US20200303114A1 - Inductor array in a single package - Google Patents
Inductor array in a single package Download PDFInfo
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- US20200303114A1 US20200303114A1 US16/820,944 US202016820944A US2020303114A1 US 20200303114 A1 US20200303114 A1 US 20200303114A1 US 202016820944 A US202016820944 A US 202016820944A US 2020303114 A1 US2020303114 A1 US 2020303114A1
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- 238000000465 moulding Methods 0.000 claims description 14
- 239000000696 magnetic material Substances 0.000 claims description 10
- 230000008878 coupling Effects 0.000 claims description 7
- 238000010168 coupling process Methods 0.000 claims description 7
- 238000005859 coupling reaction Methods 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 239000011796 hollow space material Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 229910000859 α-Fe Inorganic materials 0.000 claims description 3
- 238000000034 method Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/327—Encapsulating or impregnating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/0206—Manufacturing of magnetic cores by mechanical means
- H01F41/0246—Manufacturing of magnetic circuits by moulding or by pressing powder
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- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2847—Sheets; Strips
- H01F27/2852—Construction of conductive connections, of leads
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- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
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- H01F17/0006—Printed inductances
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- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
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- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/022—Encapsulation
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- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/08—Cooling; Ventilating
- H01F27/22—Cooling by heat conduction through solid or powdered fillings
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- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
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- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/255—Magnetic cores made from particles
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- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/26—Fastening parts of the core together; Fastening or mounting the core on casing or support
- H01F27/263—Fastening parts of the core together
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- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2823—Wires
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- H—ELECTRICITY
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- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
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- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
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- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/30—Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
- H01F27/306—Fastening or mounting coils or windings on core, casing or other support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/06—Coil winding
- H01F41/076—Forming taps or terminals while winding, e.g. by wrapping or soldering the wire onto pins, or by directly forming terminals from the wire
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/645—Inductive arrangements
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0066—Printed inductances with a magnetic layer
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- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
Definitions
- the invention relates to an inductor, in particular, to an inductor array in a single package.
- One objective is to provide an inductor array having multiple inductors in a single package to save PCB board space.
- One objective is to provide an inductor array having multiple inductors encapsulated by a magnetic body for controlling the magnetic characteristic of the multiple inductors easily.
- One objective is to provide an inductor array having multiple inductors in a single package to make the board assembly process faster and easier by mounting a single package containing multiple inductors on a PCB board.
- One objective is to provide an inductor array having multiple inductors with different inductance in a single package to meet design requirements.
- an inductor array comprising: a plurality of coils; and a magnetic body, wherein the magnetic body encapsulates the plurality of coils, wherein at least one portion of the magnetic body has a unitary body that is disposed over and across the plurality of coils and extended into a space between two adjacent coils that is disposed over and across the plurality of coils and extended into a space between two adjacent coils.
- the plurality of coils are electrically isolated from each other inside the magnetic body.
- the plurality of coils are placed along a horizontal direction with the axis of each of the plurality of coils being substantially in a vertical direction.
- the entire magnetic body is a unitary magnetic body, wherein the unitary magnetic body encapsulates the plurality of coils and extends into a hollow space of each of the plurality of coils.
- the inductor array comprise four coils to form four power inductors, wherein two power inductors all have a first inductance, and the other two power inductors all have a second inductance that is different from the first inductance.
- the inductor array comprise four coils to form four power inductors, wherein two power inductors all have a first inductance, and the other two power inductors all have a second inductance that is different from the first inductance.
- the inductance is 0.24 uH.
- the first inductance is 0.11 uH and the second inductance is 0.24 uH.
- the magnetic body comprise a first T core and a second T core, wherein a first coil is wound around the pillar of the first T core and a second coil is wound around the pillar of the second T core, wherein the magnetic body comprises a unitary and magnetic molding body to encapsulate the first coil, the pillar of the first T core, the second coil and the pillar of the second T core.
- the first T core and the unitary and magnetic molding body are made of different magnetic materials.
- the first T core and the second T core are made of different magnetic materials.
- each of the first T core, the second T core and the unitary and magnetic molding body is made of a different magnetic material.
- each of the plurality of coils has a same inductance.
- the plurality of coils have different inductance.
- the coupling coefficient of adjacent inductors is within 0.02.
- the coupling coefficient of adjacent inductors is less 0.05.
