SG11201604739RA - Method and apparatus for design of a metrology target - Google Patents

Method and apparatus for design of a metrology target

Info

Publication number
SG11201604739RA
SG11201604739RA SG11201604739RA SG11201604739RA SG11201604739RA SG 11201604739R A SG11201604739R A SG 11201604739RA SG 11201604739R A SG11201604739R A SG 11201604739RA SG 11201604739R A SG11201604739R A SG 11201604739RA SG 11201604739R A SG11201604739R A SG 11201604739RA
Authority
SG
Singapore
Prior art keywords
design
apparatus
method
metrology target
metrology
Prior art date
Application number
SG11201604739RA
Inventor
Guangqing Chen
Justin Ghan
David Harold Whysong
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US201361921907P priority Critical
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Priority to PCT/EP2014/076543 priority patent/WO2015101459A1/en
Publication of SG11201604739RA publication Critical patent/SG11201604739RA/en

Links

Classifications

    • G06F30/39
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70483Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
    • G03F7/70616Wafer pattern monitoring, i.e. measuring printed patterns or the aerial image at the wafer plane
    • G03F7/70625Pattern dimensions, e.g. line width, profile, sidewall angle, edge roughness
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70483Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
    • G03F7/70616Wafer pattern monitoring, i.e. measuring printed patterns or the aerial image at the wafer plane
    • G03F7/70633Overlay
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70483Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
    • G03F7/70616Wafer pattern monitoring, i.e. measuring printed patterns or the aerial image at the wafer plane
    • G03F7/70641Focus
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70483Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
    • G03F7/70616Wafer pattern monitoring, i.e. measuring printed patterns or the aerial image at the wafer plane
    • G03F7/70683Wafer pattern monitoring, i.e. measuring printed patterns or the aerial image at the wafer plane using process control mark, i.e. specific mark designs
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046Strategy, e.g. mark, sensor or wavelength selection
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073Alignment marks and their environment
    • G03F9/7076Mark details, e.g. phase grating mark, temporary mark
SG11201604739RA 2013-12-30 2014-12-04 Method and apparatus for design of a metrology target SG11201604739RA (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US201361921907P true 2013-12-30 2013-12-30
PCT/EP2014/076543 WO2015101459A1 (en) 2013-12-30 2014-12-04 Method and apparatus for design of a metrology target

Publications (1)

Publication Number Publication Date
SG11201604739RA true SG11201604739RA (en) 2016-07-28

Family

ID=52016067

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201604739RA SG11201604739RA (en) 2013-12-30 2014-12-04 Method and apparatus for design of a metrology target

Country Status (7)

Country Link
US (1) US10296692B2 (en)
JP (1) JP6291581B2 (en)
KR (1) KR101860042B1 (en)
CN (1) CN105874389B (en)
SG (1) SG11201604739RA (en)
TW (1) TWI567507B (en)
WO (1) WO2015101459A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201610106SA (en) 2014-06-10 2016-12-29 Asml Netherlands Bv Computational wafer inspection
CN107077077B (en) 2014-09-22 2019-03-12 Asml荷兰有限公司 Processing window identifier
WO2016078861A1 (en) 2014-11-17 2016-05-26 Asml Netherlands B.V. Process based metrology target design
US10216096B2 (en) 2015-08-14 2019-02-26 Kla-Tencor Corporation Process-sensitive metrology systems and methods
NL2017242A (en) * 2015-08-27 2017-03-01 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
CN108700834A (en) * 2016-03-07 2018-10-23 Asml荷兰有限公司 Irradiation system and measurement system
CN109478023A (en) 2016-07-15 2019-03-15 Asml荷兰有限公司 Method and apparatus for measuring the design of target field
EP3358413A1 (en) * 2017-02-02 2018-08-08 ASML Netherlands B.V. Metrology method, apparatus and computer program

