SG153813A1 - Substrate holding device, exposure apparatus having same, exposure method, method for producing device, and liquid repellent plate - Google Patents

Substrate holding device, exposure apparatus having same, exposure method, method for producing device, and liquid repellent plate

Info

Publication number
SG153813A1
SG153813A1 SG200903927-2A SG2009039272A SG153813A1 SG 153813 A1 SG153813 A1 SG 153813A1 SG 2009039272 A SG2009039272 A SG 2009039272A SG 153813 A1 SG153813 A1 SG 153813A1
Authority
SG
Singapore
Prior art keywords
exposure
exposure apparatus
same
liquid repellent
substrate holding
Prior art date
Application number
SG200903927-2A
Other languages
English (en)
Inventor
Yuichi Shibazaki
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of SG153813A1 publication Critical patent/SG153813A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG200903927-2A 2004-06-09 2005-06-08 Substrate holding device, exposure apparatus having same, exposure method, method for producing device, and liquid repellent plate SG153813A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004171116 2004-06-09
JP2004205008 2004-07-12

Publications (1)

Publication Number Publication Date
SG153813A1 true SG153813A1 (en) 2009-07-29

Family

ID=35503355

Family Applications (3)

Application Number Title Priority Date Filing Date
SG2012089082A SG186621A1 (en) 2004-06-09 2005-06-08 Substrate holding device, exposure apparatus having same, exposure method, method for producing device, and liquid repellent plate
SG10201710046XA SG10201710046XA (en) 2004-06-09 2005-06-08 Substrate holding device, exposure apparatus having same, exposure method, method for producing device, and liquid repellent plate
SG200903927-2A SG153813A1 (en) 2004-06-09 2005-06-08 Substrate holding device, exposure apparatus having same, exposure method, method for producing device, and liquid repellent plate

Family Applications Before (2)

Application Number Title Priority Date Filing Date
SG2012089082A SG186621A1 (en) 2004-06-09 2005-06-08 Substrate holding device, exposure apparatus having same, exposure method, method for producing device, and liquid repellent plate
SG10201710046XA SG10201710046XA (en) 2004-06-09 2005-06-08 Substrate holding device, exposure apparatus having same, exposure method, method for producing device, and liquid repellent plate

Country Status (10)

Country Link
US (2) US8705008B2 (zh)
EP (3) EP3318928A1 (zh)
JP (8) JP5170228B2 (zh)
KR (7) KR101421870B1 (zh)
CN (4) CN102290364B (zh)
HK (4) HK1103855A1 (zh)
IL (2) IL179937A (zh)
SG (3) SG186621A1 (zh)
TW (2) TWI447780B (zh)
WO (1) WO2005122219A1 (zh)

