TW454230B - Capacitor, semiconductor device, and manufacturing method thereof - Google Patents
Capacitor, semiconductor device, and manufacturing method thereof Download PDFInfo
- Publication number
- TW454230B TW454230B TW089108298A TW89108298A TW454230B TW 454230 B TW454230 B TW 454230B TW 089108298 A TW089108298 A TW 089108298A TW 89108298 A TW89108298 A TW 89108298A TW 454230 B TW454230 B TW 454230B
- Authority
- TW
- Taiwan
- Prior art keywords
- film
- semiconductor device
- patent application
- item
- scope
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
- G02F1/13392—Gaskets; Spacers; Sealing of cells spacers dispersed on the cell substrate, e.g. spherical particles, microfibres
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136213—Storage capacitors associated with the pixel electrode
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136227—Through-hole connection of the pixel electrode to the active element through an insulation layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6723—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device having light shields
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6725—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device having supplementary regions or layers for improving the flatness of the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6733—Multi-gate TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/481—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs integrated with passive devices, e.g. auxiliary capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thin Film Transistor (AREA)
- Liquid Crystal (AREA)
- Recrystallisation Techniques (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13499299 | 1999-05-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW454230B true TW454230B (en) | 2001-09-11 |
Family
ID=15141416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW089108298A TW454230B (en) | 1999-05-14 | 2000-05-02 | Capacitor, semiconductor device, and manufacturing method thereof |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US7391055B1 (enExample) |
| EP (2) | EP1052701A3 (enExample) |
| JP (1) | JP4298131B2 (enExample) |
| KR (2) | KR100648846B1 (enExample) |
| TW (1) | TW454230B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI566414B (zh) * | 2013-06-28 | 2017-01-11 | 神戶製鋼所股份有限公司 | Thin film transistor and manufacturing method thereof |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6680487B1 (en) | 1999-05-14 | 2004-01-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor comprising a TFT provided on a substrate having an insulating surface and method of fabricating the same |
| US8853696B1 (en) | 1999-06-04 | 2014-10-07 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and electronic device |
| TW459275B (en) * | 1999-07-06 | 2001-10-11 | Semiconductor Energy Lab | Semiconductor device and method of fabricating the same |
