TWI294518B - Scattermeter and method for measuring a property of a substrate - Google Patents
Scattermeter and method for measuring a property of a substrate Download PDFInfo
- Publication number
- TWI294518B TWI294518B TW094126274A TW94126274A TWI294518B TW I294518 B TWI294518 B TW I294518B TW 094126274 A TW094126274 A TW 094126274A TW 94126274 A TW94126274 A TW 94126274A TW I294518 B TWI294518 B TW I294518B
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- Prior art keywords
- scatterometer
- substrate
- radiation
- grating
- plane
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
- G03F9/7034—Leveling
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
1294518 九、發明說明: 【發明所屬之技術領域】 本發明係關於可精由微影技術而用於(例如)設備製造中 之檢測方法及使用微影技術製造設備之方法。 【先前技術】 在使用一微影投影裝置之製造過程中,將一圖案(例 如在一光罩中之圖案)成像至一基板上,該基板係藉由改 變一抗蝕劑之光學性質或表面物理性質而至少部分地為一
輻射敏感材料層(抗蝕劑)所覆蓋。或者,該成像步驟可使 用一無抗蝕劑製程,諸如蝕刻光柵或奈米壓印技術。在此 成像步驟之前,該基板可經歷各種程序,諸如上底漆、抗 蝕劑塗佈及軟烘烤。曝光後,該基板可經受其它程序,諸 如後曝光烘焙(PEB)、顯影、硬烘烤及成像特徵之量測/檢 測。此列程序被用作圖案化一設備(例如,一lc)之一個別 層之基礎。此一圖案化層接著可經歷各種製程,諸如餘 刻、離子植入(摻雜)、金屬化、氧化q匕學—機械研磨 等’所有製程皆傾向於完成—個別層。若需要若干層,則 不得不為每-新層重複整個程序或其變體。最終,一列設 備將存在於該基板(晶圓)上。接著藉由一諸如切割或鋸切 之技術將此等δ又備彼此分離,由此該等個別設備可安裝在 一載體上或連接至引腳等。 測 的 在顯影抗蝕劑(或在蝕刻之狀況下顯影基板表面)後之量 及谓測步驟(因為其❹處理生產基板之正常過程進行 ,所以稱作線上步驟)通常服務於兩個目的。,兩 103634.doc 1294518 ” 要偵測經顯影之抗蝕劑中之圖案有缺陷之任何目標區域。 . #足夠數目之目標區域係有缺陷的,則可剝去該基板之圖 案化抗蝕劑並重新曝光、積極校正該基板,而非藉由以一 有缺陷之圖案來進行一處理步驟(例如,蝕刻)而使缺陷永 久存在。第二,量測可允許偵測微影裝置(例如,照明設 定或曝露劑量)中之誤差並為隨後之曝光校正其。然而, 微影裝置中之許多誤差不易自印刷在抗蝕劑中之該等圖案 偵測或量化。一缺陷之偵測並非總能直接指向其原因。因 • 此,已知各種用於偵測並量測微影裝置中之誤差的離線 (off-line)程序。此等程序可涉及用一量測設備來替代該基 板或(例如)在各種不同機器設定下進行特殊測試圖案之曝 光。此等離線技術通常花費相當多的時間,在該段時間 内,在得到量測結果之前,該裝置之最終產品之品質係未 知的。因此,可在產品曝光之同時進行的用於偵測並量測 該微影裝置中之誤差的線上技術通常較佳。 散射量測技術係一可用於CD及疊對之線上量測之光學 籲量測技術之一實例。存在兩種主要的散射量測技術: (1) 光譜散射量測技術通常使用一諸如氙、氘之寬頻光 源或諸如氙弧燈之基於鹵素之光源以一為波長之函數的固 定角度來量測散射光之性質。該固定角度可為垂直入射或 傾斜入射的。 (2) 角度分辨散射量測技術通常將一雷射作為一單一波 長光源以一為入射角之函數的固定波長來量測散射光之性 質。 103634.doc 1294518 產生一反射光譜之結構係(例如)使用即時回歸或藉由與 自模擬衍生之圖案庫進行比較來重新構造。重新構造涉及 一成本函數之最小化。兩種方法藉由週期性結構來計算光 之散射。雖然光散射亦可藉由諸如時域有限差分法(Fdtd) 或積分方程技術之其它技術來計算,但是最一般之技術係 嚴袼耦合波分析法(RC WA)。
已知角度分辨散射量測技術之問題在於:其一次僅摘測 一波長,所以具有一個以上波長之光譜不得不使時間複用 彼等波長,該方法使用於偵測及處理該光譜之總的擷取時 間在光增加谱散射量測技術中,使用一具有一大的展度 (etendue)之外加光源。由於小光柵必須以一用小範圍入射 角來妝明,故來自此外加光源之大量光被浪費。此導致偵 ’貝J器上之導致長的擷取時間之低光度,此對產量具有一負 面影響。若選擇短的擷取時間,則量測結果可能不穩定。 【發明内容】 因此,在製造使用微影技術之設備及在一高na(數值孔 徑)透鏡之瞳孔平面(或後焦平面)中量測一角度分辨光譜期 間’(例如)提供-種量測疊對及光栅形狀參數(諸如光拇不 對稱性及對準)之方法A古士丨μ + 為有利的。亦可量測投影系統像差 等以校正或補償其。 本發明之實施例可涵筌締Μ 盖硬體,其能同時量測多個波長之 角度分辨光譜、能進行浸、、眚彳 田 又/貝式放射置測及一種用於角度分 辨散射計之聚焦量测方法一 亚犯一用2_D偵測器陣列來量測 一輻射源之強度雜訊。此外 外本發明之實施例可涵蓋該硬 103634.doc 1294518 體之應用,該等應用包括藉由量測散射光之不對稱性來量 /貝J i對及k由知利近點角(Rayleigh an〇maiy)及散射光之高 繞射級來量測小的線形變化。 雖然可在本文中對1C製造中之根據本發明之裝置的使用 做出特定參考,但是應清楚瞭解,此裝置具有許多其它可 能應用。舉例而言,其可用於製造積體光學系統、用於磁 可记隐體之V引及偵测圖案、液晶顯示面板、薄膜磁頭 等。熟習工匠將瞭解,在該等替代應用之情形中,本文中 之術語"主光罩”、"晶圓”或”晶粒"之任何使用可分別認為 被更通用之術語”光罩”、,,基板"及,,目標區"所替代。 在本文件中,術語,,輻射”及"射束,,用於涵蓋所有類型之 電磁輻射,包括紫外輻射(例如,波長為365、、 二7或126 nm)及EUV(遠紫外輻射,例如,具有一在5_2〇 摩巳圍内之波長)以及諸如離子束或電子束之粒子束。 【實施方式】 圖1不忍地描述了一可用於一根據本發明之一實施例之 方法中的微影投影裝置。