TW407428B - Color separation in an active pixel cell imaging array using a triple-well structure - Google Patents

Color separation in an active pixel cell imaging array using a triple-well structure Download PDF

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TW407428B
TW407428B TW088105846A TW88105846A TW407428B TW 407428 B TW407428 B TW 407428B TW 088105846 A TW088105846 A TW 088105846A TW 88105846 A TW88105846 A TW 88105846A TW 407428 B TW407428 B TW 407428B
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doped region
region
depth
silicon substrate
light
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Richard Billings Merrill
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Foveon Inc
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/1462Coatings
    • H01L27/14623Optical shielding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14643Photodiode arrays; MOS imagers
    • H01L27/14645Colour imagers
    • H01L27/14647Multicolour imagers having a stacked pixel-element structure, e.g. npn, npnpn or MQW elements
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/46Measurement of colour; Colour measuring devices, e.g. colorimeters
    • G01J3/50Measurement of colour; Colour measuring devices, e.g. colorimeters using electric radiation detectors
    • G01J3/506Measurement of colour; Colour measuring devices, e.g. colorimeters using electric radiation detectors measuring the colour produced by screens, monitors, displays or CRTs
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00Photometry, e.g. photographic exposure meter
    • G01J1/42Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G01J1/44Electric circuits
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/46Measurement of colour; Colour measuring devices, e.g. colorimeters
    • G01J3/50Measurement of colour; Colour measuring devices, e.g. colorimeters using electric radiation detectors
    • G01J3/51Measurement of colour; Colour measuring devices, e.g. colorimeters using electric radiation detectors using colour filters
