JP2012526387A - 磁性部品用の薄型層状コイル及びコア - Google Patents
磁性部品用の薄型層状コイル及びコア Download PDFInfo
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- JP2012526387A JP2012526387A JP2012509843A JP2012509843A JP2012526387A JP 2012526387 A JP2012526387 A JP 2012526387A JP 2012509843 A JP2012509843 A JP 2012509843A JP 2012509843 A JP2012509843 A JP 2012509843A JP 2012526387 A JP2012526387 A JP 2012526387A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/0206—Manufacturing of magnetic cores by mechanical means
- H01F41/0233—Manufacturing of magnetic circuits made from sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/33—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials mixtures of metallic and non-metallic particles; metallic particles having oxide skin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F3/00—Cores, Yokes, or armatures
- H01F3/10—Composite arrangements of magnetic circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2847—Sheets; Strips
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49073—Electromagnet, transformer or inductor by assembling coil and core
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Manufacturing & Machinery (AREA)
- Dispersion Chemistry (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
Description
従来、インダクタ及びトランスを含めて(ただし、これに限定されない)磁性部品は、磁気コアの周りに配置された導電性巻線を利用する。回路基板用の既存の磁性部品において、磁性部品は、時にドラムと呼ばれる薄型磁気コアの上にらせん状に巻かれた細いワイヤを使って製作できる。しかし、小さいコアの場合、ドラムの周りにワイヤを巻くことは難しい。代表的装置において、磁性部品は0.65mm未満の小さい側面高さを持つことが望ましい。このサイズのコアにワイヤコイルを巻こうとすると、部品の製造コストが増大する傾向があり、もっとコストの低い解決法が望まれる。
図1は、本発明の利点が実証される磁性部品またはデバイス100の第一の例証的実施形態の上面図である。代表的実施形態において、デバイス100はインダクタであるが、下に説明する本発明の利点は他の種類のデバイスにも生じることが分かる。下に説明する材料及び技法は、薄型インダクタの製造に特に有利であると思われるが、インダクタ100は本発明の利点が認められる電気部品の1つの種類に過ぎない。従って、下の説明は単なる例証のためのものであり、本発明の利点は他のサイズ及びタイプのインダクタ並びにトランスを含めて(ただし、これに限定されない)他の受動電子部品にも生じることが想定される。従って、本明細書に示される発明概念の実施を本明細書において説明され図面に示される例証的実施形態に限定する意図はない。
上に開示する概念は、さらに、下記の代表的実施形態において拡大され、小型インダクタ及びトランス部品を含めて(ただし、これに限定されない)従来の磁性部品組立体よりさらに付加的な利点及び長所を与える。明確には、下に説明するように、薄型磁性部品を形成する際に上述の誘電体層を使用する代わりに、磁気シート層を利用して、さらなる性能上の利点を与えることができる。
本発明の長所及び利点は充分に論証されたと思う。
Claims (27)
- 中央エリアと前記中央エリアの周りに延びる所定数の巻きとを有するコイル巻線を形成する、少なくとも1つのコイルと、
前記コイル層を囲繞し埋め込む本体であり、該本体が誘電材料及び磁性材料の一方から製作される、本体と、
少なくとも前記コイル層の前記中央エリア及び前記本体の中央エリアを占める磁気コア材であり、前記本体と該磁気コア材の電気特性及び磁気特性が相互に異なる、磁気コア材と、
を備える、磁性部品組立体。 - 前記本体が、第一層を含み、前記第一層が磁気コア材導入のためのレセプタクルを形成するコア用開口を含むことを特徴とする、請求項1に記載の磁性部品組立体。
- 前記本体が、さらに、第二層を含み、前記第一層及び第二層の両方が、前記第一層及び第二層を通過して延びるコア用開口を備えることを特徴とする、請求項2に記載の磁性部品組立体。
- 前記少なくとも1つのコイル層が前記中央エリアにおいて前記コイル層を通過して延びるコア用開口を含むことを特徴とする、請求項3に記載の磁性部品組立体。
- 前記磁気コア材が、前記第一層及び第二層と別個に用意された磁気コア素子を含み、前記磁気コア素子が、前記第一及び第二磁性シートの前記コア用開口及び前記少なくとも1つのコイル層の前記コア用開口を通過して延びることを特徴とする、請求項4に記載の磁性部品組立体。
- 前記磁気コア材がドラムコア及びロッドコアの一方に形成されることを特徴とする、請求項5に記載の磁性部品組立体。
- 前記本体が第一磁性材料から製作されたコイル部と、第二磁性材料から製作された外面部とを備え、前記第二磁性材料が前記第一磁性材料とは異なる磁気特性を有することを特徴とする、請求項6に記載の磁性部品組立体。
- 前記磁気コア材が第三磁性材料から製作され、前記第三磁性材料が前記第一及び第二磁性材料とは異なる磁気特性を有することを特徴とする、請求項7に記載の磁性部品組立体。
- 前記磁気コア材が、前記磁性体の前記外面部の間に実質的に全体的に埋め込まれる中央部を含むことを特徴とする、請求項6に記載の磁性部品組立体。
- 前記第一層及び第二層の両方が磁性材料を含み、前記第一層及び第二層の前記磁気コア材が前記磁気コア素子とは異なる磁気特性を有することを特徴とする、請求項5に記載の磁性部品組立体。
- 前記少なくとも1つのコイル層が両面コイルを備えることを特徴とする、請求項1に記載の磁性部品組立体。
- 前記少なくとも1つのコイル層がフレキシブル回路コイルを備えることを特徴とする、請求項1に記載の磁性部品組立体。
- 前記フレキシブル回路コイルが少なくとも1つの端子パッドを含むことを特徴とする、請求項12に記載の磁性部品組立体。
- 前記少なくとも1つのコイルが複数の離間したコイル層を備えることを特徴とする、請求項1に記載の磁性部品組立体。
- 前記離間したコイル層が少なくとも1つのバイア( via )によって接続されることを特徴とする、請求項14に記載の磁性部品組立体。
- 前記本体が第一層を含み、前記第一層がポリマーを主原料とするフィルムから成ることを特徴とする、請求項1に記載の磁性部品組立体。
- 前記ポリマーを主原料とするフィルムがポリイミドフィルムであることを特徴とする、請求項16に記載の磁性部品組立体。
- 前記本体が第一層を含み、前記第一層が液晶ポリマーを含むことを特徴とする、請求項1に記載の磁性部品組立体。
- 前記少なくとも1つのコイル層が、前記第一層及び第二層から独立して形成された電気鋳造コイル巻線を備えることを特徴とする、請求項1に記載の磁性部品組立体。
- 前記本体が第一層を含み、前記第一層が成形可能磁性材料を含むことを特徴とする、請求項1に記載の磁性部品組立体。
- 前記成形可能磁性材料が、フェライト粒子、鉄(Fe)粒子、センダスト(Fe−Si−Al)粒子、MPP(Ni−Mo−Fe)粒子、HighFlux(Ni−Fe)粒子、Megaflux(Fe−Si合金)粒子、鉄を主原料とするアモルフォス粉末粒子、コバルトを主原料とするアモルフォス粉末粒子及びこれらの同等物及び組合せの少なくとも1つを含むことを特徴とする、請求項20に記載の磁性部品組立体。
- 前記本体が第二層を含み、前記第二層が成形可能磁性材料を含むことを特徴とする、請求項21に記載の磁性部品組立体。