該裝置包含: 一輻射系統Ex、IL,其用於提供一輻射(例如,Duv韓 射)之投影束PB,在此特定情況下,其亦包含一輻射源 LA ; -第-載物台(光罩台)MT’其具有一用於固持一光罩 MA(例如,—主光罩)之光罩固持器,且該第—載物台被連 接至一用於相對於零件PL精確定位該光罩之第一定位設 備; 103634.doc 1294518 一第二載物台(基板台)wt,其具有一用於固持一基板 w(例如,一經抗蝕劑塗佈之矽晶圓)之基板固持器,且該 第二載物台被連接至一用於相對於零件1>1^精確定位該基板 之第二定位設備; 才又影系統(’’投影透鏡’f)PL(例如,一折射透鏡系統), 其用於將該光罩MA之一受輻射部分成像至該基板w之一 目標區C(例如,包含一或多個晶粒)上。 如此處所描繪的,該裝置為透射型的(例如,其具有一 透射性光罩)。然而,通常,其亦可為一反射型的(例如, 其具有一反射性光罩)。或者,該裝置可採用另一種圖案 化設備,諸如上述類型之一可程式化鏡面陣列。 源LA(例如,一準分子雷射器)產生一輻射束。該射束 (例如)直接或在穿過諸如射束放大器以之調整構件後被饋 入至一照明系統(照明器)IL。該照明器江可包含用於設定 该射束中之強度分佈的外部及/或内部徑向範圍(通常分別 稱作σ-外部及σ-内部)的調整構件八“。另外,該照明器通 常包含各種其它組件,諸如一積光器ΙΝ及一聚光器c〇。 以此方式,照射在該光罩ΜΑ上之該射束ρΒ在其橫截面中 具有一所要的均勻度及強度分佈。 睛注意,關於圖1,該源LA可位於該微影投影裝置之外 殼内(舉例而言,當該源LA為汞等時通常為此狀況),但是 該源LA亦可遠離該微影投影裝置,該源產生之輻射束被 引入至該裝置(例如,借助於合適之導向鏡)中;當該源la 為一準分子雷射器時,此後一假定經常為該狀況。本發明 103634.doc -10· 1294518 及申請專利範圍涵蓋此等假定兩者。 該射束PB隨後遭遇固持在一光罩台MT上之該光罩MA。 該射束PB在已穿過該光罩MA後穿過該投影透鏡PL,該透 鏡將該射束PB聚焦至該基板w之一目標區C上。借助於該 第二定位設備(及一干涉量測設備IF),可精確地移動該基 板台WT以便在該射束PB之路徑中定位不同的目標區c。 類似地,該第一定位設備可用於(例如)在自一光罩庫以機 械方式取得該光罩MA後或在掃描期間相對於該射束pB之 ® 路徑精確地定位該光罩MA。總而言之,該等載物台MT、 WT之移動係借助於一長衝程模組(粗定位)及一短衝程模組 (精定位)來實現,該等模組在圖1中未明確描繪。然而,在 步進機(與步進一掃描裝置相反)之狀況下,該光罩sMT可 僅連接至一短衝程致動器或被固定。 所述之裝置可用於兩種不同的模式: 1·在步進模式中,該光罩台MT基本上保持固定,且一 完整的光罩影像一次性地(意即,一單一 ”快閃”)投影至一 目標區C上。接著,將該基板台界丁在又及/或¥方向上移位 以使一不同的目標區c可受該射束PB輻射。 2·在掃描模式中,除一給定目標區c未在單一 ”快閃,,中 曝光外,基本上應用了相同的假定。實情為,該光罩台 MT可以一速度v在一給定方向(所謂的”掃描方向”,例如, Υ方向)上移動’以使該射束ΡΒ在一光罩影像上方掃描;同 時,該基板台WT同時以一速度ν=Μν在相同或相反方向上 移動,其中Μ為該投影系統PL之放大倍率(通常,以叫/4或 103634.doc • 11 - 1294518 1/5)。以此方式,可曝光一相對較大之目標區c而不會損 害解析率。 9 、 一基板6之表面的一或多個性質可使用一諸如圖2中所描 繪之散射計來確定。在一實施例中,該散射計包含一寬頻 (白光)輻射源2 ,其將輻射導引至一基板6上。一外加寬頻 輻射源可經組態以將具有至少50 nm波長之輻射束提供至 該基板表面。反射輻射經傳至一譜儀偵測器(spectr〇meta detector)4,其量測一鏡面反射輻射之光譜1〇(強度為波長 之函數)。自此資料,(例如)可藉由嚴袼耦合波分析及非線 性回歸或藉由與於圖2之底部所示之模擬光譜庫比較來重 新構造產生該偵測光譜之結構或輪廓。總而言之,用於重 新構造之一般形式係已知的,且一些參數可自製得該結構 之製程的知識中取得,而僅需要自散射量測資料確定該結 構之少許參數。 政射计可為一垂直入射散射計或一傾斜入射散射計。散 射量測技術之變體亦可用於以下情形中:反射係在一單一 波長的角度範圍下量測,而非在波長範圍之一單一角度下 量測。 如圖3中所不,在下面描述之一或多個實施例中,使用 了 一散射計’其經組態以藉由在一高NA透鏡之瞳孔平面 4〇中以複數個角度及波長量測由該基板表面ό反射之一角 辨光”曰之性質來量測一基板的性質。該散射計包含 、、二、、且怨以將輻射投影至該基板上之輻射源2及一經組態 q貞射光譜之摘測器32。瞳孔平面為此種平面:輕射 103634.doc -12· 1294518 之徑向位置界定入射角,且角位置界定輻射之方位角及任 何大體上之共軛平面。該偵測器32係置放在該高Να透鏡 之瞳孔平面中。Ν Α較咼,且在一實施例中,其為至少〇 · 9 或至少0.95。浸潰式散射計甚至可具有一 NA超過i之透 鏡。 以前的角度分辨散射計僅需量測散射光之強度。本發明 之一實施例允許在一角度範圍中同時量測若干波長。藉由 用於不同波長及角度之散射計所量測之性質可包括橫磁 • (TM)偏光及橫電(TE)偏光之強度及TM偏光與TE偏光之間 的相位差。 可能使用一寬頻光源(意即一具有寬範圍之光頻率或波 長一且因此具有寬範圍之色彩的光源),其供給一大的展 度,從而使多個波長混合。在一實施例中,寬頻光中之該 4複數個波長各自具有δλ之頻寬,且因此具有至少(意 即,兩倍波長)的間距。若干輻射”源”可為一已用纖維束分 裂之外加輻射源之不同部分。以此方式,角度分辨散射光 _ 譜可在平行的多個波長下量測。可量測一 3-D光譜(波長及 兩個不同的角度),其含有比一2-D光譜多的資訊。此允許 量測增強量測過程穩健性之較多資訊。 本發明之一實施例之一散射計係展示於圖3中。使用透 鏡系統L2穿過干涉濾光片3〇來聚焦該光源2且經由一顯微 鏡接物鏡L1將該光源2聚焦至該基板6上。接著,經由部分 反射表面34將該輻射反射至一在背投影瞳孔平面4〇中之 CCD债測器中以偵測該散射光譜。該瞳孔平面扣位於該透 103634.doc -13- 1294518 鏡系統L 1之焦距處。一偵測器及高να透鏡被置放在該瞳 孔平面處。由於一高ΝΑ透鏡之曈孔平面通常位於透鏡 内’故可用輔助光學元件使瞳孔平面重新成像。 反射器光(reflector light)之瞳孔平面係以(例如)40毫秒/ 框之積分時間在該CCD偵測器上成像。以此方式,該基板 目標之二維角度散射光譜係在該偵測器上成像。該偵測器 可為(例如)CCD偵測器之陣列或CMOS偵測器之陣列。該 光譜之處理提供一對稱偵測組態且因此感應器可製成旋轉 地對稱。因為該基板上之一目標可相對於該感應器以任何 旋轉定向來量測,所以此允許使用一緊湊的基板台。該基 板上之所有目標可藉由該基板之平移與旋轉之組合來量 測。 可利用一組干涉濾光片30來選擇在405-790 nm或甚至更 小範圍(諸如200-300 nm)内之有利波長。該干涉濾光片為 可調的,而非包含一組不同的濾光片。可使用一光柵來替 代一或多個干涉濾光片。 該基板6(或甚至該反射表面34)可為一光柵。