Families Citing this family (93)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100568101C (zh) 2002-11-12 2009-12-09 Asml荷兰有限公司 光刻装置和器件制造方法
US10503084B2 (en) 2002-11-12 2019-12-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
SG121818A1 (en) 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7213963B2 (en) 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR20180112884A (ko) 2003-06-13 2018-10-12 가부시키가이샤 니콘 노광 방법, 기판 스테이지, 노광 장치, 및 디바이스 제조 방법
KR101394764B1 (ko) * 2003-12-03 2014-05-27 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법, 그리고 광학 부품
EP3318928A1 (en) * 2004-06-09 2018-05-09 Nikon Corporation Exposure apparatus and method for producing a device
US7701550B2 (en) 2004-08-19 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1801850B1 (en) 2004-09-17 2014-11-26 Nikon Corporation Substrate holding apparatus, exposure apparatus and device manufacturing method
CN101015039B (zh) * 2004-09-17 2010-09-01 尼康股份有限公司 曝光用基板、曝光方法及元件制造方法
TWI493600B (zh) * 2004-12-15 2015-07-21 尼康股份有限公司 A substrate holding device, an exposure device, and a device manufacturing method
US7433016B2 (en) 2005-05-03 2008-10-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4708876B2 (ja) * 2005-06-21 2011-06-22 キヤノン株式会社 液浸露光装置
EP1962329B1 (en) * 2005-12-08 2014-08-06 Nikon Corporation Substrate holding device, exposure device, exposure method, and device fabrication method
US7649611B2 (en) 2005-12-30 2010-01-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2007083592A1 (ja) * 2006-01-17 2007-07-26 Nikon Corporation 基板保持装置及び露光装置、並びにデバイス製造方法
WO2007139017A1 (ja) * 2006-05-29 2007-12-06 Nikon Corporation 液体回収部材、基板保持部材、露光装置、及びデバイス製造方法
US8208116B2 (en) 2006-11-03 2012-06-26 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion lithography system using a sealed wafer bath
US8253922B2 (en) * 2006-11-03 2012-08-28 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion lithography system using a sealed wafer bath
US8040490B2 (en) * 2006-12-01 2011-10-18 Nikon Corporation Liquid immersion exposure apparatus, exposure method, and method for producing device
JP2008192854A (ja) * 2007-02-05 2008-08-21 Canon Inc 液浸露光装置
US20080198346A1 (en) * 2007-02-16 2008-08-21 Canon Kabushiki Kaisha Exposure apparatus and method for manufacturing device
US20080304025A1 (en) * 2007-06-08 2008-12-11 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for immersion lithography
US8705010B2 (en) 2007-07-13 2014-04-22 Mapper Lithography Ip B.V. Lithography system, method of clamping and wafer table
TWI514090B (zh) * 2007-07-13 2015-12-21 Mapper Lithography Ip Bv 微影系統及用於支撐晶圓的晶圓台
US8889042B2 (en) * 2008-02-14 2014-11-18 Asml Netherlands B.V. Coatings
US20100039628A1 (en) * 2008-03-19 2010-02-18 Nikon Corporation Cleaning tool, cleaning method, and device fabricating method
EP2128703A1 (en) * 2008-05-28 2009-12-02 ASML Netherlands BV Lithographic Apparatus and a Method of Operating the Apparatus
EP2131242A1 (en) * 2008-06-02 2009-12-09 ASML Netherlands B.V. Substrate table, lithographic apparatus and device manufacturing method
TW201009895A (en) * 2008-08-11 2010-03-01 Nikon Corp Exposure apparatus, maintaining method and device fabricating method
TW201017347A (en) * 2008-10-31 2010-05-01 Nikon Corp Exposure device, exposure method, and device manufacturing method
US8896806B2 (en) * 2008-12-29 2014-11-25 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US20100196832A1 (en) 2009-01-30 2010-08-05 Nikon Corporation Exposure apparatus, exposing method, liquid immersion member and device fabricating method
