TWI316724B - Form-less electronic device and methods of manufacturing - Google Patents

Description

1316724 IX. DESCRIPTION OF THE INVENTION: FIELD OF THE INVENTION The present invention relates generally to an electronic component, and more particularly to a transformer and sensing device including a bobbin or other forming assembly ( An improved design and method of miniature electronic components such as "choke coils". [Prior Art] As is well known in the art in the prior art, the sensing component is an electronic device that provides inductive performance (i.e., stores energy in a magnetic field) in an alternating current circuit. An inductor is an inductive device that is well known and is typically formed using one or more coils or windings that are wound or not wound around a core. The so-called "double winding" inductor uses two windings wound on a common core. A transformer is another sensing component for transferring energy from one AC circuit (A C ) to another AC circuit (A C ) by magnetic coupling. Typically, a transformer is formed by winding one or more wires on an iron core. A wire is used for the primary winding and electrically coupled energy and electrical coupling energy from the first circuit to the first circuit. Another wire is also wound around the iron core to be magnetically coupled to the first wire, which acts as a secondary winding and electrically couples energy and electrical coupling energy from the second circuit to the second circuit. The AC power applied to the primary winding causes AC power in the secondary winding and vice versa. Transformers can be used to switch between voltage magnitude and current magnitude to produce phase shifts and to switch between different levels of impedance values. 5 1316724 Ferrite core inductors and transformers are commonly used in modern wideband circuits, including IS D N (Integrated Services Digital Network) transceivers, (digital subscriber loop) modems, and cable modems. These devices are versatile, including masking, controlling longitudinal inductance (leakage), and impedance matching and isolation between the broadband communication equipment and communication lines it connects. The ferrite core inductor technology was developed to provide miniaturization and the need to achieve specifications for chipset manufacturing and standard organization (such as ITU-T). For example, a transformer to be miniaturized in a DSL modem that introduces a minimized THD (Total Harmonic Distortion) throughout the DSL signal band while making the DSL signal i| another example, a dual winding inductor can be used in The telephone line filter provides a mask and a south longitudinal inductance (face leakage). "setting" device

Typically prior art ferrite core inductive devices are known as EP devices. In the prior art, EP and similar devices are well known, for example, U.S. Patent No. 5,4 8 9,8 8 4, which was approved by Heringer et al. on February 6, 1996, entitled "Inductive Component". An inductive electronic component including a body having a wire flange defining a winding space and a stylus strip integrally formed on the flange of the coil body, the stylus strip extending portion and a cut formed therein by the bottom cut are disclosed The extension is directed to the free end. U.S. Patent No. 5,434,493, the entire disclosure of which is incorporated herein by reference. Other similar devices that are well known to us include EF, ER

Communication DSL allows us to have the same sex at the same time, and it needs to be wide. In the iron heart. For example, the electric coil body has an outer limit fixed by a kind of 〇 RS, RM 1316724, and a pot-shaped iron core device. See, for example, U.S. Patent No. 5,95 2,9,07, issued to McWilliams et al., entitled "Blind-hole pot-shaped core transformers," which discloses a pot-shaped core device. Figure 1 shows a typical The prior art EP transformer configuration shows a specific aspect of its process. Figure 1 shows the EP iron two EP core halves 104, 106 of the device, each EP core half has a flat semicircle formed therein. The channel 108 and the central column 110, and each EP core half is formed of a magnetically permeable material such as ferrous. As shown in Fig. 1, each EP core half 104, 106 is joined to form a surrounding winding. An effective continuous magnetic permeability of 1 1 2 "the outer casing is wound around the bobbin-shaped bobbin 1 〇 9, and the bobbin 1 0 9 is received on the center piece 110. A precision gap can be designed at the base of the ferrite core column 110 to adjust the transformer's conversion function to suit the specific design requirements. When the EP core device is installed, the winding 1 wound on the bobbin 109 is wound around the center column 1 1 〇. This causes an alternating magnetic flux to flow through the EP iron wafer to the winding. Once the device is installed, the EP core self-closes the winding, providing a high degree of magnetic mask. The core iron material is designed to provide a pre-magnetic flux density over a specific frequency range and temperature range. The bobbin 109 includes a terminal 114 (&1 ""seat") that is typically mounted to the bottom of the device 100, the windings 112 pass through the seat portion 1 of the half sheets 104, 106, and the terminal arrangement 11 4 is assembled to the printed circuit Board (PCB) his components. Additional galvanic isolation (not shown) outside the outer winding U 2 can also be used for additional electrical isolation if desired. 1999" and the core is matched with the component." The slit of the 5th element. When the .2 is also flowing, the fixed flat tube in the outer part or the shape and size of 7 1316724 matching each core can be used. Various bobbins. The bobbins themselves (in addition to the other components of the parent device) have different characteristics; they can provide different numbers of pins/terminals, winding options, different final mounting techniques, and relative mounting to through-hole mounting. For example, U.S. Patent No. 6,587,023, to Miyazaki et al., which is incorporated herein by reference in its entirety to the "electromagnetic induction device", is a flat bobbin with axially aligned through holes. Dye et al., U.S. Patent No. 5,350,980, which is incorporated herein by reference to U.S. Patent No. 5,350,980, the disclosure of which is incorporated herein by reference. Winding transformers and inductive devices (such as electrical transformers, including the aforementioned EP type devices). The magnetic wires are coated with a polymeric film or a mixed polymer film such as polyamine phthalate, polyester, poly"KaptonTM", etc. Made of copper or other conductive material. The thickness and composition of the film determines the insulation of the wire. Although other dimensions are used in specific applications, magnetics in the range of 3 1 to 4 2 AWG are used for microelectronic transformer applications. EP and similar sensing devices have points. The main drawback of EP devices is the complexity of their manufacturing process, which increases the cost. The use of bobbins (also known as "forms" or "formers") Not only increases the cost, but also keeps the inside of the device after the winding process is completed, which increases the final size and complexity. The bobbin takes up space inside the device, and these air can be used for other purposes. The function, or conversely, does not give the final device the same winding with many different surface names. It reveals the sensory and amine-insulating amine of the t[inductor coil] (aka coating can also be the most common line) There is a lack of 8 1316724 size and/or mesa area for the manufacture of the bobbin spool between the gauges. In addition, the EP core halves are relatively expensive to form and produce. For example, when installing and testing EP transformers, Its volume production cost is higher (now it is in the range of about 0 _ 50 to 0 · 70 USD). It is expected that the manufacturing performance is at least equal to the performance characteristics of the EP transformer, and the cost is greatly reduced. (He ad ere d)" The formed core device example of the device of Fig. 1 also has the drawback of using a socket or terminal arrangement 144. This structure additionally increases the cost and manufacturing steps, at least increasing the setting of 100 Vertical profile. In some applications, if possible, a lower vertical profile structure would be required instead of a tube holder. Bonded Wire Adhesive Enameled Wire is a long-lasting product/system Used in the production of "air coils". The hollow core is itself an inductor and is typically used for RFID tags, voice coils and sensors, etc. Materials and manufacturing equipment for producing adhesive lines can be used. It is commercially available from a variety of sources well known to those skilled in the art. Adhesive wire is an important enamel-coated wire, and the wire seller's device manufacturer is coated with an additional coating on the outer surface of the enamel. Usually when entangled, The adhesive enamel coating can be made active by other types of treatments including radiant flux chemistries, etc., but typically by heating to bond/bond the coated wires together. This rationality can provide certain advantages and is lower in the production of electronic components. For example, it is necessary to improve the electronic device and the method of manufacturing the device without using a bobbin or other formwork (bobbin). Such an improved apparatus should ideally utilize existing and well-known techniques in place of the bobbin/die (bobbin) to simplify the process and further reduce cost, but can also reduce the overall size of the device and/or The mesa area is still capable of maintaining the desired electrical and physical properties of its counterpart with a bobbin. Moreover, for specific applications, it is highly desirable to remove prior art headers (terminal arrangements) from the formed core assembly.

