WO2006070544A1 - 磁性素子 - Google Patents
磁性素子 Download PDFInfo
- Publication number
- WO2006070544A1 WO2006070544A1 PCT/JP2005/021465 JP2005021465W WO2006070544A1 WO 2006070544 A1 WO2006070544 A1 WO 2006070544A1 JP 2005021465 W JP2005021465 W JP 2005021465W WO 2006070544 A1 WO2006070544 A1 WO 2006070544A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- magnetic element
- conductor
- core member
- terminal electrode
- magnetic
- Prior art date
Links
- 239000004020 conductor Substances 0.000 claims abstract description 116
- 238000000465 moulding Methods 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 7
- 239000011230 binding agent Substances 0.000 claims abstract description 5
- 229920005989 resin Polymers 0.000 claims abstract description 5
- 239000011347 resin Substances 0.000 claims abstract description 5
- 239000006247 magnetic powder Substances 0.000 claims abstract description 4
- 239000000203 mixture Substances 0.000 claims abstract description 3
- 239000000758 substrate Substances 0.000 claims description 12
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000011162 core material Substances 0.000 description 70
- 238000004519 manufacturing process Methods 0.000 description 11
- 239000000843 powder Substances 0.000 description 10
- 239000000696 magnetic material Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- 229910000859 α-Fe Inorganic materials 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910008458 Si—Cr Inorganic materials 0.000 description 1
- XEVZIAVUCQDJFL-UHFFFAOYSA-N [Cr].[Fe].[Si] Chemical compound [Cr].[Fe].[Si] XEVZIAVUCQDJFL-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- -1 iron-silicon aluminum Chemical compound 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910000702 sendust Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0233—Filters, inductors or a magnetic substance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F17/06—Fixed inductances of the signal type with magnetic core with core substantially closed in itself, e.g. toroid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F30/00—Fixed transformers not covered by group H01F19/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F17/06—Fixed inductances of the signal type with magnetic core with core substantially closed in itself, e.g. toroid
- H01F2017/065—Core mounted around conductor to absorb noise, e.g. EMI filter
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
- H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
Definitions
- the present invention relates to a magnetic element used as a power circuit for various electric products, for example.
- the switching frequency of a drive circuit is gradually shifted to a high frequency side.
- the relationship shown below is established among the frequency f, the current I, the inductance value (L value) of the magnetic element, and the power P of the magnetic element.
- Equation 1 when power P is constant, L increases as frequency f increases. Therefore, in recent years, with the shift of the switching frequency to the high frequency side, etc., the L value of the magnetic element is lowered (hereinafter referred to as low L) and a large current can be applied. ! / I have a strong request!
- the magnetic element in order to obtain a desired inductance value (L value), the magnetic element generally has a coil portion in which a winding is wound a predetermined number of times. Then, the covering coil part is covered with a magnetic material or the like, and both ends of the coil part of the coil part are connected to the terminal electrode, thereby forming a magnetic element that can be mounted on the mounting substrate.
- a typical configuration example of such a magnetic element is disclosed in Patent Document 1.
- Patent Document 1 As a magnetic element having a configuration different from the magnetic element of Patent Document 1, a cylindrical hole is provided along the length of the polygonal cylindrical ferrite core, and the cylindrical hole is provided under the ferrite core. 2. Description of the Related Art A magnetic element is known in which a slit connecting with a surface is provided and a conductor is inserted through a cylindrical hole. As a powerful magnetic element, there is one disclosed in Patent Document 2.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2002-252120 (see FIG. 1, FIG. 3 to FIG. 5 etc.)
- Patent Document 2 Japanese Patent Laid-Open No. 2001-052934 (see FIGS. 1 to 7)
- the inductance value obtained is generally increased by having the coil portion in which the winding is wound a predetermined number of times.
- the superposition characteristics tend to be bad.
- heat generation when a large current is applied can be a problem.
- Sarakuko encloses the coil part wound with an air core and performs pressure molding so as to uniformly control the coating thickness of the magnetic material in each part, and its manufacturing method is very complicated. It becomes.
- the core member is a sinterable ferrite core, the limit point of magnetic properties and the like is generally low.
- the cylindrical hole of the polygonal cylindrical ferrite core has to be slightly larger than the veg-shaped conductor that facilitates the insertion work of the band-shaped conductor. For this reason, a gap is substantially formed between the conductor and the cylindrical hole.
