TWI480960B - 具有中央觸點及改良之熱特性之增強之堆疊式微電子組件 - Google Patents

具有中央觸點及改良之熱特性之增強之堆疊式微電子組件 Download PDF

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Publication number
TWI480960B
TWI480960B TW100137933A TW100137933A TWI480960B TW I480960 B TWI480960 B TW I480960B TW 100137933 A TW100137933 A TW 100137933A TW 100137933 A TW100137933 A TW 100137933A TW I480960 B TWI480960 B TW I480960B
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microelectronic
component
dielectric
assembly
front surface
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TW100137933A
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English (en)
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TW201222682A (en
Inventor
Belgacem Haba
Wael Zohni
Richard Dewitt Crisp
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Tessera Inc
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Publication of TW201222682A publication Critical patent/TW201222682A/zh
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Description

具有中央觸點及改良之熱特性之增強之堆疊式微電子組件
本發明係關於堆疊式微電子組件及製造此等組件之方法，且係關於可用於此等組件中之構件。
通常將半導體晶片提供為個別的已預封裝單元。標準晶片具有平坦的矩形本體，其中較大正面具有連接至晶片之內部電路的觸點。每一個別晶片通常安裝於一封裝中，該封裝又安裝於電路面板(諸如，印刷電路板)上且將晶片之觸點連接至電路面板之導體。在許多習知設計中，晶片封裝佔據顯著大於晶片自身之面積的電路面板之面積。如本發明中參考具有正面之平坦晶片所使用，應將「晶片之面積」理解為指代正面之面積。在「覆晶」設計中，晶片之正面面對封裝基板(亦即，晶片載體)之面且晶片上之觸點藉由焊球或其他連接元件而直接結合至晶片載體之觸點。又，晶片載體可經由上覆於晶片之正面的端子而結合至電路面板。「覆晶」設計提供一相對緊密之配置；每一晶片佔據等於或稍大於晶片之正面之面積的電路面板之面積，諸如(例如)共同讓與之美國專利第5,148,265號；第5,148,266號及第5,679,977號的特定實施例中所揭示，該等專利之揭示內容以引用的方式併入本文中。
特定創新安裝技術提供接近或等於習知覆晶結合之緊密性的緊密性。可將單一晶片容納於等於或稍大於晶片自身之面積的電路面板之面積中的封裝通常被稱作「晶片大小 封裝」。
除使由微電子組件佔據之電路面板的平面面積最小化之外，亦需要產生一晶片封裝，該晶片封裝呈現垂直於該電路面板之平面之一較低總高度或尺寸。此等薄微電子封裝考慮到將安裝有封裝之電路面板極接近於相鄰結構置放，因此產生併有電路面板之產品的總大小。已提出用於將複數個晶片提供於單一封裝或模組中之各種建議。在習知「多晶片模組」中，晶片並排地安裝於單一封裝基板上，該單一封裝基板又可安裝至電路面板。此做法僅提供由晶片佔據的電路面板之總面積的有限減少。總面積仍大於模組中之個別晶片的總表面積。
