、基板107之一總體大小、陣列104中之麥克風106之總數目、由陣列104覆蓋之一預設音訊頻率範圍以及其他與效能及/或製造相關之考量，麥克風106/906可被配置成其他構形形狀，諸如(例如)橢圓形、方形、矩形、三角形、五邊形或其他多邊形，其具有麥克風106/906之更多或更少子組或環圈，及/或在環圈910至922之各者中具有不同數目之麥克風106/906。
圖10繪示包括一陣列式麥克風系統1030及一控制裝置1032之一例示性音訊系統1000之一方塊圖。陣列式麥克風系統1030可類似於圖1至圖5中展示之陣列式麥克風總成100而構形或構形成其他構形。例如，陣列式麥克風系統1030可包含類似於陣列式麥克風104之一陣列式麥克風1034。陣列式麥克風系統1030亦可包含自陣列式麥克風1034 接收音訊信號且構形為一音訊記錄器、音訊混合器、放大器及/或用於處理由麥克風陣列1034擷取之音訊信號之其他組件之一音訊組件1036。在此等實施例中，音訊組件1036可至少部分包含於一印刷電路板(未展示)上，諸如(例如)音訊PCB 116。在其他實施例中，音訊組件1036定位於獨立於陣列式麥克風系統1030之音訊系統1000中，且陣列式麥克風系統1030(例如，控制裝置1032內)可與音訊組件1036有線或無線地通信。陣列式麥克風系統1030可進一步包含類似於指示器126之一指示器1038以視覺上指示陣列式麥克風系統1030之一前外部上之麥克風陣列1034之一操作模式。
控制裝置1032可與陣列式麥克風系統1030有線或無線地通信以控制音訊組件1036、麥克風陣列1034及/或指示器1038。例如，控制裝置1036可包含用以啟動或撤銷啟動麥克風陣列1034及/或指示器1038之控制件。控制裝置1036上之控制件可進一步使得能夠調整麥克風陣列1034之參數，諸如指向性、增益、雜訊抑制、拾取型樣、靜音、頻率回應等等。在實施例中，控制裝置1036可為一膝上型電腦、桌上電腦、平板電腦、智慧型電話、專屬裝置及/或其他類型之電子裝置。在其他實施例中，控制裝置1036可包含一或多個開關、調光器旋鈕、按鈕及類似者。
在一些實施例中，麥克風陣列系統1030包含用於促進系統1030與控制裝置1036及/或其他電腦裝置之間之無線通信(例如，藉由傳輸及/或接收RF信號)之一無線通信裝置1040(例如，一射頻(RF)傳輸器及/或接收器)。例如，無線通信可呈一類比或數位調變信號之形式且可含有由麥克風陣列1034擷取之音訊信號及/或自控制裝置1036接收之控制信號。在一些實施例中，無線通信裝置1040可包含用於通過與一遠端電腦裝置及/或伺服器之通信而促進網路會議及其他類似特徵之一內建網路伺服器。
在一些實施例中，陣列式麥克風系統1030包含類似於外部埠124之一外部埠(未展示)，且系統1030經由耦合至埠124之一纜線1042與控制裝置1036進行有線通信。在一項此實施例中，音訊系統1000進一步包含亦經由纜線1042耦合至陣列式麥克風系統1030之一電源供應器1044，使得纜線1042攜帶電力、控制及/或音訊系統1000之各種組件之間之音訊信號。在一較佳實施例中，纜線1042係一乙太網路纜線(例如，CAT5、CAT6等等)。在其他實施例中，電源供應器1044係經由一單獨電力纜線耦合至陣列式麥克風系統1030。