- 前記第二層の前記成形可能磁性材料が前記第一層の前記成形可能磁性材料と異なる磁気特性を有することを特徴とする、請求項22に記載の磁性部品組立体。
- さらに、表面実装端子を備える、請求項1に記載の磁性部品組立体。
- 前記磁性部品組立体がインダクタであることを特徴とする、請求項1に記載の磁性部品組立体。
- 前記インダクタが小型インダクタであることを特徴とする、請求項1に記載の磁性部品組立体。
- 前記本体がスタック磁性体層を備え、かつ前記磁気コア材が前記磁性体層と一体的に設置されることを特徴とする、請求項1に記載の磁性部品組立品。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17526909P | 2009-05-04 | 2009-05-04 | |
US61/175,269 | 2009-05-04 | ||
PCT/US2010/032787 WO2010129344A1 (en) | 2009-05-04 | 2010-04-28 | Low profile layered coil and cores for magnetic components |
Publications (2)
Publication Number | Publication Date |
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JP2012526387A true JP2012526387A (ja) | 2012-10-25 |
JP2012526387A5 JP2012526387A5 (ja) | 2013-06-20 |
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Family Applications (8)
Application Number | Title | Priority Date | Filing Date |
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JP2012509834A Expired - Fee Related JP6002035B2 (ja) | 2009-05-04 | 2010-04-26 | 磁気構成要素及び前記磁気構成要素の製造方法 |
JP2012509833A Expired - Fee Related JP5711219B2 (ja) | 2009-05-04 | 2010-04-26 | 磁気部品とその製造方法 |
JP2012509837A Pending JP2012526385A (ja) | 2009-05-04 | 2010-04-27 | 表面実装磁性部品及びその製造方法 |
JP2012509843A Pending JP2012526387A (ja) | 2009-05-04 | 2010-04-28 | 磁性部品用の薄型層状コイル及びコア |
JP2012509846A Expired - Fee Related JP5557902B2 (ja) | 2009-05-04 | 2010-04-28 | 磁気構成要素組立体 |
JP2012509845A Expired - Fee Related JP5699133B2 (ja) | 2009-05-04 | 2010-04-28 | 表面実装磁性部品及びその製造方法 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101450471B1 (ko) * | 2013-08-27 | 2014-10-13 | 주식회사 두산 | 배치 경화 방식을 이용하는 연성 금속박 적층판의 제조방법 |
US11166349B2 (en) | 2016-03-02 | 2021-11-02 | I.R.C.A. S.P.A.—Industria Resistenze Corazzate E Affini | Induction hob and method for making induction hobs |
Families Citing this family (89)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8941457B2 (en) | 2006-09-12 | 2015-01-27 | Cooper Technologies Company | Miniature power inductor and methods of manufacture |
US8378777B2 (en) | 2008-07-29 | 2013-02-19 | Cooper Technologies Company | Magnetic electrical device |
US9589716B2 (en) | 2006-09-12 | 2017-03-07 | Cooper Technologies Company | Laminated magnetic component and manufacture with soft magnetic powder polymer composite sheets |
US7791445B2 (en) | 2006-09-12 | 2010-09-07 | Cooper Technologies Company | Low profile layered coil and cores for magnetic components |
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US9859043B2 (en) | 2008-07-11 | 2018-01-02 | Cooper Technologies Company | Magnetic components and methods of manufacturing the same |
US9558881B2 (en) | 2008-07-11 | 2017-01-31 | Cooper Technologies Company | High current power inductor |
CN102592781B (zh) * | 2011-01-07 | 2016-06-29 | 乾坤科技股份有限公司 | 电感器 |
CN104051133B (zh) * | 2011-01-07 | 2020-03-10 | 乾坤科技股份有限公司 | 电感器 |
US8610533B2 (en) * | 2011-03-31 | 2013-12-17 | Bose Corporation | Power converter using soft composite magnetic structure |
US9157952B2 (en) | 2011-04-14 | 2015-10-13 | National Instruments Corporation | Switch matrix system and method |
US9097757B2 (en) | 2011-04-14 | 2015-08-04 | National Instruments Corporation | Switching element system and method |
US8704408B2 (en) | 2011-04-14 | 2014-04-22 | National Instruments Corporation | Switch matrix modeling system and method |
TWI430720B (zh) | 2011-11-16 | 2014-03-11 | Ind Tech Res Inst | 多層微型線圈總成 |
US10128035B2 (en) * | 2011-11-22 | 2018-11-13 | Volterra Semiconductor LLC | Coupled inductor arrays and associated methods |
US9373438B1 (en) * | 2011-11-22 | 2016-06-21 | Volterra Semiconductor LLC | Coupled inductor arrays and associated methods |
TWM438075U (en) * | 2012-04-19 | 2012-09-21 | Sea Sonic Electronics Co Ltd | Power supply power filter output architecture |
EP2660611A1 (en) * | 2012-04-30 | 2013-11-06 | LEM Intellectual Property SA | Electrical current transducer module |