可印刷該 光柵以使顯影後固體抗钱劑線形成一系列柵欄(bar)。或 者’該等柵攔可蝕刻至該基板中。此圖案對微影投影裝置 (尤其是該投影系統PL)中之慧型像差(comatic aberrati〇n) 敏感,且照明對稱性及此等像差之存在將在該印刷光柵之 變化中展示自身。因此,該印刷光柵之散射量測資料用於 重新構造該等光栅。自印刷步驟及/或其它散射量測方法 可知,可將該光柵之一或多個參數(諸如線寬及形狀)輸入 103634.doc -14- 1294518 至重新構造製程。 在具有矩形狹縫之透射金屬光柵中,展示複雜的光子能 帶結構(CPBS)以演示強的不連續性,該等光子能帶結構位 於伍德一瑞利近點角(Wood-Rayleigh anomaly)上且呈現兩 種類型之共振,其稱作水平及垂直表面電漿共振。可直接 自CPBS提取光譜位置及該光譜中之峰值寬度以用於水平 及垂直共振。以此方式,離開一透射金屬光柵之輻射可使 其光譜得到分析並可藉由位於該等伍德一瑞利近點角上之 ί 該強的不連續性來確定該光柵之一或多個性質。伍德一瑞 利近點角在波長或入射角變化時出現,從而提供一額外傳 播之繞射級。射束寬度越大,射束之橫向位移越大。 本發明之一實施例偵測該光譜並產生一對稱的瞳孔平面 影像,自該影像可量測該等不連續性且因此計算一或多個 光柵性質。 根據本發明之一實施例,散射計可經調適以藉由量測反 射光譜中之不對稱來量測兩個未對準之週期性結構之疊 對’該不對稱與疊對之程度相關。 在 κ ;^例中’散射計可經調適以藉由量測反射光譜及 /或偵測組態中之不對稱性來量測兩個未對準光柵或週期 性結構之疊對,該不對稱性與疊對之程度相關。由於該對 稱债測組態,故可清楚地區別任何不對稱。此提供一直接 方式以量測光柵中之未對準。 所使用之基板圖案的一個類型係展示於圖4中。一光栅 14具有一印刷在其頂部上之第二光柵12。該光柵12相對於 103634.doc -15- 1294518 該光柵14偏移之量稱為疊對22。 注意,在圖4a中所示之實施例中,儘管可能存在一自一 傾角(oblique angle)照射物件之源,但是該輻射源2相對於 表面法線對稱地照射該物件且散射量測偵測器自若干角度 量測散射輻射。 疊對量測技術係基於角度散射光譜中之不對稱性之量 測。對稱結構產生對稱的角度光譜,且目標中之不對稱性 展不為該角度散射光譜中之不對稱性。此性質是使用角度 鲁 分辨散射量測技術之疊對量測技術的基礎。 由具寬度20之栅攔製成之兩個重疊但未對準之光柵以及 光柵14形成一個複合式不對稱目標。該角度散射光譜中之 合成不對稱性係用圖3中所示之角度分辨散射計4來偵測並 用於以下列方式來衍生該疊對22 : 使用在第一對光柵及第二對光柵中分別發生精密偏差+d 及-d之兩個光柵對。換言之,光柵12在一對中在一個方向 ^ 上位移(圖4所示)且在另一對中在相反方向上位移(未圖 不)。因此每一對中之該等光柵之間的實際橫向位移為不== C^+c/及心=〇广乂 為疊對22。 當該等光柵對對準時,疊對為〇,且若入射在該等光柵 上之知明的強度為且自該等光栅反射之輻射的強度在_ 第方向上為及在相反方向上為(但仍在同一平面 中),則當豎對=〇時, 然而,若 103634.doc -16· (1) 1294518 OK矣Ο,貝ljA〆。。 (2) 對於一小疊對而言,強度差與疊對成比例: h-I—^KxOV。 ( 3 ) K為一恆定值且與過程相關,因此是未知的。 為了用根據本發明之一實施例之散射計來校準該疊對量 測’使用兩個光樹目標,其中一個具有如圖4b中所示之最 對,且第二個具有完全反向之疊對,因此該上部光桃12係 相對於該底部光桃14向左而非向右移位。第一配置中之晶 對為(9 F+ d(圖4b中之距離22)且第二配置中之疊對為 因此,對於 OV+d, '不對稱性 乂 + =尤「(9 F + 以。 且對於 OV-d, (4)
不對稱性 可消去縮放因數K : OV= d^--A- 4 一及。 (5) 因此可使用該角度分辨散射光譜中 計算疊對。 與先前已知之方法相比,此方法 (6) 之不對稱性的量測來 之優勢在於僅需要兩個 103634.doc -17- 1294518 光柵。此外’原則上’該方法亦可用於2_d光柵:在彼狀 況下,一完整的疊對量測僅需要2個光柵。與使用6個 光柵之光譜散射量測方法相比,此為一顯著改良。 使用2-D光栅之X;;疊對量測技術之分析如下: 兩個光栅具有振幅牙透函數(amplitU(je transmissi〇n) /(x,j;) 及。此等光栅在兩個方向上為週期性的且因此其穿透 函數可寫成傅立葉級數: /0,《y) = 如卿) n m
咖,*y) = Σ Σ A,-— (7) ρ q 兩個光栅具有一相等的週期,且為簡單起見,將該等光 栅之週期標準化為271以用於下列計算。係數I及、可解 釋為視光栅形狀、波長及偏振而定之繞射效率。具有分別 在尤及少方向上之心及h相對疊對之該等兩個光柵重疊。總 的穿透函數?可寫成: ΣΣΣΣ^ 其中: (8) Gp,q = Gp^ej(^0+^〇) 變數可調整如下· p + n^a=>P^a^n ' (9) q 十 m = b>q = b〜m 將此等表】查^ ^~}{{p+n)x+{q+m)y) 屯γγ式代入該傅立葉級數办W中產生 n^\K,mG'n 103634.doc (10) -18 - 1294518 其中: Γ〜=ΣΣκ “ (li) n m L可解釋為繞射級(α,δ)之振幅。可見此振幅通常視χ方 及y方向上之疊對而定。 為簡單起見,僅考慮以在X方向上行進之繞射級。亦 對y方向上之繞射級進行以下分析。此僅需調整變數。 對於在X方向上行進之繞射級而言,6=ο ’因此兩個緣 級α及-α之振幅為:
Γα,。= ΣΣν一 ej((4。,。) η τη U %,) η m , (12) 將係數e±W>放於總和之前產生: (〇 = 一 $以人'_,如。卿。) n m l,。=户。—。) n m = e-j〇x〇yyF Ληχ,-my,) -" (13) 假設兩個光柵在x方向上對稱 F-n,m - Fn,m (Η) (15) G-n,m - Gn,m 使用此性質產生繞射振幅: n m Γ-α,ο =e n m * 散射计$測繞射場(diffraCfed field)之強度,提供: ha,0 = \^±α,〇\ (16) 此表達式之評估展示該強度可寫成如下形式: 103634.doc -19- 1294518 7〇1〇=ΣΣ5»,» c〇sfc,» - - my〇) n m 7-«,〇 = YjYaKm c〇s(^,w + nx0 - my0) … (17) 其中振幅l及相位、視光柵形狀、照明波長及照明偏振 而定。去掉+1級及-1級之差產生在X方向上行進之不對稱 性七: 4c =々0 - 厂1,〇 =Σ Σ Km c〇sfc,m ~ ) - Σ Σ Bn m cos(sn m + nx0 - m.yo) n m n m =Σ Σ sinfo,m - . )si+x0) … (18)