| JP4666723B2 (ja) | 1999-07-06 | 2011-04-06 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US7071041B2 (en) * | 2000-01-20 | 2006-07-04 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device |
| JP4283020B2 (ja) * | 2003-03-28 | 2009-06-24 | シャープ株式会社 | 液晶パネルおよびその製造方法 |
| TWI231996B (en) * | 2003-03-28 | 2005-05-01 | Au Optronics Corp | Dual gate layout for thin film transistor |
| US20050088261A1 (en) * | 2003-10-24 | 2005-04-28 | Lianjun Liu | Method of making a micromechanical device |
| KR100611148B1 (ko) * | 2003-11-25 | 2006-08-09 | 삼성에스디아이 주식회사 | 박막트랜지스터, 그의 제조방법 및 이를 사용하는 유기전계발광소자 |
| JP2006251049A (ja) * | 2005-03-08 | 2006-09-21 | Toshiba Matsushita Display Technology Co Ltd | 表示装置及びアレイ基板 |
| WO2006106365A2 (en) * | 2005-04-05 | 2006-10-12 | Plastic Logic Limited | Multiple conductive layer tft |
| GB0506899D0 (en) | 2005-04-05 | 2005-05-11 | Plastic Logic Ltd | Multiple conductive layer TFT |
| WO2007058329A1 (en) * | 2005-11-15 | 2007-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| KR100759896B1 (ko) * | 2006-06-15 | 2007-09-18 | 삼성전자주식회사 | 적어도 하나의 발광소자가 장착된 백라이트 모듈 및 그제작 방법 |
| KR101236726B1 (ko) * | 2006-06-30 | 2013-02-25 | 엘지디스플레이 주식회사 | 액정표시장치의 제조방법 |
| IL176673A0 (en) * | 2006-07-03 | 2007-07-04 | Fermon Israel | A variably displayable mobile device keyboard |
| US7667795B2 (en) * | 2006-07-18 | 2010-02-23 | Chunghwa Picture Tubes, Ltd. | Color filter substrate and liquid crystal display panel |
| CN103257491B (zh) * | 2006-09-29 | 2017-04-19 | 株式会社半导体能源研究所 | 半导体设备 |
| KR100970925B1 (ko) * | 2006-12-29 | 2010-07-20 | 엘지디스플레이 주식회사 | 액정표시장치 및 이의 제조방법 |
| KR100788545B1 (ko) * | 2006-12-29 | 2007-12-26 | 삼성에스디아이 주식회사 | 유기 전계 발광 표시 장치 및 그 제조 방법 |
| KR100788551B1 (ko) * | 2006-12-29 | 2007-12-26 | 삼성에스디아이 주식회사 | 유기 전계 발광 표시 장치 및 그 제조 방법 |
| KR100850495B1 (ko) * | 2007-03-02 | 2008-08-05 | 성균관대학교산학협력단 | 유기 박막 트랜지스터 및 그 제조방법 |
| CN102509736B (zh) * | 2008-10-24 | 2015-08-19 | 株式会社半导体能源研究所 | 半导体器件和用于制造该半导体器件的方法 |
| US8471973B2 (en) * | 2009-06-12 | 2013-06-25 | Au Optronics Corporation | Pixel designs of improving the aperture ratio in an LCD |
| JP5260424B2 (ja) | 2009-07-08 | 2013-08-14 | 株式会社ジャパンディスプレイ | 液晶表示装置 |
| TWI418903B (zh) * | 2009-09-30 | 2013-12-11 | Au Optronics Corp | 陣列基板及其製造方法 |
| KR20130000938A (ko) * | 2011-06-24 | 2013-01-03 | 삼성디스플레이 주식회사 | 액정 표시 장치 및 액정 표시 장치의 제조 방법 |
| KR102038633B1 (ko) | 2012-11-13 | 2019-10-30 | 삼성전자주식회사 | 디스플레이 장치의 구동 소자 및 그 제조 방법 |
| KR102205401B1 (ko) * | 2014-01-14 | 2021-01-21 | 삼성디스플레이 주식회사 | 유기발광표시장치 |
| KR102515002B1 (ko) | 2015-12-28 | 2023-03-28 | 엘지디스플레이 주식회사 | 어레이 기판 및 이를 갖는 디스플레이 패널 |
| US10903247B2 (en) * | 2015-12-28 | 2021-01-26 | Sharp Kabushiki Kaisha | Scanning antenna and method for manufacturing same |
| CN111095385B (zh) * | 2017-09-21 | 2021-06-22 | 夏普株式会社 | 显示装置 |
| CN109585303B (zh) * | 2018-11-23 | 2023-03-10 | 合肥鑫晟光电科技有限公司 | 显示面板、阵列基板、薄膜晶体管及其制造方法 |
| KR20220099405A (ko) | 2021-01-06 | 2022-07-13 | 주성엔지니어링(주) | 기판 처리 방법 |
Family Cites Families (144)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3307150B2 (ja) * | 1995-03-20 | 2002-07-24 | ソニー株式会社 | アクティブマトリクス型表示装置 |