US9558903B2 (en) | 2012-05-02 | 2017-01-31 | National Instruments Corporation | MEMS-based switching system |
US9287062B2 (en) | 2012-05-02 | 2016-03-15 | National Instruments Corporation | Magnetic switching system |
JP6050667B2 (ja) * | 2012-12-04 | 2016-12-21 | デクセリアルズ株式会社 | コイルモジュール、非接触電力伝送用アンテナユニット、及び電子機器 |
CN103871724B (zh) * | 2012-12-18 | 2016-09-28 | 佳邦科技股份有限公司 | 功率电感及其制造方法 |
JP2014130879A (ja) * | 2012-12-28 | 2014-07-10 | Panasonic Corp | コイル埋設型磁性素子の製造方法 |
US8723629B1 (en) * | 2013-01-10 | 2014-05-13 | Cyntec Co., Ltd. | Magnetic device with high saturation current and low core loss |
KR20140094324A (ko) * | 2013-01-22 | 2014-07-30 | 삼성전기주식회사 | 공통모드필터 및 이의 제조방법 |
US10840005B2 (en) | 2013-01-25 | 2020-11-17 | Vishay Dale Electronics, Llc | Low profile high current composite transformer |
KR101451503B1 (ko) * | 2013-03-25 | 2014-10-15 | 삼성전기주식회사 | 인덕터 및 그 제조 방법 |
TW201444052A (zh) * | 2013-05-15 | 2014-11-16 | Inpaq Technology Co Ltd | 薄型疊層式功率電感製程之改進 |
JP2015026812A (ja) * | 2013-07-29 | 2015-02-05 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | チップ電子部品及びその製造方法 |
KR101449518B1 (ko) * | 2013-09-10 | 2014-10-16 | 주식회사 아모텍 | 파워 인덕터 및 그의 제조방법 |
KR101334653B1 (ko) * | 2013-09-11 | 2013-12-05 | 신우이.엔.지 주식회사 | 복합 자성 코아 및 그 제조방법 |
JP5944373B2 (ja) * | 2013-12-27 | 2016-07-05 | 東光株式会社 | 電子部品の製造方法、電子部品 |
KR20150080797A (ko) * | 2014-01-02 | 2015-07-10 | 삼성전기주식회사 | 세라믹 전자 부품 |
JP6296148B2 (ja) * | 2014-03-04 | 2018-03-20 | 株式会社村田製作所 | インダクタ装置、インダクタアレイおよび多層基板、ならびにインダクタ装置の製造方法 |
KR101548862B1 (ko) * | 2014-03-10 | 2015-08-31 | 삼성전기주식회사 | 칩형 코일 부품 및 그 제조 방법 |
DE102014207635A1 (de) * | 2014-04-23 | 2015-10-29 | Würth Elektronik eiSos Gmbh & Co. KG | Verfahren zum Herstellen eines Induktionsbauteils und Induktionsbauteil |
CN105091051A (zh) * | 2014-05-09 | 2015-11-25 | 名硕电脑(苏州)有限公司 | 薄型化底盘及具有薄型化底盘的电磁炉 |
US9831023B2 (en) * | 2014-07-10 | 2017-11-28 | Cyntec Co., Ltd. | Electrode structure and the corresponding electrical component using the same and the fabrication method thereof |
JP6522297B2 (ja) * | 2014-07-28 | 2019-05-29 | 太陽誘電株式会社 | コイル部品 |
KR102143005B1 (ko) * | 2014-07-29 | 2020-08-11 | 삼성전기주식회사 | 인덕터 및 그 실장 기판 |
KR101475677B1 (ko) * | 2014-09-11 | 2014-12-23 | 삼성전기주식회사 | 코일 부품 및 이를 포함하는 전원공급장치 |
JP6458806B2 (ja) * | 2014-09-24 | 2019-01-30 | 株式会社村田製作所 | インダクタ部品の製造方法およびインダクタ部品 |
KR102029726B1 (ko) * | 2014-10-13 | 2019-10-10 | 주식회사 위츠 | 무선 전력 전송용 코일형 유닛 및 무선전력 전송용 코일형 유닛의 제조방법 |
US10049808B2 (en) | 2014-10-31 | 2018-08-14 | Samsung Electro-Mechanics Co., Ltd. | Coil component assembly for mass production of coil components and coil components made from coil component assembly |
CN105679520B (zh) * | 2014-11-17 | 2019-04-19 | 华为技术有限公司 | 耦合电感、磁体和多电平逆变器 |
TWI553677B (zh) * | 2015-04-08 | 2016-10-11 | Yun-Guang Fan | Thin inductive components embedded in the structure |
KR102198528B1 (ko) * | 2015-05-19 | 2021-01-06 | 삼성전기주식회사 | 코일 전자부품 및 그 제조방법 |
KR102171679B1 (ko) * | 2015-08-24 | 2020-10-29 | 삼성전기주식회사 | 코일 전자 부품 및 이의 제조방법 |
KR102154201B1 (ko) * | 2015-08-24 | 2020-09-09 | 삼성전기주식회사 | 코일 전자 부품 |
JP6551142B2 (ja) * | 2015-10-19 | 2019-07-31 | Tdk株式会社 | コイル部品及びこれを内蔵した回路基板 |
CN105405610A (zh) * | 2015-12-28 | 2016-03-16 | 江苏晨朗电子集团有限公司 | 变压器 |
WO2017130719A1 (ja) * | 2016-01-28 | 2017-08-03 | 株式会社村田製作所 | 表面実装型コイル部品及びその製造方法、並びにdc-dcコンバータ |
WO2017169737A1 (ja) | 2016-04-01 | 2017-10-05 | 株式会社村田製作所 | コイル部品およびその製造方法 |
JP6531712B2 (ja) * | 2016-04-28 | 2019-06-19 | 株式会社村田製作所 | 複合インダクタ |
KR102558332B1 (ko) * | 2016-05-04 | 2023-07-21 | 엘지이노텍 주식회사 | 인덕터 및 이의 제조 방법 |
US10998124B2 (en) | 2016-05-06 | 2021-05-04 | Vishay Dale Electronics, Llc | Nested flat wound coils forming windings for transformers and inductors |
KR20180023163A (ko) * | 2016-08-25 | 2018-03-07 | 현대자동차주식회사 | 트랜스 인덕터 및 이를 이용한 전력 변환 장치 |
KR102464202B1 (ko) | 2016-08-31 | 2022-11-04 | 비쉐이 데일 일렉트로닉스, 엘엘씨 | 낮은 직류 저항을 갖는 고전류 코일을 구비한 인덕터 |
JP6872342B2 (ja) * | 2016-10-18 | 2021-05-19 | 株式会社ディスコ | 切削ブレード |