- the conductor that generates heat due to current application comes into contact with air with poor thermal conductivity, and the conductor accumulates heat, so that the temperature rise becomes significant. For this reason, even if the superimposition characteristics are good, it is impossible to ensure the reliability related to the temperature of the magnetic element.
- the present invention has been made on the basis of the above circumstances, and the object of the present invention is to make it possible to reduce the inductance value and to secure a desired inductance value by simple manufacturing conditions.
- the present invention intends to provide a magnetic element that has excellent direct current superimposition characteristics, and that can be downsized and ensure high reliability.
- a magnetic element of the present invention includes a core member formed by pressure-molding a mixture in which a magnetic powder containing metal and a resin binder are mixed.
- the conductor extends linearly inside the core member, and the conductor is not wound inside the core member. For this reason, it is possible to reduce the L of the magnetic element. As a result, the magnetic element can also be used in a circuit to which a high-frequency current is applied in a power supply system.
- the magnetic element can be easily manufactured. That is, a magnetic element can be easily formed by placing a linearly extending conductor, for example, inside a mold, covering it with granulated powder, and press-molding in that state. As described above, since the magnetic element can be easily formed, it is possible to reduce the manufacturing cost of the magnetic element.
- the magnetic element can be reduced in size by using, for example, a flat conductor.
- the terminal electrode is continuously connected to the conductor and is bent toward the mounting substrate side.
- the conductor and the terminal electrode are substantially configured integrally. This eliminates the need for separate conductors and terminal electrodes, and eliminates the need to connect conductors and terminal electrodes, which are separate parts, thus facilitating manufacturing and reducing costs. It becomes.
- a concave portion for a terminal is provided on a facing surface of the core member facing the mounting substrate, and the concave portion for the terminal is provided with a terminal electrode. It is recessed from the other part of the opposing surface so as to correspond to the bent part. In this case, the bent portion enters the terminal recess. Therefore, it is possible to reduce the height of the magnetic element.
- the other invention is further characterized in that the conductor has an outer periphery relative to the core member. It is in direct contact with the entire surface.
- the magnetic core absorbs and dissipates the heat.
- the temperature rise characteristic of the magnetic element is improved.
- the entire outer peripheral surface of the conductor is in direct contact with the magnetic core, that is, it does not have an insulating film that has a lower thermal conductivity than the metal material that is the main material of the conductor.
- the material cost can be reduced by not having an insulating film.
- a plurality of conductors are provided inside the core member, and the conductors are arranged in a state having a certain distance from adjacent conductors. It is a thing.
- a plurality of conductors are arranged inside the core member.
- a powerful magnetic element can be used, for example, for a power supply circuit driven at a high frequency, and as a multi-phase compatible multiple inductor, multiple noise filter, common mode choke, transformer, or the like.
- a current circuit is formed by a conductor, a terminal electrode, and an external conductor present on a mounting board to be mounted.
- the coil portion is formed by the conductor disposed inside the core member, the terminal electrode, and the external conductor of the mounting board to be mounted.
- a closed magnetic circuit can be formed and used as various coil components.
- the present invention it is possible to reduce the inductance value of the magnetic element and to obtain excellent DC superposition characteristics, and the high reliability of the magnetic element when a large current is applied. Can be obtained.
- the magnetic element can be easily downsized and manufactured.
- FIG. 1 is a perspective view showing an overall configuration of a first configuration example of a magnetic element according to an embodiment of the present invention, and shows a state before a terminal electrode is bent.
- 2 is a front cross-sectional view showing the configuration of the magnetic element of FIG.
- FIG. 3 is a side cross-sectional view showing the configuration of the magnetic element in FIG. 1.
- FIG. 4 is a plan view showing a second configuration example of the magnetic element according to the embodiment of the invention.
- FIG. 5 is a bottom view showing the configuration of the magnetic element in FIG.
- FIG. 6 is a side sectional view showing the configuration of the magnetic element in FIG. 4 and showing a state cut along the line BB in FIG. 5.
- FIG. 7 is a front sectional view showing the configuration of the magnetic element in FIG. 4 and showing a state cut along line AA in FIG. 5.
- FIG. 8 is a diagram showing the relationship between current and temperature rise between the first configuration example of the magnetic element according to the embodiment of the present invention and the conventional example of the magnetic element.
- FIG. 9 is a perspective view showing a configuration of a comparative magnetic element (conventional example).