- the inductor array comprise four coils to form four power inductors, wherein the four power inductors all have a same inductance.
- the magnetic body comprises at least one of the following: iron powder, alloy powder and ferrite.
- the plurality of coils are placed along a horizontal direction with the axis of each of the plurality of coils being substantially in said horizontal direction.
- each of the plurality of coils is formed by a conductive wire.
- each of the plurality of coils is formed by conductive patterns.
- FIG. 1A-1B each shows a top view of an inductor array according to one embodiment of present invention
- FIG. 1C-1E each shows a top view of an inductor array according to one embodiment of present invention with a distance between each two adjacent coils for controlling the coupling coefficient of the coils;
- FIG. 1F shows a table of the relationship between the distance of two adjacent coils and the coupling coefficient of the two adjacent coils in accordance with an embodiment of the invention
- FIG. 2 shows a top view of an inductor array according to one embodiment of present invention
- FIG. 3A shows a schematic of the inductor array in accordance with an embodiment of the invention
- FIG. 3B shows a bottom view of the inductor array in accordance with an embodiment of the invention.
- FIG. 3C shows a diagram for connecting the inductor array with an IC in accordance with an embodiment of the invention.
- first and second features are formed in direct contact
- additional features are formed between the first and second features, such that the first and second features are not in direct contact
- present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
- an inductor array comprising: a plurality of coils 101 , 102 , 103 , 104 ; and a magnetic body 100 , wherein the magnetic body 100 encapsulates the plurality of coils 101 , 102 , 103 , 104 , wherein at least one portion 100 a of the magnetic body 100 has a unitary body that is disposed over and across the plurality of coils 101 , 102 , 103 , 104 and extended into a space 105 a , 105 b , 105 c between each two adjacent coils of the plurality of coils 101 , 102 , 103 , 104 .
- the bottom surface of each of the plurality of coils 101 , 102 , 103 , 104 is in contact with the magnetic body 100 .
- the plurality of coils 101 , 102 , 103 , 104 are electrically isolated from each other inside the magnetic body.
- the plurality of coils 101 , 102 , 103 , 104 are placed along a horizontal direction with the axis of each of the plurality of coils 101 , 102 , 103 , 104 being substantially in a vertical direction.
- the entire magnetic body 100 is a unitary magnetic body, wherein the unitary magnetic body encapsulates the plurality of coils 101 , 102 , 103 , 104 and extends into a hollow space of each of the plurality of coils 101 , 102 , 103 , 104 .
- the bottom surface of each of the plurality of coils 101 , 102 , 103 , 104 is in contact with the unitary magnetic body.
- the inductor array comprise four coils 101 , 102 , 103 , 104 to form four power inductors, wherein two power inductors all have a first inductance, and the other two power inductors all have a second inductance that is different from the first inductance.
- the inductor array comprise four coils 101 , 102 , 103 , 104 to form four power inductors, wherein two power inductors all have a first inductance, and the other two power inductors all have a second inductance that is different from the first inductance.
- each of the first inductance and the second inductance is 0.24 uH.
- the first inductance is 0.11 uH and the second inductance is 0.24 uH.
- the distance between adjacent coils can affect the coupling coefficient of the adjacent coils.
- the distance between adjacent coils is greater than 0.23 mm to allow the coupling coefficient of the adjacent inductors being less than 0.05, as shown in FIG. 1F .
- the magnetic body 100 comprise a first T core 100 b and a second T core 100 c wherein a first coil 101 is wound around the pillar of the first T core 100 b and a second coil 102 is wound around the pillar of the second T core 100 c , wherein the magnetic body 100 comprises a unitary and magnetic molding body 101 a to encapsulate the first coil 101 , the pillar of the first T core 100 b , the second coil 102 and the pillar of the second T core 100 c , wherein the unitary and magnetic molding body 101 a is disposed over and across the plurality of coils 101 , 102 and extended into a space 105 a between two adjacent coils 101 , 102 .