如所繪示，指示器1038可包含一第一光源1046及一第二光源1048。第一光源1046可經構形以藉由接通或切斷燈而指示麥克風陣列1034之一第一操作模式或狀態，且同樣地，第二光源1048可經構形以指示麥克風陣列1034之一第二操作模式。例如，第一光源1046可指示麥克風陣列系統1030是否具有電力(例如，若接通系統1030，則燈1046是否接通)，且第二光源1048可指示麥克風陣列1034是否已靜音(例如，若系統1030已設定為一靜音設定，則燈1048是否接通)。在其他情況中，光源1046、1048之至少一者可指示是否已自一外界音訊源接收音訊(例如在網路會議期間)。在一較佳實施例中，第一光源1046係具有一第一光色之一第一LED，且第二光源1048係具有不同於第一光色之一第二光色(例如，藍、綠、紅、白等等)之一第二LED。指示器1038可與控制裝置1032及/或音訊組件1036電子通信且由控制裝置1032及/或音訊組件1036控制(例如)以判定可由指示器1038指示哪種(些)操作模式且將哪個(些)色彩、哪個(些)LED或其他形式之指示指派至各操作模式。
在實施例中，音訊組件1036可經構形(例如，經由電腦程式化指令)以使得能夠調整麥克風陣列1034之參數，諸如指向性、增益、雜訊抑制、拾取模式、靜音、頻率回應等等。此外，音訊組件1036可包 含一音訊混合器(未展示)以使得能夠混合由麥克風陣列1034擷取之音訊信號(例如，組合、路由、改變及/或以其他方式操縱音訊信號)。音訊混合器可持續監測自麥克風陣列1034中之各麥克風接收之音訊信號；自動選擇由麥克風陣列1034針對一給定人類講話者形成之一合適(例如最佳)瓣；將選定之瓣直接朝向人類講話者自動定位或操縱；且輸出強調該所選定之瓣且同時抑制來自其他音訊源之信號之一音訊信號。
在實施例中，為了適應一些人類講話者同時講話(例如，在一董事會議環境中)之可能性，麥克風陣列1034可經構形以同時在圍繞麥克風陣列1034之任何角度處形成多達八個瓣(例如)以模擬一桌子邊之多達八個就座位置。由於其之麥克風構形(例如，麥克風構形900)，麥克風陣列1034可形成相對較窄之瓣(例如，如圖11中所展示)以拾取一環境中之較少非所要音訊信號(例如雜訊)。可操縱該等瓣以提供對定位於圍繞陣列1034之360度之任何點處之人類講話者之音訊拾取覆蓋。例如，音訊組件1036可經構形(例如，使用電腦程式化指令)以允許瓣經操縱或調整至覆蓋方位角、仰角及距離或半徑之一個三維空間中之任何點。在實施例中，在實體上不移動陣列1034之情況下可電子操縱麥克風陣列1034之波束圖案。
此外，音訊混合器可經構形以同時提供多達八個個別路由之輸出或通道(未展示)，各輸出對應於麥克風陣列1034之八個瓣之一各別者且藉由組合自麥克風陣列1034中之所有麥克風接收之輸入而產生。該音訊混合器亦可提供一第九自動混合輸出以擷取所有其他音訊信號。如將明白，麥克風陣列1034可經構形以具有任何數目之瓣。
根據實施例，麥克風陣列1034之瓣可經構形以具有允許當人類講話者在環境內移動時，音訊組件1036有效地追蹤且擷取來自人類講話者之音訊之一可調整波束寬度。在一些情況中，麥克風陣列系統 1030及/或控制裝置1032可包含允許手動波束寬度調整之一使用者控制件(未展示)。例如，該使用者控制件可為一旋鈕、滑件或可在三個設定之間調整之其他手動控制件：正常波束寬度、寬波束寬度及窄波束寬度。在其他情況中，可使用在音訊組件1036及/或控制裝置1032上運行之軟體來構形波束寬度控制件。
在其中包含多個麥克風陣列系統1030(例如)以覆蓋一十分大之會議室之環境中，音訊系統1000可包含一音訊混合器，該音訊混合器自包含於各麥克風陣列系統1030中之音訊組件1036接收輸出且基於該等所接收之音訊信號輸出一混合輸出。
音訊組件1036亦可包含與音訊混合器有線或無線通信之一音訊放大器/記錄器(未展示)。音訊放大器/記錄器可為自音訊混合器接收該等經混合之音訊信號且放大該等混合之音訊信號以輸出至一揚聲器、耳機、直播無線電或TV轉播等等及/或將該等接收之信號記錄至一媒體(諸如快閃記憶體、硬碟、固態驅動機、磁帶、光學媒體等等)上之一組件。例如，音訊放大器/記錄器可將聲音通過定位於環境600中之揚聲器傳播至一觀眾或經由一有線或無線連接傳播至一遠端環境。