亦已建議，將複數個晶片封裝於一「堆疊」配置中，亦即，複數個晶片以一者於另一者之上方式置放的配置。在堆疊式配置中，可將若干晶片安裝於小於晶片之總面積的電路面板之面積中。特定堆疊式晶片配置揭示於(例如)前述美國專利第5,679,977號；第5,148,265號及美國專利第5,347,159號之特定實施例中，該等專利之揭示內容以引用的方式併入本文中。亦以引用之方式併入本文中的美國專利第4,941,033號揭示一配置，其中晶片堆疊於另一者之上且藉由與晶片相關聯之所謂的「佈線薄膜」上之導體而彼此互連。
儘管此項技術中存在此等努力，但在用於觸點實質上定位於晶片之中央區域中的晶片之多晶片封裝的狀況下，仍需要進一步改良。特定半導體晶片(諸如，一些記憶體晶 片)通常係藉由實質上沿晶片之中心軸線定位的一列或兩列觸點製成。
一種微電子組件包括：一介電元件，其具有相反面向之第一表面及第二表面以及在該等表面之間延伸的一或多個孔隙，該介電元件上進一步具有導電元件；一第一微電子元件，其具有一後表面及面向該介電元件之該第一表面的一前表面，該第一微電子元件具有一第一邊緣及曝露於該第一微電子元件之該前表面處的複數個觸點；一第二微電子元件，其包括具有一後表面及面向該第一微電子元件之該後表面的一前表面，該第二微電子元件之該前表面的一突出部分延伸超出該第一微電子元件之該第一邊緣，該突出部分與該介電元件之該第一表面隔開，該第二微電子元件具有曝露於該前表面之該突出部分處的複數個觸點；引線，其自該等微電子元件之觸點延伸穿過該至少一孔隙至該等導電元件中之至少一些導電元件；及一熱散播器，其熱耦接至該第一微電子元件或該第二微電子元件中之至少一者。
參看圖1，根據本發明之實施例之堆疊式微電子組件10包括一第一微電子元件12及一第二微電子元件14。在一些實施例中，第一微電子元件12及第二微電子元件14可為半導體晶片、晶圓或其類似者。
第一微電子元件12具有前表面16、遠離前表面16之後表 面18，及在該前表面與該後表面之間延伸的第一邊緣27及第二邊緣29。第一微電子元件12之前表面16包括第一末端區域15及第二末端區域17以及定位於第一末端區域15與第二末端區域17之間的中央區域13。第一末端區域15在中央區域13與第一邊緣27之間延伸，且第二末端區域17在中央區域13與第二邊緣29之間延伸。電觸點20曝露於第一微電子元件12之前表面16處。如本發明中所使用，一導電元件「曝露於」一結構之一表面處的陳述指示：該導電元件可用於接觸在垂直於該表面之方向上自該結構之外部朝向該表面移動的一理論點。因此，曝露於一結構之一表面處的端子或其他導電元件可自此表面突出；可與此表面齊平；或可相對於此表面凹入且經由該結構中之孔或凹陷而曝露。第一微電子元件12之觸點20曝露於中央區域13內之前表面16處。舉例而言，觸點20可鄰近第一表面16之中心以一列或兩個平行列配置。
第二微電子元件14具有前表面22、遠離前表面22之後表面24，及在該前表面與該後表面之間延伸的第一邊緣35及第二邊緣37。第二微電子元件14之前表面22包括第一末端區域21及第二末端區域23以及定位於第一末端區域21與第二末端區域23之間的中央區域19。第一末端區域21在中央區域19與第一邊緣35之間延伸，且第二末端區域23在中央區域19與第二邊緣37之間延伸。電觸點26曝露於第二微電子元件14之前表面22處。第二微電子元件14之觸點26曝露於中央區域19內之前表面22處。舉例而言，觸點26可鄰近 第一表面22之中心以一列或兩個平行列配置。
如圖1中所見，第一微電子元件12及第二微電子元件14相對於彼此堆疊。在一些實施例中，第二微電子元件14之前表面22與第一微電子元件12之後表面18面向彼此。第二微電子元件14之第二末端區域23的至少一部分上覆第一微電子元件12之第二末端區域17的至少一部分。第二微電子元件14之中央區域19的至少一部分突出超出第一微電子元件12之第二邊緣29。此外，第二微電子元件14之部分43在第一微電子元件12之第二邊緣29之外延伸。因此，第二微電子元件14之觸點26定位於超出第一微電子元件12之第二邊緣29的一位置中。