JP5482784B2 (ja) 2009-03-10 2014-05-07 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
NL2004305A (en) * 2009-03-13 2010-09-14 Asml Netherlands Bv Substrate table, immersion lithographic apparatus and device manufacturing method.
US8953143B2 (en) * 2009-04-24 2015-02-10 Nikon Corporation Liquid immersion member
US20100323303A1 (en) * 2009-05-15 2010-12-23 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, and device fabricating method
US20110199591A1 (en) * 2009-10-14 2011-08-18 Nikon Corporation Exposure apparatus, exposing method, maintenance method and device fabricating method
KR20170113709A (ko) 2009-11-09 2017-10-12 가부시키가이샤 니콘 노광 장치, 노광 방법, 노광 장치의 메인터넌스 방법, 노광 장치의 조정 방법, 및 디바이스 제조 방법
WO2011083724A1 (ja) 2010-01-08 2011-07-14 株式会社ニコン 液浸部材、露光装置、露光方法、及びデバイス製造方法
US20110222031A1 (en) * 2010-03-12 2011-09-15 Nikon Corporation Liquid immersion member, exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
US20120013864A1 (en) 2010-07-14 2012-01-19 Nikon Corporation Liquid immersion member, immersion exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
US20120013863A1 (en) 2010-07-14 2012-01-19 Nikon Corporation Liquid immersion member, immersion exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
US8937703B2 (en) 2010-07-14 2015-01-20 Nikon Corporation Liquid immersion member, immersion exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
US20120012191A1 (en) 2010-07-16 2012-01-19 Nikon Corporation Liquid recovery apparatus, exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
US20120019802A1 (en) 2010-07-23 2012-01-26 Nikon Corporation Cleaning method, immersion exposure apparatus, device fabricating method, program, and storage medium
US20120019804A1 (en) 2010-07-23 2012-01-26 Nikon Corporation Cleaning method, cleaning apparatus, device fabricating method, program, and storage medium
US20120019803A1 (en) 2010-07-23 2012-01-26 Nikon Corporation Cleaning method, liquid immersion member, immersion exposure apparatus, device fabricating method, program, and storage medium
NL2007802A (en) 2010-12-21 2012-06-25 Asml Netherlands Bv A substrate table, a lithographic apparatus and a device manufacturing method.
US20120162619A1 (en) 2010-12-27 2012-06-28 Nikon Corporation Liquid immersion member, immersion exposure apparatus, exposing method, device fabricating method, program, and storage medium
US20120188521A1 (en) 2010-12-27 2012-07-26 Nikon Corporation Cleaning method, liquid immersion member, immersion exposure apparatus, device fabricating method, program and storage medium
US20130016329A1 (en) 2011-07-12 2013-01-17 Nikon Corporation Exposure apparatus, exposure method, measurement method, and device manufacturing method
US9329496B2 (en) 2011-07-21 2016-05-03 Nikon Corporation Exposure apparatus, exposure method, method of manufacturing device, program, and storage medium
US9256137B2 (en) 2011-08-25 2016-02-09 Nikon Corporation Exposure apparatus, liquid holding method, and device manufacturing method
US20130050666A1 (en) 2011-08-26 2013-02-28 Nikon Corporation Exposure apparatus, liquid holding method, and device manufacturing method
JP2013102126A (ja) * 2011-10-14 2013-05-23 Fuji Electric Co Ltd 半導体装置の製造方法および半導体装置の製造装置
US20130135594A1 (en) 2011-11-25 2013-05-30 Nikon Corporation Liquid immersion member, immersion exposure apparatus, exposure method, device manufacturing method, program, and recording medium