- FIG. 10 is a front view showing a state in which two conductors are arranged inside a core member according to a modification of the magnetic element of the present invention.
- FIG. 11 is a perspective view showing a mode in which the magnetic element of FIG. 4 is mounted on a mounting board.
- [12] relate to the modification of the present invention, a view showing with three conductors are disposed within the core member, a state in which the nonmagnetic layer is disposed between the adjacent Ri fit conductors, (a ) Is a cross-sectional view seen from the front direction, and (b) is a plan view showing a state where the conductor and the nonmagnetic layer inside the core member are seen through.
- FIGS. 1 to 3 are diagrams showing a first configuration example of the magnetic element 10 according to the present embodiment.
- FIG. 1 is a perspective view showing the entire configuration of the magnetic element 10 and shows a state before the terminal electrode 40 is bent.
- FIG. 2 is a front sectional view showing the configuration of the magnetic element 10.
- FIG. 3 is a side view showing the configuration of the magnetic element 10.
- the upper side refers to the upper surface 21a side of the magnetic element 10 that is separated from the lower surface 21c described later
- the lower side refers to the lower surface 21c side that is separated from the upper surface 21a.
- the height direction refers to the up-down direction connecting the upper surface 21a and the lower surface 21c of the magnetic element 10.
- the magnetic element 10 in the present embodiment includes a core member 20, a conductor 30, and a terminal electrode 40.
- the core member 20 is made of a magnetic material.
- powerful magnetic materials include metal powders, mainly composed of Sendust (Fe Si—A1; iron-silicon aluminum), Fe Si—Cr (iron-silicon chromium), and permalloy (Fe Ni). It is a magnetic material.
- the core member 20 is formed by curing granulated powder in which the above-described magnetic material, epoxy resin, and organic solvent are mixed.
- the core member 20 has a substantially rectangular parallelepiped appearance.
- the outer surface directly facing the mounting board (not shown) the outer surface positioned above in FIG. 1
- the upper surface 21a is used, and the lower surface 21c (corresponding to the facing surface facing the mounting board) parallel to the upper surface 21a is provided in the largest area among the six outer surfaces 21.
- the six outer surfaces 21 include, in addition to the upper surface 21a and the lower surface 21c, end surfaces 21b and 21d from which a pair of terminal electrodes 40 extend, and the end surfaces 21b and 21d, the upper surface 21a and the lower surface 21c.
- FIGS. 4 to 7 A second configuration example of the magnetic element 10 according to the present embodiment is shown in FIGS.
- a terminal recess 23 is provided on the lower surface 2 lc of the core member 20.
- the terminal recess 23 is a portion into which a bent portion of the terminal electrode 40 is bent as described later.
- the terminal recessed portion 23 is a portion provided so as to be depressed upward with respect to the other portion of the lower surface 21c.
- one end side of the terminal recess 23 is provided in a portion of the lower surface 21c closer to the end surface 21b and the end surface 21d than the center line AA along the short direction.
- the other end side of the terminal recess 23 is provided in a state of piercing the lower surface 21c by directing the end surface 21b and the end surface 21d. That is, the end surface 21b and the end surface 21d and the terminal recess 23 are provided in communication with each other.
- the depth dimension d of the terminal recess 23 described above is provided to be smaller than the thickness dimension h of the conductor 30 and the terminal electrode 40.
- the depth d of the terminal recess 23 is set to be 0.1 mm thicker than the thickness h of the conductor 30 and the terminal electrode 40.
- the depth dimension d of the terminal recess 23 is set to Omm ⁇ d ⁇ 0.2 mm
- the thickness dimension h of the conductor 30 and the terminal electrode 40 is set to 0.1 mm ⁇ h ⁇ 0.3 mm. ing.
- the terminal electrode 40 enters the terminal recess 23, so that the height of the magnetic element 10 can be reduced, and the magnetic element 10 can be reduced in size (low profile). ) Can be achieved.
- a conductor 30 is provided inside the core member 20.
- the conductor 30 extends linearly inside the core member 20.
- the conductor 30 is surrounded by the above-described magnetic material that constitutes the core member 20.
- the terminal electrode 40 protrudes outward from the end faces 21b, 21d of the core member 20.
- the conductor 30 and the terminal electrode 40 are formed from the same thin metal plate member 50. Therefore, in the present embodiment, it is possible to easily form the terminal electrode 40 by bending the thin plate member 50.