實務上,與該等光柵之間距相比,疊對較小。舉例而 言,該間距經常為大約1 μπι,而最大疊對為大約60 。 因此,以上表達式可被線性化且僅保留心及外之線性項: Λ = Σ Σ sin(^,m - ^y〇 )sin(ra:0) n m =Σ Σ [Sin(^«,m )Q0^y〇) - cos(^w w )8ΐπ(^^0 )]sin(ra:0) n m 9 =Σ Σ 2Bn,m [sinfc,m COS}ny〇 }lX〇 n m = x〇K0+K x0y0 (19) 其中 =ΣΣ20(、) n m
心=ΣΣ2則lcoskJ n m (20) 可見存在-搞合項:4向上之不對稱性亦為經由輕合 項欠叮之7疊對之函數。若該2_D光柵具有9〇。旋轉對稱性" 若光偏振45。,則吾人可將尤及少方向上之不對稱性寫 下形式: .、、、或如 Λ = X0^0 + KxyX〇y〇 = y〇^0 ^xy^〇y〇 103634.doc (21) 20- 1294518 此專方知為具有兩個2-D光栅對之xj;疊對量測技術之基 礎。在第一光柵對中,偏差W被引入該上部光柵中且在第 一光柵對中,引入偏差-J。此偏差同時應用於尤及少兩個方 向。現在可量測四個不對稱項··該第一光柵對中之尤及少不
Ax Aiy K〇 {〇vy +d)+ Kxy (〇Vy + d\〇Vx + d) K〇 (〇K (〇Vy - d\〇Vx + d) KQ(ovy 一d)+ Kxy(OVy 一d\〇Vx -d) (22)
此提供四個具有四個未知係數A、尺叮、^之非 線性方程,其可求解以提供疊對。 在一實施例中,當產生該(該等)光柵圖案時,一或多個 孔徑可提供給該散射計以模擬微影曝光條件。接著該等孔 徑可使用該散射計而用於產生該(該等)光柵圖案之角度分 辨光譜影像。 在一實施例中,可將該基板與該偵測器之間的至少部分 空間(更具體言之,如圖3中所示之該透鏡!^與該基板6之 間的空間)浸入在液體中。該液體可為水。此有利於增加 該基板6與該透鏡!^之間的媒介之空間頻寬。此意謂 如)在空氣中漸漸消失之繞射可傳播並為透鏡所俘獲。由 於該空間浸入液體中,因此偵測一較高繞射級變得可能, 該較高繞射級含有關於該研究中之光栅之詳細資訊多於 (例如)空間中之空氣。 該散射計之數值孔徑(NA)較佳至少為〇9,甚至可為〇 % 或大於1。 · 103634.doc -21 · 1294518 將L1與該物件之間的空間浸入一高折射率流體中增加該 媒/1之二間頻寬且允許傳播一小間距之較高繞射級。產生 傳播第-級光譜之最小間距為。假設NA等於13且 λ等於4〇〇 nm,此產生一 154 nm之最小間距。此對應於一 臨界尺寸(CD)或約20至80 nm之重構光柵寬度。當參看諸 如圖2中所示之輪廓時,臨界尺寸為峰值之平均寬度且間 距為一個峰值至下一個峰值之距離。 该浸潰流體相對於(例如)該基板6上之抗蝕劑應具有一 大的扣數步長(index step)。此可允許偵測器影像中之最大 對比度。滿足此等要求之可能液體為水。 圖5根據本發明之一實施例展示用以監控源輸出強度及 散射輻射之強度的同一偵測器之使用,其避免同步問題且 允許即時補償源輸出變化。 該散射計可包含—非偏振射束分㈣及-詩麵合斷開 (C0Uple Off)由該輻射源發射之韓射束之一部分的傾斜鏡 面’從而用㈤一偵測器來單獨量測。在一實施例中,該 射束之部分用於量測該輻射束之強度,且該散射計可調= 以補償該輻射束之強度中的波動。在主要量測射束側面使 用用於強度量測射束之相同CCD偵測器之 額外的偵測器’且因此一參考感應器與一量測:應器二 的光性質及熱性質不存在差異;且無需額外的電子設備來 觸發、讀出並儲存參考訊號。任何強度變化均可被量 補償。 輻射路徑中之一非偏振射束分離器50使散射輻射在_2 103634.doc •22- 1294518 維偵測器32上成像。一額外透鏡使瞳孔平面在該ccd偵測 器上成像重新。入射在該偵測器上之強度係展示為影像 36 °該非偏振射束分離器50亦耦合輸出該輻射束之一部分 以將該部分用於監控強度雜訊。替代以一獨立偵測器來量 測此輕射部分,使用傾斜鏡面52來回射光並將光傳輸至同 一偵測器32之一獨立部分。一可選擇曈孔光闌54限制該輻 射部分之範圍且該鏡面傾角確保該輻射部分係在該主要輻 射束側面投影。該光譜係在L1之瞳孔平面處之該偵測器3 2 上成像。 在先前方法中,角度分辨散射量測技術已在一單一波長 下完成。不同波長下之量測本應接著連續完成且不同波長 可經時間複用。然而,該等波長之時間複用可使生產量降 級。 在一實施例中,該散射計包含一在該輻射源與該基板之 間的波長多工器及一在該基板與該偵測器之間的解多工 器。此允許同時量測若干不同波長(或色彩),從而在一較 短時段内提供更多資訊及因此如上所述之穩健性。該波長 多工器可包含一置放在一背面投影之物平面處之色散元件 或一置放在瞳孔平面處之色散元件。 該輕射源之表面區域較佳被分成N個部分,該等部分各 自耦接至一波長多工器,其中N為離散波長之數目。此分 裂可用(例如)纖維束及其類似物來完成。 在一實施例中,該多工器包含一置放在一背面投影之物 平面處之色散組件。該色散元件可為一經調適以容納^^個 103634.doc -23- 1294518 離散波長之光柵或稜鏡,該等離散波長各自具有一頻寬从 及一至少兩倍頻寬(意即,2δλ)的間距。此可最大化一外加 光源之使用。因為不同波長之量測可同時完成,所以其不 再需要時間複用,且因此一主要優勢為生產量得到增加。 在一實施例中,該解多工器包含一置放在一瞳孔平面處 之色散元件。可於該物平面處插入一或多個光學劈片以在 該瞳孔平面中達成角度分辨光譜之明確界定之分離。 在一實鉍例中,使用一外加的寬頻輻射源,諸如氙氣、 > 氮或石英鎢鹵素光源。此等光源具有一大的展度,其提供 可为成離散波長且如上所述提供更多資訊之表面區域。 該等波長可在193至800 nm之範圍。 在一實施例中,組合N個離散波長之色散稜鏡或光柵係 用於照明分枝(或圖2中之該源2與該基板6之間的輻射路徑) 中,且一光栅或稜鏡用於偵測分枝(或該基板6與該谓測器 4之間的輻射路徑之間的空間)以空間地分離該等波長。 一複用光柵之一實例係展示於圖6中。兩個光源s丨及S2 & 傳輸穿過一透鏡系統L2且碰撞在物平面42中之利特羅黏著 光柵(Littrow mounted grating)16且在穿過一透鏡系統乙“專 輸至另一物平面42之前聚焦在該瞳孔平面40上並視情況進 入一照明纖維60中。該曈孔平面含有適合尺寸之矩形孔 徑:其寬度確定了入射在該光栅上之光的角範圍。此角範 圍及該光栅間距確定經由該瞳孔平面中之孔徑傳輸之返回 光之頻寬。舉例而言,一具有1200條線/毫米之光柵產生 一約1.2 mrad/nm之色散。一 4 nm之有效頻寬對應於一 3.33 103634.doc -24- 1294518 mrad之照明射束之全角度寬。該基板6之光斑尺寸為約40 μιη且其NA為0.95。因此該光栅上之射束直徑為約23 mm。 若該透鏡L1之焦距為1〇〇茁茁,則該瞳孔平面中之孔徑孔 之寬度必須為333 μπι。若使用一照明纖維,則照明NA必 須為約0.22。 清楚地’可同時使用兩個以上的輻射源(具有不同波 長)。 