US9323160B2 (en) 2012-04-10 2016-04-26 Nikon Corporation Liquid immersion member, exposure apparatus, exposure method, device fabricating method, program, and recording medium
US9268231B2 (en) 2012-04-10 2016-02-23 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method for manufacturing device, program, and recording medium
CN104541206B (zh) * 2012-05-29 2016-12-21 Asml荷兰有限公司 物体保持器和光刻设备
US9823580B2 (en) 2012-07-20 2017-11-21 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method for manufacturing device, program, and recording medium
JP2014045090A (ja) * 2012-08-27 2014-03-13 Toshiba Corp 液浸露光装置
US9494870B2 (en) 2012-10-12 2016-11-15 Nikon Corporation Exposure apparatus, exposing method, device manufacturing method, program, and recording medium
US9568828B2 (en) 2012-10-12 2017-02-14 Nikon Corporation Exposure apparatus, exposing method, device manufacturing method, program, and recording medium
US9720331B2 (en) 2012-12-27 2017-08-01 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method of manufacturing device, program, and recording medium
US9651873B2 (en) 2012-12-27 2017-05-16 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method of manufacturing device, program, and recording medium
JP6119242B2 (ja) 2012-12-27 2017-04-26 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
CN103172271B (zh) * 2013-03-15 2015-11-25 京东方科技集团股份有限公司 一种涂布方法
CN103676263B (zh) * 2013-06-06 2016-05-25 凌晖科技股份有限公司 液晶面板的重制方法
CN104425403B (zh) * 2013-09-02 2017-12-12 日月光半导体制造股份有限公司 半导体封装件、其制造方法及其使用的切割冶具
WO2015046243A1 (ja) * 2013-09-25 2015-04-02 芝浦メカトロニクス株式会社 吸着ステージ、貼合装置、および貼合基板の製造方法
JP6369472B2 (ja) 2013-10-08 2018-08-08 株式会社ニコン 液浸部材、露光装置及び露光方法、並びにデバイス製造方法
US9760027B2 (en) * 2013-10-17 2017-09-12 United Microelectronics Corp. Scanner routing method for particle removal
CN105374709B (zh) * 2014-08-07 2019-05-03 东京毅力科创株式会社 接合装置、接合系统以及接合方法
EP3304108A1 (en) * 2015-05-26 2018-04-11 Rasco GmbH A boat, assembly&method for handling electronic components
KR20170016547A (ko) 2015-08-03 2017-02-14 삼성전자주식회사 척 테이블 및 그를 포함하는 기판 제조 장치
CN105093588B (zh) * 2015-08-24 2018-05-08 京东方科技集团股份有限公司 一种支撑销及吸附机台
JP6639175B2 (ja) * 2015-09-29 2020-02-05 東京エレクトロン株式会社 乾燥装置及び乾燥処理方法
CN105467779A (zh) * 2016-01-04 2016-04-06 京东方科技集团股份有限公司 一种曝光机及曝光方法
US10705426B2 (en) 2016-05-12 2020-07-07 Asml Netherlands B.V. Extraction body for lithographic apparatus
JP6758920B2 (ja) * 2016-06-01 2020-09-23 キヤノン株式会社 チャック、基板保持装置、パターン形成装置、及び物品の製造方法
JP6207671B1 (ja) * 2016-06-01 2017-10-04 キヤノン株式会社 パターン形成装置、基板配置方法及び物品の製造方法
WO2018224218A1 (en) 2017-06-06 2018-12-13 Asml Netherlands B.V. Method of unloading an object from a support table
CN107272351A (zh) * 2017-07-28 2017-10-20 武汉华星光电技术有限公司 承载装置及具有该承载装置的曝光设备
NL2021663A (en) 2017-10-12 2019-04-17 Asml Netherlands Bv Substrate holder for use in a lithographic apparatus
US20190259648A1 (en) * 2018-02-20 2019-08-22 Applied Materials, Inc. Patterned vacuum chuck for double-sided processing
JP7198629B2 (ja) * 2018-10-26 2023-01-04 日本特殊陶業株式会社 保持装置
JP7154995B2 (ja) * 2018-12-17 2022-10-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US11500298B2 (en) * 2018-12-21 2022-11-15 Asml Holding N.V. Reticle sub-field thermal control
JP2022068575A (ja) * 2020-10-22 2022-05-10 株式会社ディスコ 洗浄装置
US11728204B2 (en) * 2020-10-23 2023-08-15 Kla Corporation High flow vacuum chuck
CN113727595B (zh) * 2021-11-01 2022-02-15 广东科视光学技术股份有限公司 一种pcb板自动化曝光设备及方法
TWI838138B (zh) * 2023-02-24 2024-04-01 南茂科技股份有限公司 清潔裝置