- the core member 20 is configured to be in direct contact with the conductor 30.
- the relationship between the core member 20 and the conductor 30 will be described in comparison with the inductance element (see FIG. 9) disclosed in Patent Document 2 described above.
- FIG. 9 in the configuration disclosed in Patent Document 2 described above, a conductor is inserted into the cylindrical hole, and there is a gap between the conductor and the cylindrical hole.
- a gap is not generated between the core member 20 and the conductor 30 by adopting the manufacturing method described later. 20 is covered without gaps.
- FIG. 7 shows the dimensional relationship between the core member 20 and the conductor 30 in the magnetic element 10 of the second configuration example of the present embodiment.
- a dimension L1 between the upper surface of the conductor 30 and the upper surface 21a of the core member 20, and a dimension L2 between the left side surface of the conductor 30 and the side surface 21e of the core member 20 in FIG. are provided with approximately equal dimensions.
- the dimension between the lower surface of the conductor 30 and the lower surface 21c of the core member 20 is equal to L1
- the dimension between the right side surface of the conductor 30 and the side surface 21f of the core member 20 is equal to L2. Is provided.
- the magnetic saturation in the core member 20 occurs uniformly. That is, when the dimension L1 is equal to the dimension L2 and one of them is narrowed, the DC superposition characteristics can be improved as compared with the configuration in which the dimension L1 and the dimension L2 are narrower. Note that the improvement of the DC superposition characteristics greatly contributes to the configuration of the magnetic element 10. In other words, since the structure of the magnetic element 10 is simple, the molding density of the core member 20 can be reduced without setting strict pressure molding conditions in the pressure molding process of the core member 20. It can be made substantially equal in all parts of the material 20. As a result, the magnetic characteristics of the core member 20 are uniform in all parts, and the direct current superimposition characteristics can be improved.
- the above-described thin plate member 50 is made of a metal having excellent conductivity, such as copper. However, other than copper, various materials with excellent conductivity are used. May be used.
- the magnetic element 10 shown in FIGS. 1 to 3 and FIGS. 4 to 7 has only one conductor 30, there are a plurality of conductors 30 in the core member 20. In comparison, the cross-sectional area of the conductor 30 can be increased.
- the terminal electrode 40 is bent.
- the terminal electrode 40 has an end surface portion 41 along the end surfaces 21b and 21d and a mounting portion 42 along the lower surface 21c by bending force due to pressing or the like.
- the mounting portion 42 is a portion that is mounted on a conductive portion (corresponding to an external conductor) of a mounting board (not shown) in a state where, for example, solder is applied.
- a metal plate is punched to form the thin plate member 50 that is the source of the conductor 30 and the terminal electrode 40.
- a thin plate member 50 having a predetermined width and a predetermined length is formed.
- a magnetic material, an epoxy resin, and an organic solvent are mixed in advance to form granulated powder.
- the thin plate member 50 is installed inside the mold, and a predetermined amount of granulated powder is installed, so that the thin plate member 50 is covered with the granulated powder.
- the upper die and the lower die of the mold are driven in directions close to each other, and a press operation is executed. As a result, a green compact, which is the previous stage of the magnetic element 10 (the stage before the heat treatment), is formed.
- the formed green compact is subjected to a heat treatment (thermosetting treatment). That is, the granulated powder is heated and cured by heating the powder compact. In this heat curing, heat curing is performed for about 1.5 hours in an environment of about 180 ° C. Therefore, it is mixed in the granulated powder! / Lubricant (resin binder) melts, the magnetic powder and the resin binder are fixed, and stable curing is achieved.
- a heat treatment thermosetting treatment
- the terminal electrode 40 is subjected to a plating process (a process such as a soldering process) so that the terminal electrode 40 can be easily adhered by soldering or the like.
- a plating process a process such as a soldering process
- the portion of the thin plate member 50 that protrudes from the end surfaces 21b and 21d is bent toward the lower surface 21c side by a press carriage. It Thus, the conductor 30 and the terminal electrode 40 are clearly distinguished from each other in appearance.
- the terminal electrode 40 has a state having an end surface portion 41 along the end surfaces 21b and 21d and a mounting portion 42 along the lower surface 21c. In this way, the magnetic element 10 is completed, but finally, the characteristics of the magnetic element 10 thus prepared are evaluated, and the magnetic element 10 having no predetermined characteristics is removed as a defect. Through the above steps, the magnetic element 10 having predetermined characteristics is created.
