SG169230A1 - Sputtering target, sintered body, conductive film formed by using them, organic el device, and substrate used for the organic el device - Google Patents
Sputtering target, sintered body, conductive film formed by using them, organic el device, and substrate used for the organic el deviceInfo
- Publication number
- SG169230A1 SG169230A1 SG200700791-7A SG2007007917A SG169230A1 SG 169230 A1 SG169230 A1 SG 169230A1 SG 2007007917 A SG2007007917 A SG 2007007917A SG 169230 A1 SG169230 A1 SG 169230A1
- Authority
- SG
- Singapore
- Prior art keywords
- organic
- conductive film
- film formed
- sintered body
- sputtering target
- Prior art date
Links
- 238000005477 sputtering target Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 abstract 2
- 229910044991 metal oxide Inorganic materials 0.000 abstract 2
- -1 lanthanide metal oxides Chemical class 0.000 abstract 1
- 229910052747 lanthanoid Inorganic materials 0.000 abstract 1
- 150000004706 metal oxides Chemical class 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 abstract 1
- 229910001887 tin oxide Inorganic materials 0.000 abstract 1
- 239000011787 zinc oxide Substances 0.000 abstract 1
Classifications
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- C—CHEMISTRY; METALLURGY
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/453—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/50—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on rare-earth compounds
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- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/06—Luminescent, e.g. electroluminescent, chemiluminescent materials containing organic luminescent materials
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
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- H10K50/816—Multilayers, e.g. transparent multilayers
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- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
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- C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
- C04B2235/3229—Cerium oxides or oxide-forming salts thereof
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- C04B2235/3251—Niobium oxides, niobates, tantalum oxides, tantalates, or oxide-forming salts thereof
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- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
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- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
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- Ceramic Engineering (AREA)
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- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Physics & Mathematics (AREA)
- Structural Engineering (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002226429A JP4448648B2 (ja) | 2002-08-02 | 2002-08-02 | スパッタリングターゲット及び焼結体それらを利用して製造した導電膜。 |
JP2002283405A JP2004119272A (ja) | 2002-09-27 | 2002-09-27 | 有機el素子及びそれに用いる基板 |
JP2002301633A JP4308497B2 (ja) | 2002-10-16 | 2002-10-16 | 有機電界発光装置用電極基板および有機電界発光装置およびその装置の製造方法 |
JP2002307906A JP4428502B2 (ja) | 2002-10-23 | 2002-10-23 | 有機電界発光素子用電極基板およびその製造方法並びに有機el発光装置 |
JP2002323388A JP4241003B2 (ja) | 2002-11-07 | 2002-11-07 | 有機電界発光素子用電極基板および有機el発光装置 |
Publications (1)
Publication Number | Publication Date |
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SG169230A1 true SG169230A1 (en) | 2011-03-30 |
Family
ID=31499613
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200700791-7A SG169230A1 (en) | 2002-08-02 | 2003-05-26 | Sputtering target, sintered body, conductive film formed by using them, organic el device, and substrate used for the organic el device |
Country Status (8)
Country | Link |
---|---|
US (3) | US7393600B2 (zh) |
EP (2) | EP1693483B1 (zh) |
KR (2) | KR101002537B1 (zh) |
CN (4) | CN101260509A (zh) |
DE (1) | DE60329638D1 (zh) |
SG (1) | SG169230A1 (zh) |
TW (3) | TWI404810B (zh) |
WO (1) | WO2004013372A1 (zh) |
Families Citing this family (109)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1693483B1 (en) | 2002-08-02 | 2009-10-07 | Idemitsu Kosan Co., Ltd. | Sputtering target, sintered article, conductive film fabricated by utilizing the same, organic el device, and substrate for use therein |
JP2004079301A (ja) * | 2002-08-14 | 2004-03-11 | Fuji Photo Film Co Ltd | 発光素子およびその製造方法 |
US7635440B2 (en) * | 2003-03-04 | 2009-12-22 | Nippon Mining & Metals Co., Ltd. | Sputtering target, thin film for optical information recording medium and process for producing the same |
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- 2003-05-26 KR KR1020057001886A patent/KR101002537B1/ko active IP Right Grant
- 2003-05-26 EP EP03766618A patent/EP1536034A4/en not_active Withdrawn
- 2003-05-26 CN CNA2008100955746A patent/CN101260509A/zh active Pending
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- 2003-05-26 WO PCT/JP2003/006539 patent/WO2004013372A1/ja active Application Filing
- 2003-05-26 CN CN201210030870.4A patent/CN102522509B/zh not_active Expired - Fee Related
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- 2003-05-26 SG SG200700791-7A patent/SG169230A1/en unknown
- 2003-05-26 CN CNB03818642XA patent/CN100396813C/zh not_active Expired - Lifetime
- 2003-06-09 US US10/456,636 patent/US7393600B2/en not_active Expired - Fee Related
- 2003-06-10 TW TW099115817A patent/TWI404810B/zh not_active IP Right Cessation
- 2003-06-10 TW TW092115733A patent/TW200402475A/zh not_active IP Right Cessation
- 2003-06-10 TW TW095120961A patent/TW200641174A/zh not_active IP Right Cessation
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Also Published As
Publication number | Publication date |
---|---|
TW200641174A (en) | 2006-12-01 |
KR20050034729A (ko) | 2005-04-14 |
CN1869277A (zh) | 2006-11-29 |
US8093800B2 (en) | 2012-01-10 |
CN1675399A (zh) | 2005-09-28 |
US20080309223A1 (en) | 2008-12-18 |
EP1693483B1 (en) | 2009-10-07 |
US20060234088A1 (en) | 2006-10-19 |
EP1536034A1 (en) | 2005-06-01 |
EP1693483A2 (en) | 2006-08-23 |
CN1869277B (zh) | 2010-09-29 |
TWI316093B (zh) | 2009-10-21 |
KR101002492B1 (ko) | 2010-12-17 |
TW201035340A (en) | 2010-10-01 |
KR101002537B1 (ko) | 2010-12-17 |
CN102522509A (zh) | 2012-06-27 |
US7306861B2 (en) | 2007-12-11 |
KR20060069892A (ko) | 2006-06-22 |
TW200402475A (en) | 2004-02-16 |
US20040081836A1 (en) | 2004-04-29 |
EP1536034A4 (en) | 2009-12-02 |
CN100396813C (zh) | 2008-06-25 |
DE60329638D1 (de) | 2009-11-19 |
CN101260509A (zh) | 2008-09-10 |
EP1693483A3 (en) | 2006-11-22 |
TWI328616B (zh) | 2010-08-11 |
WO2004013372A1 (ja) | 2004-02-12 |
CN102522509B (zh) | 2016-01-20 |
US7393600B2 (en) | 2008-07-01 |
TWI404810B (zh) | 2013-08-11 |
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