JP2005191240A - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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Publication number
JP2005191240A
JP2005191240A JP2003430092A JP2003430092A JP2005191240A JP 2005191240 A JP2005191240 A JP 2005191240A JP 2003430092 A JP2003430092 A JP 2003430092A JP 2003430092 A JP2003430092 A JP 2003430092A JP 2005191240 A JP2005191240 A JP 2005191240A
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Japan
Prior art keywords
lead
semiconductor device
sealing body
resin sealing
recess
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Pending
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JP2003430092A
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English (en)
Japanese (ja)
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JP2005191240A5 (enExample
Inventor
Nagahiro Fukaya
修大 深谷
Toshiyuki Shintani
俊幸 新谷
Hajime Hasebe
一 長谷部
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Renesas Technology Corp
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Renesas Technology Corp
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Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP2003430092A priority Critical patent/JP2005191240A/ja
Priority to TW93135256A priority patent/TW200522328A/zh
Priority to US11/002,804 priority patent/US7410834B2/en
Priority to KR1020040109225A priority patent/KR20050065340A/ko
Priority to CNA2004101048856A priority patent/CN1638111A/zh
Publication of JP2005191240A publication Critical patent/JP2005191240A/ja
Publication of JP2005191240A5 publication Critical patent/JP2005191240A5/ja
Priority to US12/169,921 priority patent/US20080268576A1/en
Pending legal-status Critical Current

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2003430092A 2003-12-25 2003-12-25 半導体装置及びその製造方法 Pending JP2005191240A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2003430092A JP2005191240A (ja) 2003-12-25 2003-12-25 半導体装置及びその製造方法
TW93135256A TW200522328A (en) 2003-12-25 2004-11-17 Semiconductor device and manufacturing method thereof
US11/002,804 US7410834B2 (en) 2003-12-25 2004-12-03 Method of manufacturing a semiconductor device
KR1020040109225A KR20050065340A (ko) 2003-12-25 2004-12-21 반도체장치 및 그 제조방법
CNA2004101048856A CN1638111A (zh) 2003-12-25 2004-12-24 半导体元件的制造方法
US12/169,921 US20080268576A1 (en) 2003-12-25 2008-07-09 Method of manufacturing a semiconductor device

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WO2022209819A1 (ja) * 2021-04-01 2022-10-06 ローム株式会社 半導体装置および半導体装置の製造方法

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