TWI484513B - 層壓電磁元件總成 - Google Patents
層壓電磁元件總成 Download PDFInfo
- Publication number
- TWI484513B TWI484513B TW099114240A TW99114240A TWI484513B TW I484513 B TWI484513 B TW I484513B TW 099114240 A TW099114240 A TW 099114240A TW 99114240 A TW99114240 A TW 99114240A TW I484513 B TWI484513 B TW I484513B
- Authority
- TW
- Taiwan
- Prior art keywords
- coil
- magnetic
- component assembly
- electromagnetic component
- magnet
- Prior art date
Links
- 230000005291 magnetic effect Effects 0.000 claims description 141
- 239000010410 layer Substances 0.000 claims description 113
- 239000000696 magnetic material Substances 0.000 claims description 59
- 239000004020 conductor Substances 0.000 claims description 45
- 239000000463 material Substances 0.000 claims description 35
- 239000002245 particle Substances 0.000 claims description 25
- 239000000843 powder Substances 0.000 claims description 13
- 230000004907 flux Effects 0.000 claims description 9
- 239000006247 magnetic powder Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 230000004888 barrier function Effects 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- 239000005300 metallic glass Substances 0.000 claims description 3
- 229920005596 polymer binder Polymers 0.000 claims description 3
- 239000002491 polymer binding agent Substances 0.000 claims description 3
- 230000004913 activation Effects 0.000 claims description 2
- 238000001994 activation Methods 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 238000000137 annealing Methods 0.000 claims description 2
- 238000003475 lamination Methods 0.000 claims description 2
- 239000011344 liquid material Substances 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 238000007725 thermal activation Methods 0.000 claims description 2
- 239000000306 component Substances 0.000 description 122
- 238000000034 method Methods 0.000 description 35
- 238000004519 manufacturing process Methods 0.000 description 34
- 230000000712 assembly Effects 0.000 description 18
- 238000000429 assembly Methods 0.000 description 18
- 238000004804 winding Methods 0.000 description 17
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- 230000008901 benefit Effects 0.000 description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 239000011230 binding agent Substances 0.000 description 8
- 238000010276 construction Methods 0.000 description 6
- 238000009413 insulation Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 239000006249 magnetic particle Substances 0.000 description 5
- 239000000956 alloy Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000000465 moulding Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229910017082 Fe-Si Inorganic materials 0.000 description 2
- 229910017133 Fe—Si Inorganic materials 0.000 description 2
- 229910003271 Ni-Fe Inorganic materials 0.000 description 2
- 238000010923 batch production Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- -1 iron-bismuth aluminum Chemical compound 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 229910003296 Ni-Mo Inorganic materials 0.000 description 1
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- DDTIGTPWGISMKL-UHFFFAOYSA-N molybdenum nickel Chemical compound [Ni].[Mo] DDTIGTPWGISMKL-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000009417 prefabrication Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/0206—Manufacturing of magnetic cores by mechanical means
- H01F41/0233—Manufacturing of magnetic circuits made from sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/33—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials mixtures of metallic and non-metallic particles; metallic particles having oxide skin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F3/00—Cores, Yokes, or armatures