- FIG. 8 shows a magnetic element 10 according to the present embodiment (in the first configuration example) and a comparative product (conventional example) shown in FIG. 9 that reproduces the inductance element disclosed in Patent Document 2. It is a figure which shows the temperature characteristic at the time of current application.
- the temperature rise (heat generation amount) 1S is suppressed by about 20% when the same current is applied as compared with the comparative product.
- the magnetic element 10 according to the present embodiment has been found to have improved temperature rise characteristics as compared with the comparative product.
- the core member 20 is in direct contact with the conductor 30, even if the conductor 30 generates heat when a current is applied, the generated heat is immediately absorbed by the core member 20. . Further, the absorbed heat is thermally diffused by the core member 20 whose thermal conductivity is much better than that of air, and is further radiated by the outer surface. Therefore, even when a current of 75 A, for example, is applied to the magnetic element 10, the temperature rise (heat generation amount) can be limited to a temperature rise of 40 ° C or less at room temperature.
- the conductor 30 extends linearly inside the core member 20, and the conductor 30 is not wound inside the core member 20. As described above, the conductor 30 extends linearly, so that the magnetic element 10 can have a low L (having a low L value). Accordingly, the magnetic element 10 can be used even in a circuit to which a high-frequency current is applied, such as a power supply system.
- the magnetic element 10 of the present embodiment employs a configuration in which the core member 20 is in direct contact with the conductor 30. For this reason, even if the conductor 30 generates heat, the generated heat is immediately absorbed by the core member 20 and radiated by the outer surface of the core member 20. Therefore, the magnetic element 10 It is possible to improve the temperature characteristics.
- the conductor 30 is provided in a straight line, the magnetic element 10 can be easily manufactured.
- the linear conductor 30 can be easily formed by, for example, installing it inside the mold, covering it with the granulated powder, and press molding in that state.
- the manufacturing cost of the magnetic element 10 can be reduced.
- the magnetic element 10 has a simple configuration in which the conductor 30 is surrounded by the core member 20 and the terminal electrode 40 is provided, and the force can be easily manufactured as described above. For this reason, variation in characteristics of each magnetic element 10 can be reduced.
- the magnetic element 10 has a simple configuration. For this reason, the characteristic design of the magnetic element 10 is also facilitated. That is, it is not necessary to perform complicated calculations for the characteristic design.
- the conductor 30 is formed using a linear thin plate member 50. Therefore, the conductor 30 does not have a large dimension in the thickness direction, and the magnetic element 10 can be easily reduced in size.
- the magnetic element 10 of the second configuration example shown in FIGS. 4 to 7 includes a terminal recess 23.
- the terminal electrode 40 (mounting part 42) can be inserted into the terminal recess 23, the height of the magnetic element 10 can be reduced, and the size of the magnetic element 10 can be reduced. ) Can be achieved.
- the terminal electrode 40 (mounting part 42) is in a state of slightly protruding from the lower surface 21c. For this reason, when the magnetic element 10 is mounted, it is possible to reliably perform bonding between the terminal electrode 40 (mounting portion 42) and cream solder or the like.
- the gap between the lower surface 21c and the mounting substrate can be reduced. As a result, the mountability of the magnetic element 10 on the mounting substrate can be improved. Further, by reducing the gap, the height dimension of the magnetic element 10 after the magnetic element 10 is mounted can be reduced.
- the dimension Ll between the upper surface of the conductor 30 and the upper surface 2 la of the core member 20, and the left side surface of the conductor 30 and the side surface 21e of the core member 20 is set to approximately the same dimension. Therefore, when current is applied to the magnetic element 10 (conductor 30), magnetic saturation in the core member 20 occurs uniformly. As a result, Since there is no deviation as in the case where one of the method LI and the dimension L2 is equally narrowed, the DC superposition characteristics of the magnetic element 10 can be improved.
- the configuration of the magnetic element 10 is simple, and the molding density of the core member 20 can be reduced to the entire core member 20 without setting strict pressure molding conditions in the pressure molding process of the core member 20. Can be approximately equal in terms of position. As a result, the magnetic characteristics of the core member 20 are uniform in all parts, and the direct current superimposition characteristics can be improved.
- only one conductor 30 is provided inside the core member 20.
- the number of conductors 30 provided in the core member 20 is not limited to one, and two or more conductors may be provided.