Family Cites Families (101)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4346164A (en) 1980-10-06 1982-08-24 Werner Tabarelli Photolithographic method for the manufacture of integrated circuits
JPS57117238A (en) 1981-01-14 1982-07-21 Nippon Kogaku Kk <Nikon> Exposing and baking device for manufacturing integrated circuit with illuminometer
JPS57153433A (en) 1981-03-18 1982-09-22 Hitachi Ltd Manufacturing device for semiconductor
JPS58202448A (ja) 1982-05-21 1983-11-25 Hitachi Ltd 露光装置
JPS5919912A (ja) 1982-07-26 1984-02-01 Hitachi Ltd 液浸距離保持装置
NL8204450A (nl) 1982-11-17 1984-06-18 Philips Nv Verplaatsingsinrichting, in het bijzonder voor het stralingslithografisch behandelen van een substraat.
DD221563A1 (de) 1983-09-14 1985-04-24 Mikroelektronik Zt Forsch Tech Immersionsobjektiv fuer die schrittweise projektionsabbildung einer maskenstruktur
DE3340079A1 (de) * 1983-11-05 1985-05-15 Brown, Boveri & Cie Ag, 6800 Mannheim Speicherzellenverbindung
DD224448A1 (de) 1984-03-01 1985-07-03 Zeiss Jena Veb Carl Einrichtung zur fotolithografischen strukturuebertragung
JPS6144429A (ja) 1984-08-09 1986-03-04 Nippon Kogaku Kk <Nikon> 位置合わせ方法、及び位置合せ装置
JPS6265326A (ja) 1985-09-18 1987-03-24 Hitachi Ltd 露光装置
JPS63157419A (ja) 1986-12-22 1988-06-30 Toshiba Corp 微細パタ−ン転写装置
JP2587953B2 (ja) * 1987-09-30 1997-03-05 日立電子エンジニアリング株式会社 レジスト塗布装置
JPH01303720A (ja) * 1988-06-01 1989-12-07 Toshiba Corp チャッキング装置
JP2897355B2 (ja) 1990-07-05 1999-05-31 株式会社ニコン アライメント方法，露光装置，並びに位置検出方法及び装置
JPH04305917A (ja) 1991-04-02 1992-10-28 Nikon Corp 密着型露光装置
JPH04305915A (ja) 1991-04-02 1992-10-28 Nikon Corp 密着型露光装置
JPH0562877A (ja) 1991-09-02 1993-03-12 Yasuko Shinohara 光によるｌｓｉ製造縮小投影露光装置の光学系
JP3203719B2 (ja) * 1991-12-26 2001-08-27 株式会社ニコン 露光装置、その露光装置により製造されるデバイス、露光方法、およびその露光方法を用いたデバイス製造方法
JP3246615B2 (ja) 1992-07-27 2002-01-15 株式会社ニコン 照明光学装置、露光装置、及び露光方法
JPH06188169A (ja) 1992-08-24 1994-07-08 Canon Inc 結像方法及び該方法を用いる露光装置及び該方法を用いるデバイス製造方法
JP3173928B2 (ja) 1992-09-25 2001-06-04 キヤノン株式会社 基板保持装置、基板保持方法および露光装置
JPH06124873A (ja) 1992-10-09 1994-05-06 Canon Inc 液浸式投影露光装置
JP2753930B2 (ja) 1992-11-27 1998-05-20 キヤノン株式会社 液浸式投影露光装置
JP3412704B2 (ja) 1993-02-26 2003-06-03 株式会社ニコン 投影露光方法及び装置、並びに露光装置
JPH07220990A (ja) 1994-01-28 1995-08-18 Hitachi Ltd パターン形成方法及びその露光装置
US5874820A (en) 1995-04-04 1999-02-23 Nikon Corporation Window frame-guided stage mechanism
US5528118A (en) 1994-04-01 1996-06-18 Nikon Precision, Inc. Guideless stage with isolated reaction stage
JP3555230B2 (ja) 1994-05-18 2004-08-18 株式会社ニコン 投影露光装置
US5623853A (en) 1994-10-19 1997-04-29 Nikon Precision Inc. Precision motion stage with single guide beam and follower stage
JP3940823B2 (ja) 1994-12-26 2007-07-04 株式会社ニコン ステージ装置及びその制御方法
JPH09306802A (ja) * 1996-05-10 1997-11-28 Nikon Corp 投影露光装置
JPH08316125A (ja) 1995-05-19 1996-11-29 Hitachi Ltd 投影露光方法及び露光装置
JPH08316124A (ja) 1995-05-19 1996-11-29 Hitachi Ltd 投影露光方法及び露光装置
JP3709896B2 (ja) 1995-06-15 2005-10-26 株式会社ニコン ステージ装置
KR970072024A (ko) 1996-04-09 1997-11-07 오노 시게오 투영노광장치
JP3709904B2 (ja) 1996-11-14 2005-10-26 株式会社ニコン 投影露光装置