微電子組件10進一步包括介電元件30，介電元件30具有相反面向之第一表面32及第二表面34。雖然圖1僅展示一個介電元件30，但微電子組件10可包括一個以上介電元件。一或多個導電元件或端子36曝露於介電元件30之第一表面32處。至少一些端子36可相對於第一微電子元件12及/或第二微電子元件14移動。
介電元件30可進一步包括一或多個孔隙。在圖1中所描繪之實施例中，介電元件30包括：第一孔隙33，其實質上與第一微電子元件12之中央區域13對準；及第二孔隙39，其實質上與第二微電子元件14之中央區域19對準，藉此提供對觸點20及26之接入。
如圖1中所見，介電元件30可延伸超出第一微電子元件12之第一邊緣27及第二微電子元件14之第二邊緣35。介電 元件30之第二表面34可與第一微電子元件12之前表面16並置。介電元件30可部分地或完全地由任何合適之介電材料製成。舉例而言，介電元件30可包含一可撓性材料層，諸如，一聚醯亞胺層、BT樹脂層或通常用於製造捲帶式自動結合(「TAB」)帶之其他介電材料層。或者，介電元件30可包含相對硬質之板狀材料，諸如一較厚的纖維加強型環氧樹脂層，諸如Fr-4或Fr-5板。不管所使用之材料如何，介電元件30均可包括單一層或多層介電材料。
介電元件30亦可包括曝露於第一表面32上之導電元件40及導電跡線42。導電跡線42將導電元件40電耦接至端子36。
間隔或支撐元件31(諸如，黏著層)可定位於第二微電子元件14之第一末端區域21與介電元件30之一部分之間。若間隔層31包括黏著劑，則該黏著劑可將第二微電子元件14連接至介電元件30。另一間隔層60可定位於第二微電子元件14之第二末端區域23與第一微電子元件12之第二末端區域17之間。此間隔層60可包括用於將第一微電子元件12及第二微電子元件14結合在一起之黏著劑。在此狀況下，間隔層60可部分地或完全地由晶粒附著黏著劑製成且可由低彈性模數材料(諸如，聚矽氧彈性體)組成。然而，若兩個微電子元件12及14為由相同材料形成之習知半導體晶片，則間隔層60可完全地或部分地由一較薄的高彈性模數黏著劑或焊料層製成，此係因為該等微電子元件將傾向於回應於溫度改變而一致地膨脹及收縮。不管所使用之材料如 何，間隔層31及60中之每一者可包括單一層或多層。
如圖1及圖2中所見，電連接件或引線70將第一微電子元件12之觸點20電連接至介電元件30上之一些導電元件40。電連接件70可包括電連接微電子元件12之觸點與導電元件40的多個導線結合72、74。導線結合72、74延伸穿過第一孔隙33且實質上平行於彼此而定向。導線結合72及74中之每一者將觸點20電耦接至介電元件之一對應導電元件40。根據此實施例之多導線結合結構可藉由提供一供電流在已連接觸點之間流動的額外路徑來實質上減少導線結合連接件之電感。
其他電連接件或引線50將第二微電子元件14之觸點26電耦接至一些導電元件40。電連接件50可包括電連接微電子元件14之觸點與導電元件40的多個導線結合52、54。導線結合52、54延伸穿過第二孔隙39且實質上平行於彼此而定向。導線結合52與54兩者將觸點26電耦接至介電元件30之對應元件40。根據此實施例之多導線結合結構可藉由提供一供電流在已連接觸點之間流動的額外路徑來實質上減少導線結合連接件之電感。
微電子組件10進一步包括包覆成型件11，其覆蓋至少第一微電子元件12及第二微電子元件14。如圖1中所見，包覆成型件11亦可覆蓋延伸超出第一微電子元件12之第一邊緣27及第二微電子元件14之第一邊緣35的介電元件30之部分。
圖3描繪包括至少兩個堆疊式且電互連之微電子組件900 的配置1000。微電子組件900A及900B可為上文所描述之組件中的任一者。該等微電子組件中之至少一者可具有附著至其端子的導電接合單元，諸如焊球981或其他結合塊及金屬塊(例如，錫、銦或其組合)。該兩個微電子組件900經由任何合適之導電連接件而電連接至彼此。舉例而言，該等組件可經由焊料柱990而電互連，焊料柱990接合至各別微電子元件之介電元件930A、930B上之襯墊(未圖示)。在亦展示於圖3中之特定實施例中，導電支柱992及焊料994可用以電互連該兩個微電子組件900A與900B。支柱992可自第一組件或自第二組件朝向另一組件延伸，或設置於兩個組件上之支柱可朝向彼此延伸。