圖10中展示之組件之間之連接意欲描繪經由有線及/或無線通信鏈接之控制信號、音訊信號及/或其他信號之潛在流。此等信號可呈數位及/或類比格式。
在實施例中，麥克風陣列1034包含配置成包括環繞一中心麥克風(例如麥克風902)之麥克風之同心嵌套環圈(例如，環圈910至922)之一自相似或重複構形之複數個MEMS麥克風(例如，麥克風906)。MEMS麥克風可係十分低成本且十分小定大小，此允許大量麥克風在一單一麥克風陣列中放置為緊接近。例如，在實施例中，麥克風陣列1034包含113個與120個之間之麥克風且具有小於兩英尺之一直徑(例 如以配接取代一個兩英尺乘兩英尺之天花板塊)。此外，藉由使用麥克風陣列1034中之MEMS麥克風，音訊組件1036可需要較少程式化及其他基於軟體之構形。更具體言之，由於MEMS麥克風產生呈一數位格式之音訊信號，所以音訊組件1036無需包含減少用以混合由麥克風擷取之音訊信號所需之處理量之類比轉數位轉換/調變技術。另外，麥克風陣列1034可固有地更能夠抑制振動雜訊，此係因為MEMS麥克風係優良壓力換能器但係較差機械換能器且相較於其他麥克風技術具有優良射頻抗擾力之事實。
圖11係根據實施例之一實例性麥克風極座標圖案1100之一圖式。極座標圖案1100表示一給定麥克風陣列(例如，麥克風陣列1034/104或具有麥克風構形900之一麥克風陣列)之指向性，或更具體言之，指示麥克風陣列對以圍繞麥克風陣列之一中心軸之不同角度到達之聲音係如何敏感。特定言之，極座標圖案1100展示在頻率500Hz、1000Hz、2000Hz、4000Hz及8000Hz之各者處之麥克風陣列之極座標回應，其中麥克風陣列經構形以在此等頻率之各者處形成一瓣1102或一指向性波束且將瓣1102操縱至相對於陣列平面之60度之一仰角。如將明白，儘管極座標圖1100展示在所選定之頻率處之一單一瓣1102之極座標回應，但麥克風陣列能夠沿多個方向同時產生多個瓣，其中各瓣具有等效或至少基本上類似之極座標回應。
如由極座標圖案1100所展示，在1000Hz頻率處，旁瓣1104以10分貝(dB)形成於主瓣1102下方。此外，如圖11中所展示，500Hz處之低頻率回應具有表示較低指向性之一大波束寬度，而在1000Hz、2000Hz、4000Hz及8000Hz處之較高頻率回應之各者具有表示高指向性之一窄波束寬度。因此，在實施例中，麥克風陣列可提供具有一高位準旁瓣抑制之跨語音頻率範圍之一高總體指向性指數(例如，19dB)及一指定操縱角度範圍內之一最佳主旁瓣比(例如，10dB)。
圖12繪示根據實施例組裝一陣列式麥克風之一實例性方法1200。該陣列式麥克風可基本上類似於圖5中展示之陣列式麥克風104及/或可包含配置成基本上類似於圖9中展示之麥克風構形900之一構形之複數個麥克風。陣列式麥克風可配置於一基板上，諸如(例如)一印刷電路板、一碳纖維板或任何其他適合之基板。在一些實施例中，該基板包含一中心板(例如，中心PCB 107a)及複數個周邊或衛星板(例如，周邊PCB 107b)。在此等情況中，方法1200可包含步驟1204，其中(例如)使用板對板連接器(例如連接器130)將周邊板電耦合至中心板。
在一些實施例中，方法1200包含：在步驟1206處，選擇將在各構形中包含的將放置於基板上之之麥克風(例如，麥克風106b/906)之總數目。在該構形包含數個同心環圈之情況下，可基於陣列之一所要頻率範圍、指派至環圈之一頻帶、陣列之一所要麥克風密度以及其他考量而選擇各環圈中之麥克風之數目，如本文所討論。在一項實施例中，總數目可自由大於1之一整數之一倍數之數字組成之一群組選擇。例如，針對圖5及圖9中展示之環圈，該整數係7，且各環圈包含7個、14個或21個麥克風。其他圖案或配置可驅使針對各構形選擇麥克風之總數目，如本文所描述。