US5825043A (en) * 1996-10-07 1998-10-20 Nikon Precision Inc. Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus
JPH10135115A (ja) 1996-11-01 1998-05-22 Nikon Corp 露光方法及び基準プレート
JP4029182B2 (ja) 1996-11-28 2008-01-09 株式会社ニコン 露光方法
CN1244021C (zh) 1996-11-28 2006-03-01 株式会社尼康 光刻装置和曝光方法
JP4029183B2 (ja) 1996-11-28 2008-01-09 株式会社ニコン 投影露光装置及び投影露光方法
DE69717975T2 (de) 1996-12-24 2003-05-28 Asml Netherlands B.V., Veldhoven In zwei richtungen ausgewogenes positioniergerät, sowie lithographisches gerät mit einem solchen positioniergerät
JP3276601B2 (ja) * 1997-01-22 2002-04-22 東京エレクトロン株式会社 洗浄処理方法及び洗浄処理装置
JP3747566B2 (ja) * 1997-04-23 2006-02-22 株式会社ニコン 液浸型露光装置
JP3817836B2 (ja) 1997-06-10 2006-09-06 株式会社ニコン 露光装置及びその製造方法並びに露光方法及びデバイス製造方法
JPH1116816A (ja) 1997-06-25 1999-01-22 Nikon Corp 投影露光装置、該装置を用いた露光方法、及び該装置を用いた回路デバイスの製造方法
TW444270B (en) * 1997-11-12 2001-07-01 Nippon Kogaku Kk Exposure apparatus, apparatus for fabricating device and fabricating method of exposure apparatus
JPH11176727A (ja) 1997-12-11 1999-07-02 Nikon Corp 投影露光装置
US6897963B1 (en) 1997-12-18 2005-05-24 Nikon Corporation Stage device and exposure apparatus
US6208407B1 (en) 1997-12-22 2001-03-27 Asm Lithography B.V. Method and apparatus for repetitively projecting a mask pattern on a substrate, using a time-saving height measurement
WO1999049504A1 (fr) 1998-03-26 1999-09-30 Nikon Corporation Procede et systeme d'exposition par projection
JP2000058436A (ja) 1998-08-11 2000-02-25 Nikon Corp 投影露光装置及び露光方法
JP2001044097A (ja) 1999-07-26 2001-02-16 Matsushita Electric Ind Co Ltd 露光装置
WO2001035168A1 (en) 1999-11-10 2001-05-17 Massachusetts Institute Of Technology Interference lithography utilizing phase-locked scanning beams
JP2001183844A (ja) * 1999-12-22 2001-07-06 Sharp Corp 露光方法
DE10011130A1 (de) 2000-03-10 2001-09-13 Mannesmann Vdo Ag Entlüftungseinrichtung für einen Kraftstoffbehälter
JP2001332609A (ja) 2000-03-13 2001-11-30 Nikon Corp 基板保持装置及び露光装置
US20020041377A1 (en) 2000-04-25 2002-04-11 Nikon Corporation Aerial image measurement method and unit, optical properties measurement method and unit, adjustment method of projection optical system, exposure method and apparatus, making method of exposure apparatus, and device manufacturing method
JP2002014005A (ja) 2000-04-25 2002-01-18 Nikon Corp 空間像計測方法、結像特性計測方法、空間像計測装置及び露光装置
JP2001319865A (ja) 2000-05-11 2001-11-16 Canon Inc 基板ステージ装置、露光装置および半導体デバイス製造方法
JP2002231622A (ja) 2000-11-29 2002-08-16 Nikon Corp ステージ装置及び露光装置
JP2002200453A (ja) * 2000-12-28 2002-07-16 Matsushita Electric Ind Co Ltd 塗布装置および塗布方法
US6513796B2 (en) * 2001-02-23 2003-02-04 International Business Machines Corporation Wafer chuck having a removable insert
JP3704064B2 (ja) * 2001-07-05 2005-10-05 東京エレクトロン株式会社 液処理装置および液処理方法
TW529172B (en) 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
US6801301B2 (en) * 2001-10-12 2004-10-05 Canon Kabushiki Kaisha Exposure apparatus
WO2003052804A1 (fr) * 2001-12-17 2003-06-26 Nikon Corporation Appareil porte-substrat, appareil d'exposition et procede de production d'un dispositif
JP4288694B2 (ja) 2001-12-20 2009-07-01 株式会社ニコン 基板保持装置、露光装置及びデバイス製造方法