繼續參看圖3，熱散播器970可安置於第一微電子組件900A與第二微電子組件900B之間，以幫助將熱均勻地分散於堆疊式微電子組件之配置內。熱散播器970亦可改良至周圍環境的熱耗散。熱散播器可部分地或完全地由任何合適之導熱材料製成。合適之導熱材料的實例包括(但不限於)金屬、石墨、導熱黏著劑(例如，導熱環氧樹脂、焊料或其類似者)或此等材料之組合。在一實例中，熱散播器可為實質上連續之金屬薄片。在特定實施例中，由金屬或其他導熱材料製成的預形成之熱散播器970可(諸如)藉由導熱材料(諸如，導熱黏著劑或導熱油脂)而附著至第二微電子組件900B之介電元件930B的前表面932B或安置於前表面932B上。黏著劑(若存在)可為准許熱散播器與微電子元件或微電子元件附著至之介電元件之間的相對移動(諸 如，適應柔性地附著之元件之間的差異熱膨脹)的柔性材料。熱散播器970可為單體結構或可包括實質上分別與介電元件930B之孔隙933B、939B對準的一或多個孔隙972、974。在一實施例中，熱散播器970之孔隙972、974中之每一者可經設定尺寸以收納覆蓋介電元件930B之孔隙933B或939B的囊封劑980B或982B。或者，熱散播器970可包括彼此隔開之多個散播器部分。儘管未展示，但熱散播器970或者可附著至微電子組件900A之第二微電子元件914A的後表面924A，或可附著至第一微電子組件900A之第一微電子元件912A的後表面918A，或至兩個微電子元件912A、914A之後表面。在特定實施例中，熱散播器可為或包括直接接合至第一微電子元件912A及第二微電子元件914A中之一或多者的後表面之至少一部分的一焊料層。
在本文中所描述之實施例之任一者中，微電子組件可包括安置於微電子組件之其他位置中的額外熱散播器。
圖4展示如上文所描述之微電子組件1200，其包括至少附著至第二微電子元件1214之後表面1224的熱散播器1280。熱散播器1280可與第二微電子組件1214之整個後表面1224導熱連通且可延伸超出第二微電子元件之第一邊緣1235及第二邊緣1237。支撐元件1290可由矽或任何其他合適材料製成且可安置於熱散播器1280與第一微電子元件1212之第一末端區域1215之間。支撐元件可由導熱材料製成，諸如金屬、填充有金屬之聚合物材料，例如，導熱環氧樹脂、石墨、黏著劑、焊料，或適合於改良組件內及組 件與環境之間的熱轉移及熱耗散的任何材料。
另一支撐元件1292可安置於第二微電子元件1214之第一末端區域1221與介電元件1230之間。支撐元件1292可部分地或完全地由矽製成。熱散播器1280可延伸超出第一微電子元件之第一邊緣1227及第二邊緣1229。如上文所論述，熱散播器1280可完全地或部分地由金屬、石墨或任何其他合適之導熱材料製成且可經由導熱黏著劑(其可為柔性或導熱油脂)附著至組件之其他部分或與組件之其他部分熱連通。在一實施例中，尤其當微電子元件基本上由一類型之半導體材料(例如，矽)組成時，支撐元件1290、1292可基本上由相同半導體材料組成。
除熱散播器1280之外，微電子組件1200亦可包括一或多個導熱球1282、1284。球1282、1284通常由焊料製成，但可包括導熱金屬之核心(諸如，其中之銅球或銅支柱)，如1283處所說明。導熱球1282可以實質上與第一微電子元件1212之第一邊緣1227對準方式附著至介電元件1230之前表面1232。導熱連接器1286可附著至一或多個導熱球1282且可延伸穿過介電元件1230。導熱球1284可以實質上與第二微電子元件1214之第一邊緣1235對準方式附著至介電元件1230之前表面1232。導熱連接器1288可附著至一或多個導熱球1284且可延伸穿過介電元件1230。