    • G01J3/513Measurement of colour; Colour measuring devices, e.g. colorimeters using electric radiation detectors using colour filters having fixed filter-detector pairs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/10Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
    • H04N25/11Arrangement of colour filter arrays [CFA]; Filter mosaics
    • H04N25/13Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
    • H04N25/134Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements based on three different wavelength filter elements
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/10Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
    • H04N25/17Colour separation based on photon absorption depth, e.g. full colour resolution obtained simultaneously at each pixel location
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00Photometry, e.g. photographic exposure meter
    • G01J1/42Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G01J1/44Electric circuits
    • G01J2001/4446Type of detector
    • G01J2001/448Array [CCD]
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N2209/00Details of colour television systems
    • H04N2209/04Picture signal generators
    • H04N2209/041Picture signal generators using solid-state devices
    • H04N2209/042Picture signal generators using solid-state devices having a single pick-up sensor
    • H04N2209/047Picture signal generators using solid-state devices having a single pick-up sensor using multispectral pick-up elements

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  • Physics & Mathematics (AREA)
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  • Spectroscopy & Molecular Physics (AREA)
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  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Spectrometry And Color Measurement (AREA)

Description

五 弩明鞔明{ 1 , ΑΊ 87 Ί 經濟部智慧財產局員工消費合作社印製. :發%背景丨.:.. . :Y. :也:滅 i.發明領域 " :·χ^ 本發帅Μ於_冬成相’❿更特指料同波長之光 在矽中之不同吸收長皮應:用於主動戒素士的成像陣列的 色毛刀離技術’ _.击二井結構確保陣列中的各個像素偵測 在同位置上之二原:色(R-G-B),本發明之主動像素成像 陣列可降低在數位彰秦中#呀翁夹真信鵲,一〜 之相關技術之翁明:.+: 與本發明相關之昔知技術可大致歸類如下:作為色彩 感應器之疊層光t二極體:v具有疊層感應鼻之成像啐列於 以及其它色彩陣列方法。 . ·...·. ... 第一類別包括一用於測量光色彩之非成像裝置,此等 裝置已藉由不同技術設計之,其取決於光子吸收深度波長 之變化’其例如其標題為“半導體幅射波長彳貞測器’,之美國 專利第4,〇 11,〇 16號案’與其標題辱”用以感應光之波長輿 強度之裝置”之美國:專利第Ά9,6Ό4號案,此二案皆未揭 、 露作為二井積-體電路色彩碜應或成像陣到的結缉·> 第二類別包括具有多個内埋通道之CCD裝置,:其用以 累積並平移光電荷’該等裝置係不易且昂貴敏造,且不用 於三色應用,標題為,’使用波長相關半導體尧吸收的色彩 .. - - - :* 回應成像裝置’’之美國專利第4,613,895號案,此類亦包括 使用施於成像積體電路頂部的多層薄膜光ϋ料,此技術 之例锌揭露於標題爲”色彩威應器,,之美國;.專利第4,677,2名9: . ;- ft; - ';. : ' ; 號案,以及標題為”具署^層晶胞结構之可見光/紫外線成 V *- Ά·读·: 媒 .嘯' 先 .聞:
I丨·i l· $ I m
I •. |· i 11 i · r 訂 -ϊ. 攀 鐵 本紙張子变學用,雨揭夺轉,(CMS >A^r(f2K)vX297公t j ir 球紅v漆·‘^ 1 „ 〜i > I、 407428 A7 _______B7__ 五、發明説明(2 ) 像裝置”之美國專利第4,651,001號案,此等結構亦是難以 製造且昂貴的,是以仍未可行。 (請先閲讀背面之注意事項再填寫本頁> 第三類包括色彩成像積體電路,其係使用一遽光感光 喪鑲幕以選擇在不同光感應位置的不同波長頻寬,標題為 “色彩成像陣列”之美國專利第3,971,065號案,其揭露此種 技術之例。 如卩3〇11514丨等人在1996年提出156/8?1£第2654號案的“ 數位相機類所用之致動技術,,所揭露者,廣用於數位像機 之一像素感光嵌鑲幕圖案為Bayer濾光陣列(CFA)圖索,如 第1圖所示者’ BayerCFA具有以棋盤式排列之5〇%綠像素 ,而其它紅或綠像素用以填入圖案其餘部份。 如第2圖所示者’ BayerCFA造成一綠色所用之鑽石型 Nyquist疇’以及較小的紅與藍所用之矩形NyqUist鳴,人 類肉眼對於螢光較色度中的高空間頻率更加敏感,因此, 由於BayerCFA提供同樣Nyquist頻率以作為單色度成像器 之水平或垂直空間頻率’其改善數位像機之預設銳度。 經濟部智慧財產局員工消費合作社印製 此等感光鼓鑲幕法為此項技術中所固知地關於嚴重色 彩模糊問題,此是因為感應器較其間空間間隔為小的事實 ’是以其等區域性地取樣影像信號,且不同顏色之感應器 位於不同位置,是故,該等取樣不在色彩間對準。 據此’本發明之目的在於提供一色彩成像陣列,其中 以在同一位置之每一偵測器以其感應區域量測三色頻寬, 該等區域較其等間距小的多,如此一來’將衰減該模糊影 像組成’並使該等色彩樣本得以在色彩間對準. 本紙張尺度適用中國國家標準(CNS > A4规格(210X297公釐) 5 4〇7428 A7 B7 五、發明説明(3 本發明之另一目的係欲提供一主動像素色彩成像陣列 ’其可利用標準新型CMOS記憶法加以製造。 參考第3圖,許多新型CMOS積體電路製造法使用一《 雙井”或“雙管”結構,在其中使用攙雜密度約為 l〇17atoms/cm2為P井區域10及]^井區域12,其分別作為用 以在其中製造N-通道與P-通道電晶體◊基板材料14典型上 為更輕微攙雜P型發(l〇i5at〇ms/ciri2),是以p井10並不與基 板14相隔離,在?井1〇中所形成之N通道FET具有攙雜濃度 >l〇18atoms/cm2之N+正常源/漏極擴散18,而濃度約為 li^atoms/cmkN型淺的微攙雜漏極(LLD)區域20,在N井 區域12中所形成之p通道FET22被相類似地加以構成,其 使用相似攙雜濃度之正常P+源/漏極區24以及淺的Ldd區 域26。 經濟部智慧財產局員工消費合作社印製 參照第4圖’在改良之新穎方法,熟知如“三井,,者, 使用一加深N絕緣井28以提供一將卩井10與p基板相格離之 連接絕緣部,該N絕緣井28攙雜密度(1016扣〇][115/(;1112)係介 於P基板14與P井1 〇攙雜密度間(分別為丨〇ISat〇ms/cm2與 1017at〇mS/Cm2),標題為“用以製造具有三井結構之半導體 裝置的方法”之美國專利第5,397’734號案,其揭露三井結 構技術之一例。 三井結構法變的益見普遍且廉價地製造M〇S記憶體 (DRAM)裝置,由於其提供動態電荷儲存節電之有效絕緣 ’以隔開可擴散過基板之雜散次要載體。 