JP6610498B2 (ja) * | 2016-10-21 | 2019-11-27 | 株式会社村田製作所 | 複合型電子部品の製造方法 |
US10340074B2 (en) | 2016-12-02 | 2019-07-02 | Cyntec Co., Ltd. | Transformer |
US11482369B2 (en) | 2016-12-20 | 2022-10-25 | Lg Innotek Co., Ltd. | Magnetic core, coil component, and electronic component including same |
US10396016B2 (en) * | 2016-12-30 | 2019-08-27 | Texas Instruments Incorporated | Leadframe inductor |
CN107068375B (zh) * | 2017-02-22 | 2018-11-16 | 湧德电子股份有限公司 | 制作电感器之组合式模具 |
DE202017104061U1 (de) * | 2017-07-07 | 2018-10-09 | Aixtron Se | Beschichtungseinrichtung mit beschichteter Sendespule |
KR102463331B1 (ko) * | 2017-10-16 | 2022-11-04 | 삼성전기주식회사 | 인덕터 어레이 |
KR102501904B1 (ko) | 2017-12-07 | 2023-02-21 | 삼성전기주식회사 | 권선형 인덕터 |
KR102394054B1 (ko) * | 2018-02-01 | 2022-05-04 | 엘지이노텍 주식회사 | 자성코어 조립체 및 이를 포함하는 코일부품 |
US20200038952A1 (en) * | 2018-08-02 | 2020-02-06 | American Axle & Manufacturing, Inc. | System And Method For Additive Manufacturing |
KR102098867B1 (ko) * | 2018-09-12 | 2020-04-09 | (주)아이테드 | 임프린팅 장치 및 임프린팅 방법 |
JP6856059B2 (ja) * | 2018-09-25 | 2021-04-07 | 株式会社村田製作所 | インダクタ |
WO2020075745A1 (ja) | 2018-10-10 | 2020-04-16 | 味の素株式会社 | 磁性ペースト |
US12002615B2 (en) | 2018-11-02 | 2024-06-04 | Delta Electronics (Shanghai) Co., Ltd. | Magnetic element, manufacturing method of magnetic element, and power module |
CN115359999A (zh) | 2018-11-02 | 2022-11-18 | 台达电子企业管理(上海)有限公司 | 变压器模块及功率模块 |
DE102019103895A1 (de) * | 2019-02-15 | 2020-08-20 | Tdk Electronics Ag | Spule und Verfahren zur Herstellung der Spule |
KR102188451B1 (ko) | 2019-03-15 | 2020-12-08 | 삼성전기주식회사 | 코일 부품 |
US11915855B2 (en) * | 2019-03-22 | 2024-02-27 | Cyntec Co., Ltd. | Method to form multile electrical components and a single electrical component made by the method |
US20210035730A1 (en) * | 2019-07-31 | 2021-02-04 | Murata Manufacturing Co., Ltd. | Inductor |
JP7485505B2 (ja) | 2019-08-09 | 2024-05-16 | 日東電工株式会社 | インダクタ |
KR102662853B1 (ko) * | 2019-09-30 | 2024-05-03 | 삼성전기주식회사 | 인쇄회로기판 |
JP7173065B2 (ja) * | 2020-02-19 | 2022-11-16 | 株式会社村田製作所 | インダクタ部品 |
DE102020110850A1 (de) * | 2020-04-21 | 2021-10-21 | Tdk Electronics Ag | Spule und Verfahren zur Herstellung der Spule |
CN113628851B (zh) | 2020-05-07 | 2024-01-23 | 台达电子企业管理(上海)有限公司 | 绕组组件及磁性元件 |
CN112071579A (zh) * | 2020-09-03 | 2020-12-11 | 深圳市铂科新材料股份有限公司 | 一种贴片电感的制造方法及由其制得的贴片电感 |
US11948724B2 (en) | 2021-06-18 | 2024-04-02 | Vishay Dale Electronics, Llc | Method for making a multi-thickness electro-magnetic device |
TWI760275B (zh) | 2021-08-26 | 2022-04-01 | 奇力新電子股份有限公司 | 電感元件及其製造方法 |
JPWO2023042634A1 (ja) * | 2021-09-16 | 2023-03-23 | ||
WO2023188588A1 (ja) * | 2022-03-29 | 2023-10-05 | パナソニックIpマネジメント株式会社 | 結合インダクタ、インダクタユニット、電圧コンバータ及び電力変換装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09306715A (ja) * | 1996-05-15 | 1997-11-28 | Tokin Corp | 電子部品及びその製造方法 |
JP2003203813A (ja) * | 2001-08-29 | 2003-07-18 | Matsushita Electric Ind Co Ltd | 磁性素子およびその製造方法、並びにそれを備えた電源モジュール |
JP2003257744A (ja) * | 2002-03-01 | 2003-09-12 | Matsushita Electric Ind Co Ltd | 磁性素子及びその製造方法並びにそれを用いた電源モジュール |
JP2007123376A (ja) * | 2005-10-26 | 2007-05-17 | Matsushita Electric Ind Co Ltd | 複合磁性体およびそれを用いた磁性素子並びにその製造方法 |
WO2008033316A2 (en) * | 2006-09-12 | 2008-03-20 | Cooper Technologies Company | Low profile layered coil and cores for magnetic components |
Family Cites Families (137)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3255512A (en) * | 1962-08-17 | 1966-06-14 | Trident Engineering Associates | Molding a ferromagnetic casing upon an electrical component |
US4072780A (en) * | 1976-10-28 | 1978-02-07 | Varadyne Industries, Inc. | Process for making electrical components having dielectric layers comprising particles of a lead oxide-germanium dioxide-silicon dioxide glass and a resin binder therefore |
GB2045540B (en) * | 1978-12-28 | 1983-08-03 | Tdk Electronics Co Ltd | Electrical inductive device |
NL7900244A (nl) * | 1979-01-12 | 1980-07-15 | Philips Nv | Vlakke tweelaags electrische spoel. |