- H01F3/10—Composite arrangements of magnetic circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2847—Sheets; Strips
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49073—Electromagnet, transformer or inductor by assembling coil and core
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Manufacturing & Machinery (AREA)
- Dispersion Chemistry (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17526909P | 2009-05-04 | 2009-05-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201101352A TW201101352A (en) | 2011-01-01 |
| TWI484513B true TWI484513B (zh) | 2015-05-11 |
Family
ID=42270089
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099114240A TWI484513B (zh) | 2009-05-04 | 2010-05-04 | 層壓電磁元件總成 |
| TW099114255A TWI588849B (zh) | 2009-05-04 | 2010-05-04 | 層壓磁性元件總成 |
| TW099114241A TW201108269A (en) | 2009-05-04 | 2010-05-04 | Low profile layered coil and cores for magnetic components |
| TW099114251A TW201110164A (en) | 2009-05-04 | 2010-05-04 | Miniature shielded magnetic component and methods of manufacture |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099114255A TWI588849B (zh) | 2009-05-04 | 2010-05-04 | 層壓磁性元件總成 |
| TW099114241A TW201108269A (en) | 2009-05-04 | 2010-05-04 | Low profile layered coil and cores for magnetic components |
| TW099114251A TW201110164A (en) | 2009-05-04 | 2010-05-04 | Miniature shielded magnetic component and methods of manufacture |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20100277267A1 (enExample) |
| EP (7) | EP2427895A1 (enExample) |
| JP (8) | JP6002035B2 (enExample) |
| KR (6) | KR20120018157A (enExample) |
| CN (7) | CN105529175A (enExample) |
| ES (1) | ES2413632T3 (enExample) |
| TW (4) | TWI484513B (enExample) |
| WO (6) | WO2010129228A1 (enExample) |
Families Citing this family (101)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7791445B2 (en) | 2006-09-12 | 2010-09-07 | Cooper Technologies Company | Low profile layered coil and cores for magnetic components |
| US8941457B2 (en) | 2006-09-12 | 2015-01-27 | Cooper Technologies Company | Miniature power inductor and methods of manufacture |
| US8466764B2 (en) | 2006-09-12 | 2013-06-18 | Cooper Technologies Company | Low profile layered coil and cores for magnetic components |
| US9589716B2 (en) | 2006-09-12 | 2017-03-07 | Cooper Technologies Company | Laminated magnetic component and manufacture with soft magnetic powder polymer composite sheets |
| US8378777B2 (en) | 2008-07-29 | 2013-02-19 | Cooper Technologies Company | Magnetic electrical device |
| US9558881B2 (en) | 2008-07-11 | 2017-01-31 | Cooper Technologies Company | High current power inductor |
| US8659379B2 (en) | 2008-07-11 | 2014-02-25 | Cooper Technologies Company | Magnetic components and methods of manufacturing the same |
| US9859043B2 (en) | 2008-07-11 | 2018-01-02 | Cooper Technologies Company | Magnetic components and methods of manufacturing the same |
| CN104051133B (zh) * | 2011-01-07 | 2020-03-10 | 乾坤科技股份有限公司 | 电感器 |
| CN102592781B (zh) * | 2011-01-07 | 2016-06-29 | 乾坤科技股份有限公司 | 电感器 |
| US8610533B2 (en) * | 2011-03-31 | 2013-12-17 | Bose Corporation | Power converter using soft composite magnetic structure |
| US8704408B2 (en) | 2011-04-14 | 2014-04-22 | National Instruments Corporation | Switch matrix modeling system and method |
| US9157952B2 (en) | 2011-04-14 | 2015-10-13 | National Instruments Corporation | Switch matrix system and method |
| US9097757B2 (en) | 2011-04-14 | 2015-08-04 | National Instruments Corporation | Switching element system and method |
| TWI430720B (zh) | 2011-11-16 | 2014-03-11 | Ind Tech Res Inst | 多層微型線圈總成 |
| US10128035B2 (en) * | 2011-11-22 | 2018-11-13 | Volterra Semiconductor LLC | Coupled inductor arrays and associated methods |
| US9373438B1 (en) * | 2011-11-22 | 2016-06-21 | Volterra Semiconductor LLC | Coupled inductor arrays and associated methods |