本發明之摘要 本紙張尺度逍用中國國家標準(CNS ) A4規格(210X297公釐) 6 A7 B7 五、發明説明(4 經濟部智慧財產局員工消費合作社印製 407428 本發明係指在主動像素MOS成像陣列中之色彩分離 技術’使用二井結構陣列以利用在碎中不同波長之光的不 同吸收長度’進而以如同其等所佔空間大小之感應區域來 測量在同一位置上之不同顏色。 據此,本發明之較佳實試施例提供一在p_型5夕基板中 所形成的光感應結構以分離藍、綠與紅光,該光感結構包 括一個在基板中所形成之深的N-攙雜區域,其使得在N_ 區域與基板中的pn連接區界定紅色感應光電二極體,其在 基板中的深度約等同於紅光在矽中的吸收長度。在N區 域t所形成的P-攙雜區域,其使得在p_區域與N_區域間的 叩連接區界定綠色感應光電二極體,其在基板中的深度約 等同於綠光在矽中的吸收長度。在p_區域中所形成的淺的 N-攙雜區域,其使得在淺的沁區域與p_區域間的叫連接區 界疋藍色感應光電二極體,其在基板中的深度約等同於藍 光在矽中的吸收長度。 二井結構方法之所以可用於本發明係因為:其提供一 可行的方法以製造產生三重層#光電二極體所需要的垂直 PNPN裝置,儘其可應用於在成像晶胞陣列外的同樣晶片 ,二井方法中正常N井不適用於本發明像素晶胞,三重疊 層光電二極體所需深的N-攙雜區域即上述中的队絕緣井二 藉由確保在成像陣列的所有像素可測量像素結構中同 樣位置的紅、綠與藍色回應,本發明可減少在色彩不明的 失真信號H之進行’係利用切巾紅、綠與藍光吸收 波長的不同。 尺度顧t關家辟(CNS )⑽桃(170X297^1-—- -7 (請先聞讀背面之注意事項再填寫本頁)
A7 B7 由 經濟部智慧財產局員工消費合作社印製 407428 五、發明説明(5 本發月提供消除色彩模糊外的優點,舉例言之,其消 除在曰$ + it用的複雜聚合體渡色陣列法,相反地,在此 利用半導體工業所常用的二 的一井方法°而且,可增加可得光 子整體利用效率,以值姑沾+1 傅統的方法,無法通過濾波材料之光 子被濾'波H所吸收並㈣掉,林發明之方法色彩藉 吸收冰度加以刀離’且所有均為收集並利用,此可造成 倍以上的量子效能改善。 本發明提供—個傳統CCD技術所難以達到之優異成像 裝置例,此外,本發明受益於層eCM〇s處理法,即在每 一三色像素上有多個輔助電晶體。 藉由參照下述利用本發明之概念所作為實例的施詳細 說明以及所附圖式,可更加瞭解本發明之特徵與優點。 圖式簡要說明 第1圖說明熟知之Bayer濾色陣列(CFA)圖案; 第2圖說明由Bayer CFA所產生之紅、綠、藍用之 Nyquist 疇; 第3圖為一部分截面圖式,其說明傳統雙井cmos結 構; 第4圖為一部分載面圖式,其說明傳統三井CMOS結 構; 第5圖為一描繪矽中光的吸收長度對應波長的圖例; 第6圖為一部分戴面圖式,其利用本發明概念真井結 構的三色像素感應器; 第7圖為第6圊三色像素感應器結構之平面圖,以及例 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁)
A7 B7 經濟部智慧財產局員工消費合作社印製 407428 五、發明説明( 說簡圏以說明相關光電流感應電路之例; 第8圖為一曲線圖,其顯示第6圓中本發明三井結構光 電二極體的成組估算感應曲線; 第9圖為部份略圖,其用以說明本發明成像陣列之一 部份,其中,每一晶胞之光電二極體與讀出放大電路係以 陣列方式安排之,在每一晶胞中有一條列選擇線與三條直 排輸出線; 第10圖為部份略圖’其用以說明本發明成像陣列之一 部份,其中,每一晶胞之光電二極體與讀出放大電路係以 陣列方式安排之,在每一晶胞中有三條列選擇線與一條直 排輸出線; 第11圖為一略圖’其說明第10圖實施例之像素感應器 ,其具有三條列選擇線與一條直排輸出線; 第12A圖為一佈局圖式,其說明第11圖晶胞之矽層, 包括由矽至第一金屬的接點; 第12B圖為一佈局圖式,其說明第11圖晶胞之三金屬 内連層,其包括接點與通點; 第13八圖為一截面圖式,其說明第12八/128圖晶胞加 上上部金屬遮光層的理想矽表面, 第13B圖為一截面圖式,其說明具有向外擴散N-區域 之第12A/12B圖晶胞加上上部金屬遮光層的石夕表面。 本發明之詳細說明 為人所熟知地,當對矽基板入射光的波長越長’在光 被吸收前所穿過之矽板越深,第5圖為可見光譜中的光在 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閱讀背面之注f項再填寫本頁)