- 10 and 11 show a magnetic element in which two conductors 30 are provided inside the core member 20 (hereinafter referred to as magnetic element 11). In this configuration, the two conductors 30 are arranged with a certain distance from each other.
- the magnetic element 11 when the magnetic element 11 includes a plurality of conductors 30 such as two, the magnetic element 11 is used for, for example, a high-frequency drive power circuit, and is a multiphase-compatible multiple inductor. It can be used as multiple noise filters, common mode chokes, transformers, etc. When two or more conductors 30 are provided, it is necessary to increase the number of terminal electrodes 40 corresponding to the number of conductors 30.
- FIG. 11 shows a mode in which the magnetic element 11 is mounted on the mounting board 60.
- the mounting board 60 includes land portions 61 to which the mounting portions 42a and 42d are mounted and Z-bonded, and land patterns 62 to which the mounting portions 42b and 42c are mounted and Z-bonded.
- the land pattern 62 is a conductor portion connected to the above-described external conductor 40 at both ends thereof.
- the land pattern 62 is for flowing current to the adjacent conductor 30.
- the land pattern 62, the conductor 30 and the outer conductor 40 form a coil portion, and a closed magnetic circuit can be formed by current conduction.
- a nonmagnetic material is provided between conductors 30 adjacent to each other, such as a magnetic element shown in FIG. 12 (hereinafter, this magnetic element is referred to as a magnetic element 12).
- Layer 22 may be provided.
- the nonmagnetic layer 22 is formed by curing a nonmagnetic and nonconductive nonmagnetic paste mainly composed of glass (Si), acid aluminum, or the like.
- the nonmagnetic layer 22 when the nonmagnetic layer 22 is provided, the flow of magnetic flux (short path of magnetic flux) formed around each conductor 30 is blocked. Therefore, when the current is conducted, it is possible to make the flow of magnetic flux one. As a result, it is possible to obtain a larger inductance value (L value) as compared with the configuration in which the nonmagnetic layer 22 is not provided. In addition, the direct current superimposition characteristics of the magnetic element 12 can be improved, and magnetic saturation can be prevented from occurring. It should be noted that the magnetic element 12 that works is suitable for common mode coils, inductors, transformers, and the like.
- the gap layer is a portion that also has a nonmagnetic member and functions as a magnetic gap.
- the magnetic element can have a good DC superimposition characteristic as compared with the case where no gap layer is present. As a result, the range where magnetic saturation does not occur can be expanded.
- the conductor 30 and the terminal electrode 40 are formed by bending the thin plate member 50, and then the magnetic element 10 is mounted on the mounting substrate.
- the thin plate member 50 may be mounted as it is without being bent.
- the terminal electrode 40 is not bent, but it is necessary to provide a conductive portion in contact with the terminal electrode 40 that is not bent forcefully on the mounting substrate.
- the strong magnetic element 10 may be used not only for achieving low L but also for applications where the L value increases.
- the inside of the core member 20 A magnetic element having a number of conductors 30 is used, and a land pattern (corresponding to an external conductor) for connecting adjacent conductors 30 to each other on different outer surfaces 21 is provided on the mounting board. In this way, in a state where the magnetic element is mounted on the mounting substrate, the coil portion is wound about several times. As a result, the L value can be increased.
- the core member 20 has a substantially rectangular parallelepiped appearance.
- the shape of the core member 20 may be various shapes such as a substantially disk shape that is not limited to a substantially rectangular parallelepiped shape.
- a strip-shaped conductor 30 whose front shape (or cross-sectional shape) is rectangular is used as the conductor.
- the conductor is not limited to a strip-shaped conductor having a rectangular front shape (or cross-sectional shape), and is a conductor having various shapes other than a rectangular shape, such as a circular shape or an elliptical shape.