EP0117764A1 (en) * | 1983-03-01 | 1984-09-05 | Mitsubishi Denki Kabushiki Kaisha | Coil device |
JPS6041312A (ja) * | 1983-08-16 | 1985-03-05 | Tdk Corp | 回路素子 |
JPH0217447Y2 (ja) * | 1984-12-21 | 1990-05-16 | ||
JPS6261305A (ja) * | 1985-09-11 | 1987-03-18 | Murata Mfg Co Ltd | 積層チツプコイル |
JPS62252112A (ja) * | 1986-04-24 | 1987-11-02 | Murata Mfg Co Ltd | バルントランス |
US4803425A (en) * | 1987-10-05 | 1989-02-07 | Xerox Corporation | Multi-phase printed circuit board tachometer |
JPH01266705A (ja) | 1988-04-18 | 1989-10-24 | Sony Corp | コイル部品 |
JPH0236013U (ja) * | 1988-09-02 | 1990-03-08 | ||
JPH02172207A (ja) * | 1988-12-23 | 1990-07-03 | Murata Mfg Co Ltd | 積層型インダクター |
JPH03241711A (ja) * | 1990-02-20 | 1991-10-28 | Matsushita Electric Ind Co Ltd | リニアリティコイル |
DE4117878C2 (de) * | 1990-05-31 | 1996-09-26 | Toshiba Kawasaki Kk | Planares magnetisches Element |
JP3108931B2 (ja) * | 1991-03-15 | 2000-11-13 | 株式会社トーキン | インダクタ及びその製造方法 |
JP3197022B2 (ja) * | 1991-05-13 | 2001-08-13 | ティーディーケイ株式会社 | ノイズサプレッサ用積層セラミック部品 |
US5487214A (en) * | 1991-07-10 | 1996-01-30 | International Business Machines Corp. | Method of making a monolithic magnetic device with printed circuit interconnections |
JP2563943Y2 (ja) * | 1991-10-02 | 1998-03-04 | 富士電気化学株式会社 | インダクタンスコア |
JPH0555515U (ja) * | 1991-12-25 | 1993-07-23 | 太陽誘電株式会社 | 面実装型コイル |
JPH05283238A (ja) * | 1992-03-31 | 1993-10-29 | Sony Corp | トランス |
JP3160685B2 (ja) * | 1992-04-14 | 2001-04-25 | 株式会社トーキン | インダクタ |
JPH065450A (ja) * | 1992-06-18 | 1994-01-14 | Showa Electric Wire & Cable Co Ltd | コイル装置の製造方法 |
JP2566100B2 (ja) * | 1992-07-02 | 1996-12-25 | 株式会社トーキン | 高周波トランス |
US5312674A (en) * | 1992-07-31 | 1994-05-17 | Hughes Aircraft Company | Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, drop-in components and multi-layer transformer |
EP0593020B1 (en) * | 1992-10-12 | 1999-02-03 | Matsushita Electronics Corporation | Manufacturing method for an electronic component |
JPH06290975A (ja) * | 1993-03-30 | 1994-10-18 | Tokin Corp | コイル部品並びにその製造方法 |
US5500629A (en) * | 1993-09-10 | 1996-03-19 | Meyer Dennis R | Noise suppressor |
JP3472329B2 (ja) * | 1993-12-24 | 2003-12-02 | 株式会社村田製作所 | チップ型トランス |
JP3434339B2 (ja) * | 1994-01-27 | 2003-08-04 | エヌイーシートーキン株式会社 | インダクタの製造方法 |
JPH07320938A (ja) * | 1994-05-24 | 1995-12-08 | Sony Corp | インダクタ装置 |
US6911887B1 (en) * | 1994-09-12 | 2005-06-28 | Matsushita Electric Industrial Co., Ltd. | Inductor and method for producing the same |
US5985356A (en) * | 1994-10-18 | 1999-11-16 | The Regents Of The University Of California | Combinatorial synthesis of novel materials |
US5821846A (en) * | 1995-05-22 | 1998-10-13 | Steward, Inc. | High current ferrite electromagnetic interference suppressor and associated method |
US7034645B2 (en) * | 1999-03-16 | 2006-04-25 | Vishay Dale Electronics, Inc. | Inductor coil and method for making same |
US7263761B1 (en) * | 1995-07-18 | 2007-09-04 | Vishay Dale Electronics, Inc. | Method for making a high current low profile inductor |
US6198375B1 (en) * | 1999-03-16 | 2001-03-06 | Vishay Dale Electronics, Inc. | Inductor coil structure |
US7921546B2 (en) * | 1995-07-18 | 2011-04-12 | Vishay Dale Electronics, Inc. | Method for making a high current low profile inductor |
CA2180992C (en) * | 1995-07-18 | 1999-05-18 | Timothy M. Shafer | High current, low profile inductor and method for making same |
JPH0992540A (ja) * | 1995-09-21 | 1997-04-04 | Nippon Steel Corp | 薄型インダクタ |
JP2978117B2 (ja) * | 1996-07-01 | 1999-11-15 | ティーディーケイ株式会社 | つぼ型コアを用いた面実装部品 |
US6038134A (en) * | 1996-08-26 | 2000-03-14 | Johanson Dielectrics, Inc. | Modular capacitor/inductor structure |
US6683783B1 (en) * | 1997-03-07 | 2004-01-27 | William Marsh Rice University | Carbon fibers formed from single-wall carbon nanotubes |
US6284060B1 (en) * | 1997-04-18 | 2001-09-04 | Matsushita Electric Industrial Co., Ltd. | Magnetic core and method of manufacturing the same |