SUMMARY OF THE INVENTION The present invention satisfies the above needs by providing an improved electronic sensing device and a method of fabricating the same.

In a first aspect of the invention, an improved bobbinless electronic device is disclosed. The device typically includes a core and at least one winding, the at least one winding being formed and mounted within the device, but without the use of an internal bobbin. In one embodiment, the apparatus includes an adhesive lacquered coil formed in a formed core, the bonded enamel of the coil not using an internal bobbin or other similar structure. Termination elements are provided at the bottom of the device to terminate the coil windings to the parent assembly (e.g., PCB). In a second aspect of the invention, a multi-core device is disclosed. In an exemplary embodiment, the multi-core apparatus includes a plurality of the above-described bobbin-free electronic sensing devices that are disposed in a common termination socket in an end-to-end (or side-by-side) orientation, thereby saving the mesa area of the PCB. The pins with the common signal are selectively combined to also reduce the number of terminal leads required. 10 1316724 In a third aspect of the invention, a termination header for terminating a bobbinless induction device is disclosed. In one embodiment, the termination header includes a molded component with an embedded SMT terminal that connects the SET terminal to a separate device using standard adhesive techniques. In another embodiment, the header is adapted to receive a plurality of cores adjacent to each other. In a fourth aspect of the invention, a method of manufacturing the above-described bobbinless electronic device is disclosed. The method generally includes: providing a terminating header; providing a formed core divided into at least two components; providing an adhesive enameled wire comprising a wire having an end; the exposed end by mounting the winding in the core assembly a portion to form a formed core assembly; connect the formed core assembly to a termination member having a plurality of terminals; and terminate the ends of the winding to the ends of the terminals. In a fifth aspect of the invention, an improved "direct assembly" cordless device is disclosed. In one embodiment, the apparatus includes a previously described bobbin-free sensing device, but the bobbin-free sensing device is directly mounted on the female component (e.g., P C B ), thereby eliminating the need for a termination header. The free end of the winding protrudes from the device through a hole formed in the lower assembly. The end is soldered to a conductive pad on the PCB substrate. In a sixth aspect of the invention, a method of manufacturing the aforementioned bobbinless and tubeless sensing device is disclosed. The method generally includes providing a shaped core divided into at least two components; providing at least one long length of wire having an end; forming the wire into a core winding having a plurality of turns, and further comprising processing the wire to form the turns into A substantially integral assembly; and mounting the windings within the core member to expose the ends of the windings for termination. In an embodiment of 11 1316724, the wire comprises a thermally actuated adhesive enamel wire wound around a mandrel and then heated so that the bobbin can be omitted. The assembled device is then mounted directly to the PCB or other device described above. In a seventh aspect of the invention, a self-guided electronic device for surface mounting is disclosed, which typically includes a bobbin-free sensing element and a self-guided termination element that connects an inductive element, the self-guided termination element comprising a plurality of Terminal elements, each of which is adapted to receive at least one winding end of the upper inductive winding thereof so that surface mounting is possible. In an exemplary embodiment, the termination component includes a molded plastic stem with a terminal post on which the core winding is wound. In an eighth aspect of the invention, a low profile, low cost electronic component is disclosed, generally comprising: a PCB having a first aperture formed therein and a plurality of contact tabs formed thereon; and having a shaped core and a bobbin-free sensing device having a plurality of free-end windings, the forming core having a second aperture formed therein, the first and second apertures being substantially connected to each other such that the free end passes through the two apertures and each is free The end is connected to a contact pad. At least a portion of the windings are received in the second aperture, thereby reducing the overall (mounting) height of the sensing device. In a ninth aspect of the invention, a multi-core electronic component having a reduced mesa area is disclosed. The assembly typically includes a plurality of bobbinless and tubeless sensing devices that are substantially mated and arranged in a linear configuration. In one embodiment, the device is placed in adjacent, side-by-side (side-by-side) and mounted directly to the parent device (e.g., P c B ) to occupy as small a mesa area as possible. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring now to the drawings, the same reference numerals refer to the As used herein, the term "inductive device" refers to any device that applies or performs induction, including but not limited to inductors, transformers, and reactors (or "choke coils").