經濟部智慧財產局員工消費合作社印製 407428 A7 B7 五、發明説明(7 ) 矽中之光吸收長度’如第5圖所指出者,其波長在4〇〇_ 490ηπι之藍光會在矽基板中約〇.2_〇 5微米的深度被吸收, 其波長在490-575nm之綠光會在矽基板中約〇 5_15微米的 深度被吸收’其波長在570-700nm之紅光會在石夕基板中約 1.5-3.0微米的深度被吸收。 利用不同波長之光在矽基板中吸收深度之不同,一如 第6圖所示者,本發明較佳實施例提供一個在p_型(約 lO^toms/cm2)導電矽基板ι00所形成之一三井色彩光感結 構’ 6亥二井色彩光感結構包括一個在|>_型砂基板wo中所 形成深的N-型攙雜井區域1〇2(约1〇16at〇ms/cm2),N_型攙 雜井區域102的連接深度约為丨.5_3 〇微米,且較佳為2〇微 求’即大約為紅光的吸收深度,是以.,在深的型攙雜 區域102與P-型基板1 〇〇間的pn連接部形成一在兩區域中的 紅色感應光電二極體。 相似地’在N-型攙雜區域1〇2中形成型導電攙雜 井區域104(約l〇17at〇ms/cm2),在Ρ·型攙雜區域1〇4與1<4型 攙雜區域102間的pn連接部形成的深度約〇 5_丨5微米’而 較佳約為0_6微米,即大約為綠光在矽基板的吸收深度, 是以,在P-型攙雜區域104與深的N-型區域1〇2間的pn連接 部形成一在兩區域中的綠色感應光電二極體。 再者第6圖所示’在p_型攙雜區域1〇4中形成一淺的N_ 型導電挽雜£域〗06(約1 〇18atoms/cm2),其深度約〇 2-〇 5 微米,而較佳約為0.2微米,即大約為藍光在矽基板的吸 收深度,是以,在淺的N-型攙雜區域1〇6與;^型區域1〇4間 -----------IT-------#^). {諳先閲讀背面之注意事項再填寫本頁) " 10 407428 at Β7 經濟部智慧財產局員工消費合作社印製 五、發明説明(8 ) 的pn連接部形成一個在兩區域中的藍色感應光電二極體。 熟於此技之人士當瞭解’如上述者,上述之二極體敏 感性耗盡區域在連接部深度之上下延伸。 熟於此技之人士亦當瞭解’可使用相反的導電性,即 在N-型基板中之深的P-型攙雜區域,在寐的?_型區域中的 N-攙雜區域以及在N-型區域中的淺的P-攙雜區域,實施上 述的三井結構’然而’在此產業中不使用此種結構,由於 其使用標準MOS記憶體技術,第6圖之結構係較佳的。 第6圖更顯示,色彩光感應結構亦包括一連接至紅、 綠與藍光電·一極體的感應機構10 8,用以測量分別流過= 個光電二極體之紅、綠與藍光電流。 第_6圖顯示一光電流感應器108的概念排列,其包括— 連接通過紅色光電二極體的第一電流測量器11 〇以量測紅 光電流ir,一連接通過綠色光電二極體的第二電流測量器 112以量測綠光電流ig,一連接通過藍色光電二極體的第 三電流測量器114以量測紅光電流ib。 假設在光電二極體中大部份的電流被集中於耗盡區中 ,熟於此技之人士當已清楚瞭解電流ib大致由可見光區藍 光入射’光子的光電流所組成,電流ig大致來自藍光光子之 光電流所組成,電流ir大致由來自紅光光子的光電流所組 成。 如第6圖所示,絕緣p-井方法假設所示非常淺的 nldd(N-型微攙雜漏極)層的表面連接部可最大藍色回應。 第7圖顯示上述三井光感應器結構大致佈局,熟於此 ----------讓"I (ι'-ί (請先聞讀背面之注意事項再填寫本頁) 訂 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公嫠) Η 407428 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明(9 ) 一' " 技之人士當瞭解,三井結構可大於單一昔知像素感應晶胞 ,由於傳統像素陣列圖案之混色性質,第7圊中像素區域 必需與二個傳統像素晶胞相比較。 在此技中慣用“主動像素”電路以和光電二極體相連接 ,第7圖顯示三個此種光電流感應電路的略圖,其每一對 應一光電二極體,在第7圖實施例中,此等電路為傳統三 電aa體電流感應器(熟於此技之人士當瞭解亦可使用其它 電流感應電路),藉整合光電二極體電容之光電流與相關 電路節點’並藉由緩衝讀出放大器所得之電壓,主動像素 電流可能感應光電荷。 如上所述者,典型上使用三個電晶體:一還原電晶體 (Re)以還原電容上之電壓至由暗狀態所指示之參考準位, 一源從動放大電晶體B缓衝光電二極體上之電壓,一選 擇電晶體S連接晶胞至縱列輸出線,其當晶胞在使用時 選擇列以讀出。 如第7圊所示,當使用本發明疊層三重光電二極體時 ,相對P-基板,兩個二極體節點之還原電壓(Vn)大致為正 的’而中間節點之還原電壓為較小之正值(即Vn>Vp),所 以二個二極體啟動在反偏壓狀態,當光電二極體曝光時, 其等變得較不反偏壓,而在其溢流前,其等變得較正向偏 壓’取決於電路之雜散電容與不同光電二極體的值,所測 得之三個電壓對應光電荷之不同線性組合,此等線性組合 影響電壓輸出最終敏感曲線’故,被修正以作為矩陣傳輪 之用’其流出以產生一熱感最終輸出。 本紙張尺度適用中國國家橾準((:.阳)六4規格(210父297公釐) (請先閲讀背面之注意事項再填寫本頁)