圖7展不該偵測分枝中之一波長解多工器之一實例。為 簡單起見,再次展示僅兩個波長之分離。除光栅係置放在 瞳孔平面而非物平面中,該解多工器類似於多工器。藉由 該利特羅黏著光柵16中之光栅繞射之光係藉由該透鏡L2來 傳輸,此使在該物平面中產生波長為λ1&λ2之兩個物像。 此平面可含有具有η個(在此狀況下η=2)孔之視野闌,其應 足夠覓以避免空間濾光從而避免干擾光譜。該視野闌之 每-孔亦具有-有一獨特楔角之劈片62。此劈片62確保每 一波長之角度分辨散射光譜係在該⑽偵測器32之一不同 部分上成像。該CCD债測器位於該第二瞳孔平面4〇之底 部。 一 由於該劈片62可使光在兩個方向上偏轉,故可能實現一 具有許多角度分辨光譜之CCD偵測器之有效填充。 為了獲得可重現結果,應使該等目標充分聚焦。為了達 成此目的,-高ΝΑ物鏡之瞳孔平面4〇係根據本發明之一 ::例在一如圖8中所示之具有-雙焦閣系統之谓測器上 成像。在所有實施例中,财是高的;較佳至少為〇9。 103634.doc -25- 1294518 中間體物平面42中之一刀口 70將中間物像的一半擋住。 該刀口可為一佛科(Foucault)刀口。 該刀口有助於將該輻射之影像聚焦至該基板上。對於每 一定向而言,取樣該曈孔平面4〇之外部區域(或實際而 言,兩個-半)中之強度。在散焦之狀況下,產生強度_ 強度12之間的差。已知焦距ρ為·· F=k /1 - /27Γ+ η (23)
比例因數k獨立於該影像且僅需要確定一次,雖然由於 焦距感應器可用於一積分反饋迴路中,但是k之精確值不 甚重要。 照明源不總是均勻的且必須校準及校正以保證基板之 確曝光。不均勻性可由照明源自身引起,或由照明路徑 之反射器之表面塗層的粗糙而引起。先前,該照明射束 標準化已使用一銘質鏡面來完成。然而,當待測物件( 即,光柵或基板)產生較高繞射級時,此標準化失效。」 等較高繞射級在疊對應用中導致工具誘發性移位誤差。1 因此,在一實施例中,該散射量測系統進一步包含在i 照明射束中之一或多個鏡面。更具體言之,該等鏡面可; 該基板臺上之基準且可由㈣成。此等鏡面或傾斜或以^ :傾斜角而存在,以便產生至少兩個以不同角度反射之予 。對於母—傾斜角,㈣測光譜以與傾斜方向相同之力 向位移°_此等影像並將其組合錢分方程,輕 照明輪靡可由該微分方程確i所得照明輪廓用於校 103634.doc -26- 1294518 高繞射級下之反射光譜之性質的量測。 該量測訊號M。㈨表示為: ⑻=[4-咖。(灸)+4一灸土、)及?1(文)+".+4-灸土焉)及(24) 其中: 4⑹為瞳孔平面中位置々處之未知照明強度; 5⑹為感應器之偵測分枝中之未知光損失;且 Αν為光拇物件之第N級之繞射效率。
實務上,因為一緩慢改變之不均勻照明射束及照明路徑 中之光學器件及塗層之表面粗糙度,所以照明強度改變。 光予塗層之表面粗縫度通常在瞳孔平面中引起照明射束之 粒狀現象。 一參考量測可在一高反射鋁質鏡面上進行,其產生以〕 量測訊號: (25) MA[— k)RM(k)B[k) 用該參考來標準化物件之量測得到: = R〇{k\ A{rk±kG) Rn(x) ^A^k±Nkr)R^r(x) mm rm^)+ 4-k) (26) 可見此標準化消除偵測分枝中之損耗。 然而’照明中之不均句性僅在。繞射級時消除(意即, 面反射)。較高繞射級保留一以下形式之未知誤差項: AjrkiNk。、 、 斗·灸) (27) 為了消除此項,照明輪廓j㈨必須校準如下。 鏡面可為一單一凸面鏡或凹面鏡,或其可為一在相 103634.doc -27-
1294518 間主動以一角度範圍傾斜之平面鏡。或者,存在具不同傾 角之一系列鏡面。所量測之反射角可在一徑向方向(此改 變傾斜之幅度)或一方位方向(此改變傾斜之方向)上。 現將在一維中描述用於確定微分方程之方法。至二維之 擴展是容易的。 為級數為1 mrad之兩個小相對鏡面傾角士~量測一參考 鏡面。由於此傾斜,所量測之瞳孔影像將位移。因此,量 測到兩個稍經位移之影像: Μ±θ (k) = A{-k± A(k))RM (k)B{k)c(k;±e) (28) 此處,Δ為曈孔平面中之位移,其通常視該瞳孔平面中 之位置A而定。對於一等光程系統而言: Δ(Α:) = 2Θμ λ/Γ— k2 (29) 等式(18)中之c說明反射強度之重新分佈且對於_等 程系統: (30) (31) 其中及从—分別為以小的正傾角及小的負傾角量之 譜。 ’、光 此處,ρ之下標” M”用於強調其與量測資料相關 小的傾角,一近似值可為: A(k + A(k))^A(k) + ^iAik\ dk (32) 使用此線性化得出2之微分方程: 。對於 幽=雄) 1 dA A(k) dk 103634.doc (33) 28- 1294518 容易解出此方程以求得: 以上推導可容易地擴展至二維。實務上 () 是不連續的,但是其為數字化取樣 所I測之資料 變以上推導出之概念。 “、、而,此未改
實務上’可採用一使用致動器而以機械方 鏡。一種更優雅且簡單之方法為使用一曲率、三斜之平面 向位置為X之凹面鏡或凸面鏡。一曲 “半仏為及且橫 述為: 自鏡2之局部高度係描
2R |面0之局部傾斜與該橫向位置X成線性比例(3:5) Θ = — 4 dx
___ X
一 J (36) 因為恰當傾角係藉由將基準移至該偵測器下之恰當位置而 簡單達成,所以,該基板平臺上之一凹面或凸面之球形鋁 負基準提供直接校準。本發明之一實施例使用一在該基板 之一共軛平面中具有一環形強度分佈之輻射束。為產生該 環形強度分佈’輻射源可包含機械刀片、空間光調變器或 空間同调寬頻雷射器及一變焦旋轉三稜鏡(意即,以產生 一環狀雷射光)。該環形輻射束較佳包含小的_φ照明。 因為”使用’’ 了幾乎所有光子而無光損失,所以建構環形 輻射具有優於插入一刀片之優勢。此對於使用諸如UV或 DUV光源之處尤其重要,因為其發射比更豐富之光源少的 103634.doc -29- 1294518 光子’因此損失大量光子更加引人注意。詳言之,因為若 光強度低,則微影卫具經受___定量之延遲,所以此在訊 號收集中尤為明顯。環形光源具有的另一優勢為:不會像 刀片-樣可能引起内反射。内反射需阻斷以避免光假影。 备然’可使用提供相同優勢之其它照明技術,諸如四極照 明〇 、,理心地,忒裱形輻射之環係置放在該高NA透鏡之瞳孔 :面中 '然而,該瞳孔平面不可直接接近,且實務上,該 %係置放在散射計之照明分枝中之該瞳孔平面的背面投影 影像中。環形照射之優勢在於:可分別量測具有_^組級 小間距光栅之+ 1/-1繞射級之強度。 此只細例可用於藉由將一成形視障⑽叩ed如㈣⑷⑽) 放入輻射束中來計算基板傾角的變化及用於㈣由基板傾 角之變化導致之該基板上的該成形視障之寬度及形狀的改 變。該成形視障可為⑼如如圖9aA9b中所示之十_ 絲。當'然,其可為任何其它形狀且其不必位於瞳孔平面之 中心〇 量測晶圓傾角之想法係基於以下基本關係:晶圓平面中 之傾角在瞳孔平面中導致—位移。在本實施例中,一十字 絲形㈣係置放在該照明射束之中心。此以散射光在瞳孔 平面中產生一如圖9a中所示之黑色十字絲。 