As used herein, the terms "bobbin" and "form" (or "former") are used to mean one or a device that is placed on or in the sensing device to help form or hold the device. Any structure or component of multiple windings. As used herein, the terms "signal conditioning" or "conditioning" are understood to include, but are not limited to, signal voltage conversion, filtering and arpeggio cancellation, signal separation, impedance control and correction, current limiting, and delay.

The term 'digital subscriber line' (or "DSL") refers to any form of DSL structure or device, whether symmetrical or asymmetrical, including the infinite "G · 1 ite" ADSL (eg, Compliance with j; τ u G.992.2 ), RADSL: (rate adaptive DSL), VDSL (very high speed DSL), SDSL (symmetric DSL), SHDSL or super high bit rate DSL, known G.shdsl (eg, conforming to ITU Recommended G_991.2, ITU-T approved in February 2001), HDSL: (High Speed DSL), HDSL2: (Second Generation HDSL) and IDS L (Integrated Services Digital Network dSL), and fixed telephone line network (for example, HPN). 13

1316724 Summary In one broad aspect, the present invention provides an improved bobbinless electronic device and method of fabricating the same. The electronic device can be used in many electronic circuits 'which include, for example, those used for signal conditioning or DSL circuits. The main advantage of winding a coil without a bobbin (or bobbin) is that the space typically occupied by the bobbin in the device is used for other functions' or this design results in a smaller size and/or mesa area. In particular, 'more winding space inside the device makes it possible to apply the following points (or combinations thereof) in the design: (0 can use more windings for a given design, thus in a given shape Higher inductance/performance (ie, higher winding density) can be obtained at a factor; (ii) or a higher number of wires can be used to maintain the same number of turns, providing other electrical performance advantages; The performance of a given design using a bobbin can be obtained in a smaller "bobbinless" design. Smaller devices are generally cheaper. In addition to the cost advantages, they are used for a given performance. The small size also offers the ultimate in space and reduced bench area, which is very attractive in high-density applications. I, ^ Other important advantages, including the random installation of the winding of the iron device, and can be used Various termination means bobbin design structure and manufacturing method advantages. Front or rear end which takes full advantage of the exemplary equipment in the case of an exemplary shaped iron transformer As discussed in the same 14 I316724, it will be appreciated that the present invention can be used in other sensing devices (eg, inductive) and core structures. Therefore, seven offices have multiple windings and require electrical insulation. Any device can benefit from the application of the present invention. Therefore, the subsequent discussion of the formed core transformer σ esj. Ding = 〇, 疋 wider content. Refer to Figure 2a-2c' An illustrative embodiment of a non-reacting bell-to-heat ratio line-inductive device (e.g., a shaped core transformer) is described. As shown in Figure 9, Figure 2, the device 2〇〇 typically includes a core element 202, a wound coil 2〇4 and terminating element or socket 2〇6.

In the embodiment of the introduction, the core element county is a gentleman~

疋八 has an elliptical center foot 2 0 3 "E-shape"; but you can recognize that you can use

1 Especially in different shapes of cereals (such as EF, EE, ER and RM or even pot core). This is from the outer side of G, it can be recognized that the core member and the winding coil together can be at any angle with respect to the stem. For example, the fourth (4th) represents an embodiment in which the "E_shaped" core element 6仏, 6 coffee and the winding wire 圏6〇4 are mounted such that the opening plane of the core is perpendicular to the plane of the board on which the amp is mounted. . The core element 202 comprises two sheets 2〇2&, 2〇 of the same structure. The manufacture of cores, such as soft ferrite or powdered iron, from magnetically permeable materials is well known in the electrical arts. The manufacture and composition of this core is already

Well known, so no further explanation here. The core is mounted on the winding coil 2〇4 and the terminating member 206. In the illustrated embodiment, the core 220 was assembled to the molded polymer termination member 2 用 6 with an adhesive primarily because of ease of manufacture and low cost. However, other techniques for securing the two components (i.e., core 202 and splicing element 206) can be used. For example, a "spring clip" of a metal that is well known in the art can be used. Alternatively, a friction arrangement can be used, such as forming two side spacers disposed laterally outside the core elements 202a, 202b as termination elements 206 15