12 A7
407428 、發明説明(i〇 ) 第8圖顯示本發明三疊層光電二極體安排的成組估計 感應曲線,其為可見光譜中波長函數,如所示者,此等曲 線係僅粗調而非細調,其如其它濾色器的其它色彩分離方 法,然而,如彩色成像技術所熟知者,其可能以適當矩陣 化以轉換由此組曲線之三種測量為红、綠與藍密度值的精 密熱量修正值。估算適當矩陣轉化之方法為熟於此技之人 所固知,其如美國專利案第5,668,596號案之例,其標題 為色彩表線最佳化的數位成像裝置”。 參照第6圖與上述者之三光電二極體色感應結構,以 及其相關光電流感應電路,例如第7圖所說明者,其等可 加以應用,進而獲得三井結構之主動像素晶胞成像陣列, 此種成像陣列包括縱橫向晶胞所組成之矩陣,每一光晶胞 具有一三井結構以及相關的光感應電路,矩陣之每一列具 有三個相關讀取選擇線,其如第7圖所示方式連接至該列 的母-光感應電路,相似地,p車列之每—縱列具有三個與 其相關的縱列輸出、線,其等以第7圖所示之方式連接至縱 列中的每一光感應電路。 然而在本發明之成像陣列中,每一光晶胞之三個選擇 線與三個縱列輸出線’不需要如第7圖所示被分別引出。 另卜—個色彩感應器與讀出故大器可以列或縱列之 短部加以佈線,藉由連接共同之列選擇線或者共同的縱列 輸出線’分別如第9或10圖所示,在第9或1〇圖中,陣列中 之所有晶胞共用信號線,未示出,其如還原與電源共應_ 號等。 、。 407428 經濟部智慧財產局員工消費合作社印製 A7 '^—- ______Β7___ 五、發明説明(11 ) 第11圖顯示像素之完整略圖,其依據第10圖之陣列圖 解’具有三個選擇線R0WR、尺謂〇與R〇wB分別供紅、綠 與藍光感應測量/讀取結構,以及一共用縱列輸出線,第i i 圖簡要地安排使MOS電晶體Ml至M9之位置與方向與其等 佈局的位置及方向相符,其示於第12a/12B圖之中,在此 實施例中’第7圖之讀出供應Vcc與還原參考電壓Vn被共 享,而Vp是分用的。 第12A/12B圖顯示第11圖電路之範例佈局,為清楚說 明’使用點刻圖案以將光罩層分為兩組,第12圖顯示之光 罩層’其影響矽-主動區域、井、種鍍、聚矽閘以及接槽 ,而為熟於此技之人士所立即瞭解的,第12B圖顯示接槽 、與三金屬互聯以及二個經光罩層,如第12A/12B圖所示 者’金屬1係作為内像素互連,金屬2做為列線、金屬3作 為縱列線,聚矽作為列還原線,較佳地使用第四金屬層作 為遮光層’使得光僅落在光電二極體,但未示於圖式。 熟於主動像素感應器此技的人士,當知道還原功能常 以列連接之’致動捲動型電子快門時間,其中在對應列被 讀出前,列中像素被還原一段時間,不同於全球還原功能 ’因此’像素陣列較佳地如第12 A/B圖中者以水平佈線該 還原線’也可知的,當所說明佈局之晶胞靠接於陣列中, 電晶體所在之P井將完全地環繞疊層光電二極體,在最左 端與下方之像素較佳由陣列外之長條P井所完成。 .第13 A/13B圖顯示第12圖佈局中通過像素中央的截面 圖’其包括位於下方之矽攙雜區,並包括一遮光層,但未 本紙張尺度適用中國國家標隼(C.NS ) A4規格(210X297公釐了 (請先閲讀背面之注意事項再填寫本頁)
14 407428 at B7 五、發明説明(12 ) 省略金屬與氧化物互聯之中間層,並包括下一晶胞之左緣 〇 弟13A圖顯示一理想態井,並說明一事實,即可使用 標準三井CMOS法,其利用同樣的光罩與製造法,以定義 在光感應器中之P丼與在讀出電路中之p井,同樣地,在. 光感應器中之N+攙雜區域可以使用如同製造讀出電路中 的N+源/漏極區的光罩與製造步驟,該N+區域可為cM〇s 法之標準強化N+攙雜主動區域,或為NLDD輕微攙雜漏極 區,其取決於實驗設計之選擇(該載面區域可為通過源;漏 極區域部份兩者之一 經濟部智慧財產局員工消費合作社印製 第13B圖顯示在像素中之攙雜區域看來似乎具有適度 外擴之N-井區域》藉由整合疊層光感應器與(:1^〇5中的主 動像素感應與讀出電子,本發明可使其中設立有讀出電子 之P井作用為一介於深的N井間的有效絕緣屏蔽,如第13 圖所不者,N井間被隔開以使其等不致過度擴散以改變由 P至N之空間,即便其中無干擾p井或主動像素感應與讀出 電路。換言之’N井不可設置過於接近,而不造成紅感應 光電二極體與其鄰近者的短路現象’介於N光電二極體間 的該P井帶係作用將其等相隔離地更加安全,並提供一在 N態場效電晶體令之“自*,,區域,其用以感應並讀出電子 ,此一由®層矽光電二極體與三井(:^4〇8法中(:“〇8電路 所形成之新穎組合,將可提供—遠優於昔知技藝的令人驚 訝並具吸引力之優點。 應瞭解的是,在實施本發明時,可利用各種另外於此 15 - __A07428 b7 五、發明説明(ΐ3 ) " -- 處所述本發明實鮮丨时法,其所欲者在於··應包括下列 定義本發明之範圍與該等申請專利範圍中的方法及結構。 圖式元件標號對照表 10…P井區域 12…N井區域 14…基板材料