| US3694053A (en) * | 1971-06-22 | 1972-09-26 | Bell Telephone Labor Inc | Nematic liquid crystal device |
| US3834792A (en) * | 1972-04-10 | 1974-09-10 | Ncr | Alignment film for a liquid crystal display cell |
| US4161743A (en) * | 1977-03-28 | 1979-07-17 | Tokyo Shibaura Electric Co., Ltd. | Semiconductor device with silicon carbide-glass-silicon carbide passivating overcoat |
| US4555746A (en) * | 1983-01-12 | 1985-11-26 | Matsushita Electric Industrial Co., Ltd. | Organic chip capacitor |
| JPS61184518A (ja) | 1985-02-12 | 1986-08-18 | Semiconductor Energy Lab Co Ltd | 液晶表示装置作成方法 |
| US4775225A (en) | 1985-05-16 | 1988-10-04 | Canon Kabushiki Kaisha | Liquid crystal device having pillar spacers with small base periphery width in direction perpendicular to orientation treatment |
| US4653864A (en) | 1986-02-26 | 1987-03-31 | Ovonic Imaging Systems, Inc. | Liquid crystal matrix display having improved spacers and method of making same |
| US5963288A (en) | 1987-08-20 | 1999-10-05 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal device having sealant and spacers made from the same material |
| US5379139A (en) | 1986-08-20 | 1995-01-03 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal device and method for manufacturing same with spacers formed by photolithography |
| JPS6350817A (ja) | 1986-08-20 | 1988-03-03 | Semiconductor Energy Lab Co Ltd | 液晶電気光学装置作製方法 |
| US5032883A (en) | 1987-09-09 | 1991-07-16 | Casio Computer Co., Ltd. | Thin film transistor and method of manufacturing the same |
| DE3732519A1 (de) | 1987-09-26 | 1989-04-06 | Olympia Aeg | Anordnung zum eingeben und verarbeiten von zeichen und/oder grafischen mustern |
| US5062198A (en) | 1990-05-08 | 1991-11-05 | Keytec, Inc. | Method of making a transparent touch screen switch assembly |
| TW228633B (enExample) | 1991-01-17 | 1994-08-21 | Semiconductor Energy Res Co Ltd | |
| JP2794678B2 (ja) | 1991-08-26 | 1998-09-10 | 株式会社 半導体エネルギー研究所 | 絶縁ゲイト型半導体装置およびその作製方法 |
| KR970001735B1 (en) * | 1991-04-05 | 1997-02-14 | Sharp Kk | A liquid crystal display device and a liquid crystal display system using the liquid crystal display device |
| CA2082136C (en) | 1991-11-08 | 1998-01-06 | Hiroshi Tsujioka | Coordinates input device |
| US5739882A (en) | 1991-11-18 | 1998-04-14 | Semiconductor Energy Laboratory Co., Ltd. | LCD polymerized column spacer formed on a modified substrate, from an acrylic resin, on a surface having hydrophilic and hydrophobic portions, or at regular spacings |
| JPH05273532A (ja) * | 1992-01-31 | 1993-10-22 | Canon Inc | 液晶素子 |
| JPH05281558A (ja) | 1992-04-03 | 1993-10-29 | Toshiba Corp | 液晶表示素子 |
| JP3251690B2 (ja) | 1992-06-01 | 2002-01-28 | 株式会社東芝 | 液晶表示素子 |
| FR2693005B1 (fr) | 1992-06-26 | 1995-03-31 | Thomson Lcd | Disposition d'encapsulation et de passivation de circuit pour écrans plats. |
| KR0159123B1 (ko) | 1992-07-15 | 1999-01-15 | 사토 후미오 | 액정표시장치 |