如所繪示，方法1200包含：在步驟1208處，在基板上將第一複數個麥克風配置成一第一構形。方法1200亦包含：在步驟1210處，在該基板上將第二複數個麥克風配置成一第二構形，該第二構形同心環繞該第一構形。在一些實施例中，方法1200可另外包含：在步驟1212處，在基板上將第三複數個麥克風配置成一第三構形，該第三構形同心環繞該第二構形。
在實施例中，第一構形、第二構形及/或第三構形之各者包括定位於距基板之一中心點不同徑向距離處之數個同心環圈以形成一嵌套 構形。在一些情況中，第一構形包含與第二構形及第三構形之至少一者數個不同之同心環圈。例如，在圖9之所繪示之實施例中，第一構形包括至少最內環圈910、第二環圈912及第三環圈914；第二構形包括至少第四環圈916及第五環圈918；且第三構形包括至少第六環圈920及最外環圈922。在構形之各者中，配置麥克風可包含：針對各同心環圈沿該環圈之一圓周在預定間隔處配置麥克風之一子組。在一些實施例中，第一構形進一步包含基板之中心點，且該第一複數個麥克風之至少一者定位於該中心點處。此外，在一些實施例中，包含於第二構形中之環圈之至少一者可定位於周邊板上。此外，在一些實施例中，第三構形可完全定位於周邊板上。
在一些實施例中，方法1200可包含：在步驟1214處，使得第一構形、第二構形、第三構形及第四構形之至少一者相對於陣列式麥克風之一中心軸(例如，中心軸930)旋轉，使得該等構形彼此至少輕微旋轉偏移以改良陣列式麥克風之總體指向性。方法1200亦可包含：在步驟1216處，將麥克風之各者電耦合至一音訊處理器以用於處理由麥克風擷取之音訊信號。
在實施例中，該第一複數個、該第二複數個及/或該第三複數個麥克風經構形以覆蓋不同預設頻率範圍，或在一些情況中，覆蓋陣列式麥克風之一總體操作範圍內之倍頻帶(例如但不限制於100Hz至10KHz)。根據實施例，可由指派至形成環圈之麥克風之一最低操作頻率界定各同心環圈之一直徑。在一些情況中，包含於第一構形、第二構形及/或第三構形中之同心環圈係諧波嵌套的。在一較佳實施例中，麥克風陣列包含複數個MEMS麥克風。
圖中之任何程序描述或方塊應理解為表示包含用於實施程序中之特定邏輯功能或步驟之一或多個可執行指令之程式碼之模組、片段或部分，且替代實施方案包含於其中可不按所展示或討論之順序，包 含基本上同時或按反序(此取決於所涉及之功能性)，執行功能之本發明之實施例之範疇內，如將由一般技術者所瞭解。
本發明意欲解釋如何根據技術塑造且使用各種實施例而非限制本發明之真實、預期且合理之範疇及精神。以上描述不意欲為排他性或受限於所揭示之精確形式。鑒於以上教示，修改或變動係可行的。選擇且描述(若干)實施例以提供對所描述之技術之原理及其實際應用之最佳繪示，且使得一般技術者能夠利用各種實施例中之技術且設想適合特定用途之各種修改。所有此等修改及變動係在由隨附申請專利範圍判定之實施例之範疇內，當根據其等所合理、合法及公正地授權之廣度解譯時，可在此專利申請案及其全部等效物之未決期間改正該等修改及變動。
100‧‧‧麥克風陣列總成/總成/陣列式麥克風總成
104‧‧‧陣列式麥克風/麥克風陣列/陣列/麥克風總成
105‧‧‧支座
106‧‧‧麥克風換能器/麥克風
107a‧‧‧中心印刷電路板
107b‧‧‧周邊印刷電路板/圓環形周邊印刷電路板
108‧‧‧可透聲螢幕/螢幕/格柵
110‧‧‧背板/支撐件/背支撐件/背部分
111‧‧‧隔膜/發泡體隔膜
112‧‧‧側軌
116‧‧‧印刷電路板/音訊印刷電路板
118‧‧‧板對板連接器
120‧‧‧開口
122‧‧‧可移除蓋
124‧‧‧外部埠/埠
126a‧‧‧印刷電路板/發光二極體印刷電路板
126b‧‧‧光導
128‧‧‧纜線
129‧‧‧連接器
130‧‧‧邊/板對板連接器/連接器
132‧‧‧邊
134‧‧‧內端部
136‧‧‧外端部

Claims (24)