f該基板傾角改變’則此十字絲之位置將變化。因此, 可:測此圖案(〇傾角)與一未知傾角之實際量測之間的差以 獲传-如圖9b中所示之影像。該基板之—小傾角不會導致 103634.doc -30 - 1294518 該光環形狀完全改變,但是,其將導致該瞳孔平面影像之 一位移。此位移通常較小且為大約^丨像素級數。為了能 偵測此一小位移,可藉由(例如)曲線擬合來内插像素之間 的值。藉由擬合一在環之邊緣處出現之黑光過渡中之曲 線’可量測環之子像素位移。 此等過渡之寬度及符號可用於計算並校正二維之基板傾 角。以此方式,可以恆定(0)傾角量測該基板。 圖10展示小間距光柵之繞射級,其使用具有一該美 一共輛平面中之環形強度分佈之輻射束來_。使2一環 形強度分佈允許該等影像之形m时所示且進而允許 確地㈣基板傾角。標記為G之影像係成像 在該摘測器中財心0級繞射、級。標記為-2、-1、⑴之影 像係較高繞射級的影像。此等較高繞射級相對於較低繞: 級位移且因此更容易量測隔離的Μ及2_d特徵之疊對量 ^ 了增加計算次數,在某些狀況下,尤其在期待平滑變 無需計算瞳孔平面中之每一單一位置中的一模擬訊 ^在狀況T,可量測—粗柵格且-像素插值技術用 心里孔平面處插入全部形狀。在此 束亦更為有利’因為該瞳孔平面中之有些區域僅接收衣= ^繞射光。若(例如则—阻斷射束,則該瞳孔平面中 :·點將接收來自〇級或〇級與第一級之 導致該瞳孔平面處之量測誤差。 使用放射計之正規量测涉及同時量測具有一單一偏振 103634.doc -31 - 1294518 之一單一基板上之一單一目標的性質。此限制該散射量測 技術中之基板的生產量及潛在地曝光步驟。本發明之一實 施例使用照明源將複數個照明點投影至一基板上。該散射 計之偵測器同時偵測由該基板之一表面反射之複數個照明 點的角度分辨光譜。可使用一用於產生兩個正交偏振照明 點之雙照明纖維或一渥拉斯頓(W〇llast〇n)稜鏡來產生該等 複數個照明點。 圖11展示該散射計硬體之部分。兩個照明點70在穿過位 於該瞳孔平面40中之高數值孔徑物鏡向下傳輸至該基板6 上之剷在射束分離器5〇中分裂。反射射束穿過分離曈孔平 面中之兩個角度分辨光譜之兩個劈片62向上傳輸,該等劈 片自身係定位在該中間像平面42中。接著用在圖丨丨之頂部 處的4重新成像之瞳孔平面4〇上之CCD來偵測該照明射 束。藉此可得到兩個(或甚至更多)平行量測,例如,用於 一單一偏振之水平線及垂直線,或甚至用於TE&TM偏振 兩者之水平線及垂直線兩者。 本發明之一實施例將一散射計換成一橢圓偏光計。為完 成此步驟,照明分枝進一步包括:一經組態以使輻射束線 性偏振之第一偏光器;一經組態以將該輻射束分成兩個正 父分量(orthogonal component)(ETE、ETH)之射束分離器; 一經組態以使散射射束偏振之第二偏光器;一定位在該第 一偏光器與該第二偏光器之間的可變補償器(波卡爾裝置 (Pockells Cell)、渥拉斯頓稜鏡對或索累·巴比奈特(s〇leil_ Babinet)補償器),該可變補償器可經組態以改變正交偏振 103634.doc -32- 1294518 分篁之間(且視情況之該射束分離器與該高數值孔徑透鏡 之間)的光%差,及一用於偵測合成射束分量之正弦強度 變化之二維偵測器。雖然該補償器當然可位於一第二照明 勿枝中,但是其最常見於散射計之主要照明分枝中。 諸如一互補金氧半導體(CMOS)偵測器之二維(2_D)偵測 器具有一較南的框速率,意即,大約1〇〇〇框/秒。 Η展示角度分辨光譜概念如何轉換成一角度分辨光 譜橢圓偏光計。一具有兩個波長λιΑλ2之照明射束傳輸穿 過45偏光器72、經基板6反射並在被再次偏振之前傳輸 穿過一可變補償器74。在該射束分離器與該可變補償器Μ 之間,該照明射束被分成兩個射束,並且ΤΕ偏振射束與 ΤΜ偏振射束之間具有一相位差△。圖以中之桃格%展示l D伯測為陣列及此陣列之—像素中之與時間相關之強度變 化。其它像素將展示一可比較之變化。該等射束穿過兩個 帶通濾光片76以獲得照明輪廓心及^。合成橢圓偏光參數 、sin(~及tan(W實際上不受内部感應器散射影響, 且因此訊雜比可得以改良。雖然亦可使用使數學模型中之 光學組件包含不完整性的繆勒(Mueller)矩陣來模型化,但 是運算可用下面的瓊斯向量及矩陣來模型化。 該第一偏光器後之照明場經45。偏振且用瓊斯向量描述 如下:
Einc=\\ (37) 向量對應於入射在一樣本上之一目標上的丁£及TM偏 103634.doc -33 - 1294518 光。反射該樣本之行為導致散射的TE分量及TM分量之振 幅及相位的改變。此可用一瓊斯矩陣來表示: Rte 〇 sample (38) 其中A為散射場之TE分量與TM分量之間的相位差,且及 及及γμ分別為TE及TM散射場之振幅。 此等參數為入射角度及波長之函數。對於該補償器上之 入射場,可忽略由該高NA透鏡及該射束分離器弓丨i之任 何相位及振幅變化 ^c_in ~ ^sample Rte (39) 該補償器在該TE分量與該TM分量之間弓丨入—士 差(〇pD)變化。若光之波長為人’則該』償二二二變光程 為: 烫斯矩陣 0 0 且因此該補償器後之場為 (40) out ^compel ^TE if Α+2π· OPD(t)) 偏光器係以45。定向且具有一瓊斯矩陣 (41) J pol 且因此該偏光器後之場為 103634.doc -34- (42) (43)1294518
E P〇l —out • Jpol Ec _〇ut (ΔΑ 手] 2 j Δ+2λγ -及TE +及T 入射至該偵測器陣列上之強度為 ^d ~~ ^pol _〇ut * ^pol_out 2
Rte +Rm + 2RTERm cos OPDjt) λ 若OPD隨量測時間間隔線性地增加 此產生一時間諧和的強度變化: 1d = 2 fe +Rm + 2RTERm c〇s(A + Ωί)] 其中 Ω = 2π— λ (44) 則 (45) (46) 強度變化之對比度直接與橢圓偏光參數tan(XI/)相關且該 正弦變化之相位直接產生該等橢圓偏光參數cos(A)及 δΐη(Δ)。在一標準橢圓偏光散射計中,tar^T)及cos(A)係經 量測並模擬以獲得輪廓資訊之訊號。在彼狀況下,將tan〇F)及e〇S(A)記作波長的函數。在本發明中,tanCF)及 cos(A)係作為目里孔平面中之位置的函數而獲得且可用於類 似分析。詳言之’該等橢圓偏光參數用於藉由解決一散射 反算問題來量測層厚度,意即’將該等量測參數與模型化多數進仃比#乂且堆豐參數係藉由最小化該等量 該等模型化參數之間的均方根差。 乂再匕適合量度)來確 定 因為變化之頻率視波長而定,所以可用一帶通遽光片來 103634.doc -35- 1294518 分離各種波長。此可經由經(例如)離散的傅立葉變換技術 處理之訊號來容易地實現。 該補償器亦可置放在該照明分枝中。此外,其亦可置放 在該射束分離器與一高數值孔徑物鏡之間。此配置之優勢 在於:OPD變化被加倍了。 $亥2-D^貞測係此概念之關鍵部分;為了確保量測時間 足夠短,必須具有一較高的框速率。