圖5展示圖4中所描繪之實施例的變化。在此變化中，微電子組件1400不需要在第一微電子1314之第一末端區域1315與熱散播器1380之間包括支撐元件。熱散播器1380可 包括鄰近第二微電子元件1314之第二邊緣1337的台階1398。台階1398使得熱散播器1380能夠接觸或至少極接近於第一微電子元件1312之後表面1318。
圖6展示圖3中所說明之實施例的變化。在圖6中所描繪之變化中，熱散播器971與微電子組件900B之第一微電子元件912B及第二微電子元件914B熱連通。熱散播器971可具有分別背對第一微電子元件912B及第二微電子元件914B之後表面918B及924B的第一實質上平坦表面987。另外，熱散播器971可具有分別面向第一微電子元件912B及第二微電子元件914B之後表面918B及924B的第二實質上平坦表面989A及第三實質上平坦表面989B。熱散播器971可包括：第一部分973，其與第二微電子元件914B之後表面924B熱連通且上覆第二微電子元件914B之後表面924B；及第二部分975，其與第一微電子元件912B之後表面918B熱連通且上覆第一微電子元件912B之後表面918B。在一特定實施例中，例如，熱散播器971之第一部分973可(諸如)經由焊料、導熱油脂或導熱黏著劑與第二微電子元件914B之部分或整個後表面924B熱接觸。類似地，熱散播器971之第二部分975可與第一微電子元件912B之部分或整個後表面918B熱接觸。熱散播器971之第二部分975可比第一部分973厚。
繼續參看圖6，另一熱散播器977可與微電子組件900A之第一微電子元件912A及第二微電子元件914A熱連通。熱散播器977可包括背對第一微電子元件912A及第二微電子 元件914A之第一實質上平坦表面991。此外，熱散播器977可包括分別面向第一微電子元件912A及第二微電子元件914A之後表面918A及924A的第二實質上平坦表面993A及993B。另外，熱散播器977可包括：第一部分979，其與第二微電子元件914A之後表面924A熱連通且上覆第二微電子元件914A之後表面924A；及第二部分983，其與第一微電子元件912A之後表面918A熱連通且上覆第一微電子元件912A之後表面918A。在一特定實施例中，熱散播器977之第一部分979可與第二微電子元件914A之部分或整個後表面924A熱接觸(類似於熱散播器971之配置)。類似地，熱散播器977之第二部分983可與第一微電子元件912A之部分或整個後表面918A熱接觸。熱散播器977之第二部分983可比其第一部分979厚。
導熱材料985可安置於熱散播器977與介電元件930B之間。導熱材料985可包括一或多個任何合適材料層且厚度可在25微米至100微米之間。合適之導熱材料包括(但不限於)導熱油脂、焊料、銦或任何合適之導熱黏著劑。導熱材料985可以液體或未完全固化之狀態塗覆至介電元件930B及熱散播器977中之一者或兩者的表面。以彼方式，材料可流入至其之間的空間中。因此，導熱材料可遵照其接觸之表面之高度的變化。在一些實施例中，導熱材料985可為包括一或多個孔隙999之單體結構或一體式結構，該一或多個孔隙999實質上與第一微電子元件912B及第二微電子元件914B之觸點920及926對準。或者，導熱材料 985可包括多個隔開且離散之部分。在特定實施例中，導熱材料985可為導電的。在此實施例中，此導電材料可用作導電平面且可電連接至接地。微電子組件900A可在第二微電子元件914A及介電元件930A之間包括支撐元件931。
如圖6中所見，本文中所描述之微電子組件中之任一者可電耦接至一電路面板或電路板。舉例而言，微電子組件900A可包括複數個接合單元，諸如焊球581或銅柱。焊球981將微電子組件900A電連接至電路面板1300。雖然圖6僅展示將微電子組件900A連接至電路面板1300之焊球981，但預期，任何導電元件可使電路面板1300與微電子組件900A互連。一或多個導電元件或端子1302曝露於電路面板1300之第一表面1304處。電路面板1300之第一表面1304面向焊球981。焊球981附著至端子1302且因此電互連至電路面板1300中之電路的至少一些電路。