A portion of 1316724; the mounted core 2 Ο 2 is placed over the top of the terminating element 2 〇 6 and then brought into frictional engagement with the yoke to maintain the core 202 in a fixed position on the element. Alternatively, the core portions 202a, 202b may be glued or bonded together. The conductors of the core are effectively elongated and terminated (e.g., wound and/or soldered) on the terminal 210 of the component 206. Thus, the terminated wires are used to maintain tension on the winding coils 204 (and the core 202) for holding the core assembly that is coupled to the termination elements 206. Different combinations as described above can also be used if desired. Termination component 206 includes a plurality (e.g., '8) of terminals 210 for physical and electrical assembly to other devices, such as PCBs. These terminals 21A may be of any construction' including, for example, a substantially rectangular cross-section suitable for surface mounting (SMT), a circular or elliptical cross-section for through-hole mounting, a ball-grid array, and the like. If necessary, it can also be cut or shaped to help entangle the wire. Furthermore, it will be understood that the terminating element 2〇6 may comprise a self-guided device (not shown) which is commonly known as the "self-guided surface mount coplanar header" approved by Gutierrez on May 18, 1993. U.S. Patent No. 5,309,130, issued on May 3, 1994, which is incorporated herein by reference in its entirety, the entire disclosure of which is incorporated herein by reference. reference. For example, in one embodiment, the termination component 206 is a molded polymer device. The device has eight (8) self-guided terminals formed therein in which different conductors of the coil 206 are wound. It is to be understood that the termination elements 206 can be present in a variety of different shapes or configurations. For example, the termination element 206 can comprise substantially square, circular or multiple

16 1316724 Edge, depending on the needs of the particular application. In addition, the exact location of terminal 210 in component 2〇6 can be tailored to the circuit location and mounting considerations at the system level. Further, if necessary, the termination elements may be omitted entirely by means of, for example, the apparatus described later with reference to Figures 4 and 4a, or the conductive terminals 21'' may be directly bonded to the core. As shown in Fig. 2a, the winding coil 204 includes a winding of one or more wires. The winding is inserted between the core portions 2 0 2 a and 2 0 2 b and inserted into the termination member 206 when formed. The coil winding consists of a bonded enamel wire of the type previously described 'and wraps in the case of an internal bobbin or formwork (spool), for example on a movable mould, winding mandrel or steel bobbin . The shape of the coil is determined by the size of the winding mandrel. In an exemplary embodiment, the winding mandrel includes a polished steel shaft with a centrally disposed groove or slit. The groove/cut is formed by an optionally removed pin or extension of the shaft. The first of the two small pins or dowels that are radially disposed with the grooves of the adjacent shaft are fixedly bonded to the enameled wire. The bonded enameled wire source (e.g., spool) is then laterally aligned on the groove, and the rotating shaft forms the winding coil 204. After the winding is completed, the terminal of the wire is fixed with a second radial pin disposed adjacent to the other side of the groove. The windings are then heated (for example by blowing hot air over the mandrel or heating the mandrel itself, etc.) to tie the wires of the coil from the line. It should be noted that this method can have many different variations, such as the axis (heart thin) s fixed and the wire source rotating around the mandrel. This winding technique is well known in the mechanical field' and therefore will not be described in detail here. Furthermore, it will be appreciated that different winding layout patterns of 17 1316724 can be used depending on the particular design objective achieved. For example, a 'substantially parallel numbering pattern can provide the most compact spatial package' to reduce the overall size of the winding. Alternatively, other laying patterns can provide optimal electrical and/or magnetic properties for a particular application. The general technician will recognize all these changes. After completing one or more windings, the removable center pin on the winding mandrel (which forms the groove) exits, so that the formed and bonded coil can be removed or it can fall out due to gravity, Winding a new coil 0

In an exemplary embodiment, the 'adhesive enamel wire includes a 35AWG-42AWG bondable wire manufactured by Bridgeport Insulated Wire Company of Bridgeport, Connecticut, USA, although other manufacturers, structures and sizes may be used. Wire. The wire comprises a round steel magnetic wire with a polyurethane based coating. The polyurethane-based coating has a polydecylamine (Kapton) and a self-adhesive topcoat. Although not required, the wires of the illustrated embodiment conform to the NEMA MW29-C and IEC 3 17-35 international standards for wires. However, it can be understood that a suitable wire can be purchased for the winding 204 required for production.

Post-coating (regardless of before, during or after the aforementioned mandrel forming process) ° It is to be understood that the aforementioned "form_less" wire bonding method can be applied to (1) a single continuous winding; a plurality of windings connected as a unitary physical group or structure; or (iii) single or multiple windings connected in two or more separate groups' which may or may not ultimately be connected by the aforementioned joining techniques or other techniques Together. Thus, the present invention can have a variety of winding/connection configurations, which can be determined, for example, by insulation tolerance requirements, multiple windings 18 1316724 inside the same core, and the like. In addition, although the adhesive enameled wire is preferred, the device 2 can also use the commonly-owned U.S. Patent No. 6,642,847, which is entitled "Advanced Electronic Microcoil and Its Manufacturing Method", which was approved on April 4, 2003. The description describes the formation and application of a wound coil, the contents of which are incorporated herein by reference. Specifically, the parylene support coating is applied to a plurality of individual wires forming a layer or group by, for example, gas phase or vacuum deposition. Polyparene is chosen because of its excellent properties and low price; however, specific applications may require the use of other insulating materials. Such materials may be polymers such as fluoropolymers (eg, Tefl〇n, ethylene tetrafluoroethylene copolymer (Tefzel)), polyethylene (eg, XLpE), polychloroethane, return ( Pvcs) or even an elastomer. Further, the wound coil 2 〇 4 of the invention may be formed by dipping or spraying a coating. In the present invention, the insulation of the winding, & the free end (see Figure 2c), is stripped before, after or during the welding (so-called solder stripping) using techniques well known in the art. This peeling helps to form a good electrical connection with the terminal 21A connected to the free end 220. Since the coils are independently wrapped without relying on the internal bobbin or formwork (spool), the two adjacent spaces can be obtained within the apparatus 200. This additional space allows for a given core design to be included. Thus, the inductance and/or performance of a given shape is beneficially improved. The additional space created by the removal of the bobbin allows the same number of turns to be maintained with heavier gauge junctions, two &", thus providing other electrical characteristics advantages such as reduced DC resistance and insertion loss. 19