16…N通道FET 18…N+正常源/漏極擴散區 20”,微攙雜漏極(LDD) 22…P通道FET 24…P+源/漏極區 26…淺的LDD區 28…N絕緣井 102…N攙雜區 104…P攙雜區 106…淺的N攙雜區 108.…感應機構 110…第一電流計 112…第二電流計 114…第三電流計 本纸張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閲讀背面之注i項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 - I - I * ^^1 -- - : ^^1 m ( - i -- - - ---^^1 In - 1 m^i-#TA - — I - - -I - I ...... . n 1 16

Claims (1)

  1. 經濟部中央標準局負工消費合作社印装 407428 B8 C8 D8 夂、申請專利範圍 一種在第一導電態之矽基板中所形成的色彩光感應結 構,其用以分離不同波長之光,該色彩光感應結構包 括: 一個形成於矽基板中以不同於第—導電態之第二 導電態的第一攙雜區,在第一攙雜區與矽基板間所形 成之連接部,其位於矽基板中之深度大約為第—光波 長在石夕中的吸收長度,藉以定義第一光電二極體; 一個形成於第一攙雜區中的第一導電態之第二攙 雜區’第二攙雜區與第一攙雜區間所形成之連接部, 其位於第一攙雜區中之深度大约為第二光波長在矽中 的吸收長度’藉以定義第二光電二極體; 一個形成於第二攙雜區中的第二導電態之第三攙 雜區,第三攙雜區與第二攙雜區間所形成之連接部’ 其位於第二攙雜區中之深度大約為第三光波長在矽中 的吸收長度,藉以定義第三光電二極體;以及 一光電流感應器,被連接以測量分別通過第一、 第一與第二光電二極體的第一、第二與第三光電流。 2_如申請專利範圍第1項之色彩光感應結構,其中. 第一攙雜區與矽基板間所形成之連接部在矽基板 中的深度約為1.5-3.0微米; 第二攙雜區與第一攙雜區間所形成之連接部在第 一攙雜區中的深度約為0.5·1.5微米;以及 第二攙雜區與第二攙雜區間所形成之連接部在第 二攙雜區中的深度約為0,2-0.5微米。 中國國家標準(CNS ) Α4規格(2丨0X297公釐) (請先閲讀背面之注意事項再填寫本頁) — U ^^1 I....... in n -- -I I 1 m I I-I - 1 ! - 1^1 >^i ml 1..... - - t—I - - - - i -- -I I ^^1 A8 B8 C8 D8 夂、申請專利範圍 經濟部中央標準局員工消費合作社印製 407428 3 如肀請專利範圍第1項之色彩光感應結構,其中 第一攙雜區與石夕基板間所形成之連接部在石夕基板 中的深度約為2.0微米; 第一授雜區與第一挽雜區間所形成之連接部在第 一攙雜區中的深度約為0.6微米;以及 第三攙雜區與第二攙雜區間所形成之連接部在第 二攙雜區中的深度約為0.2微米。 4. 一種形成於p-型導電態矽基板中的色彩光感應結構, 其用以分離藍、綠與紅波長的光,其中藍、綠與紅波 長的光在矽中分別具有第一、第二與第三光吸收長度 ’該光感應結構包括: —個形成於P-型矽基板中之N-型導電態的第一深 區’在深的P —型區與p_型矽.基板間形成連接部,其 位於P-型矽基板中之深度大約為第三光吸收長度,藉 以定義紅色光電二極體; —個形成於深N -型區中之p_型導電態的第二深區 在P _型區與深N-型區之間形成連接部,其位於深N_ 型區中之深度大約為第二光吸收長度,藉以定義綠色 光電二極體; 一個形成於P-型區中之沁型導電態的第三淺區, 在淺的N-型區與p_型區間所形成之連接部,其位於p_ 型區中之深度大約為第一光吸收長度,藉以定義藍色 光電二極體;以及 光電流感應裝置,其被連接跨越紅、綠與藍的光 中國固家標準(CNS )从齡297公楚) ί請先閲讀背面之注$項再填寫本頁)
    8 8 8 8 ABCD 經濟部中央標準局員工消費合作社印装 407428 六、申請專利範圍 電二極體以測量分別通過紅色、綠色與藍色光電二極 體的紅光、綠光與藍光的光電流。 5. —個主動像素成像陣列,該陣列包括+ (a)—在具第一導電態矽基板中所形成色彩光感結構之 列與縱列的矩陣,每一色彩光感結構具有: (1 )—個形成於矽基板中;由與第一導電態相反之 第二導電態的第一攙雜區,在第一攙雜區與矽 基板間所連接部形成於矽基板之深度约為第一 光波長在矽中的吸收長度,以定義一第一光電 二極體; (ϋ) 一個形成於第_攙雜區中;且為第一導電態之 第二攙雜區,在第二攙雜區與第一攙雜區間之 連接部形成於第一攙雜區之深度約為第二光波 長在矽中的吸收長度,以定義一第二光電二極 體; (m)—個形成於第二攙雜區中;且為第二導電態之 第三攙雜區,在第三攙雜區與第二攙雜區間之 連接部形成於第二攙雜區之深度約為第三光波 長在矽中的吸收長度,以定義一第三光電二極 體; (W)—光電流感應器,其被連接以測量分別通過第 ~、第二與第三光電二極體的第―、第二及第 2光電流; (b)對在矩陣中之每—列,和在該列中之每—色彩 本紙張尺度逋用中國國家梯準(CNS)Mii72l^x29^^ ) {請先閲讀背面之注意事項再填寫本頁)