  1. 一種陣列式麥克風系統，其包括：一基板；及複數個麥克風，其等在該基板上經配置成數個具有不同大小的同心嵌套環圈，各環圈包括沿該環圈之一圓周經定位於預定間隔處之該複數個麥克風之一子組，其中該等環圈係諧波嵌套的且相對於該基板之一中心軸彼此旋轉偏置。
  2. 如請求項1之陣列式麥克風系統，其中該等環圈經定位於距該中心軸之一中心點之不同諧波相關的徑向距離處，以形成該諧波嵌套構形。
  3. 如請求項1之陣列式麥克風系統，其中該複數個麥克風係微電機械系統(MEMS)麥克風。
  4. 如請求項2之陣列式麥克風系統，其中各同心嵌套環圈形成一圓圈。
  5. 如請求項2之陣列式麥克風系統，其中各環圈之該徑向距離係基於經指派至被包含於該環圈中之麥克風之該子組之一最低操作頻率來判定。
  6. 如請求項1之陣列式麥克風系統，其中同心嵌套環圈之數目係7個。
  7. 如請求項1之陣列式麥克風系統，其中該複數個麥克風包含至少113個麥克風。
  8. 如請求項1之陣列式麥克風系統，其中各環圈包括預定數目個麥克風，該預定數目係選自由大於1之一整數之倍數之數字組成之一群組。
  9. 如請求項1之陣列式麥克風系統，進一步包括一處理器，該處理 器經電耦合至該基板，且經構形以接收由該複數個麥克風之各者擷取之音訊信號，且基於該等接收之信號來產生一輸出。
  10. 如請求項9之陣列式麥克風系統，其中該處理器經構形以基於該等接收之音訊信號而同時產生多個音訊輸出。
  11. 如請求項1之陣列式麥克風系統，進一步包括一外部指示器，該外部指示器經耦合至該基板，且經構形以指示該陣列式麥克風系統之一操作模式。
  12. 如請求項1之陣列式麥克風系統，其中該基板包括一中心印刷電路板(PCB)及經圍繞該中心PCB徑向定位且經電連接至該中心PCB之複數個周邊印刷電路板(PCB)，該數個同心嵌套環圈之至少一者係定位於該複數個周邊PCB上。
  13. 如請求項1之陣列式麥克風系統，進一步包括配置於該中心軸之一中心點處之至少一麥克風。
  14. 如請求項1之陣列式麥克風系統，其中各環圈從該中心軸旋轉偏置數個不同角度。
  15. 如請求項8之陣列式麥克風系統，其中該整數為奇數。
  16. 一種組裝一陣列式麥克風之方法，其包括：配置第一複數個麥克風，以在一基板上形成一第一構形；配置第二複數個麥克風，以在該基板上形成一第二構形，該第二構形同心地環繞該第一構形；使該第一構形及該第二構形之至少一者相對於該陣列式麥克風之一中心軸旋轉；且將該第一複數個麥克風及該第二複數個麥克風之各者電耦合至一音訊處理器，用於處理由該等麥克風擷取之音訊信號，其中該第一構形及該第二構形係諧波嵌套的。
  17. 如請求項16之方法，其中該第一構形及該第二構形之各者包括 經定位於距該基板之一中心點之不同諧波相關的徑向距離處之數個同心環圈，以形成該諧波嵌套構形。
  18. 如請求項17之方法，其中配置該第一複數個麥克風包含：針對該數個同心環圈之各者，將該第一複數個麥克風之一子組沿該環圈之一圓周配置於預定間隔處。
  19. 如請求項17之方法，其中該第一構形進一步包括該基板之該中心點，且配置該第一複數個麥克風包含：將該第一複數個麥克風之至少一者配置於該中心點處。
  20. 如請求項17之方法，其中該第一構形包含與該第二構形數目不同之同心環圈。
  21. 如請求項16之方法，其中該等麥克風係微電機械系統(MEMS)麥克風。
  22. 如請求項17之方法，其中各環圈包括預定數目個麥克風，該預定數目係選自由大於1之一整數之倍數之數字組成之一群組。
  23. 如請求項19之方法，其中該整數為奇數。
  24. 如請求項17之方法，其中各同心環圈從該中心軸旋轉偏置數個不同角度。
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