上文所描述之微電子組件可用於不同電子系統之建構中，如圖7中所展示。舉例而言，根據本發明之另一實施例之系統1100包括如上文所描述之微電子組件1106連同其他電子構件1108及1110。在所描繪之實例中，構件1108為半導體晶片，而構件1110為顯示螢幕，但可使用任何其他構件。當然，儘管為了說明之清晰起見在圖7中僅描繪兩個額外構件，但系統可包括任何數目個此等構件。微電子組件1106可為上文所描述之組件中的任一者。在另一變體中，可使用任何數目個此等微電子組件。微電子組件1106及構件1108及1110安裝於共同外殼901(以斷線示意性地描 繪)中，且在必要時彼此電互連以形成所要電路。在所展示之例示性系統中，系統包括電路面板1102(諸如，可撓性印刷電路板)，且該電路面板包括使構件彼此互連之眾多導體1104(圖7中僅描繪該等導體1104中之一個導體)。然而，此情形僅為例示性的；可使用用於形成電連接之任何合適結構。將外殼1101描繪為可用於(例如)蜂巢式電話或個人數位助理中之類型之攜帶型外殼，且螢幕1110曝露於外殼之表面處。在結構1106包括諸如成像晶片之光敏元件之情況下，亦可提供透鏡1111或其他光學器件以用於將光導引至該結構。此外，圖7中所展示之簡化系統僅為例示性的；可使用上文所論述之結構製造其他系統，包括通常被視為固定結構之系統(諸如，桌上型電腦、路由器及其類似者)。
應瞭解，各種附屬請求項及其中所闡述之特徵可以不同於初始請求項中所呈現之方式之方式組合。亦應瞭解，結合個別實施例所描述之特徵可與所描述實施例之其他者共用。
儘管本文中已參考特定實施例描述本發明，但應理解，此等實施例僅說明本發明之原理及應用。因此，應理解，可對該等說明性實施例作出眾多修改且可在不脫離如由所附申請專利範圍界定的本發明之精神及範疇的情況下設計其他配置。
10‧‧‧堆疊式微電子組件
11‧‧‧包覆成型件
12‧‧‧第一微電子元件
13‧‧‧中央區域
14‧‧‧第二微電子元件
15‧‧‧第一末端區域
16‧‧‧第一微電子元件之前表面
17‧‧‧第二末端區域
18‧‧‧第一微電子元件之後表面
19‧‧‧中央區域
20‧‧‧電觸點
21‧‧‧第一末端區域
22‧‧‧第二微電子元件之前表面
23‧‧‧第二末端區域
24‧‧‧第二微電子元件之後表面
26‧‧‧電觸點
27‧‧‧第一邊緣
29‧‧‧第二邊緣
30‧‧‧介電元件
31‧‧‧間隔或支撐元件
32‧‧‧第一表面
33‧‧‧第一孔隙
34‧‧‧第二表面
35‧‧‧第一邊緣
36‧‧‧導電元件或端子
37‧‧‧第二邊緣
39‧‧‧第二孔隙
40‧‧‧導電元件
42‧‧‧導電跡線
43‧‧‧部份
50‧‧‧電連接件或引線
52‧‧‧導線結合
54‧‧‧導線結合
60‧‧‧間隔層
70‧‧‧電連接件或引線
72‧‧‧導線結合
74‧‧‧導線結合
900‧‧‧微電子組件
900A‧‧‧微電子組件
900B‧‧‧微電子組件
901‧‧‧共同外殼
912A‧‧‧第一微電子元件
912B‧‧‧第一微電子元件
914A‧‧‧第二微電子元件
914B‧‧‧第二微電子元件
918A‧‧‧第一微電子元件之後表面
918B‧‧‧第一微電子元件之後表面
920‧‧‧觸點
924A‧‧‧第二微電子元件之後表面
924B‧‧‧第二微電子元件之後表面
926‧‧‧觸點
930A‧‧‧介電元件
930B‧‧‧介電元件
931‧‧‧支撐元件
932B‧‧‧第二微電子組件之介電元件之前表面
933B‧‧‧孔隙
939B‧‧‧孔隙
970‧‧‧熱散播器
971‧‧‧熱散播器
972‧‧‧孔隙
973‧‧‧第一部分
974‧‧‧孔隙
975‧‧‧第二部分
977‧‧‧熱散播器
979‧‧‧第一部分
980B‧‧‧囊封劑
981‧‧‧焊球
982B‧‧‧囊封劑
983‧‧‧第二部分
985‧‧‧導熱材料
987‧‧‧第一實質上平坦表面
989A‧‧‧第二實質上平坦表面
989B‧‧‧第三實質上平坦表面
990‧‧‧焊料柱
991‧‧‧第一實質上平坦表面
992‧‧‧導電支柱