- the magnetic element of the present invention can be used in the field of electrical equipment.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Coils Or Transformers For Communication (AREA)
- Coils Of Transformers For General Uses (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA002588094A CA2588094A1 (en) | 2004-12-27 | 2005-11-22 | Magnetic device |
JP2006550624A JPWO2006070544A1 (ja) | 2004-12-27 | 2005-11-22 | 磁性素子 |
EP05809497A EP1833063A4 (en) | 2004-12-27 | 2005-11-22 | MAGNETIC DEVICE |
TW094146600A TW200625351A (en) | 2004-12-27 | 2005-12-27 | Magnetic device |
US11/768,743 US20080012674A1 (en) | 2004-12-27 | 2007-06-26 | Magnetic device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004377718 | 2004-12-27 | ||
JP2004-377718 | 2004-12-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006070544A1 true WO2006070544A1 (ja) | 2006-07-06 |
Family
ID=36614670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/021465 WO2006070544A1 (ja) | 2004-12-27 | 2005-11-22 | 磁性素子 |
Country Status (8)
Country | Link |
---|---|
US (1) | US20080012674A1 (ja) |
EP (1) | EP1833063A4 (ja) |
JP (1) | JPWO2006070544A1 (ja) |
KR (1) | KR20070088554A (ja) |
CN (1) | CN101048830A (ja) |
CA (1) | CA2588094A1 (ja) |
TW (1) | TW200625351A (ja) |
WO (1) | WO2006070544A1 (ja) |
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JP2012049435A (ja) * | 2010-08-30 | 2012-03-08 | Alps Green Devices Co Ltd | コイル封入圧粉コア |
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Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009075110A1 (ja) * | 2007-12-12 | 2009-06-18 | Panasonic Corporation | インダクタンス部品およびその製造方法 |
US8339227B2 (en) | 2007-12-12 | 2012-12-25 | Panasonic Corporation | Inductance part and method for manufacturing the same |
JP2011530172A (ja) * | 2008-07-29 | 2011-12-15 | クーパー テクノロジーズ カンパニー | 電磁デバイス |
JP2012526383A (ja) * | 2009-05-04 | 2012-10-25 | クーパー テクノロジーズ カンパニー | 磁気部品とその製造方法 |
JP2013515377A (ja) * | 2009-12-21 | 2013-05-02 | ボルテラ セミコンダクター コーポレイション | 多巻回インダクタ |
CN103081325A (zh) * | 2010-05-24 | 2013-05-01 | 沃特拉半导体公司 | 利于改进的印刷电路板布局的两相耦合电感器 |
JP2013528321A (ja) * | 2010-05-24 | 2013-07-08 | ボルテラ セミコンダクター コーポレイション | 改善されたプリント回路基板レイアウトを推進する2相結合インダクタ |
JP2012049435A (ja) * | 2010-08-30 | 2012-03-08 | Alps Green Devices Co Ltd | コイル封入圧粉コア |
JP2019121737A (ja) * | 2018-01-10 | 2019-07-22 | Tdk株式会社 | インダクタ素子 |
US11587717B2 (en) | 2018-01-10 | 2023-02-21 | Tdk Corporation | Inductor element |
US20190272945A1 (en) * | 2018-03-01 | 2019-09-05 | Murata Manufacturing Co., Ltd. | Surface mount inductor |
US11887772B2 (en) * | 2018-03-01 | 2024-01-30 | Murata Manufacturing Co., Ltd. | Surface mount inductor |
US11476038B2 (en) | 2018-04-27 | 2022-10-18 | Panasonic Intellectual Property Management Co., Ltd. | Inductor |
US11817255B2 (en) | 2019-09-19 | 2023-11-14 | Tdk Corporation | Inductor element |
JP2022520294A (ja) * | 2020-01-17 | 2022-03-30 | 深▲セン▼市▲ハク▼科新材料股▲フン▼有限公司 | 銅板埋め込み式軟磁性粉末コアインダクタ、その製造方法及び用途 |
JP2022547241A (ja) * | 2020-08-14 | 2022-11-11 | 深▲セン▼市▲ハク▼科新材料股▲フン▼有限公司 | モールディング複合インダクタの製造方法及びモールディング複合インダクタ |
WO2024166857A1 (ja) * | 2023-02-10 | 2024-08-15 | 株式会社村田製作所 | 電子部品 |
Also Published As
Publication number | Publication date |
---|---|
KR20070088554A (ko) | 2007-08-29 |
JPWO2006070544A1 (ja) | 2008-06-12 |
US20080012674A1 (en) | 2008-01-17 |
EP1833063A1 (en) | 2007-09-12 |
TWI297505B (ja) | 2008-06-01 |
EP1833063A9 (en) | 2008-07-16 |
CN101048830A (zh) | 2007-10-03 |
CA2588094A1 (en) | 2006-07-06 |
TW200625351A (en) | 2006-07-16 |
EP1833063A4 (en) | 2008-09-17 |
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