- the magnetic body 100 comprise a first T core 100 b , a second T core 100 c , a third T core 100 d and, a fourth T core 100 d , wherein a first coil 101 is wound around the pillar of the first T core 100 b , a second coil 102 is wound around the pillar of the second T core 100 c , a third coil 103 is wound around the pillar of the third T core 100 d , and a fourth coil 104 is wound around the pillar of the fourth T core 100 e , wherein the magnetic body 100 comprises a unitary and magnetic molding body 101 a to encapsulate the plurality of coils 101 , 102 , 103 , 104 , and the pillar of the first T core 100 b , the pillar of the second T core 100 c , the pillar of the third T core 100 d and the pillar of the fourth T core 100 e , wherein the unitary and magnetic molding body 101 a
- the first T core 100 b and the unitary and magnetic molding body 100 a are made of different magnetic materials.
- the first T core 100 b and the second T core 100 c are made of different magnetic materials.
- each of the first T core 100 b , the second T core 100 c and the unitary and magnetic molding body 100 a is made of a different magnetic material.
- each of the first T core 100 b , the second T core 100 c , the third T core 100 d , the fourth T core 100 e and the unitary and magnetic molding body 100 a is made of a different magnetic material.
- each of the plurality of coils 101 , 102 , 103 , 104 has a same inductance.
- the plurality of coils 101 , 102 , 103 , 104 have different inductance.
- the inductor array comprise four coils to form four power inductors, wherein the four power inductors all have a same inductance.
- the magnetic body comprises at least one of the following: iron powder, alloy powder and ferrite.
- the plurality of coils are placed along a horizontal direction with the axis of each of the plurality of coils being substantially in said horizontal direction.
- each of the plurality of coils is formed by a conductive wire.
- FIG. 3A shows a schematic of four inductors 101 , 102 , 103 , 104 in a package 301 , and each of the four inductors 101 , 102 , 103 , 104 is electrically connected to corresponding two electrodes 101 a , 101 b , 102 a , 102 b , 103 a , 103 b , 104 a , 104 b.
- FIG. 3B shows the electrodes of four inductors can be placed on the bottom surface of the package 301 having a width W and a length L, wherein each electrode can have a width A and a length B.
- each of the electrodes 101 a , 101 b , 102 a , 102 b , 103 a , 103 b , 104 a , 104 b is disposed on the bottom surface of the magnetic body.
- each of the electrodes 101 a , 101 b , 102 a , 102 b , 103 a , 103 b , 104 a , 104 b can be a surface-mount pad.
- FIG. 3C shows a schematic of a package containing multiple inductors 101 , 102 , 103 , 104 can be placed as a single component 301 for connecting with an IC 300 , which not only reduces the board space to accommodate the multiple inductors but also makes the assembly process faster, compared with the conventional technology using multiple independent inductors.
Abstract
Description
- The present application claims the benefit of U.S. Provisional Application Ser. No. 62/822,048 filed on Mar. 22, 2019, which is hereby incorporated by reference herein and made a part of the specification.
- The invention relates to an inductor, in particular, to an inductor array in a single package.
- Conventionally, when multiple inductors are needed for an application, multiple inductors will be placed on a PCB board to meet the design requirement, which not only occupy a larger PCB board space but also make the assembly process slower by mounting the multiple inductors one by one.
- Accordingly, there is demand for a better solution to solve these problems.
- One objective is to provide an inductor array having multiple inductors in a single package to save PCB board space.
- One objective is to provide an inductor array having multiple inductors encapsulated by a magnetic body for controlling the magnetic characteristic of the multiple inductors easily.
- One objective is to provide an inductor array having multiple inductors in a single package to make the board assembly process faster and easier by mounting a single package containing multiple inductors on a PCB board.
- One objective is to provide an inductor array having multiple inductors with different inductance in a single package to meet design requirements.
- In one embodiment, an inductor array is disclosed, wherein the inductor array comprises: a plurality of coils; and a magnetic body, wherein the magnetic body encapsulates the plurality of coils, wherein at least one portion of the magnetic body has a unitary body that is disposed over and across the plurality of coils and extended into a space between two adjacent coils that is disposed over and across the plurality of coils and extended into a space between two adjacent coils.
- In one embodiment, the plurality of coils are electrically isolated from each other inside the magnetic body.
- In one embodiment, the plurality of coils are placed along a horizontal direction with the axis of each of the plurality of coils being substantially in a vertical direction.
- In one embodiment, the entire magnetic body is a unitary magnetic body, wherein the unitary magnetic body encapsulates the plurality of coils and extends into a hollow space of each of the plurality of coils.