1316724 In addition, additional space may be used to reduce the overall size and/or deck area of the unit 2 Ο 0, as well as its weight. Smaller coils not only have cost advantages (because of the use of less material), but also provide the ultimate application space advantage, which is especially attractive in high density applications. For example, a larger prior art (with bobbin) counterpart with the required electrical performance cannot be adapted to a particular application. It will be appreciated that these design variations and other design variations can be used independently or in combination with each other simply because of the "formless" feature of the present invention. Figure 2d shows an exemplary method 270 of fabricating the sensing device 200 of Figures 2a-2c. It will be understood that although various steps are described for the elements that form or fabricate the sensing device 200, such steps can be eliminated by selectively obtaining previously fabricated components from a third party. As shown in Figure 2d, the method 270 generally includes first forming a termination header 206 (step 272) that includes forming the terminal 210 and placing it within the header 206 (step 274). Then, the shaped core 202 is provided and divided into its constituent elements 202a, 202b (step 276). A sufficient amount of adhesive enameled wire is then provided (step 278). Then, through step 280, an adhesive enamel wire is formed on the outer shape and cured (e.g., heated, exposed to a chemical, irradiated, etc.). The cured coil 204 is then removed from the form and, if desired, further includes positioning the free end of the winding and stripping the free end (step 282). Then, the prepared coils are placed between the core halves, and if necessary, the core halves can be selectively bonded together (step 2 8 4 ). The assembled core can then be mounted on the termination component 206 with a bonding agent (step 286) and the free end 220 terminated at its corresponding terminal 210 (step 288). The device is then selectively tested via steps 290 20 1316724. Referring to Fig. 3, another embodiment of the sensing device of the present invention is described. Figure 3 shows the assembly 3A comprising a plurality of sensing devices 310 (e.g., four) coaxially coupled together in an arrangement disposed within the combined termination header 306. Ten in the

In the illustrated embodiment, device 310 is provided with its long sides collinear, although other orientations (e.g., side by side) and arrays are used. The multi-inquiry component 300 of Figure 3 provides a number of advantages over a single core component. In particular, the plurality of cores 310 on a single header 306 reduces and/or eliminates the space or spacing required between the cores on a single header in conventional designs. This space sounds a waste of PCB area because each device cannot be placed too close to each other. The space saving advantage of this month is even greater when a large number of devices such as eight 'twelve devices are coaxially connected together.

Xixi iron. The termination of the base 306 also reduces the number of terminations that are mounted to the printed circuit board (the PCB, because as shown in Figure 3, the ms or singularly shared pins or terminals 310 on the 'disparate structure' can be concentrated. To a single termination point. This "Eve, Spot 13⁄4彳 51 4, >

— Compared with the discrete structure of s eve, it has the economic advantage of manufacturing a single terminal seat. Direct Mounting Welding Termination Method * In addition to the above-described advantages, the bobbin-free sensing device of the present invention also has the possibility of terminating the wires before or after the women's core, without requiring the technical requirements Terminate the wire to the pin of the winder door before installing the core. The flexibility of terminating the wires before or after the installation of the core is not only 21

1316724 The flexibility of the process (for example, the pre-change of the order of the steps of making the device) and allowing at least two non-independent termination methods; (i) according to the above Figures 2a-:2b use the above-mentioned termination components to make a dry (seat): and (ii) direct mount soldering. Reference will now be made to the detailed sentence of Figures 4 and 4a from the day after the leaf, Tian Yuming, a technique. Although the subsequent discussion is directed to an E P-type core, it is possible to understand the present invention and is in no way limited to such a core structure. As shown in Figures 4 and 4a, the direct ampere welding method of the present invention advantageously eliminates the need for a bobbin or socket. In this method, the sensing device 4 is directly mounted and/or assembled to the final assembly or the female device. The final assembly or parent device can be, for example, a PCB 403 or other electronic device. Component. In an example, the component or parent device includes one or more apertures 405 formed therein that are adapted to receive the device coil 4〇4 free conductor end 420. The sensing device 4 can be glued or bonded to the PCB 403 or other components mounted thereon, as shown in Figure 4, or friction mounted, for example by providing a tapered or embossed structure to the outer circumference 402a '(4) of the core portion. (not shown) 'The device 4 is effectively "bited" in the pcb cavity 405. Other techniques can be used to maintain the device 4A in a substantially constant orientation relative to the parent assembly 410, such as bonding. Pin, Shuangzi, etc. As shown in Fig. 4a, the free end 42 of the coil winding passes through the hole 4〇5 and is directly terminated on the PCB contact pad 450, which is disposed on the lower side of the PCB 403 4 1 7. In the illustrated embodiment, such termination includes welding the free end 42〇 (e.g., by a manual or wave soldering process) to the contact pad 45 5 , and other termination methods can be used. It should be understood that the present invention is in no way limited to the use of contact pads 45 0 as shown in Figure 4a; thus, it is well compatible with the present invention' so that elevated or embedded terminals, pins, etc. can also be used.