| TWM438075U (en) * | 2012-04-19 | 2012-09-21 | Sea Sonic Electronics Co Ltd | Power supply power filter output architecture |
| EP2660611A1 (en) * | 2012-04-30 | 2013-11-06 | LEM Intellectual Property SA | Electrical current transducer module |
| US9287062B2 (en) | 2012-05-02 | 2016-03-15 | National Instruments Corporation | Magnetic switching system |
| US9558903B2 (en) | 2012-05-02 | 2017-01-31 | National Instruments Corporation | MEMS-based switching system |
| JP6050667B2 (ja) * | 2012-12-04 | 2016-12-21 | デクセリアルズ株式会社 | コイルモジュール、非接触電力伝送用アンテナユニット、及び電子機器 |
| CN103871724B (zh) * | 2012-12-18 | 2016-09-28 | 佳邦科技股份有限公司 | 功率电感及其制造方法 |
| JP2014130879A (ja) * | 2012-12-28 | 2014-07-10 | Panasonic Corp | コイル埋設型磁性素子の製造方法 |
| US8723629B1 (en) * | 2013-01-10 | 2014-05-13 | Cyntec Co., Ltd. | Magnetic device with high saturation current and low core loss |
| KR20140094324A (ko) * | 2013-01-22 | 2014-07-30 | 삼성전기주식회사 | 공통모드필터 및 이의 제조방법 |
| US10840005B2 (en) * | 2013-01-25 | 2020-11-17 | Vishay Dale Electronics, Llc | Low profile high current composite transformer |
| KR101451503B1 (ko) * | 2013-03-25 | 2014-10-15 | 삼성전기주식회사 | 인덕터 및 그 제조 방법 |
| TW201444052A (zh) * | 2013-05-15 | 2014-11-16 | Inpaq Technology Co Ltd | 薄型疊層式功率電感製程之改進 |
| JP2015026812A (ja) * | 2013-07-29 | 2015-02-05 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | チップ電子部品及びその製造方法 |
| KR101450471B1 (ko) * | 2013-08-27 | 2014-10-13 | 주식회사 두산 | 배치 경화 방식을 이용하는 연성 금속박 적층판의 제조방법 |
| KR101449518B1 (ko) * | 2013-09-10 | 2014-10-16 | 주식회사 아모텍 | 파워 인덕터 및 그의 제조방법 |
| KR101334653B1 (ko) * | 2013-09-11 | 2013-12-05 | 신우이.엔.지 주식회사 | 복합 자성 코아 및 그 제조방법 |
| JP5944373B2 (ja) * | 2013-12-27 | 2016-07-05 | 東光株式会社 | 電子部品の製造方法、電子部品 |
| KR20150080797A (ko) * | 2014-01-02 | 2015-07-10 | 삼성전기주식회사 | 세라믹 전자 부품 |
| GB2538471B (en) | 2014-03-04 | 2020-10-21 | Murata Manufacturing Co | Inductor device, inductor array, and multilayered substrate, and method for manufacturing inductor device |
| KR101548862B1 (ko) * | 2014-03-10 | 2015-08-31 | 삼성전기주식회사 | 칩형 코일 부품 및 그 제조 방법 |
| DE102014207635A1 (de) * | 2014-04-23 | 2015-10-29 | Würth Elektronik eiSos Gmbh & Co. KG | Verfahren zum Herstellen eines Induktionsbauteils und Induktionsbauteil |
| CN105091051A (zh) * | 2014-05-09 | 2015-11-25 | 名硕电脑(苏州)有限公司 | 薄型化底盘及具有薄型化底盘的电磁炉 |
| US9831023B2 (en) * | 2014-07-10 | 2017-11-28 | Cyntec Co., Ltd. | Electrode structure and the corresponding electrical component using the same and the fabrication method thereof |
| JP6522297B2 (ja) * | 2014-07-28 | 2019-05-29 | 太陽誘電株式会社 | コイル部品 |
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| US10049808B2 (en) * | 2014-10-31 | 2018-08-14 | Samsung Electro-Mechanics Co., Ltd. | Coil component assembly for mass production of coil components and coil components made from coil component assembly |
| CN105679520B (zh) * | 2014-11-17 | 2019-04-19 | 华为技术有限公司 | 耦合电感、磁体和多电平逆变器 |
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| US10998124B2 (en) | 2016-05-06 | 2021-05-04 | Vishay Dale Electronics, Llc | Nested flat wound coils forming windings for transformers and inductors |
| KR20180023163A (ko) * | 2016-08-25 | 2018-03-07 | 현대자동차주식회사 | 트랜스 인덕터 및 이를 이용한 전력 변환 장치 |
| JP7160438B2 (ja) | 2016-08-31 | 2022-10-25 | ヴィシェイ デール エレクトロニクス エルエルシー | 低い直流抵抗を有す高電流コイルを備えた誘導子 |
| JP6872342B2 (ja) * | 2016-10-18 | 2021-05-19 | 株式会社ディスコ | 切削ブレード |
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| US10340074B2 (en) | 2016-12-02 | 2019-07-02 | Cyntec Co., Ltd. | Transformer |
| WO2018117595A1 (en) * | 2016-12-20 | 2018-06-28 | Lg Innotek Co., Ltd. | Magnetic core, coil component, and electronic component including same |
| US10396016B2 (en) * | 2016-12-30 | 2019-08-27 | Texas Instruments Incorporated | Leadframe inductor |
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