- In one embodiment, the inductor array comprise four coils to form four power inductors, wherein two power inductors all have a first inductance, and the other two power inductors all have a second inductance that is different from the first inductance.
- In one embodiment, the inductor array comprise four coils to form four power inductors, wherein two power inductors all have a first inductance, and the other two power inductors all have a second inductance that is different from the first inductance.
- In one embodiment, the inductance is 0.24 uH.
- In one embodiment, the first inductance is 0.11 uH and the second inductance is 0.24 uH.
- In one embodiment, the magnetic body comprise a first T core and a second T core, wherein a first coil is wound around the pillar of the first T core and a second coil is wound around the pillar of the second T core, wherein the magnetic body comprises a unitary and magnetic molding body to encapsulate the first coil, the pillar of the first T core, the second coil and the pillar of the second T core.
- In one embodiment, the first T core and the unitary and magnetic molding body are made of different magnetic materials.
- In one embodiment, the first T core and the second T core are made of different magnetic materials.
- In one embodiment, each of the first T core, the second T core and the unitary and magnetic molding body is made of a different magnetic material.
- In one embodiment, each of the plurality of coils has a same inductance.
- In one embodiment, the plurality of coils have different inductance.
- In one embodiment, the coupling coefficient of adjacent inductors is within 0.02.
- In one embodiment, the coupling coefficient of adjacent inductors is less 0.05.
- In one embodiment, the inductor array comprise four coils to form four power inductors, wherein the four power inductors all have a same inductance.
- In one embodiment, the magnetic body comprises at least one of the following: iron powder, alloy powder and ferrite.
- In one embodiment, the plurality of coils are placed along a horizontal direction with the axis of each of the plurality of coils being substantially in said horizontal direction.
- In one embodiment, each of the plurality of coils is formed by a conductive wire.
- In one embodiment, each of the plurality of coils is formed by conductive patterns.
- The present invention can be more fully understood by reading the subsequent description and examples with references made to the accompanying drawings, wherein:
-
FIG. 1A-1B each shows a top view of an inductor array according to one embodiment of present invention; -
FIG. 1C-1E each shows a top view of an inductor array according to one embodiment of present invention with a distance between each two adjacent coils for controlling the coupling coefficient of the coils; -
FIG. 1F shows a table of the relationship between the distance of two adjacent coils and the coupling coefficient of the two adjacent coils in accordance with an embodiment of the invention; -
FIG. 2 shows a top view of an inductor array according to one embodiment of present invention; -
FIG. 3A shows a schematic of the inductor array in accordance with an embodiment of the invention; -
FIG. 3B shows a bottom view of the inductor array in accordance with an embodiment of the invention; and -
FIG. 3C shows a diagram for connecting the inductor array with an IC in accordance with an embodiment of the invention. - It is understood that the following disclosure provides many different embodiments, or examples, for implementing different features of the invention. Specific examples of devices and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features are formed between the first and second features, such that the first and second features are not in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
- In one embodiment, as shown in
FIG. 1A , an inductor array is disclosed, wherein the inductor array comprises: a plurality ofcoils magnetic body 100, wherein themagnetic body 100 encapsulates the plurality ofcoils portion 100 a of themagnetic body 100 has a unitary body that is disposed over and across the plurality ofcoils space coils coils magnetic body 100. - In one embodiment, the plurality of
coils - In one embodiment, as shown in
FIG. 1A , the plurality ofcoils coils - In one embodiment, as shown in
FIG. 1A , the entiremagnetic body 100 is a unitary magnetic body, wherein the unitary magnetic body encapsulates the plurality ofcoils coils coils - In one embodiment, as shown in
FIG. 1A , the inductor array comprise fourcoils - In one embodiment, as shown in
FIG. 1B , the inductor array comprise fourcoils - In one embodiment, each of the first inductance and the second inductance is 0.24 uH.
- In one embodiment, the first inductance is 0.11 uH and the second inductance is 0.24 uH.