JP3979464B2 (ja) * 2001-12-27 2007-09-19 株式会社荏原製作所 無電解めっき前処理装置及び方法
AU2003235124A1 (en) * 2002-04-24 2003-11-10 Nikon Corporation Exposure system and device manufacturing method
WO2004008499A1 (en) * 2002-07-17 2004-01-22 Matsushita Electric Industrial Co. Ltd. Method and apparatus for picking up semiconductor chip and suction and exfoliation tool up therefor
TWI307526B (en) * 2002-08-06 2009-03-11 Nikon Corp Supporting device and the mamufacturing method thereof, stage device and exposure device
JP2005536775A (ja) 2002-08-23 2005-12-02 株式会社ニコン 投影光学系、フォトリソグラフィ方法および露光装置、並びに露光装置を用いた方法
JP2004119497A (ja) 2002-09-24 2004-04-15 Huabang Electronic Co Ltd 半導体製造設備と方法
JP4020741B2 (ja) * 2002-10-01 2007-12-12 東京エレクトロン株式会社 液処理装置における気液分離回収装置
JP4040423B2 (ja) 2002-10-16 2008-01-30 キヤノン株式会社 基板保持装置
EP1420298B1 (en) 2002-11-12 2013-02-20 ASML Netherlands B.V. Lithographic apparatus
CN101470360B (zh) 2002-11-12 2013-07-24 Asml荷兰有限公司 光刻装置和器件制造方法
CN100568101C (zh) 2002-11-12 2009-12-09 Asml荷兰有限公司 光刻装置和器件制造方法
EP1420299B1 (en) 2002-11-12 2011-01-05 ASML Netherlands B.V. Immersion lithographic apparatus and device manufacturing method
EP1429188B1 (en) * 2002-11-12 2013-06-19 ASML Netherlands B.V. Lithographic projection apparatus
DE60335595D1 (de) 2002-11-12 2011-02-17 Asml Netherlands Bv Lithographischer Apparat mit Immersion und Verfahren zur Herstellung einer Vorrichtung
WO2004053955A1 (ja) 2002-12-10 2004-06-24 Nikon Corporation 露光装置及びデバイス製造方法
CN1723541B (zh) 2002-12-10 2010-06-02 株式会社尼康 曝光装置和器件制造方法
SG10201404132YA (en) 2003-04-11 2014-09-26 Nippon Kogaku Kk Apparatus having an immersion fluid system configured to maintain immersion fluid in a gap adjacent an optical assembly
US7213963B2 (en) 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1486828B1 (en) * 2003-06-09 2013-10-09 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
KR20180112884A (ko) 2003-06-13 2018-10-12 가부시키가이샤 니콘 노광 방법, 기판 스테이지, 노광 장치, 및 디바이스 제조 방법
JP3862678B2 (ja) * 2003-06-27 2006-12-27 キヤノン株式会社 露光装置及びデバイス製造方法
EP2466383B1 (en) 2003-07-08 2014-11-19 Nikon Corporation Wafer table for immersion lithography
KR101419192B1 (ko) * 2003-08-29 2014-07-15 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
JP4378136B2 (ja) * 2003-09-04 2009-12-02 キヤノン株式会社 露光装置及びデバイス製造方法
EP3392713A1 (en) 2003-10-31 2018-10-24 Nikon Corporation Immersion exposure apparatus and method
KR101394764B1 (ko) 2003-12-03 2014-05-27 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법, 그리고 광학 부품
KR101941351B1 (ko) 2003-12-15 2019-01-22 가부시키가이샤 니콘 스테이지 장치, 노광 장치, 및 노광 방법
KR101636632B1 (ko) * 2004-01-05 2016-07-05 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
US7990516B2 (en) * 2004-02-03 2011-08-02 Nikon Corporation Immersion exposure apparatus and device manufacturing method with liquid detection apparatus
JP4548341B2 (ja) * 2004-02-10 2010-09-22 株式会社ニコン 露光装置及びデバイス製造方法、メンテナンス方法及び露光方法
EP3318928A1 (en) * 2004-06-09 2018-05-09 Nikon Corporation Exposure apparatus and method for producing a device
EP1801850B1 (en) * 2004-09-17 2014-11-26 Nikon Corporation Substrate holding apparatus, exposure apparatus and device manufacturing method