CMOS偵測器可達到 極高的框速率,例如1 0 0 0框/秒。 籲 如以上該等段落5 1至8 〇中所述地量測疊對不能量測到大 的疊對誤差,詳言之,疊對誤差等於光柵間距之整數倍。 清楚地’若存在一意謂光柵線彼此排列成行但移位了若干 光柵間距X度之疊對誤差,則偵測小於光栅間距之疊對誤 差之能力係無用的。 因此,本發明之一實施例使用已存在於用於進行粗疊對 篁測之散射計(上文中已論述)中之該第二偵測器分枝以判 定粗誤差是否存在,諸如光柵疊對誤差事實上是否大於光 栅之間距。一粗疊對量測法為一基於成像之技術,其中一 第一相機注視一具有兩個重疊光柵之一影像且藉由比較一 基板上之標記的邊緣之位置來判定是否存在較大的位移。 2吴的豐對冑具有完全對準之標記邊緣。冑用樣式辨識演 算法來確定處理層中之一光柵的邊緣及抗餘劑層中之光栅 的邊緣。此量測係在-光栅對之四侧或角上完成。使用量 測邊緣位置來計算相對於該處理層中之該光拇之位置的該 抗餘劑光柵的位置。 103634.doc -36 - 1294518 因為量測原則係基於隨光桃間距而週期性地變化之光柵 麵合’所以此事實:散射量測技術不能獨自量測等於光拇 間距之倍數的疊對為一重要限制。換言之,〇疊對及等於 間距之疊對產生一樣的結果。 本發明之散射計允許一極簡單的解決方法。該散射計包 含一將基板表面成像在一 CCD相機上之單獨成像分枝。需 要此第二相機分枝在一對準及樣式辨識步驟中量測該基板 之位置。該第二分枝係示意地展示於圖13中。 瞳孔平面40量測(實際上的角度分辨量測)需要一不填滿 物平面42處之目標之照明源(意即,量測點小於量測目 標)。瞳孔平面成像照明射束係如圖13中之實線所示。在 此狀況下,僅量測該目標之一部分且不照明該目標區域外 之結構。若量測點填滿或過度填充該量測目標,則量測訊 號受包圍該目標之區域干擾,且不必複雜化資料解釋及訊 號分析。 另-方面’因為必須取樣包括該目標之輪廓的完整瞳孔 平面,所以像平面量測必須過量填充該目標以偵測對準。 用則象平面量測之光線如虛線所示。物平面之影像係形成 於-弟- CCD相機8G上且曈孔平面之影像係形成於一第二 CCD相機82上。 圖14展示0疊對(左側圖)及—等於兩倍光柵間距之X最對 (右側圖)之一疊對目標的-個可能實例。瞳孔平面量測將 使兩種情形產生相同的量測疊對〇,#而使其成為一不可 罪罝測。然而’像平面量測可清楚區別此等兩種情形。以 103634.doc -37- 1294518 此方式,一穩健的二階段量測方案可進行如下: ⑴,行兩個像平面量測以驗證不存在大的疊對誤差。 (2)右先刖置測指示疊對小 且了 j於約200 nm,則進行瞳孔平 面篁測。 2〇〇 nm標準為一指示性實例 枯J 只巧丹口J馮任一可覺察之臨限 =假設像平面CCD具有卿xl_像素,且假設基板階 S处像素間距為1〇〇 nm,則總視場將為100χ100 μιη2,其 合適樣式辨識及對準同時仍允許粗疊對量測具有一大: 20-50 nm之精確度。 右使用曝光工具中之邊緣預對準及粗晶圓對準之結果, 則擷取相關影像所需之視角甚至可進—步減小。利用此等 資料,在於疊對量測技術模組中完成邊緣預對準之後,可 以μηι精確度預測基板上之該等標記之位置。 粗疊對僅可在整個對準標記可看見該CCD時量測。若 (二如)僅該標記之中心部分可見,則該基板台需移動至該 標記之邊緣以能夠進行粗4對之量測。此要求該台之額^ 移動’藉此減慢量測發生過程。—大視角允許在—個”衝 程"中擷取該標記且快速進行一粗量測,同時一第二相機 能夠自由擷取瞳孔平面上之影像且獲得詳細之疊對資訊。 本發明之一實施例不僅偵測疊對誤差,而且亦使用為該 等光柵或其它週期性結構上之CD量測配置之散射計來偵 測遭損壞之光柵。該散射計通常偵測鏡面反射光;意即,' 已由該光柵直接反射之最低級光。該光栅中之局部畸變破 壞該光柵之週期性且在一非鏡面反射方向上導致散射。該 103634.doc -38 - 1294518 散射計可用於以其鏡面反射方向外之各種角度偵測散射射 束之一角度分辨光譜。具有一環形強度分佈或小·φ照明之 輻射可用於較高精確度及較易讀出之影像。 本發明之一實施例可用於偵測一浸潰式微影裝置中之氣 泡缺陷,其中一液體被引入如上所述的該投影系統與該基 板之間。以前,使用離線缺陷檢測工具來量測氣泡缺陷。 因為必須將基板自生產線取出並排隊,所以離線工具耗用 比線上工具長的時間才能產生結果。液體中之氣泡導致基 板上之表面缺陷,此將在該表面曝至光中時導致光散射。 此散射輻射係使用本發明之散射計來量測,且散射之原因 推斷為氣泡缺陷。 雖然上文已描述了本發明之特定實施例,但是應瞭解, 本發明可能與已描述的不同方式實施。本說明書不欲限制 本發明。特定描述之實施例係一般工作原理之擴展且未必 互相排斥;其可全部組合在一單一量測工具中以基於一上 述偵測器中所見之結果來增強其有效性。此外,雖然本文 中所述之該等實施例與微影術應用相關,但是硬體及應用 並不限於此等實施例。其可用於其它應用,諸如監控敍刻 處理步驟及其類似者。 【圖式簡單說明】 圖1描述一可用於執行一根據本發明之一實施例之方法 的微影投影装置; 圖2描述一散射計; 圖3描述根據本發明之一眚 > R只軛例之在一兩ΝΑ透鏡之瞳孔 i03634.doc -39- 1294518 平面中里測一角度分辨光譜的一般工作原理; 圖4a及圖4b描述在確定疊對時本發明之一實施例之使 用; 圖5描述根據本發明之一實施例之一用於耦合斷開一輻 射束之一部分的非偏光射束分離器之使用; 圖6描述一根據本發明之一實施例之波長多工器; 圖7描述一根據本發明之一實施例之波長解多工器; 圖8描述根據本發明之一實施例之一處於一中間物平面 處之刀口; 圖9a及圖9b描述根據本發明之一實施例之一檢測射束中 之一成形視障; 圖10描述根據本發明之一實施例之散射光譜之不同繞射 級的偵測影像; 圖11描述根據本發明之一實施例之一具有兩個照明點之 散射計; 圖12描述根據本發明之一實施例之一橢圓偏光計; 圖13描述根據本發明之一實施例之一用於在瞳孔平面及 像平面中偵測影像的散射計;且 圖14描述一具兩倍光柵間距之光柵疊對。 【主要元件符號說明】 2 寬頻(白光)輻射源/光源 4 譜儀偵測器/角度分辨散射計 6 基板/基板表面 10 光譜 103634.doc -40 - 1294518 12 第二光柵 14 光柵/底部光柵 16 利特羅黏著光柵 30 干涉濾光片 32 CCD偵測器/二維偵測器 34 部分反射表面 36 栅格/影像 40 瞳孔平面/視野闌/第二瞳孔平面 42 物平面 50 射束分離器 52 傾斜鏡面 54 瞳孔光闌 60 照明纖維 62 劈片 70 刀口 /照明點 72 45°偏光器 76 帶通濾光片 80 第一 CCD相機 82 第二CCD相機 AM 調整構件 CO 聚光器 c 目標區 Ex 輻射系統/射束放大器 IF 干涉量測設備 103634.doc -41 - 1294518 IL 輻射系統/照明系統(照明器) IN 積光器 LI 顯微鏡接物鏡 L2 透鏡系統 LA 輕射源 MA 光罩 MT 第一載物台(光罩台) PB 輻射投影束 | PL 投影系統("投影透鏡π) Sl,S2 光源 w 基板 WT 第二載物台(基板台) 103634.doc -42-