twenty two

1316724 The described embodiment has the advantage of being simple and easy to manufacture. For example, the depth of the coil 404 in the aperture 405 can be adjusted as needed (if by device design, PCB thickness, or using an insert spacer (not shown), so that wave soldering can be used, and wave soldering can provide a large number of electrical contact terminations. Very efficient. Thus, prior to performing such a large amount of soldering, in order to maintain the free end 42 of the wiring in the desired orientation relative to the contact cymbal 450, the inner edge 452 of the aperture 4 〇 5 can be engraved if desired (not shown). . It should be understood that although the embodiment of Figures 4 and 4a utilizes a spacer 450 disposed on the underside of the PCB 403, such spacers may be disposed on the (joined) side 425 (the same side) of the PCB 403. In one embodiment (Fig. 4b), the free end 420 of the winding simply exits from the underside of the device 400, coated within the thickness of the adhesive/bonding agent 470 between the device 400 and the PCB 403 (i.e., A sufficiently thick adhesive is applied to insulate the leads to the spacers 450 disposed on the upper side 425. In another embodiment, the leads 420 are routed through grooves formed in the core members 402a, 402b. Other methods can be used as well. Similarly, it will be appreciated that the above described "same side" spacer arrangement with or without the aforementioned PCB holes or recesses 405 can be used. For example, as shown in Fig. 4b, the core member 402 can be constructed such that the windings (when mounted) do not protrude from the underside of the plane of the core element substrate, and thus such grooves or holes 405 are not required. However, this approach allows the overall mounting height of the device 400 on the PCB (or other device) to be slightly higher than when the recess/hole 405 is used. However, such an "aperture-less" structure is required when the PCB or other device of the mounting device 400 does not have (or cannot have) the aperture 405. 23 1316724 It is also noted that at least a portion of the inductive device 400 of the present invention may also be sealed with an epoxy or polymeric encapsulant (e.g., a lithographic resin) when mounted to a substrate or p CB, as is well known in the art. of. The device can also mask EMI as is well known in the prior art, for example by using a tin or metal Faraday mask that is well known. The aforementioned "direct mounting" method shown in Figures 4 - 4 a not only eliminates the expense of splitting the bobbin and the terminating header 2〇6 (thus providing easier and more costly for the same electrical performance) The low device), and advantageously reduces the overall mounting height of the predetermined sensing device structure. The method of Figure 4b is simply that there is no bobbin or socket 'and instead actually achieves a higher vertical height because there are no pCB holes or grooves that accommodate the lower portion of the winding. It should be understood that the direct mounting method described above can generally be applied to a plurality of cores, similar to the structure of Figure 3. Specifically, a plurality of cores may be placed on the parent device (e.g., p C B ) in a vehicle or in a side-by-side manner, thereby

Most of the mesa area used by these devices. If necessary, these devices can be connected to Φ and soil (not shown), for example, by using adhesives, etc., with metal aging, and by using a molded plastic frame that holds the device in a connected relationship. They are connected together. As a further alternative, the left side #D for the internal device, the side core halves 402a, 4〇2b may be made as a unitary component (i.e., a device having a right core half piece for the device 400 immediately adjacent thereto). The 哉^ half piece as its integral part), the core half of the component is the type of the fourth figure. Thus, when the core is installed, each device 4 naturally establishes a physical connection. Under the advanced technical method of the core of the evening (Fig. 4c), each belt has 24 1316724 • vo bobbin and tributary socket; the β p core needs to be slightly spaced from each other to prevent its mesa area (for example, the surface female) The terminals are interfering with each other. Comparing the direct dressing structure of the exemplary student of the present invention (Figs. 4d and 4e), wherein the respective devices 4〇〇 can be fitted one by one, as shown in Fig. 4d side by side or end to end (not shown). This reduces the overall mesa area of the integrated device 400 (as in Figure 4e, in length or when the device is first connected).

Furthermore, the non-cavity method of Fig. 4b can be carried out in a multi-device women's method similar to that of Figs. 4d and 4e (except for the absence of the PCB holes 405) because a higher vertical height is obtained without the holes 6/grooves. Refer to Figure 5 for a detailed description of the direct mounting method for EP cores (〇5). In a first step 502, the steps for forming the core of the device (specifically steps 2 7 6 - 2 8 4 ) as previously described with reference to Figure 2d are used. A hole 405 or groove (or an existing PCB having such a feature) for accommodating the protruding coil (and, if necessary, for accommodating the lower side contact portion of the core) is then formed in the PCB by step 504. Then, if necessary, the core is bonded, mated or attached to the PCB (step 506). As described above, the above bonding, fitting or joining can be accomplished by a glue, a resin-based compound, an "embedded" structure or the like. The termination is then performed on the spacer 450 disposed on the side of the PCB opposite the side on which the device 400 is mounted; that is, the free end of the coil wire is routed through the aperture from the core component (step 506) and terminated. On the spacer 450 (step 5 10). Moreover, in another embodiment of the method, the 'coil 704 can be pre-positioned within the aperture before the core elements 402a, 402b sandwich the outer portion of the coil (and first selectively terminate at the spacer 45 0 And then 'bonding to each other 25 1316724 and/or adhering to the PCB 403. Other embodiments Referring to Figures 6a and 6b, another embodiment of the "without bobbin" sensing device of the present invention is illustrated. As shown in Figure 6a, the device 6A includes a core assembly 602 having two core elements 602a, 602b, and is generally similar to the previous description of Figures 2a-2c, but without the use of a header termination coil winding The winding 6〇6 is terminated on a substrate 6〇4 such as pCB. In the structure, the terminal ends of the windings 6〇6 are soldered to the pads 6〇9 or tracks of the substrate 6〇4 (which may be disposed on the upper and/or lower surfaces of the substrate 604); however, Instead of such soldering (e.g., using standard electronic soldering techniques well known in the art). In order to reduce the cost, a conventional pcB component is selected as the board in the embodiment: that is, such a PCB is reported to be common in manufacturing, and has a low unit cost, and other factors may be formed at the same time. The skirt 6 of Fig. 6a further comprises an interface element 6〇8, which is electrically separated and mechanically worn at the core 6〇2 and the winding 6〇6 on the upper portion of the substrate 604. The interface element 6Q8 of the present embodiment is formed of a polymer (eg, a knee) which is manufactured by injection molding, or other conventional molding techniques, although other materials and materials can be used as needed. 4+ ^ Replacement technology. The substrate 6〇4 optionally includes a plurality of holes 6 1 1 , 哕a Λ ^ 八, and the corresponding pin 6 1 2 in the lower portion of the interface element cooperates to fix the interface element 608, and may be otherwise Device 600 is aligned with respect to the substrate. Example s : 4 7 -, edge of the substrate 6 1 6 mating edge part 6 i 4 (as shown in Figure 6 a) can be used alone ^ ^ m 蜀 use 'or can also be combined with the aforementioned hole / pin to provide Need alignment. Λ D to 26 1316724 In another embodiment (Fig. 6c), the lower portion of each core element is selectively extended to reduce the cost and labor associated with the interface element 680 of the embodiment of Fig. 6. In particular, one variant uses two core halves 622a, 622b, each core half having an extended skirt or lower portion 625 for receiving the substrate 604 'each core half having separately formed (or cut) holes 627, the winding conductors pass through the hole routing 'so that the winding ends are terminated on the substrate 6 〇4. Thus, the lower portion of the core provides a mechanical attachment that is additionally provided by the embodiment interposer element 608 of Figure 6a. Other alternative methods of providing the desired mechanical coaxial connection can also be used, such as forming or machining the core portions 6 2 2 a, 6 2 2 b, having one or more coaxial connections that cooperate with the apertures formed in the substrate 604. pin. In another variation (Fig. 6d), a plurality of holes or holes 630' are formed in the substrate 604 through the holes 630 to a contact pad or trace 632 such as the bottom of the substrate. These contact pads or tracks or other components that are electrically connected thereto are used as the interface of the female device (e.g., the motherboard). In another embodiment (Figs. 6e and 6f), the substrate 6〇4 is partially trapped in the bottom of the core elements 602a, 602b. A winding lead (not shown) can then be formed through the face between the core element and the substrate to form a gap 65 or pass through a hole formed in the substrate, or even directly route to the upper surface of the substrate below the winding ( That is, on the contacts or pads in the area of the core mesa. If desired, the substrate 604 can also be provided with electrical terminations of the type well known in the art, for example, by directly bonding it to a substrate or inserting it into a hole formed in the substrate. It should be understood that although described only within the scope of a single sensing device, the above techniques can be easily extended to multi-inductive devices, such as Figure 27 of Figure 3.