Also Published As

Publication number Publication date
SG10201710046XA (en) 2018-01-30
JP6115610B2 (ja) 2017-04-19
HK1164543A1 (zh) 2012-09-21
EP3318928A1 (en) 2018-05-09
JP2016014895A (ja) 2016-01-28
KR20120135439A (ko) 2012-12-13
TW200610029A (en) 2006-03-16
JP5733382B2 (ja) 2015-06-10
WO2005122219A1 (ja) 2005-12-22
JP5170228B2 (ja) 2013-03-27
JP2018018099A (ja) 2018-02-01
EP1788617A4 (en) 2008-10-15
EP2637061B1 (en) 2018-07-18
KR20070020076A (ko) 2007-02-16
IL179937A0 (en) 2007-05-15
JP2014078748A (ja) 2014-05-01
KR20160137690A (ko) 2016-11-30
CN1965389A (zh) 2007-05-16
EP2637061A1 (en) 2013-09-11
KR20130010038A (ko) 2013-01-24
KR101323967B1 (ko) 2013-10-31
HK1164542A1 (zh) 2012-09-21
KR101511876B1 (ko) 2015-04-13
IL179937A (en) 2013-10-31
CN1965389B (zh) 2011-08-10
KR20190006080A (ko) 2019-01-16
JP6319394B2 (ja) 2018-05-09
EP1788617A1 (en) 2007-05-23
TW201344752A (zh) 2013-11-01
CN103558737A (zh) 2014-02-05
JP5920447B2 (ja) 2016-05-18
IL228755A (en) 2016-08-31
CN102290364B (zh) 2016-01-13
SG186621A1 (en) 2013-01-30
JP5565430B2 (ja) 2014-08-06
KR101681101B1 (ko) 2016-11-30
JP2019040214A (ja) 2019-03-14
KR101421870B1 (ko) 2014-07-22
CN102290365A (zh) 2011-12-21
IL228755A0 (en) 2013-12-31
CN102290365B (zh) 2015-01-21
EP1788617B1 (en) 2013-04-10
HK1249935A1 (zh) 2018-11-16
JP2011077544A (ja) 2011-04-14
KR20120068817A (ko) 2012-06-27
TWI574300B (zh) 2017-03-11
JP2015046636A (ja) 2015-03-12
TWI447780B (zh) 2014-08-01
JP2012164995A (ja) 2012-08-30
JP2017016160A (ja) 2017-01-19
HK1103855A1 (en) 2007-12-28
US8705008B2 (en) 2014-04-22
US20140226144A1 (en) 2014-08-14
US20070177125A1 (en) 2007-08-02
KR101227290B1 (ko) 2013-01-29
KR20140140647A (ko) 2014-12-09
CN102290364A (zh) 2011-12-21

Similar Documents

Publication Publication Date Title
SG153813A1 (en) Substrate holding device, exposure apparatus having same, exposure method, method for producing device, and liquid repellent plate
SG155927A1 (en) Substrate holding device, exposure apparatus, and device manufacturing method
EP1710630A3 (en) Lithographic apparatus and device manufacturing method
SG170060A1 (en) Exposure apparatus, exposure method, and device production method
EP2605068A3 (en) Exposure apparatus, exposure method, and method for producing device
TW200604755A (en) Lithographic apparatus and device manufacturing method
EP3139214A3 (en) Exposure apparatus, exposure method, device producing method, and optical component
WO2006108034A3 (en) System and method for automatically populating appointment fields
TW200641161A (en) Method of forming mask and mask
TW200619868A (en) Exposure apparatus and device producing method
TW200942995A (en) Lithographic apparatus and device manufacturing method
TW200622507A (en) Lithographic apparatus and device manufacturing method
EP2019422A3 (en) Apparatus and method for arranging magnetic solder balls
HK1109498A1 (en) Substrate holding device and exposure method
TW200620490A (en) Method of forming a thin film component
TW200707090A (en) Lithographic apparatus and device manufacturing method
MY139622A (en) An apparatus and a method for processing a fluid meniscus
TW200708175A (en) Mask holding structure, film forming method, electro-optic device manufacturing method, and electronic apparatus
MY137975A (en) Proximity meniscus manifold
TW200603264A (en) Mask, method for producing the same, deposition method, electronic device, and electronic apparatus
TW200615135A (en) Carrier film for ceramic green sheet, ceramic green sheet processing method using it and manufacturing method of electronic part
TW200705117A (en) Measuring apparatus, exposure apparatus, and device manufacturing method
TW200625026A (en) Substrate processing method, method of exposure, exposure device and device manufacturing method
TW200644079A (en) Exposure apparatus, exposure method, and device production method
TW200702938A (en) Lithographic apparatus and device manufacturing method