Claims (1)
129始碰6274號專利申請案 价γν❿嫌⑵正替換頁j 申請專利範圍替換本(95年12月)i、- ________________________________.... .....1 十、申請專利範圍: • - 1 · 種經組悲以®測一基板之一性質之散射計,其包含·· 一高數值孔徑透鏡;及 一偵測器’其經組態以偵測由該基板之一表面反射之 一輻射束的一角度分辨光譜,以及一非偏振射束分離器 及一經組態以耦合斷開由一輻射源發射之輻射束之一部 分’俾以該彳貞測器單獨量測之傾斜鏡面, 其中該基板之該性質可藉由在該高數值孔徑透鏡之瞳 Φ 孔平面中以複數個角度同時量測該反射光譜之一性質來 量測。 2·如請求項1之散射計,其中該透鏡之該數值孔徑為至少 0.9。 3. 如請求項1之散射計,其中該反射光譜之該性質包含(a) 橫磁偏光及橫電偏光之一強度;(b)橫磁偏光與橫電偏光 之間的一相位差;或(a)及(b)兩者。 4. 如請求項1之散射計,其中該基板之該性質係藉由在該 _ 尚數值孔徑透鏡之該瞳孔平面中以複數個波長同時量測 該反射光譜之一性質來進一步量測。 5·如請求項4之散射計,其中該等複數個波長各自具有一 頻寬Aw及一至少2Aw的間距。 6·如請求項1之散射計,其中兩個未對準週期性結構之一 疊對可藉由量測該反射光譜中之不對稱性來量測,該不 對稱與該疊對之程度相關。 7·如請求項1之散射計,其包含: 103634-951228.doc 1294518 —^^.一〜} 經組態以提供該輻射束之轄射 一波長多工器,其在一 源與該基板之間;及 一解多工器,其在該基板與該偵測器之間。 8·如請求項7之散射計,其中該波長多工器為一諸如光柵 或稜鏡之色散元件,其經調適以容納各自具有一頻寬Aw 及一至少2Aw的間距之N個離散的波長。 9.如請求項6之散射計,其中一經組態以提供該輻射束之 輕射源的表面區域被分成N個部分,該等n個部分各自被 麵接至該波長多工器,其中N為離散波長之數目。 10·如叫求項1之散射計,其包含一在一物平面處之光學劈 片以在該瞳孔平面中達成角度分辨光譜之界定的分離。 11·如清求項1之散射計,其中該輻射,束之該部分用於量測 該輕射束之一強度及補償該輻射束之強度的波動。 12.如請求項i之散射計,其包含一瞳孔光闌,該光闌經組 態以限制該輻射束之該部分之尺寸並確保該輻射束之該 部分平行於該輻射束之剩餘部分。 13·如μ求項丨之散射計,其包含一在該基板與該高數值孔 徑透鏡之間且包含一液體之空間。 14·如睛求項1之散射計,其包含一經調適以置放在一中間 物平面之相對兩半的一處之邊緣。 15·如請求項1之散射計,該散射計進一步包含: 至少一反射器; 一债測器,其經組態以偵測並結合由該至少一鏡所反射 之至少兩影像, 103634-951228.doc • 2 - 1294518 β日修(更)正替換頁 一處理器,其經組態以產生一基於該等影像之微分方程 式,該輻射束之照明輪廓可由該等方程式確定。 16·如請求項15之散射計,其中該照明輪廓用於校正較高繞 射級下之該反射光譜之該性質的量測。 Ρ·如請求項15之散射計,其中該反射器包含一凹面鏡且該 政射a十包含一用於使β輪射束在該鏡之表面上移動以獲 得複數個反射角之機構。 18. 如請求項15之散射計,其中該反射器包含一凸面鏡且該 散射計包含一用於使該輻射束在該鏡之表面上移動以獲 付複數個反射角之機構。 19. 如請求項15之散射計,其中該反射器包含一平面鏡且該 散射計包含一用於使該鏡傾斜成複數個角度之機構。 20·如請求項15之散射計,其包含具不同傾角之複數個鏡。 21 ·如請求項15之散射計,其中所量測之反射角在一徑向方 向上。 22. 如請求項15之散射計,其中該所量測之反射角在一方位 角方向上。 23. 如請求項1之散射計,該散射計進一步包含: 一第一偏光器,其經組態以使該輻射束線性偏振; 一射束分離器,其經組態以將該輻射束分成兩個正交 勿里(Ετε、Ετη); 一第二偏光器,其經組態以使該散射射束偏振; 一可變補償器,其位於該第一偏光器與該第二偏光器 之間,其經組態以改變正交偏振分量之間的光程差;及 103634-951228.doc 1294518 i今終/v月乂曰t (¾正替換頁 1 >«ρ*«ι·ν»»·>· .一《:一 —一 丨· f _._丨.... — -叫.,一 _ 一 2維偵測器,其用於偵測該等合成射束分量之正弦 強度變化。 24·如請求項23之散射計,其中該補償器係置放在該散射計 之一照明分枝中。 2 5 ·如睛求項2 3之散射計,其中該補償器位於該射束分離器 與該高數值孔徑透鏡之間。 26·如請求項1之散射計,該散射計進一步包含一用於進行 粗疊對量測之第二偵測器分枝。 27·如請求項26之散射計,其中該第二偵測器分枝在該基板 之該像平面中。 28. 如請求項26之散射計,其中該第二偵測器分枝經組態以 量測一基板上之疊對誤差,該等誤差等於一整數乘以該 基板光柵之間距。 29. 如請求項1之散射計,該散射計進一步包含: 一投影儀,其經組態以將複數個照明點投影至一基板 上;以及 其中該偵測器經進一步組態以同時偵測由該基板之一 ' 表面反射之複數個輻射點之一角度分辨光譜。 3 0·如請求項29之散射計,其包含一用於產生兩個相同偏振 照明點的間隔物。 3 1 · —種量測一基板之一性質之方法,其包含: 將一圖案印刷至一基板上,該圖案包含兩個平行分層 但未對準之光柵,藉此產生一個光柵相對於另一個光栅 之一疊對; 103634-951228.doc -4- 1294518
個角度量測該反射光譜之一 之一反射光譜;及 導出該疊對之程度。 其中量測該反射光譜包含(a)以複數 譜之一性質;(b)複數個波長量;或 同時進行(a)及(b)兩者。 33·如請求項32之方法,其中該反射光 譜之該性質包含⑴橫 磁偏光及橫電偏光之一強度;(Η)橫磁偏光與橫電偏光之 間的一相位差;或⑴及(ii)兩者。 34·如請求項31之方法,該方法進一步包含:進行該等光柵 之粗疊對量測,其包含確定該疊對是否大於該光柵間距 寬度。 3 5.如請求項34之方法,其包含: 0進行一輻射束之兩個像平面量測以確定一大於該光柵 間距之疊對誤差的存在;及 H)若一經確定之疊對在一預定臨限值之下,則進行該輻 射束之一瞳孔平面量測。 103634-951228.doc -5-
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI426018B (zh) * | 2009-09-29 | 2014-02-11 | Asml Netherlands Bv | 壓印微影 |
TWI564539B (zh) * | 2011-06-27 | 2017-01-01 | 克萊譚克公司 | 光學系統、用於其中之照射控制之方法及非暫時性電腦可讀媒體 |
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