| JPH0659228A (ja) | 1992-08-12 | 1994-03-04 | Toshiba Corp | 液晶表示素子の製造方法 |
| JP2924506B2 (ja) | 1992-10-27 | 1999-07-26 | 日本電気株式会社 | アクティブマトリックス型液晶表示装置の画素構造 |
| DE69417124T2 (de) | 1993-01-26 | 1999-11-18 | Hughes Electronics Corp., El Segundo | Flüssigkristallzelle mit distanzelementen und verfahren zu ihrer herstellung |
| JP3497198B2 (ja) | 1993-02-03 | 2004-02-16 | 株式会社半導体エネルギー研究所 | 半導体装置および薄膜トランジスタの作製方法 |
| US5843225A (en) | 1993-02-03 | 1998-12-01 | Semiconductor Energy Laboratory Co., Ltd. | Process for fabricating semiconductor and process for fabricating semiconductor device |
| US5639698A (en) | 1993-02-15 | 1997-06-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor, semiconductor device, and method for fabricating the same |
| JP3562588B2 (ja) | 1993-02-15 | 2004-09-08 | 株式会社半導体エネルギー研究所 | 半導体装置の製造方法 |
| JP3210126B2 (ja) | 1993-03-15 | 2001-09-17 | 株式会社東芝 | 液晶表示装置の製造方法 |
| JPH07152024A (ja) | 1993-05-17 | 1995-06-16 | Sharp Corp | 液晶表示素子 |
| US5539545A (en) | 1993-05-18 | 1996-07-23 | Semiconductor Energy Laboratory Co., Ltd. | Method of making LCD in which resin columns are cured and the liquid crystal is reoriented |
| KR100186886B1 (ko) | 1993-05-26 | 1999-04-15 | 야마자끼 승페이 | 반도체장치 제작방법 |
| US5481121A (en) | 1993-05-26 | 1996-01-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having improved crystal orientation |
| JP2791858B2 (ja) | 1993-06-25 | 1998-08-27 | 株式会社半導体エネルギー研究所 | 半導体装置作製方法 |
| US5594569A (en) | 1993-07-22 | 1997-01-14 | Semiconductor Energy Laboratory Co., Ltd. | Liquid-crystal electro-optical apparatus and method of manufacturing the same |
| JP2762215B2 (ja) | 1993-08-12 | 1998-06-04 | 株式会社半導体エネルギー研究所 | 薄膜トランジスタおよび半導体装置の作製方法 |
| JPH07335904A (ja) | 1994-06-14 | 1995-12-22 | Semiconductor Energy Lab Co Ltd | 薄膜半導体集積回路 |
| US5923962A (en) * | 1993-10-29 | 1999-07-13 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a semiconductor device |
| JP3431033B2 (ja) | 1993-10-29 | 2003-07-28 | 株式会社半導体エネルギー研究所 | 半導体作製方法 |
| TW264575B (enExample) | 1993-10-29 | 1995-12-01 | Handotai Energy Kenkyusho Kk | |
| JP3269734B2 (ja) | 1994-06-21 | 2002-04-02 | シャープ株式会社 | 半導体装置及びその製造方法 |
| TW272319B (enExample) | 1993-12-20 | 1996-03-11 | Sharp Kk | |
| JP3378078B2 (ja) | 1994-02-23 | 2003-02-17 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US6162667A (en) | 1994-03-28 | 2000-12-19 | Sharp Kabushiki Kaisha | Method for fabricating thin film transistors |
| JP2547523B2 (ja) * | 1994-04-04 | 1996-10-23 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 液晶表示装置及びその製造方法 |
| JP3192546B2 (ja) | 1994-04-15 | 2001-07-30 | シャープ株式会社 | 半導体装置およびその製造方法 |
| JP3067949B2 (ja) | 1994-06-15 | 2000-07-24 | シャープ株式会社 | 電子装置および液晶表示装置 |
| JP2888177B2 (ja) | 1994-09-28 | 1999-05-10 | 日本電気株式会社 | 液晶表示装置 |
| US5915174A (en) | 1994-09-30 | 1999-06-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for producing the same |
| JP3894969B2 (ja) | 1994-09-30 | 2007-03-22 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP3277082B2 (ja) | 1994-11-22 | 2002-04-22 | シャープ株式会社 | 半導体装置およびその製造方法 |