1316724 Installation. For example, a multi-device 600 of the type shown in Figures 6a-6f can be mounted to a conventional substrate 604 and interface element 608, such as the "row" structure of Figure 3, or alternatively can be assembled into another pattern (e.g., rectangular or Square array). In the premise of the present disclosure, numerous other structures will be apparent to those skilled in the art. It is contemplated that while specific steps of the present invention are described in terms of specific steps of the method, those descriptions are merely illustrative of a broader range of methods of the present invention and may be modified as needed for a particular application. Specific steps may be implemented non-essentially or selectively in a particular environment. In addition, specific steps or functions may be added to the disclosed embodiments or the order of execution of two or more steps. All such changes are contemplated as falling within the scope of the invention as disclosed and claimed. While the foregoing is a detailed description of the various embodiments of the embodiments of the present invention, it will be understood that those skilled in the art can The appearance and specific structure of the method are variously omitted, replaced and changed. The foregoing description is by way of the best mode of carrying out the invention. These descriptions are by no means intended to be limiting, but rather should be considered as illustrative of the basic principles of the invention. The scope of the invention should be determined with reference to the claims. BRIEF DESCRIPTION OF THE DRAWINGS The advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings in which: FIG. 1 is a typical prior art EP transformer structure having a two-piece EP core and a bobbin. An exploded view showing its components;

28 1316724 Figure 2a is an exploded perspective view of a first exemplary embodiment of the improved electronic device of the present invention; Figure 2b is a side view of the device of Figure 2a; Figure 2c is a device of Figure 2a along line 2c- Cross-sectional view of 2c; Figure 2d is a logic flow diagram showing an exemplary method of fabrication of the apparatus of Figures 2a-2c.

Figure 3 is a perspective view of a second embodiment of the bobbinless device of the present invention having a plurality of inductive cores and integral terminating headers; Figure 4 is a perspective view of the present invention for direct assembly to a parent device (e.g., PCB) A top perspective view of another embodiment of a bobbin-free electronic device; Figure 4a is a bottom perspective view of the device of Figure 4, showing an exemplary termination scheme used therein; Figure 4b is for use in accordance with the present invention A plan view of another exemplary structure of a "direct assembly" sensing device on a PCB or other device having no holes or recesses; Figure 4c is a top plan view of a typical prior art multi-core arrangement disposed on a PCB, showing Its relatively large mesa area; Figures 4d and 4e are top and bottom plan views, respectively, of an exemplary "ganged" multi-core configuration (on a PCB) according to the present invention, shown in Figure 4c Prior art configuration compared to reduced mesa area; Figure 5 is a logic flow diagram showing an exemplary fabrication method of the apparatus of Figure 4-4a; Figure 6a is an exploded view of another embodiment of the sensing apparatus of the present invention View, showing the use of the substrate and interface elements; 29 1316724 Figure 6b is a perspective view of the device of Figure 6a when fully installed; Figure 6c is an exploded perspective view of another embodiment of the sensing device of the present invention, showing no interface elements Simplified structure; Fig. 6d is an exploded perspective view of another embodiment of the sensing device of the present invention; and Figs. 6e and 6f show another embodiment of the sensing device of the present invention.

