KR20050065340A - 반도체장치 및 그 제조방법 - Google Patents

반도체장치 및 그 제조방법 Download PDF

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Publication number
KR20050065340A
KR20050065340A KR1020040109225A KR20040109225A KR20050065340A KR 20050065340 A KR20050065340 A KR 20050065340A KR 1020040109225 A KR1020040109225 A KR 1020040109225A KR 20040109225 A KR20040109225 A KR 20040109225A KR 20050065340 A KR20050065340 A KR 20050065340A
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South Korea
Prior art keywords
lead
resin encapsulation
semiconductor chip
semiconductor device
exposed
Prior art date
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Application number
KR1020040109225A
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English (en)
Korean (ko)
Inventor
후카야슈다이
신야토시유키
하세베하지메
Original Assignee
가부시끼가이샤 르네사스 테크놀로지
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Publication of KR20050065340A publication Critical patent/KR20050065340A/ko
Withdrawn legal-status Critical Current

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1020040109225A 2003-12-25 2004-12-21 반도체장치 및 그 제조방법 Withdrawn KR20050065340A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003430092A JP2005191240A (ja) 2003-12-25 2003-12-25 半導体装置及びその製造方法
JPJP-P-2003-00430092 2003-12-25

Publications (1)

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KR20050065340A true KR20050065340A (ko) 2005-06-29

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KR1020040109225A Withdrawn KR20050065340A (ko) 2003-12-25 2004-12-21 반도체장치 및 그 제조방법

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Country Link
US (2) US7410834B2 (enExample)
JP (1) JP2005191240A (enExample)
KR (1) KR20050065340A (enExample)
CN (1) CN1638111A (enExample)
TW (1) TW200522328A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
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