JP3336346B2 (ja) * | 1997-07-01 | 2002-10-21 | スミダコーポレーション株式会社 | チップインダクタンス素子 |
US5922514A (en) * | 1997-09-17 | 1999-07-13 | Dale Electronics, Inc. | Thick film low value high frequency inductor, and method of making the same |
US6169801B1 (en) * | 1998-03-16 | 2001-01-02 | Midcom, Inc. | Digital isolation apparatus and method |
US6054914A (en) * | 1998-07-06 | 2000-04-25 | Midcom, Inc. | Multi-layer transformer having electrical connection in a magnetic core |
JP2001185421A (ja) * | 1998-12-28 | 2001-07-06 | Matsushita Electric Ind Co Ltd | 磁性素子およびその製造方法 |
US6392525B1 (en) * | 1998-12-28 | 2002-05-21 | Matsushita Electric Industrial Co., Ltd. | Magnetic element and method of manufacturing the same |
US6566731B2 (en) * | 1999-02-26 | 2003-05-20 | Micron Technology, Inc. | Open pattern inductor |
US6379579B1 (en) * | 1999-03-09 | 2002-04-30 | Tdk Corporation | Method for the preparation of soft magnetic ferrite powder and method for the production of laminated chip inductor |
JP2000323336A (ja) * | 1999-03-11 | 2000-11-24 | Taiyo Yuden Co Ltd | インダクタ及びその製造方法 |
US6198374B1 (en) * | 1999-04-01 | 2001-03-06 | Midcom, Inc. | Multi-layer transformer apparatus and method |
JP3776281B2 (ja) * | 1999-04-13 | 2006-05-17 | アルプス電気株式会社 | インダクティブ素子 |
US6114939A (en) * | 1999-06-07 | 2000-09-05 | Technical Witts, Inc. | Planar stacked layer inductors and transformers |
JP3365622B2 (ja) * | 1999-12-17 | 2003-01-14 | 松下電器産業株式会社 | Lc複合部品および電源素子 |
US6908960B2 (en) * | 1999-12-28 | 2005-06-21 | Tdk Corporation | Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosettin |
JP3670575B2 (ja) * | 2000-01-12 | 2005-07-13 | Tdk株式会社 | コイル封入圧粉コアの製造方法およびコイル封入圧粉コア |
GB2360292B (en) * | 2000-03-15 | 2002-04-03 | Murata Manufacturing Co | Photosensitive thick film composition and electronic device using the same |
US6594157B2 (en) * | 2000-03-21 | 2003-07-15 | Alps Electric Co., Ltd. | Low-loss magnetic powder core, and switching power supply, active filter, filter, and amplifying device using the same |
JP4684461B2 (ja) * | 2000-04-28 | 2011-05-18 | パナソニック株式会社 | 磁性素子の製造方法 |
US6420953B1 (en) * | 2000-05-19 | 2002-07-16 | Pulse Engineering. Inc. | Multi-layer, multi-functioning printed circuit board |
DE10024824A1 (de) * | 2000-05-19 | 2001-11-29 | Vacuumschmelze Gmbh | Induktives Bauelement und Verfahren zu seiner Herstellung |
JP2001345212A (ja) * | 2000-05-31 | 2001-12-14 | Tdk Corp | 積層電子部品 |
JP2002083732A (ja) * | 2000-09-08 | 2002-03-22 | Murata Mfg Co Ltd | インダクタ及びその製造方法 |
US6720074B2 (en) * | 2000-10-26 | 2004-04-13 | Inframat Corporation | Insulator coated magnetic nanoparticulate composites with reduced core loss and method of manufacture thereof |
US7485366B2 (en) * | 2000-10-26 | 2009-02-03 | Inframat Corporation | Thick film magnetic nanoparticulate composites and method of manufacture thereof |
US20020067234A1 (en) * | 2000-12-01 | 2002-06-06 | Samuel Kung | Compact surface-mountable inductors |
CN1218333C (zh) * | 2000-12-28 | 2005-09-07 | Tdk株式会社 | 叠层衬底、电子部件的制造方法及叠层电子部件 |
JP3593986B2 (ja) * | 2001-02-19 | 2004-11-24 | 株式会社村田製作所 | コイル部品及びその製造方法 |
JP3612028B2 (ja) * | 2001-02-27 | 2005-01-19 | 松下電器産業株式会社 | コイル部品の製造方法 |
DE60208523T2 (de) * | 2001-02-27 | 2006-07-13 | Matsushita Electric Industrial Co., Ltd., Kadoma | Spulenbauteil und verfahren zu seiner herstellung |
DE60136223D1 (de) * | 2001-03-01 | 2008-11-27 | Tdk Corp | Gesintertes magnetisches oxid und hochfrequenzschaltkreisteil dieses verwendend |
JP2002299130A (ja) * | 2001-04-02 | 2002-10-11 | Densei Lambda Kk | 電源用複合素子 |
JP2002313632A (ja) * | 2001-04-17 | 2002-10-25 | Matsushita Electric Ind Co Ltd | 磁性素子およびその製造方法 |
US6768409B2 (en) * | 2001-08-29 | 2004-07-27 | Matsushita Electric Industrial Co., Ltd. | Magnetic device, method for manufacturing the same, and power supply module equipped with the same |
US7162302B2 (en) * | 2002-03-04 | 2007-01-09 | Nanoset Llc | Magnetically shielded assembly |