[Main component symbol description] 100 device 104, 106 EP core half piece 108 semi-circular channel 109 winding tube 110 center column element 112 winding 114 terminal row 116 flat tube seat portion 200 device 204 winding diagram 206 terminal element 210 Terminal 202 Core assembly 220 Free end 300 Device assembly 301 Core 306 Head 310 Terminal 400 Inductive mounting 402a, 402b Peripheral 403 PCB 404 Coil 405 Hole 420 Free end 417 Lower side 450 Contact pad 470 Adhesive 425 Side 600 Device 602 Core 602a, 602b core element 604 substrate 606 winding 608 interface element 609 pad 611 hole 612 pin 614 edge part 622a, 622b core half piece 625 lower part 627 hole 630 hole 632 track 650 gap 30

Claims (1)

1316724 X. Patent application scope: The first horn is a non-winding surface mount type sensing device having a core and at least one winding, the core comprising two core portions, the core portions being substantially along each other The planes are assembled with each other, and the at least one winding is formed and mounted in the device, but the internal bobbin is not used, and the plane is placed 6 again with a surface on which the device is to be placed. The vertical state 'n' the at least one winding is adapted to form an electrical fit with a plurality of electrically conductive regions disposed on the one end device, the termination device comprising a frame-like recess. φ 2 The device of claim 1, wherein the core comprises a magnetically permeable "E" core. 3. The device of claim 1, wherein the at least one winding comprises a bonded enameled wire. 4. The device of claim 1, wherein the at least one winding is designed to be formed with a plurality of electrically conductive regions disposed on the termination device without the use of a terminal array. Electrical coordination. 5. The device of claim 4, wherein the termination device comprises a PCB having at least a first and a second side 'and at least a portion of the plurality of electrically conductive regions disposed on the second side' The device is adapted to be mounted substantially on the first side. The device of claim 1, wherein the terminating device comprises a terminating member adjacent the core for mating with other devices. 7. The device of claim 6 wherein the termination component comprises a plastic header with a plurality of terminals for surface mounting, the at least one winding being electrically coupled to at least a portion of the terminal. 8. The device of claim 7, wherein the terminal is for winding a wire. 9. The device of claim 6 wherein the terminal comprises a self-guided element. The device of claim 6, wherein the termination component comprises a plurality of terminals directly connected to the core. 1 1. The device of claim 10, wherein the plurality of terminals are connected to the core with an insulating material. 1 2. A method of manufacturing a bobbin-free sensing device, comprising: providing a one-end socket; providing a formed core divided into at least two components; providing an adhesive enameled wire comprising a wire having an end 32 1316724 The winding is disposed within the core assembly to expose the end of the winding to form the formed core assembly; the formed core assembly is coupled to the one end member, the termination member comprising at least four walls, the walls The frame is formed into a hole six, at least two of the walls having a plurality of terminals extending from a bottom surface; and the end of the winding is terminated to some of the terminals. The method of claim 12, wherein the step of providing a bonded enameled wire comprises: providing a wire of at least one length; forming the wire into a winding shape; and processing the winding to bond at least a portion of the wire wire. The method of claim 1, wherein the wire comprises a thermally activated bonded wire, and the treating step comprises exposing the bonded enamel wire to a temperature sufficient to bond the respective turns of the winding to each other. The method of claim 13, wherein the wire comprises a magnetic wire, and the treating step comprises disposing the polymer coating on at least a portion of the winding by vacuum deposition. The method of claim 13, wherein the step of forming the wire into a winding shape comprises: 33 1316724 providing a retractable mandrel; winding the wire onto the mandrel to form the wire Winding; and retracting the mandrel. The method of claim 16, wherein the step of winding the wire onto the mandrel comprises rotating the mandrel about a rotational axis relative to a source of wire. 18. The method of claim 16, further comprising heating the at least a portion of the mandrel between or after the step of winding the wire, but before completing the retracting operation. 19. A method of directly assembling a surface mount electronic device accessory, comprising: providing a formed core device having a cavity formed therein and a coil having a plurality of free ends through which the free end is disposed; Providing a substrate having a first side and a second side, a second hole, and a plurality of contact areas, the plurality of contact areas being disposed at least on the second side adjacent to the second hole; mounting the formed core device in proximity At the first side of the substrate: and passing at least a portion of the free end through the second hole routing; and connecting the routed free end to the substrate 34 1316724 Touch area. 20. The method of claim 19, further comprising attaching the shaped core device to the substrate. 21 a low profile sensing device comprising: a shaped core having: (0 a groove formed therein; (π) a base region thereof, the base region being substantially formed into a plane; and (iii) at least adjacent to the base region a hole in the groove and having a plurality of turns and a plurality of free end windings through the first hole for termination to an external device; wherein at least a portion of the winding extends through the hole and extends to The plane is 'allowed to allow at least a portion of the winding to be received in a corresponding aperture or recess formed in the external device when the sensing device is assembled to the external device. 22. Low profile as described in claim 21 Inductive device, wherein the sensing device is free of bobbins, without the bobbin causing the forming core to obtain a smaller vertical height than when the bobbin is used. 23. Direct assembly induction without a bobbin The device comprises: a conductive magnet '' having two core portions and side walls and a truncated base, the two core portions being substantially mounted to each other along a first plane And at least one hole is formed in the plane of the short substrate and 35 1316724 i has a plurality of turns wound along a horizontal axis and can be accommodated in the core, the lead wire of the winding Through the hole routing; Wherein the core is used to allow a single of the leads to pass through the side wall adjacent the substrate such that the substrate can be mounted directly to an external device comprising a substantially planar bottom surface, a cavity, and a plurality of electrical a conductive terminal, the plurality of electrically conductive terminals projecting from a bottom surface of the substantially planar surface; and wherein the first plane is disposed substantially perpendicular to the truncated substrate. 36