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5629772A (en) * 1994-12-20 1997-05-13 International Business Machines Corporation Monitoring of minimum features on a substrate
US7541201B2 (en) * 2000-08-30 2009-06-02 Kla-Tencor Technologies Corporation Apparatus and methods for determining overlay of structures having rotational or mirror symmetry
US6965895B2 (en) * 2001-07-16 2005-11-15 Applied Materials, Inc. Method and apparatus for analyzing manufacturing data
DE10143723B4 (en) 2001-08-31 2006-09-28 Infineon Technologies Ag A method for optimizing a layout for a mask for use in semiconductor fabrication
US7804994B2 (en) * 2002-02-15 2010-09-28 Kla-Tencor Technologies Corporation Overlay metrology and control method
WO2003075328A1 (en) 2002-03-01 2003-09-12 Nikon Corporation Projection optical system adjustment method, prediction method, evaluation method, adjustment method, exposure method, exposure device, program, and device manufacturing method
US6721691B2 (en) 2002-03-26 2004-04-13 Timbre Technologies, Inc. Metrology hardware specification using a hardware simulator
JP4080813B2 (en) * 2002-08-09 2008-04-23 株式会社東芝 Mark design system, mark design method, mark design program, and semiconductor device manufacturing method using the mark design method
US7020535B1 (en) * 2003-11-06 2006-03-28 Advanced Micro Devices, Inc. Method and apparatus for providing excitation for a process controller
US7791727B2 (en) 2004-08-16 2010-09-07 Asml Netherlands B.V. Method and apparatus for angular-resolved spectroscopic lithography characterization
DE102005063460B4 (en) 2005-02-28 2008-07-24 Advanced Micro Devices, Inc., Sunnyvale Method for process control
US7704605B2 (en) 2006-03-28 2010-04-27 Eastman Chemical Company Thermoplastic articles comprising cyclobutanediol having a decorative material embedded therein
CN102662309B (en) 2005-09-09 2014-10-01 Asml荷兰有限公司 System and method for mask verification using individual mask error model
US7925486B2 (en) * 2006-03-14 2011-04-12 Kla-Tencor Technologies Corp. Computer-implemented methods, carrier media, and systems for creating a metrology target structure design for a reticle layout
US7415319B2 (en) 2006-04-04 2008-08-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN100456142C (en) * 2006-10-18 2009-01-28 上海微电子装备有限公司 Alignment mark and its producing method
US8045786B2 (en) 2006-10-24 2011-10-25 Kla-Tencor Technologies Corp. Waferless recipe optimization
CN1963679A (en) * 2006-11-24 2007-05-16 上海微电子装备有限公司 Alignment mark structure for aligning wafer
US8175831B2 (en) * 2007-04-23 2012-05-08 Kla-Tencor Corp. Methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers
US7873504B1 (en) * 2007-05-07 2011-01-18 Kla-Tencor Technologies Corp. Computer-implemented methods, carrier media, and systems for creating a metrology target structure design for a reticle layout
JP2008306030A (en) * 2007-06-08 2008-12-18 Canon Inc Mark designing device and position detecting device
NL1036734A1 (en) 2008-04-09 2009-10-12 Asml Netherlands Bv A method of assessing a model, an inspection apparatus and a lithographic apparatus.
NL1036750A1 (en) 2008-04-14 2009-10-15 Brion Tech Inc A Method Of Performing Mask-Writer Tuning and Optimization.
JP4843649B2 (en) * 2008-08-07 2011-12-21 株式会社東芝 Evaluation pattern creation method, evaluation pattern creation program, and pattern verification method
NL2003702A (en) 2008-11-10 2010-05-11 Brion Tech Inc Pattern selection for lithographic model calibration.
US8214771B2 (en) * 2009-01-08 2012-07-03 Kla-Tencor Corporation Scatterometry metrology target design optimization
US8180471B2 (en) * 2009-05-27 2012-05-15 Globalfoundries Inc. Tuning a process controller based on a dynamic sampling rate
KR20120039725A (en) * 2009-07-22 2012-04-25 케이엘에이-텐코 코포레이션 Angle-resolved antisymmetric scatterometry
TWI417942B (en) 2009-12-17 2013-12-01 Ind Tech Res Inst Method for designing two dimensional array overlay target set and method and system for measureing overlay error using the same
NL2006700A (en) 2010-06-04 2011-12-06 Asml Netherlands Bv Method and apparatus for measuring a structure on a substrate, computer program products for implementing such methods & apparatus.
NL2008957A (en) 2011-07-08 2013-01-09 Asml Netherlands Bv Methods and systems for pattern design with tailored response to wavefront aberration.
US8468471B2 (en) 2011-09-23 2013-06-18 Kla-Tencor Corp. Process aware metrology
NL2009723A (en) 2011-11-30 2013-06-03 Asml Netherlands Bv Inspection method and apparatus, and corresponding lithographic apparatus.
US10354929B2 (en) 2012-05-08 2019-07-16 Kla-Tencor Corporation Measurement recipe optimization based on spectral sensitivity and process variation
NL2010717A (en) 2012-05-21 2013-11-25 Asml Netherlands Bv Determining a structural parameter and correcting an asymmetry property.
US8612898B1 (en) * 2012-08-14 2013-12-17 Globalfoundries Inc. Identification of illegal devices using contact mapping
US9910953B2 (en) 2013-03-04 2018-03-06 Kla-Tencor Corporation Metrology target identification, design and verification
US9857291B2 (en) * 2013-05-16 2018-01-02 Kla-Tencor Corporation Metrology system calibration refinement
US20150142395A1 (en) * 2013-11-15 2015-05-21 Meng Cao Automatic selection of sample values for optical metrology