JP2003229311A (ja) * | 2002-01-31 | 2003-08-15 | Tdk Corp | コイル封入圧粉磁芯およびその製造方法、コイルおよびその製造方法 |
TW553465U (en) * | 2002-07-25 | 2003-09-11 | Micro Star Int Co Ltd | Integrated inductor |
JP2004165539A (ja) * | 2002-11-15 | 2004-06-10 | Toko Inc | インダクタ |
KR100479625B1 (ko) * | 2002-11-30 | 2005-03-31 | 주식회사 쎄라텍 | 칩타입 파워인덕터 및 그 제조방법 |
EP1428667B1 (en) * | 2002-12-11 | 2009-03-25 | Konica Minolta Holdings, Inc. | Ink jet printer and image recording method |
JP4140632B2 (ja) * | 2002-12-13 | 2008-08-27 | 松下電器産業株式会社 | 多連チョークコイルおよびそれを用いた電子機器 |
US7965165B2 (en) * | 2002-12-13 | 2011-06-21 | Volterra Semiconductor Corporation | Method for making magnetic components with M-phase coupling, and related inductor structures |
JP3800540B2 (ja) * | 2003-01-31 | 2006-07-26 | Tdk株式会社 | インダクタンス素子の製造方法と積層電子部品と積層電子部品モジュ−ルとこれらの製造方法 |
US6873241B1 (en) * | 2003-03-24 | 2005-03-29 | Robert O. Sanchez | High frequency transformers and high Q factor inductors formed using epoxy-based magnetic polymer materials |
US6879238B2 (en) * | 2003-05-28 | 2005-04-12 | Cyntec Company | Configuration and method for manufacturing compact high current inductor coil |
JP4514031B2 (ja) * | 2003-06-12 | 2010-07-28 | 株式会社デンソー | コイル部品及びコイル部品製造方法 |
US20050007232A1 (en) * | 2003-06-12 | 2005-01-13 | Nec Tokin Corporation | Magnetic core and coil component using the same |
US7598837B2 (en) * | 2003-07-08 | 2009-10-06 | Pulse Engineering, Inc. | Form-less electronic device and methods of manufacturing |
US7307502B2 (en) * | 2003-07-16 | 2007-12-11 | Marvell World Trade Ltd. | Power inductor with reduced DC current saturation |
JP2005064319A (ja) * | 2003-08-18 | 2005-03-10 | Matsushita Electric Ind Co Ltd | コイル部品およびそれを搭載した電子機器 |
JP4532167B2 (ja) * | 2003-08-21 | 2010-08-25 | コーア株式会社 | チップコイルおよびチップコイルを実装した基板 |
WO2005024862A1 (en) * | 2003-09-04 | 2005-03-17 | Philips Intellectual Property & Standards Gmbh | Fractional turns transformers with ferrite polymer core |
CN1860562A (zh) * | 2003-09-29 | 2006-11-08 | 株式会社田村制作所 | 层叠型磁性部件及其制造方法 |
US7319599B2 (en) * | 2003-10-01 | 2008-01-15 | Matsushita Electric Industrial Co., Ltd. | Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor |
EP1526556A1 (en) * | 2003-10-21 | 2005-04-27 | Yun-Kuang Fan | Ferrite cored coil structure for SMD and fabrication method of the same |
US7489225B2 (en) * | 2003-11-17 | 2009-02-10 | Pulse Engineering, Inc. | Precision inductive devices and methods |
US7187263B2 (en) * | 2003-11-26 | 2007-03-06 | Vlt, Inc. | Printed circuit transformer |
JP4851062B2 (ja) * | 2003-12-10 | 2012-01-11 | スミダコーポレーション株式会社 | インダクタンス素子の製造方法 |
JP4293603B2 (ja) * | 2004-02-25 | 2009-07-08 | Tdk株式会社 | コイル部品及びその製造方法 |
US7019391B2 (en) * | 2004-04-06 | 2006-03-28 | Bao Tran | NANO IC packaging |
US7330369B2 (en) * | 2004-04-06 | 2008-02-12 | Bao Tran | NANO-electronic memory array |
JP2005310864A (ja) * | 2004-04-19 | 2005-11-04 | Matsushita Electric Ind Co Ltd | コイル部品 |
CN2726077Y (zh) * | 2004-07-02 | 2005-09-14 | 郑长茂 | 电感器 |
JP2006032587A (ja) * | 2004-07-15 | 2006-02-02 | Matsushita Electric Ind Co Ltd | インダクタンス部品およびその製造方法 |
JP4528058B2 (ja) * | 2004-08-20 | 2010-08-18 | アルプス電気株式会社 | コイル封入圧粉磁心 |
US7567163B2 (en) * | 2004-08-31 | 2009-07-28 | Pulse Engineering, Inc. | Precision inductive devices and methods |
US7339451B2 (en) * | 2004-09-08 | 2008-03-04 | Cyntec Co., Ltd. | Inductor |
WO2006070544A1 (ja) * | 2004-12-27 | 2006-07-06 | Sumida Corporation | 磁性素子 |
TWM278046U (en) * | 2005-02-22 | 2005-10-11 | Traben Co Ltd | Inductor component |
JP2007053312A (ja) * | 2005-08-19 | 2007-03-01 | Taiyo Yuden Co Ltd | 面実装型コイル部品及びその製造方法並びにその実装方法 |
JP2007165779A (ja) * | 2005-12-16 | 2007-06-28 | Sumida Corporation | コイル封入型磁性部品 |
KR20070082539A (ko) * | 2006-02-15 | 2007-08-21 | 쿠퍼 테크놀로지스 컴파니 | 자기 부품을 위한 갭이 있는 코어 구조체 |
JP4904889B2 (ja) * | 2006-03-31 | 2012-03-28 | Tdk株式会社 | コイル部品 |
US7994889B2 (en) * | 2006-06-01 | 2011-08-09 | Taiyo Yuden Co., Ltd. | Multilayer inductor |