    A8 B8 C8 D8 經濟部中央樣準局員工消費合作社印製 407428 六、申請專利範圍 應結構所連接的列選擇電路,其被選擇性地指定以 輸出第一、第二與第三輸出信號,其等代表在該列 中色彩光電感應結構中所產生之第一、第二與第三 色彩光感應結構;以及 (C)對在矩陣中之每一縱列,和在該縱列中之每一色彩 光感應結構所連接的縱列輸出電路,其用以選擇性 地指定輪出輸出信號,其等代表在該縱列中色彩光 電感應結構中所產生之第一、第二與第三光電流 6·如申請範圍第5項中之主動像素成像陣列,其中 在第一攙雜區與矽基板間之連接部,其形成於石夕 基板中之深度約為〇.5-3.0微米; 在第一攙雜區與第一攙雜區之連接部,其形成於 第一攙雜區中之深度約為0.51.5微米; 在第二挽雜區與第二.攙雜區之連接部,其形成於 第二攙雜區中之深度約為〇.2_〇·5微米。 7‘如申請範圍第5項中之主動像素成像陣列’其中 在第一攙雜區與矽基板間之連接部,其形成於矽 基板中之深度約為2.0微米: 在第二攙雜區與第一攙雜區之連接部’其形成於 第一攙雜區中之深度約為〇6微米; ^在第三攙雜區與第二攙雜區之連接部,其形成於 第二攙雜區中之深度約為〇2微米。 8’如申請範圍第5項中之主動像素成像陣列,其中 該列選擇電路包括-列選擇線,其連接至該列中 {請先閱讀背面之注意事項再填寫本頁)
    經濟部中央標準局員工消費合作社印製 407428 as B8 C8 ---------- D8 A、申請專利範圍 每一色衫光感應結構之光電流感應器,用以指定輸出 用之第一、第二與第三光電流;以及 該縱列選擇電路包括第一、第二與第三縱列輸出 線,其等連接至該列中每一色彩光感應結構之光電流 感應器,用以指定分別用於輸出之第一 '第二與第三 光電流。 9.如申請範圍第5項中之主動像素成像陣列,其中 該列選擇電路包括第一、第二與第三列選擇線, 其等連接至該列中每一色彩光感應結構之光電流感應 器,用以指定分別用於輸出之第一、第二與第三光電 流,以及 該縱列選擇電路包括一縱列輸出線,其連接至該 縱列中每一色彩光感應結構之光電流感應器’用以指 定分別輸出之第一、第二與第三光電流。 10·—個形成於第一導電態矽基板中之色彩光感應結構, 用以分離不同波長之光,該色彩光感應結構包括: 一個形成於矽基板中;由與第一導電態相反之第 二導電態的第一攙雜區,在第一攙雜區與矽基板間所 連接部形成於矽基板之深度約為第一光波長在矽中的 吸收長度,以定義一第一光電二極體: 一個形成於第一攙雜區中;且為第一導電態之第 二攙雜區,在第二攙雜區與第一攙雜區間之連接部形 成於第一攙雜區之深度約為第二光波長在矽中的吸收 長度’以定義一第二光電二極體; (請先閱讀背面之注意事項再填寫本頁〕 訂 "
    經濟部中央標隼局員工消费合作社印製 407428 龆 ~—--- 六、申請專利範圍 一個形成於第二攙雜區中;且為第二導電態之第 二攙雜區’在第三攙雜區與第二攙雜區間之連接部形 成於第二攙雜區之深度約為第三光波長在矽中的吸收 長度’以定義一第三光電二極體; 一個形成於梦基板中屬第一導電態之第四攙雜區 ,其大致具有如第二攙雜區濃度,並完全包圍第一攙 雜區;以及 在第四擾雜區中所形成之眾多第二導電態場效電 晶體,且其等被互聯以提供光電流感應器而測量分別 流過第一、第二與第三光電二極體之第一、第二與第 三光電流。 11. 一個主動像素成像陣列,該陣列包括: (a)—在具第一導電態矽基板中所形成色彩光感結構列 與縱列的矩陣,每一色彩光感結構具有: (1) 一個形成於矽基板中;由與第一導電態相反之 第二導電態的第一攙雜區,在第一攙雜區與矽基 板間所連接部形成於矽基板之深度約為第一光波 長在梦中的吸收長度,以定義一第一光電二極體 1 (ϋ)—個形成於第一攙雜區中;且為第一導電態之 第二攙雜區,在第二攙雜區與第一攙雑區間之連 接部形成於第一攙雜區之深度約為第二光波長在 石夕中的吸收長度,以定義一第二光電二極體; (lil) —個形成於第二攙雜區中;且為第二電態之 本紙張从適財關家揉( 21ρχ297ϋ (請先閱讀背面之注意事項再填寫本頁) —------訂------線一"-1--- 脚 22
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