| JP2694126B2 (ja) * | 1995-02-06 | 1997-12-24 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 液晶表示装置及びその製造方法 |
| JPH08248427A (ja) | 1995-03-13 | 1996-09-27 | Semiconductor Energy Lab Co Ltd | 液晶表示装置 |
| JPH08297286A (ja) | 1995-04-26 | 1996-11-12 | Internatl Business Mach Corp <Ibm> | 液晶表示装置 |
| JP4056571B2 (ja) | 1995-08-02 | 2008-03-05 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP2647815B2 (ja) | 1995-08-18 | 1997-08-27 | 工業技術院長 | レーザー変位計・レーザー振動計の周波数特性測定法 |
| JPH09120062A (ja) | 1995-08-18 | 1997-05-06 | Toshiba Electron Eng Corp | カラーフィルタ基板及びその製造方法、それを用いた液晶表示素子及びその製造方法 |
| US6286359B1 (en) | 1995-08-18 | 2001-09-11 | Director-General Of The Agency Of Industrial Science And Technology | Method for testing frequency response characteristics of laser displacement/vibration meters |
| JP3999824B2 (ja) | 1995-08-21 | 2007-10-31 | 東芝電子エンジニアリング株式会社 | 液晶表示素子 |
| TW373098B (en) | 1995-09-06 | 1999-11-01 | Toshiba Corp | Liquid crystal exposure component and its fabricating method |
| JPH0973093A (ja) | 1995-09-06 | 1997-03-18 | Toshiba Electron Eng Corp | 液晶表示装置、及びその製造方法 |
| US6888608B2 (en) | 1995-09-06 | 2005-05-03 | Kabushiki Kaisha Toshiba | Liquid crystal display device |
| JPH0980447A (ja) | 1995-09-08 | 1997-03-28 | Toshiba Electron Eng Corp | 液晶表示素子 |
| JP3184771B2 (ja) * | 1995-09-14 | 2001-07-09 | キヤノン株式会社 | アクティブマトリックス液晶表示装置 |
| JP3199215B2 (ja) | 1995-09-14 | 2001-08-13 | シャープ株式会社 | 液晶表示素子およびその製造方法 |
| JP3299869B2 (ja) | 1995-09-27 | 2002-07-08 | シャープ株式会社 | 液晶表示装置とその製造方法 |
| US5933207A (en) * | 1995-10-23 | 1999-08-03 | Hughes Electronics Corporation | Reflective-type liquid crystal displays using mixed-mode twist nematic cells |
| JPH09127525A (ja) * | 1995-11-06 | 1997-05-16 | Sharp Corp | 液晶表示素子およびその製造方法 |
| US6800875B1 (en) | 1995-11-17 | 2004-10-05 | Semiconductor Energy Laboratory Co., Ltd. | Active matrix electro-luminescent display device with an organic leveling layer |
| TWI228625B (en) | 1995-11-17 | 2005-03-01 | Semiconductor Energy Lab | Display device |
| JP3124480B2 (ja) | 1995-12-12 | 2001-01-15 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US5657101A (en) * | 1995-12-15 | 1997-08-12 | Industrial Technology Research Institute | LCD having a thin film capacitor with two lower capacitor electrodes and a pixel electrode serving as an upper electrode |
| KR100459682B1 (ko) * | 1995-12-29 | 2005-04-06 | 삼성전자주식회사 | 액정표시장치의박막트랜지스터및그제조방법 |
| JP3310152B2 (ja) | 1996-01-18 | 2002-07-29 | 株式会社東芝 | 液晶表示装置およびその製造方法 |
| JPH09203890A (ja) | 1996-01-25 | 1997-08-05 | Sharp Corp | 入力機能付き液晶表示素子および反射型入力機能付き液晶表示素子、並びにそれらの製造方法 |
| US6236445B1 (en) | 1996-02-22 | 2001-05-22 | Hughes Electronics Corporation | Method for making topographic projections |
| US5852485A (en) * | 1996-02-27 | 1998-12-22 | Sharp Kabushiki Kaisha | Liquid crystal display device and method for producing the same |
| US5815226A (en) | 1996-02-29 | 1998-09-29 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and method of fabricating same |