993A‧‧‧第二實質上平坦表面
993B‧‧‧第二實質上平坦表面
994‧‧‧焊料
999‧‧‧孔隙
1000‧‧‧配置
1100‧‧‧系統
1101‧‧‧外殼
1102‧‧‧電路面板
1104‧‧‧導體
1106‧‧‧微電子組件
1108‧‧‧電子構件
1110‧‧‧電子構件/螢幕
1111‧‧‧透鏡
1200‧‧‧微電子組件
1212‧‧‧第一微電子元件
1214‧‧‧第二微電子元件
1215‧‧‧第一末端區域
1221‧‧‧第一末端區域
1224‧‧‧第二微電子元件之後表面
1227‧‧‧第一邊緣
1229‧‧‧第二邊緣
1230‧‧‧介電元件
1232‧‧‧介電元件之前表面
1235‧‧‧第一邊緣
1237‧‧‧第二邊緣
1280‧‧‧熱散播器
1282‧‧‧導熱球
1283‧‧‧導熱金屬之核心
1284‧‧‧導熱球
1286‧‧‧導熱連接器
1288‧‧‧導熱連接器
1290‧‧‧支撐元件
1304‧‧‧第一表面
1312‧‧‧第一微電子元件
1314‧‧‧第二微電子元件
1315‧‧‧第一末端區域
1318‧‧‧第一微電子元件之後表面
1337‧‧‧第二邊緣
1380‧‧‧熱散播器
1398‧‧‧台階
圖1為根據本發明之實施例之堆疊式微電子組件的圖解 剖視正視圖；圖2為圖1之堆疊式組件的仰視圖；圖3為根據本發明之另一實施例之堆疊式微電子配置的圖解剖視圖；圖4為根據本發明之另一實施例之堆疊式微電子組件的圖解剖視圖；及圖5為根據本發明之又一實施例之堆疊式微電子組件的圖解剖視圖；圖6為根據本發明之實施例之堆疊式微電子組件的圖解剖視圖；圖7為根據本發明之一實施例之系統的示意性描繪。
900A‧‧‧微電子組件
900B‧‧‧微電子組件
912A‧‧‧第一微電子元件
914A‧‧‧第二微電子元件
918A‧‧‧第一微電子元件之後表面
924A‧‧‧第二微電子元件之後表面
930A‧‧‧介電元件
930B‧‧‧介電元件
932B‧‧‧第二微電子組件之介電元件之前表面
933B‧‧‧孔隙
939B‧‧‧孔隙
970‧‧‧熱散播器
972‧‧‧孔隙
974‧‧‧孔隙
980B‧‧‧囊封劑
981‧‧‧焊球
982B‧‧‧囊封劑
990‧‧‧焊料柱
992‧‧‧導電支柱
994‧‧‧焊料
1000‧‧‧配置

Claims (22)

  1. 一種微電子組件，其包含：一介電元件，其具有相反面向之第一表面及第二表面以及在該等表面之間延伸的一或多個孔隙，該介電元件上進一步具有導電元件；一第一微電子元件，其具有一後表面及面向該介電元件之該第一表面的一前表面，該第一微電子元件具有一第一邊緣及曝露於該第一微電子元件之該前表面處的複數個觸點；一第二微電子元件，其上覆該第一微電子元件，該第二微電子元件具有一後表面及面向該第一微電子元件之該後表面的一前表面，該第二微電子元件之該前表面的一突出部分延伸超出該第一微電子元件之該第一邊緣，該突出部分與該介電元件之該第一表面隔開，該第二微電子元件具有曝露於該前表面之該突出部分處的複數個觸點；引線，其自該等微電子元件之觸點延伸穿過該至少一孔隙至該等導電元件中之至少一些導電元件；及一熱散播器，其熱耦接至該第一微電子元件或該第二微電子元件中之至少一者，其中該熱散播器包括定位於該第一微電子元件之上之一第一部分、定位於該第二微電子元件之上之一第二部分，及在該第一部分與該第二部分之間的一台階。
  2. 如請求項1之微電子組件，其中該等引線為導線結合。
  3. 如請求項1之微電子組件，其中該熱散播器部分地或完全地由石墨製成。
  4. 如請求項1之微電子組件，其中該熱散播器包括一金屬薄片。
  5. 如請求項1之微電子組件，其中該熱散播器覆蓋至少該第一微電子元件之該後表面。
  6. 如請求項1之微電子組件，其中該熱散播器覆蓋至少該第二微電子元件之該後表面。
  7. 如請求項1之微電子組件，其進一步包含熱耦接至該介電元件之導熱球。
  8. 如請求項7之微電子組件，其中該等導熱球附著至該介電元件之第二表面。
  9. 如請求項7之微電子組件，其中每一導熱球包括嵌入於其中之一金屬核心。