TW200800443A (en) * | 2006-06-23 | 2008-01-01 | Delta Electronics Inc | Powder-compressed assembly and its manufacturing method |
CN101501791A (zh) * | 2006-07-14 | 2009-08-05 | 美商·帕斯脉冲工程有限公司 | 自引线表面安装电感器和方法 |
US20080278275A1 (en) * | 2007-05-10 | 2008-11-13 | Fouquet Julie E | Miniature Transformers Adapted for use in Galvanic Isolators and the Like |
US7986208B2 (en) * | 2008-07-11 | 2011-07-26 | Cooper Technologies Company | Surface mount magnetic component assembly |
US8400245B2 (en) * | 2008-07-11 | 2013-03-19 | Cooper Technologies Company | High current magnetic component and methods of manufacture |
US9589716B2 (en) * | 2006-09-12 | 2017-03-07 | Cooper Technologies Company | Laminated magnetic component and manufacture with soft magnetic powder polymer composite sheets |
US8310332B2 (en) * | 2008-10-08 | 2012-11-13 | Cooper Technologies Company | High current amorphous powder core inductor |
US8378777B2 (en) * | 2008-07-29 | 2013-02-19 | Cooper Technologies Company | Magnetic electrical device |
JP2008078178A (ja) * | 2006-09-19 | 2008-04-03 | Shindengen Electric Mfg Co Ltd | インダクタンス素子 |
JP2008147342A (ja) * | 2006-12-08 | 2008-06-26 | Sumida Corporation | 磁気素子 |
TWI315529B (en) * | 2006-12-28 | 2009-10-01 | Ind Tech Res Inst | Monolithic inductor |
CN101217070A (zh) * | 2007-01-05 | 2008-07-09 | 胜美达电机(香港)有限公司 | 面安装型磁性元件 |
JP2008288370A (ja) * | 2007-05-17 | 2008-11-27 | Nec Tokin Corp | 面実装インダクタおよびその製造方法 |
JP2009021549A (ja) * | 2007-06-15 | 2009-01-29 | Taiyo Yuden Co Ltd | コイル部品及びその製造方法 |
JP5084408B2 (ja) * | 2007-09-05 | 2012-11-28 | 太陽誘電株式会社 | 巻線型電子部品 |
US7525406B1 (en) * | 2008-01-17 | 2009-04-28 | Well-Mag Electronic Ltd. | Multiple coupling and non-coupling inductor |
JP5165415B2 (ja) * | 2008-02-25 | 2013-03-21 | 太陽誘電株式会社 | 面実装型コイル部材 |
US8279037B2 (en) * | 2008-07-11 | 2012-10-02 | Cooper Technologies Company | Magnetic components and methods of manufacturing the same |
US8659379B2 (en) * | 2008-07-11 | 2014-02-25 | Cooper Technologies Company | Magnetic components and methods of manufacturing the same |
US8183967B2 (en) * | 2008-07-11 | 2012-05-22 | Cooper Technologies Company | Surface mount magnetic components and methods of manufacturing the same |
-
2010
- 2010-04-23 US US12/766,300 patent/US20100277267A1/en not_active Abandoned
- 2010-04-26 WO PCT/US2010/032407 patent/WO2010129228A1/en active Application Filing
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- 2010-04-26 ES ES10716225T patent/ES2413632T3/es active Active
- 2010-04-26 WO PCT/US2010/032414 patent/WO2010129230A1/en active Application Filing
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- 2010-04-26 CN CN2010800281522A patent/CN102460613A/zh active Pending
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-
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- 2014-09-12 JP JP2014186238A patent/JP2015015492A/ja not_active Withdrawn
-
2016
- 2016-08-31 JP JP2016169707A patent/JP6517764B2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09306715A (ja) * | 1996-05-15 | 1997-11-28 | Tokin Corp | 電子部品及びその製造方法 |
JP2003203813A (ja) * | 2001-08-29 | 2003-07-18 | Matsushita Electric Ind Co Ltd | 磁性素子およびその製造方法、並びにそれを備えた電源モジュール |
JP2003257744A (ja) * | 2002-03-01 | 2003-09-12 | Matsushita Electric Ind Co Ltd | 磁性素子及びその製造方法並びにそれを用いた電源モジュール |
JP2007123376A (ja) * | 2005-10-26 | 2007-05-17 | Matsushita Electric Ind Co Ltd | 複合磁性体およびそれを用いた磁性素子並びにその製造方法 |
WO2008033316A2 (en) * | 2006-09-12 | 2008-03-20 | Cooper Technologies Company | Low profile layered coil and cores for magnetic components |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101450471B1 (ko) * | 2013-08-27 | 2014-10-13 | 주식회사 두산 | 배치 경화 방식을 이용하는 연성 금속박 적층판의 제조방법 |
US11166349B2 (en) | 2016-03-02 | 2021-11-02 | I.R.C.A. S.P.A.—Industria Resistenze Corazzate E Affini | Induction hob and method for making induction hobs |
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