| US6288764B1 (en) | 1996-06-25 | 2001-09-11 | Semiconductor Energy Laboratory Co., Ltd. | Display device or electronic device having liquid crystal display panel |
| US5986729A (en) | 1996-07-10 | 1999-11-16 | Matsushita Electric Industrial Co., Ltd. | Liquid crystal display device and method of manufacturing the same |
| JPH1044659A (ja) | 1996-08-08 | 1998-02-17 | Kawai Musical Instr Mfg Co Ltd | 電子カード |
| JPH1068955A (ja) | 1996-08-29 | 1998-03-10 | Toshiba Corp | 液晶表示素子 |
| DE19639016A1 (de) | 1996-09-23 | 1998-03-26 | Basf Ag | Mesoporöses Siliciumdioxid, Verfahren zu seiner Herstellung und seiner Verwendung |
| JPH1096955A (ja) | 1996-09-24 | 1998-04-14 | Toshiba Corp | 液晶表示装置 |
| JP3992797B2 (ja) * | 1996-09-25 | 2007-10-17 | 東芝松下ディスプレイテクノロジー株式会社 | 液晶表示装置 |
| JP3179729B2 (ja) | 1996-09-25 | 2001-06-25 | 株式会社日本アルミ | 金属酸化物微粒子の製造方法 |
| JPH10153785A (ja) | 1996-09-26 | 1998-06-09 | Toshiba Corp | 液晶表示装置 |
| US5973763A (en) | 1996-10-16 | 1999-10-26 | Seiko Epson Corporation | Liquid crystal device including supporting columns |
| JP3472422B2 (ja) | 1996-11-07 | 2003-12-02 | シャープ株式会社 | 液晶装置の製造方法 |
| JPH10152305A (ja) | 1996-11-21 | 1998-06-09 | Nippon Sanso Kk | 酸素ガス製造装置および酸素ガス製造方法 |
| JP3808155B2 (ja) | 1997-01-17 | 2006-08-09 | 株式会社半導体エネルギー研究所 | アクティブマトリクス型液晶表示装置 |
| JPH11133463A (ja) | 1997-10-31 | 1999-05-21 | Semiconductor Energy Lab Co Ltd | アクティブマトリクス型液晶表示装置及び電子機器 |
| US6088070A (en) | 1997-01-17 | 2000-07-11 | Semiconductor Energy Laboratory Co., Ltd. | Active matrix liquid crystal with capacitor between light blocking film and pixel connecting electrode |
| US5831710A (en) | 1997-02-06 | 1998-11-03 | International Business Machines Corporation | Liquid crystal display |
| JPH10228022A (ja) | 1997-02-17 | 1998-08-25 | Semiconductor Energy Lab Co Ltd | 液晶表示装置およびその作製方法 |
| JP3032801B2 (ja) | 1997-03-03 | 2000-04-17 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| TW379360B (en) | 1997-03-03 | 2000-01-11 | Semiconductor Energy Lab | Method of manufacturing a semiconductor device |
| JPH10268316A (ja) | 1997-03-24 | 1998-10-09 | Toshiba Corp | 液晶表示素子の製造方法 |
| TW375689B (en) * | 1997-03-27 | 1999-12-01 | Toshiba Corp | Liquid crystal display device and method for manufacturing the same |
| JPH10268361A (ja) | 1997-03-27 | 1998-10-09 | Semiconductor Energy Lab Co Ltd | 液晶表示装置およびその製造方法 |
| JP3883641B2 (ja) | 1997-03-27 | 2007-02-21 | 株式会社半導体エネルギー研究所 | コンタクト構造およびアクティブマトリクス型表示装置 |
| US5978063A (en) | 1997-04-15 | 1999-11-02 | Xerox Corporation | Smart spacers for active matrix liquid crystal projection light valves |
| US6465268B2 (en) | 1997-05-22 | 2002-10-15 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing an electro-optical device |
| JPH10325959A (ja) | 1997-05-26 | 1998-12-08 | Semiconductor Energy Lab Co Ltd | 表示装置 |
| JP3998755B2 (ja) | 1997-05-22 | 2007-10-31 | 株式会社半導体エネルギー研究所 | 半導体表示装置 |
| JPH10339889A (ja) | 1997-06-09 | 1998-12-22 | Semiconductor Energy Lab Co Ltd | 電気光学装置およびその製造方法 |