  10. 如請求項7之微電子組件，其進一步包含一導熱連接器，該導熱連接器延伸穿過該介電元件且將該等導熱球中之一者耦接至該介電元件。
  11. 如請求項1之微電子組件，其中該整個熱散播器沿一平面延伸。
  12. 如請求項11之微電子組件，其進一步包含在該熱散播器與該第一微電子元件之間的一支撐元件。
  13. 一種微電子組件，其包含：第一單元及第二單元，每一單元包括： (1)一介電元件，其具有相反面向之第一表面及第二表面、在該等表面之間延伸的至少一孔隙，該介電元件上具有導電元件；(2)一第一微電子元件，其具有一後表面、面向介電元件之該第一表面的一前表面、一邊緣及在該第一微電子元件的該前表面上之觸點；(3)一第二微電子元件，其上覆該第一微電子元件，該第二微電子元件具有一後表面、面向該第一微電子元件之一前表面及突出超出該第一微電子元件之該邊緣的該第一微電子元件的該前表面上之觸點；(4)信號引線，其自該第一微電子元件之該等觸點及該第二微電子元件之該等觸點延伸穿過該至少一孔隙至該介電元件上之該等導電元件中的至少一些導電元件；及(5)一熱散播器，其覆蓋該第一微電子元件和該第二微電子元件的後表面，該熱散播器包括定位於該第一微電子元件之上之一第一部分、定位於該第二微電子元件之上之一第二部分，及在該第一部分與該第二部分之間的一台階，該第二單元上覆該第一單元之該等微電子元件，該組件進一步包含堆疊互連件，該等堆疊互連件電連接該第一單元之該介電元件上之該等導電元件中的至少一些導電元件與該第二單元之該介電元件上之該等導電元件中的至少一些導電元件。
  14. 如請求項13之微電子組件，其中該熱散播器為具有孔隙之一單體結構，該等孔隙實質上與該第一單元之該第一微電子元件及該第二微電子元件的該等觸點對準。
  15. 如請求項13之微電子組件，其中該熱散播器包括彼此隔開之熱散播器部分。
  16. 如請求項13之微電子組件，其中該熱散播器附著至該第一單元之該介電元件的該第二表面。
  17. 如請求項13之微電子組件，其中該等引線為導線結合。
  18. 如請求項13之微電子組件，其中該熱散播器包括面向該第一單元之該第一微電子元件及該第二微電子元件之各別後表面的實質上平坦表面。
  19. 一種電子系統，其包含如請求項1之組件及電連接至該組件的一或多個其他電子構件。
  20. 如請求項19之系統，其進一步包含一外殼，該組件及該等其他電子構件安裝至該外殼。
  21. 一種電子系統，其包含如請求項13之組件及電連接至該組件的一或多個其他電子構件。
  22. 如請求項21之系統，其進一步包含一外殼，該組件及該等其他電子構件安裝至該外殼。
TW100137933A 2010-10-19 2011-10-19 具有中央觸點及改良之熱特性之增強之堆疊式微電子組件 TWI480960B (zh)

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US9312239B2 (en) 2016-04-12
US20140035121A1 (en) 2014-02-06
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US20120092832A1 (en) 2012-04-19
WO2012054335A1 (en) 2012-04-26
KR20140001898A (ko) 2014-01-07
JP2013540371A (ja) 2013-10-31
WO2012054335A8 (en) 2013-06-06
TW201222682A (en) 2012-06-01
JP5883456B2 (ja) 2016-03-15
DE202011110802U1 (de) 2016-06-15
US8941999B2 (en) 2015-01-27
KR101941615B1 (ko) 2019-01-23
US8553420B2 (en) 2013-10-08
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