- In one embodiment, as shown in
FIG. 1C ,FIG. 1D ,FIG. 1E , the distance between adjacent coils can affect the coupling coefficient of the adjacent coils. - In one embodiment, the distance between adjacent coils is greater than 0.23 mm to allow the coupling coefficient of the adjacent inductors being less than 0.05, as shown in
FIG. 1F . - In one embodiment, as shown in
FIG. 2 , themagnetic body 100 comprise afirst T core 100 b and asecond T core 100 c wherein afirst coil 101 is wound around the pillar of thefirst T core 100 b and asecond coil 102 is wound around the pillar of thesecond T core 100 c, wherein themagnetic body 100 comprises a unitary andmagnetic molding body 101 a to encapsulate thefirst coil 101, the pillar of thefirst T core 100 b, thesecond coil 102 and the pillar of thesecond T core 100 c, wherein the unitary andmagnetic molding body 101 a is disposed over and across the plurality ofcoils space 105 a between twoadjacent coils - In one embodiment, as shown in
FIG. 2 , themagnetic body 100 comprise afirst T core 100 b, asecond T core 100 c, athird T core 100 d and, afourth T core 100 d, wherein afirst coil 101 is wound around the pillar of thefirst T core 100 b, asecond coil 102 is wound around the pillar of thesecond T core 100 c, athird coil 103 is wound around the pillar of thethird T core 100 d, and afourth coil 104 is wound around the pillar of thefourth T core 100 e, wherein themagnetic body 100 comprises a unitary andmagnetic molding body 101 a to encapsulate the plurality ofcoils first T core 100 b, the pillar of thesecond T core 100 c, the pillar of thethird T core 100 d and the pillar of thefourth T core 100 e, wherein the unitary andmagnetic molding body 101 a is disposed over and across the plurality ofcoils space coils - In one embodiment, the
first T core 100 b and the unitary andmagnetic molding body 100 a are made of different magnetic materials. - In one embodiment, the
first T core 100 b and thesecond T core 100 c are made of different magnetic materials. - In one embodiment, each of the
first T core 100 b, thesecond T core 100 c and the unitary andmagnetic molding body 100 a is made of a different magnetic material. - In one embodiment, each of the
first T core 100 b, thesecond T core 100 c, thethird T core 100 d, thefourth T core 100 e and the unitary andmagnetic molding body 100 a is made of a different magnetic material. - In one embodiment, each of the plurality of
coils - In one embodiment, the plurality of
coils - In one embodiment, the inductor array comprise four coils to form four power inductors, wherein the four power inductors all have a same inductance.
- In one embodiment, the magnetic body comprises at least one of the following: iron powder, alloy powder and ferrite.
- In one embodiment, the plurality of coils are placed along a horizontal direction with the axis of each of the plurality of coils being substantially in said horizontal direction.
- In one embodiment, each of the plurality of coils is formed by a conductive wire.
-
FIG. 3A shows a schematic of fourinductors package 301, and each of the fourinductors electrodes -
FIG. 3B shows the electrodes of four inductors can be placed on the bottom surface of thepackage 301 having a width W and a length L, wherein each electrode can have a width A and a length B. - In one embodiment, each of the
electrodes - In one embodiment, each of the
electrodes -
FIG. 3C shows a schematic of a package containingmultiple inductors single component 301 for connecting with anIC 300, which not only reduces the board space to accommodate the multiple inductors but also makes the assembly process faster, compared with the conventional technology using multiple independent inductors. - From the foregoing, it will be appreciated that, although specific embodiments have been described herein for purposes of illustration, various modifications may be made without deviating from the spirit and scope of the disclosure. Furthermore, where an alternative is disclosed for a particular embodiment, this alternative may also apply to other embodiments even if not specifically stated.
Claims (20)
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US16/820,944 US20200303114A1 (en) | 2019-03-22 | 2020-03-17 | Inductor array in a single package |
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US16/820,968 Active 2041-10-14 US11915855B2 (en) | 2019-03-22 | 2020-03-17 | Method to form multile electrical components and a single electrical component made by the method |
US16/820,918 Active 2041-04-02 US11676758B2 (en) | 2019-03-22 | 2020-03-17 | Magnetic device |
US18/138,148 Pending US20230260693A1 (en) | 2019-03-22 | 2023-04-24 | MAGNETIC DEVICE and STACKED ELECTRONIC STRUCTURE |
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US18/138,148 Pending US20230260693A1 (en) | 2019-03-22 | 2023-04-24 | MAGNETIC DEVICE and STACKED ELECTRONIC STRUCTURE |
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US11676758B2 (en) | 2023-06-13 |
US11915855B2 (en) | 2024-02-27 |
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