| DE19725944C1 (de) | 1997-06-19 | 1998-12-24 | Trw Fahrwerksyst Gmbh & Co | Hydraulische Zahnstangenlenkung |
| JP3541625B2 (ja) * | 1997-07-02 | 2004-07-14 | セイコーエプソン株式会社 | 表示装置及びアクティブマトリクス基板 |
| JP4831850B2 (ja) * | 1997-07-08 | 2011-12-07 | 株式会社半導体エネルギー研究所 | 薄膜トランジスタの作製方法 |
| JPH1145558A (ja) | 1997-07-28 | 1999-02-16 | Sony Corp | 遠隔操作装置及び電子機器 |
| KR100269520B1 (ko) * | 1997-07-29 | 2000-10-16 | 구본준 | 박막트랜지스터, 액정표시장치와 그 제조방법 |
| JPH1153424A (ja) | 1997-08-04 | 1999-02-26 | Hitachi Ltd | 論理シミュレータ |
| WO1999010862A1 (en) | 1997-08-21 | 1999-03-04 | Seiko Epson Corporation | Active matrix display |
| JP3325211B2 (ja) * | 1997-08-22 | 2002-09-17 | シャープ株式会社 | カラーフィルタの製造方法 |
| JP3439636B2 (ja) | 1997-09-01 | 2003-08-25 | 株式会社クボタ | 早期安定型埋立処分方法 |
| JPH1184386A (ja) | 1997-09-01 | 1999-03-26 | Toshiba Corp | アクティブマトリクス型液晶表示装置 |
| JP3919900B2 (ja) | 1997-09-19 | 2007-05-30 | 株式会社半導体エネルギー研究所 | 液晶表示装置およびその作製方法 |
| JP4159633B2 (ja) | 1997-09-19 | 2008-10-01 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法並びに電子機器 |
| JPH1195194A (ja) | 1997-09-24 | 1999-04-09 | Toshiba Electronic Engineering Corp | 液晶表示素子およびその製造方法 |
| US6025244A (en) | 1997-12-04 | 2000-02-15 | Fujitsu Limited | Self-aligned patterns by chemical-mechanical polishing particularly suited to the formation of MCM capacitors |
| JPH11295746A (ja) | 1998-02-16 | 1999-10-29 | Sharp Corp | 液晶素子の製造方法、液晶注入装置および液晶注入システム |
| JP4011725B2 (ja) | 1998-04-24 | 2007-11-21 | 東芝松下ディスプレイテクノロジー株式会社 | 液晶表示装置 |
| US6313481B1 (en) | 1998-08-06 | 2001-11-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and a method of manufacturing the same |
| US6555420B1 (en) | 1998-08-31 | 2003-04-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and process for producing semiconductor device |
| KR100324914B1 (ko) | 1998-09-25 | 2002-02-28 | 니시무로 타이죠 | 기판의 검사방법 |
| JP2000122071A (ja) * | 1998-10-13 | 2000-04-28 | Toshiba Corp | 液晶表示素子及び液晶表示素子の製造方法 |
| JP3661443B2 (ja) | 1998-10-27 | 2005-06-15 | 株式会社日立製作所 | アクティブマトリクス液晶表示装置 |
| KR100327696B1 (ko) | 1998-11-16 | 2002-03-09 | 니시무로 타이죠 | 액정표시장치 및 착색층 부재 |
| US6420988B1 (en) | 1998-12-03 | 2002-07-16 | Semiconductor Energy Laboratory Co., Ltd. | Digital analog converter and electronic device using the same |
| US6285247B1 (en) | 1999-01-21 | 2001-09-04 | Agere Systems Guardian Corporation | Optimized low voltage CMOS operation |
| JP4215905B2 (ja) | 1999-02-15 | 2009-01-28 | シャープ株式会社 | 液晶表示装置 |
| JP4372943B2 (ja) | 1999-02-23 | 2009-11-25 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
| US7821065B2 (en) | 1999-03-02 | 2010-10-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device comprising a thin film transistor comprising a semiconductor thin film and method of manufacturing the same |
| US6531993B1 (en) * | 1999-03-05 | 2003-03-11 | Semiconductor Energy Laboratory Co., Ltd. | Active matrix type display device |
| US6861670B1 (en) | 1999-04-01 | 2005-03-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having multi-layer wiring |