Also Published As

Publication number Publication date
CN105874389A (en) 2016-08-17
KR20160103133A (en) 2016-08-31
US10296692B2 (en) 2019-05-21
JP6291581B2 (en) 2018-03-14
TW201531812A (en) 2015-08-16
TWI567507B (en) 2017-01-21
WO2015101459A1 (en) 2015-07-09
JP2017502339A (en) 2017-01-19
KR101860042B1 (en) 2018-05-21
CN105874389B (en) 2018-06-26
US20150186582A1 (en) 2015-07-02

Similar Documents

Publication Publication Date Title
GB2570066B (en) Method for determining location of wireless devices
EP2956821B8 (en) Method and apparatus for three-dimensional fabrication
GB201320011D0 (en) An apparatus and method of providing an apparatus comprising a bendable portion
GB201316102D0 (en) A method and apparatus
GB201315588D0 (en) An apparatus and method of providing an apparatus comprising a bendable portion
GB201308662D0 (en) Apparatus for fabrication of three dimensional objects
PL3010470T3 (en) Apparatus for automated walking training
GB201321832D0 (en) An apparatus and method of providing an apparatus comprising a bendable portion
GB201319088D0 (en) A system and method for disseminating functionality to a target device
EP2874473A4 (en) Target for neutron-generating device and manufacturing method therefor
GB2540325B (en) Metrology device and method of performing an inspection
EP3005092A4 (en) Method and apparatus for setting profile
EP2955971A4 (en) Method for transreceiving signal and apparatus for same
GB201302787D0 (en) Method and apparatus
AP201508813A0 (en) A method and apparatus for identifying and communicating locations
GB201406615D0 (en) An apparatus and method for sensing
GB201311764D0 (en) An apparatus
GB201514324D0 (en) Method and apparatus for document planning
IL248170A (en) A method and apparatus for manufacture of 3d objects
EP2979508A4 (en) Method and apparatus of performing a discovery procedure
DK3038799T3 (en) Method and system for determining at least one characteristic of a manipulator
GB2509935B (en) Method and apparatus for reducing self-interference
EP2852930A4 (en) Apparatus and method for executing tasks
GB201308467D0 (en) Method and Apparatus for Inspecting Workpieces
PL2886420T3 (en) Method and Apparatus for Causing Sending of a Parking Directive