| US6680487B1 (en) | 1999-05-14 | 2004-01-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor comprising a TFT provided on a substrate having an insulating surface and method of fabricating the same |
| US6630977B1 (en) | 1999-05-20 | 2003-10-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device with capacitor formed around contact hole |
| JP2001005007A (ja) | 1999-06-18 | 2001-01-12 | Hitachi Ltd | 液晶表示装置 |
| TW459275B (en) | 1999-07-06 | 2001-10-11 | Semiconductor Energy Lab | Semiconductor device and method of fabricating the same |
| US7002659B1 (en) | 1999-11-30 | 2006-02-21 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal panel and liquid crystal projector |
| JP2001311963A (ja) * | 2000-04-27 | 2001-11-09 | Toshiba Corp | 液晶表示装置および液晶表示装置の製造方法 |
-
2000
- 2000-04-25 JP JP2000124838A patent/JP4298131B2/ja not_active Expired - Fee Related
- 2000-05-02 TW TW089108298A patent/TW454230B/zh active
- 2000-05-12 US US09/570,223 patent/US7391055B1/en not_active Expired - Fee Related
- 2000-05-13 KR KR1020000025627A patent/KR100648846B1/ko not_active Expired - Fee Related
- 2000-05-15 EP EP00110377A patent/EP1052701A3/en not_active Withdrawn
- 2000-05-15 EP EP10176397A patent/EP2259135A2/en not_active Withdrawn
-
2005
- 2005-03-14 US US11/079,840 patent/US7330234B2/en not_active Expired - Fee Related
- 2005-05-13 KR KR1020050040295A patent/KR100652472B1/ko not_active Expired - Fee Related
-
2008
- 2008-03-14 US US12/077,161 patent/US8502232B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI566414B (zh) * | 2013-06-28 | 2017-01-11 | 神戶製鋼所股份有限公司 | Thin film transistor and manufacturing method thereof |
| US9660103B2 (en) | 2013-06-28 | 2017-05-23 | Kobe Steel, Ltd. | Thin film transistor and method for manufacturing same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100648846B1 (ko) | 2006-11-24 |
| US7391055B1 (en) | 2008-06-24 |
| EP1052701A2 (en) | 2000-11-15 |
| US8502232B2 (en) | 2013-08-06 |
| KR100652472B1 (ko) | 2006-12-01 |
| EP2259135A2 (en) | 2010-12-08 |
| KR20010014906A (ko) | 2001-02-26 |
| US20050156174A1 (en) | 2005-07-21 |
| JP2001036019A (ja) | 2001-02-09 |
| JP4298131B2 (ja) | 2009-07-15 |
| EP1052701A3 (en) | 2005-01-12 |
| US7330234B2 (en) | 2008-02-12 |
| US20080174710A1 (en) | 2008-07-24 |
| KR20050052449A (ko) | 2005-06-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW454230B (en) | Capacitor, semiconductor device, and manufacturing method thereof | |
| TW469484B (en) | A method for manufacturing an electrooptical device | |
| TW459275B (en) | Semiconductor device and method of fabricating the same | |
| US6576924B1 (en) | Semiconductor device having at least a pixel unit and a driver circuit unit over a same substrate | |
| US9910334B2 (en) | Semiconductor device and fabrication method thereof | |
| CN101150135B (zh) | 半导体器件及其制造方法 | |
| JP4850763B2 (ja) | 半導体装置の作製方法 | |
| JP4712926B2 (ja) | 半導体装置及び半導体装置の作製方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent |