KR102464202B1 - 낮은 직류 저항을 갖는 고전류 코일을 구비한 인덕터 - Google Patents

낮은 직류 저항을 갖는 고전류 코일을 구비한 인덕터 Download PDF

Info

Publication number
KR102464202B1
KR102464202B1 KR1020197009249A KR20197009249A KR102464202B1 KR 102464202 B1 KR102464202 B1 KR 102464202B1 KR 1020197009249 A KR1020197009249 A KR 1020197009249A KR 20197009249 A KR20197009249 A KR 20197009249A KR 102464202 B1 KR102464202 B1 KR 102464202B1
Authority
KR
South Korea
Prior art keywords
coil
inductor
lead
conductor
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020197009249A
Other languages
English (en)
Korean (ko)
Other versions
KR20190040349A (ko
Inventor
벤자민 엠 핸슨
데렉 블로우
크리스 거블스
Original Assignee
비쉐이 데일 일렉트로닉스, 엘엘씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 비쉐이 데일 일렉트로닉스, 엘엘씨 filed Critical 비쉐이 데일 일렉트로닉스, 엘엘씨
Priority to KR1020227038405A priority Critical patent/KR102571361B1/ko
Publication of KR20190040349A publication Critical patent/KR20190040349A/ko
Application granted granted Critical
Publication of KR102464202B1 publication Critical patent/KR102464202B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/04—Fixed inductances of the signal type with magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2823—Wires
    • H01F27/2828—Construction of conductive connections, of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H01F27/255—Magnetic cores made from particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2847—Sheets; Strips
    • H01F27/2852—Construction of conductive connections, of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/30—Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
    • H01F27/306—Fastening or mounting coils or windings on core, casing or other support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/0206—Manufacturing of magnetic cores by mechanical means
    • H01F41/0246—Manufacturing of magnetic circuits by moulding or by pressing powder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/0073—Printed inductances with a special conductive pattern, e.g. flat spiral
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2847—Sheets; Strips
    • H01F2027/2857—Coil formed from wound foil conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Coils Of Transformers For General Uses (AREA)
KR1020197009249A 2016-08-31 2017-08-30 낮은 직류 저항을 갖는 고전류 코일을 구비한 인덕터 Active KR102464202B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020227038405A KR102571361B1 (ko) 2016-08-31 2017-08-30 낮은 직류 저항을 갖는 고전류 코일을 구비한 인덕터

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662382182P 2016-08-31 2016-08-31
US62/382,182 2016-08-31
PCT/US2017/049332 WO2018045007A1 (en) 2016-08-31 2017-08-30 Inductor having high current coil with low direct current resistance

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020227038405A Division KR102571361B1 (ko) 2016-08-31 2017-08-30 낮은 직류 저항을 갖는 고전류 코일을 구비한 인덕터

Publications (2)

Publication Number Publication Date
KR20190040349A KR20190040349A (ko) 2019-04-17
KR102464202B1 true KR102464202B1 (ko) 2022-11-04

Family

ID=61243190

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020227038405A Active KR102571361B1 (ko) 2016-08-31 2017-08-30 낮은 직류 저항을 갖는 고전류 코일을 구비한 인덕터
KR1020197009249A Active KR102464202B1 (ko) 2016-08-31 2017-08-30 낮은 직류 저항을 갖는 고전류 코일을 구비한 인덕터

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020227038405A Active KR102571361B1 (ko) 2016-08-31 2017-08-30 낮은 직류 저항을 갖는 고전류 코일을 구비한 인덕터

Country Status (9)

Country Link
US (4) US10854367B2 (enExample)
EP (1) EP3507816A4 (enExample)
JP (2) JP7160438B2 (enExample)
KR (2) KR102571361B1 (enExample)
CN (2) CN116344173A (enExample)
CA (1) CA3035547A1 (enExample)
MX (1) MX2019002447A (enExample)
TW (2) TWI757330B (enExample)
WO (1) WO2018045007A1 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116344173A (zh) * 2016-08-31 2023-06-27 韦沙戴尔电子有限公司 具有低直流电阻的高电流线圈的电感器
JP6561953B2 (ja) * 2016-09-21 2019-08-21 株式会社オートネットワーク技術研究所 磁性コア、及びリアクトル
JP7471770B2 (ja) * 2017-12-28 2024-04-22 新光電気工業株式会社 インダクタ、及びインダクタの製造方法
JP7229706B2 (ja) * 2018-09-05 2023-02-28 新光電気工業株式会社 インダクタ及びその製造方法
JP7628390B2 (ja) * 2019-07-18 2025-02-10 株式会社トーキン インダクタ
US20210035730A1 (en) * 2019-07-31 2021-02-04 Murata Manufacturing Co., Ltd. Inductor
JP2021027203A (ja) * 2019-08-06 2021-02-22 株式会社村田製作所 インダクタ
JP7354715B2 (ja) * 2019-09-19 2023-10-03 Tdk株式会社 インダクタ素子
JP7287216B2 (ja) * 2019-09-24 2023-06-06 Tdk株式会社 コイル構造体
JP7111086B2 (ja) 2019-11-01 2022-08-02 株式会社村田製作所 インダクタ
CN110911145A (zh) * 2019-12-02 2020-03-24 旺诠科技(昆山)有限公司 一种批量制作电感元件的方法
JP7472490B2 (ja) * 2019-12-24 2024-04-23 Tdk株式会社 コイル装置
US20210280361A1 (en) * 2020-03-03 2021-09-09 Vishay Dale Electronics, Llc Inductor with preformed termination and method and assembly for making the same
WO2021205817A1 (ja) * 2020-04-07 2021-10-14 株式会社村田製作所 コイル構造およびインダクタ素子
CN112509783B (zh) * 2020-08-09 2022-04-12 华为数字能源技术有限公司 一种功率电感及其制备方法、系统级封装模组
KR102871143B1 (ko) * 2020-11-20 2025-10-16 현대모비스 주식회사 컨버터의 전자파 규제를 위한 emc 필터 및 이의 제조 방법
WO2022116686A1 (zh) * 2020-12-04 2022-06-09 横店集团东磁股份有限公司 一种一体共烧电感及其制备方法
JP2022104713A (ja) * 2020-12-29 2022-07-11 セイコーエプソン株式会社 液体吐出装置
JP7585785B2 (ja) * 2020-12-29 2024-11-19 セイコーエプソン株式会社 液体吐出装置
USD1034462S1 (en) 2021-03-01 2024-07-09 Vishay Dale Electronics, Llc Inductor package
US11948724B2 (en) 2021-06-18 2024-04-02 Vishay Dale Electronics, Llc Method for making a multi-thickness electro-magnetic device
FR3130082A1 (fr) * 2021-12-07 2023-06-09 Valeo Systemes De Controle Moteur Composant électrique pour machine électrique
US11744021B2 (en) 2022-01-21 2023-08-29 Analog Devices, Inc. Electronic assembly
US20230307836A1 (en) * 2022-03-25 2023-09-28 Intel Corporation Low radiation high symmetry inductor
TWI832230B (zh) * 2022-05-05 2024-02-11 聯寶電子股份有限公司 跨電感電壓調節變壓器
WO2025182251A1 (ja) * 2024-02-29 2025-09-04 株式会社村田製作所 コイル部品および金属板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000323336A (ja) 1999-03-11 2000-11-24 Taiyo Yuden Co Ltd インダクタ及びその製造方法
JP2004087607A (ja) 2002-08-23 2004-03-18 Alps Electric Co Ltd 磁気素子
JP2005310865A (ja) 2004-04-19 2005-11-04 Matsushita Electric Ind Co Ltd コイル部品
JP2012195399A (ja) 2011-03-16 2012-10-11 Panasonic Corp コイル部品およびその製造方法

Family Cites Families (247)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1085437A (en) 1912-02-06 1914-01-27 Friedrich August Volkmar Klopfer Manufacture of milled soap.
US2497516A (en) 1944-04-22 1950-02-14 Metropolitan Eng Co Electrical winding
US2889525A (en) 1954-12-13 1959-06-02 Central Transformer Corp Three-phase core for transformers
US3169234A (en) 1959-08-17 1965-02-09 Coileraft Inc Coil form, and coils and transformers mounted thereto
FR1392548A (fr) 1964-01-10 1965-03-19 Comp Generale Electricite Enroulement à haute tension d'appareil électrique statique
GB1440343A (en) 1973-04-13 1976-06-23 Data Recording Instr Co Magnetic core and coil assemblies
US3958328A (en) 1975-06-02 1976-05-25 Essex International, Inc. Method of making a transformer coil assembly
US4180450A (en) 1978-08-21 1979-12-25 Vac-Tec Systems, Inc. Planar magnetron sputtering device
US4413161A (en) 1980-02-09 1983-11-01 Nippon Gakki Seizo Kabushiki Kaisha Electro-acoustic transducer
US4901048A (en) 1985-06-10 1990-02-13 Williamson Windings Inc. Magnetic core multiple tap or windings devices
JPH0236013U (enExample) * 1988-09-02 1990-03-08
US6026311A (en) 1993-05-28 2000-02-15 Superconductor Technologies, Inc. High temperature superconducting structures and methods for high Q, reduced intermodulation resonators and filters
DE3912840A1 (de) * 1989-04-19 1990-10-25 Foerster Inst Dr Friedrich Suchspulenanordnung fuer ein induktives suchgeraet
US5468681A (en) 1989-08-28 1995-11-21 Lsi Logic Corporation Process for interconnecting conductive substrates using an interposer having conductive plastic filled vias
JPH03171793A (ja) 1989-11-30 1991-07-25 Yokogawa Electric Corp 面実装部品の半田付け方法
JPH03171703A (ja) 1989-11-30 1991-07-25 Tokin Corp トランスフォーマー
US5010314A (en) 1990-03-30 1991-04-23 Multisource Technology Corp. Low-profile planar transformer for use in off-line switching power supplies
JPH0459396A (ja) 1990-06-29 1992-02-26 Yoshikazu Kimura 情報通信体の製法とその素材
US5126715A (en) 1990-07-02 1992-06-30 General Electric Company Low-profile multi-pole conductive film transformer
JPH04129206A (ja) 1990-09-19 1992-04-30 Toshiba Corp 薄形変圧器
US5530308A (en) 1992-02-18 1996-06-25 General Electric Company Electromagnetic pump stator coil
JPH05258959A (ja) * 1992-03-10 1993-10-08 Mitsubishi Electric Corp 信号弁別器
US5801432A (en) 1992-06-04 1998-09-01 Lsi Logic Corporation Electronic system using multi-layer tab tape semiconductor device having distinct signal, power and ground planes
CN1053760C (zh) * 1992-10-12 2000-06-21 松下电器产业株式会社 电子元件及其制造方法
JP2697548B2 (ja) * 1993-03-26 1998-01-14 松下電器産業株式会社 インダクタンス部品の製造方法
JPH0655211U (ja) * 1993-01-09 1994-07-26 東光株式会社 ノイズフィルタ
JPH0655215U (ja) * 1993-01-11 1994-07-26 株式会社トーキン インダクタ
US5773886A (en) 1993-07-15 1998-06-30 Lsi Logic Corporation System having stackable heat sink structures
NO950083L (no) 1994-01-10 1995-07-11 Hughes Aircraft Co Helisk induksjonsspole samt fremgangsmåte for dens fremstilling
US5844451A (en) * 1994-02-25 1998-12-01 Murphy; Michael T. Circuit element having at least two physically separated coil-layers
JPH07245217A (ja) 1994-03-03 1995-09-19 Tdk Corp インダクタンス素子及び該素子用コイル
JPH07273292A (ja) * 1994-03-31 1995-10-20 Matsushita Electron Corp 半導体集積回路
US5481238A (en) 1994-04-19 1996-01-02 Argus Technologies Ltd. Compound inductors for use in switching regulators
US5451914A (en) * 1994-07-05 1995-09-19 Motorola, Inc. Multi-layer radio frequency transformer
JP3497276B2 (ja) 1994-07-20 2004-02-16 松下電器産業株式会社 インダクタンス素子とその製造方法
FR2733630B1 (fr) 1995-04-27 1997-05-30 Imphy Sa Pattes de connexion pour composant electronique
US7034645B2 (en) 1999-03-16 2006-04-25 Vishay Dale Electronics, Inc. Inductor coil and method for making same
US7263761B1 (en) 1995-07-18 2007-09-04 Vishay Dale Electronics, Inc. Method for making a high current low profile inductor
CA2180992C (en) 1995-07-18 1999-05-18 Timothy M. Shafer High current, low profile inductor and method for making same
US7921546B2 (en) * 1995-07-18 2011-04-12 Vishay Dale Electronics, Inc. Method for making a high current low profile inductor
JPH09213530A (ja) 1996-01-30 1997-08-15 Alps Electric Co Ltd 平面トランス
US6078502A (en) 1996-04-01 2000-06-20 Lsi Logic Corporation System having heat dissipating leadframes
JPH09306757A (ja) 1996-05-14 1997-11-28 Sumitomo Special Metals Co Ltd 低背型コイル及び磁性製品
JP2978117B2 (ja) 1996-07-01 1999-11-15 ティーディーケイ株式会社 つぼ型コアを用いた面実装部品
US7362015B2 (en) 1996-07-29 2008-04-22 Iap Research, Inc. Apparatus and method for making an electrical component
US5781093A (en) 1996-08-05 1998-07-14 International Power Devices, Inc. Planar transformer
SE9704413D0 (sv) 1997-02-03 1997-11-28 Asea Brown Boveri Krafttransformator/reaktor
US6144269A (en) 1997-06-10 2000-11-07 Fuji Electric Co., Ltd. Noise-cut LC filter for power converter with overlapping aligned coil patterns
US5917396A (en) 1997-08-04 1999-06-29 Halser, Iii; Joseph G. Wideband audio output transformer with high frequency balanced winding
US6546184B2 (en) 1997-08-29 2003-04-08 Matsushita Electric Industrial Co., Ltd Still picture player
US6137237A (en) 1998-01-13 2000-10-24 Fusion Lighting, Inc. High frequency inductive lamp and power oscillator
TW416067B (en) 1998-02-27 2000-12-21 Tdk Corp Pot-core components for planar mounting
US6087922A (en) 1998-03-04 2000-07-11 Astec International Limited Folded foil transformer construction
US6222437B1 (en) 1998-05-11 2001-04-24 Nidec America Corporation Surface mounted magnetic components having sheet material windings and a power supply including such components
JP3469464B2 (ja) 1998-05-22 2003-11-25 東光株式会社 インバータトランス
US6255725B1 (en) 1998-05-28 2001-07-03 Shinko Electric Industries Co., Ltd. IC card and plane coil for IC card
US6081416A (en) 1998-05-28 2000-06-27 Trinh; Hung Lead frames for mounting ceramic electronic parts, particularly ceramic capacitors, where the coefficient of thermal expansion of the lead frame is less than that of the ceramic
JP3306377B2 (ja) 1998-06-26 2002-07-24 東光株式会社 インバータトランス
US6409859B1 (en) 1998-06-30 2002-06-25 Amerasia International Technology, Inc. Method of making a laminated adhesive lid, as for an Electronic device
TW462131B (en) * 1998-07-08 2001-11-01 Winbond Electronics Corp Assembling type inductive devices
JP2000091133A (ja) 1998-09-10 2000-03-31 Oki Electric Ind Co Ltd トランスの端子構造及びその端子の形成方法
US6372348B1 (en) 1998-11-23 2002-04-16 Hoeganaes Corporation Annealable insulated metal-based powder particles
US6392525B1 (en) 1998-12-28 2002-05-21 Matsushita Electric Industrial Co., Ltd. Magnetic element and method of manufacturing the same
JP3680627B2 (ja) 1999-04-27 2005-08-10 富士電機機器制御株式会社 ノイズフィルタ
CN1161880C (zh) * 1999-09-21 2004-08-11 株式会社村田制作所 电感电容滤波器
US6351033B1 (en) 1999-10-06 2002-02-26 Agere Systems Guardian Corp. Multifunction lead frame and integrated circuit package incorporating the same
EP1091369A3 (en) 1999-10-07 2002-04-17 Lucent Technologies Inc. Low profile transformer and method for making a low profile transformer
US6204745B1 (en) * 1999-11-15 2001-03-20 International Power Devices, Inc. Continuous multi-turn coils
AUPQ637600A0 (en) 2000-03-21 2000-04-15 Metal Manufactures Limited A superconducting transformer
JP4684461B2 (ja) 2000-04-28 2011-05-18 パナソニック株式会社 磁性素子の製造方法
JP2001332430A (ja) 2000-05-22 2001-11-30 Murata Mfg Co Ltd トランス
JP2001345212A (ja) 2000-05-31 2001-12-14 Tdk Corp 積層電子部品
FR2812755B1 (fr) 2000-08-04 2002-10-31 St Microelectronics Sa Inductance integree
KR100824234B1 (ko) 2000-09-14 2008-04-24 롬 앤드 하스 캄파니 그라프트 공중합체 제조방법 및 이로부터 제조된 조성물
US6456184B1 (en) 2000-12-29 2002-09-24 Abb Inc. Reduced-cost core for an electrical-power transformer
JP2002324714A (ja) 2001-02-21 2002-11-08 Tdk Corp コイル封入圧粉磁芯およびその製造方法
ATE255271T1 (de) 2001-06-21 2003-12-15 Magnetek Spa Kreisförmige flachspulen sowie induktives bauelement, welches mit einer oder mehreren dieser spulen hergestellt wird
US6856007B2 (en) * 2001-08-28 2005-02-15 Tessera, Inc. High-frequency chip packages
US7176506B2 (en) 2001-08-28 2007-02-13 Tessera, Inc. High frequency chip packages with connecting elements
TW550997B (en) 2001-10-18 2003-09-01 Matsushita Electric Industrial Co Ltd Module with built-in components and the manufacturing method thereof
US6734074B2 (en) 2002-01-24 2004-05-11 Industrial Technology Research Institute Micro fabrication with vortex shaped spirally topographically tapered spirally patterned conductor layer and method for fabrication thereof
JP2003229311A (ja) * 2002-01-31 2003-08-15 Tdk Corp コイル封入圧粉磁芯およびその製造方法、コイルおよびその製造方法
US6621140B1 (en) 2002-02-25 2003-09-16 Rf Micro Devices, Inc. Leadframe inductors
JP4049246B2 (ja) 2002-04-16 2008-02-20 Ｔｄｋ株式会社 コイル封入型磁性部品及びその製造方法
JP2003324017A (ja) 2002-04-30 2003-11-14 Koito Mfg Co Ltd トランス
JP2003347125A (ja) 2002-05-27 2003-12-05 Sansha Electric Mfg Co Ltd コイル
JP4178004B2 (ja) 2002-06-17 2008-11-12 アルプス電気株式会社 磁気素子及びインダクタ及びトランス
US6940154B2 (en) 2002-06-24 2005-09-06 Asat Limited Integrated circuit package and method of manufacturing the integrated circuit package
US20040232982A1 (en) 2002-07-19 2004-11-25 Ikuroh Ichitsubo RF front-end module for wireless communication devices
CA2394403C (en) 2002-07-22 2012-01-10 Celestica International Inc. Component substrate for a printed circuit board and method of assemblying the substrate and the circuit board
TW553465U (en) 2002-07-25 2003-09-11 Micro Star Int Co Ltd Integrated inductor
US6985062B2 (en) 2002-09-13 2006-01-10 Matsushita Electric Industrial Co., Ltd. Coil component and method of producing the same
JP2004140006A (ja) 2002-10-15 2004-05-13 Minebea Co Ltd コモンモードチョークコイル及びラインフィルタ
US6873239B2 (en) 2002-11-01 2005-03-29 Metglas Inc. Bulk laminated amorphous metal inductive device
JP2004174797A (ja) 2002-11-26 2004-06-24 Fuji Xerox Co Ltd 印刷制御プログラム、印刷制御システム及び印刷制御方法
US7292128B2 (en) 2002-12-19 2007-11-06 Cooper Technologies Company Gapped core structure for magnetic components
US6933895B2 (en) 2003-02-14 2005-08-23 E-Tenna Corporation Narrow reactive edge treatments and method for fabrication
JP2004266120A (ja) 2003-03-03 2004-09-24 Matsushita Electric Ind Co Ltd チョークコイルおよびそれを用いた電子機器
TW200419603A (en) 2003-03-25 2004-10-01 Cyntec Co Ltd Choke and manufacturing method thereof
US7126443B2 (en) 2003-03-28 2006-10-24 M/A-Com, Eurotec, B.V. Increasing performance of planar inductors used in broadband applications
US6879238B2 (en) 2003-05-28 2005-04-12 Cyntec Company Configuration and method for manufacturing compact high current inductor coil
US7041937B2 (en) 2003-06-04 2006-05-09 Illinois Tool Works Inc. Wire feeder operable with lower minimum input voltage requirement
US7427909B2 (en) 2003-06-12 2008-09-23 Nec Tokin Corporation Coil component and fabrication method of the same
US7307502B2 (en) 2003-07-16 2007-12-11 Marvell World Trade Ltd. Power inductor with reduced DC current saturation
US7023313B2 (en) 2003-07-16 2006-04-04 Marvell World Trade Ltd. Power inductor with reduced DC current saturation
US7489219B2 (en) 2003-07-16 2009-02-10 Marvell World Trade Ltd. Power inductor with reduced DC current saturation
JP2005109290A (ja) * 2003-10-01 2005-04-21 Hitachi Ferrite Electronics Ltd 低背型インダクタ
US7557433B2 (en) 2004-10-25 2009-07-07 Mccain Joseph H Microelectronic device with integrated energy source
US6998952B2 (en) 2003-12-05 2006-02-14 Freescale Semiconductor, Inc. Inductive device including bond wires
CN1677581A (zh) 2004-04-01 2005-10-05 乾坤科技股份有限公司 新颖线圈及其制造方法
US7295448B2 (en) 2004-06-04 2007-11-13 Siemens Vdo Automotive Corporation Interleaved power converter
US7289329B2 (en) 2004-06-04 2007-10-30 Siemens Vdo Automotive Corporation Integration of planar transformer and/or planar inductor with power switches in power converter
US20050273938A1 (en) 2004-06-09 2005-12-15 The Coleman Company, Inc. Airbed utilizing extruded coils
CN2726077Y (zh) 2004-07-02 2005-09-14 郑长茂 电感器
ATE445232T1 (de) 2004-07-13 2009-10-15 Nxp Bv Elektronische vorrichtung mit integrierter schaltung
US7567163B2 (en) 2004-08-31 2009-07-28 Pulse Engineering, Inc. Precision inductive devices and methods
US7667565B2 (en) 2004-09-08 2010-02-23 Cyntec Co., Ltd. Current measurement using inductor coil with compact configuration and low TCR alloys
US7915993B2 (en) 2004-09-08 2011-03-29 Cyntec Co., Ltd. Inductor
US7339451B2 (en) * 2004-09-08 2008-03-04 Cyntec Co., Ltd. Inductor
KR100684715B1 (ko) * 2004-10-19 2007-02-20 삼성에스디아이 주식회사 입체 영상 표시 장치 및 이를 갖는 전자 기기
JP4436794B2 (ja) 2004-11-16 2010-03-24 スミダコーポレーション株式会社 プレート部材、このプレート部材を用いた磁性素子および磁性素子の製造方法
JP4321818B2 (ja) 2004-11-30 2009-08-26 Ｔｄｋ株式会社 トランス
KR100688858B1 (ko) * 2004-12-30 2007-03-02 삼성전기주식회사 스파이럴 3차원 인덕터를 내장한 인쇄회로기판 및 그 제조방법
US7192809B2 (en) 2005-02-18 2007-03-20 Texas Instruments Incorporated Low cost method to produce high volume lead frames
US7221251B2 (en) * 2005-03-22 2007-05-22 Acutechnology Semiconductor Air core inductive element on printed circuit board for use in switching power conversion circuitries
US8183504B2 (en) 2005-03-28 2012-05-22 Tyco Electronics Corporation Surface mount multi-layer electrical circuit protection device with active element between PPTC layers
AU2006242334B2 (en) 2005-04-29 2009-11-12 Finisar Corporation Molded lead frame connector with one or more passive components
US7460002B2 (en) 2005-06-09 2008-12-02 Alexander Estrov Terminal system for planar magnetics assembly
JP4699102B2 (ja) * 2005-06-22 2011-06-08 ルネサスエレクトロニクス株式会社 半導体装置
US7317373B2 (en) 2005-08-18 2008-01-08 Delta Electronics, Inc. Inductor
US7362201B2 (en) 2005-09-07 2008-04-22 Yonezawa Electric Wire Co., Ltd. Inductance device and manufacturing method thereof
KR101044373B1 (ko) 2005-09-08 2011-06-29 스미다 코포레이션 가부시키가이샤 코일장치, 복합 코일장치 및 트랜스 장치
KR100998814B1 (ko) 2005-10-27 2010-12-06 도시바 마테리알 가부시키가이샤 평면 자기 소자 및 그것을 이용한 전원 ｉｃ 패키지
US20070257759A1 (en) 2005-11-04 2007-11-08 Delta Electronics, Inc. Noise filter and manufacturing method thereof
WO2007063884A1 (ja) * 2005-11-30 2007-06-07 Holy Loyalty International Co., Ltd. 面状インダクタ装置
US20070166554A1 (en) 2006-01-18 2007-07-19 Ruchert Brian D Thermal interconnect and interface systems, methods of production and uses thereof
US20080002460A1 (en) 2006-03-01 2008-01-03 Tessera, Inc. Structure and method of making lidded chips
JP2007250924A (ja) 2006-03-17 2007-09-27 Sony Corp インダクタ素子とその製造方法、並びにインダクタ素子を用いた半導体モジュール
US7864015B2 (en) 2006-04-26 2011-01-04 Vishay Dale Electronics, Inc. Flux channeled, high current inductor
US7705508B2 (en) 2006-05-10 2010-04-27 Pratt & Whitney Canada Crop. Cooled conductor coil for an electric machine and method
US20080036566A1 (en) 2006-08-09 2008-02-14 Andrzej Klesyk Electronic Component And Methods Relating To Same
CN101136281B (zh) 2006-08-28 2011-10-26 Abb技术有限公司 具有屏蔽环的高压变压器、屏蔽环及屏蔽环的制造方法
US8466764B2 (en) 2006-09-12 2013-06-18 Cooper Technologies Company Low profile layered coil and cores for magnetic components
US8941457B2 (en) 2006-09-12 2015-01-27 Cooper Technologies Company Miniature power inductor and methods of manufacture
US8378777B2 (en) 2008-07-29 2013-02-19 Cooper Technologies Company Magnetic electrical device
US9589716B2 (en) 2006-09-12 2017-03-07 Cooper Technologies Company Laminated magnetic component and manufacture with soft magnetic powder polymer composite sheets
US7791445B2 (en) 2006-09-12 2010-09-07 Cooper Technologies Company Low profile layered coil and cores for magnetic components
US8310332B2 (en) 2008-10-08 2012-11-13 Cooper Technologies Company High current amorphous powder core inductor
US7298238B1 (en) 2006-12-15 2007-11-20 The United States Of America As Represented By The Secretary Of The Navy Programmable microtransformer
KR100834744B1 (ko) 2006-12-20 2008-06-05 삼성전자주식회사 다층의 대칭형 헬리컬 인덕터
MY145348A (en) 2007-03-15 2012-01-31 Semiconductor Components Ind Circuit component and method of manufacture
CN101636515B (zh) * 2007-03-20 2014-09-24 Nec东金株式会社 软磁性合金及使用该软磁性合金的磁气部件以及它们的制造方法
US7872350B2 (en) 2007-04-10 2011-01-18 Qimonda Ag Multi-chip module
US7468547B2 (en) 2007-05-11 2008-12-23 Intersil Americas Inc. RF-coupled digital isolator
US7629860B2 (en) 2007-06-08 2009-12-08 Stats Chippac, Ltd. Miniaturized wide-band baluns for RF applications
US20090057822A1 (en) 2007-09-05 2009-03-05 Yenting Wen Semiconductor component and method of manufacture
US8097934B1 (en) 2007-09-27 2012-01-17 National Semiconductor Corporation Delamination resistant device package having low moisture sensitivity
TWI362047B (en) 2007-09-28 2012-04-11 Cyntec Co Ltd Inductor and manufacture method thereof
TWI397930B (zh) 2007-11-06 2013-06-01 威盛電子股份有限公司 螺旋電感元件
JP5084459B2 (ja) 2007-11-15 2012-11-28 太陽誘電株式会社 インダクタ及びその製造方法
US8049588B2 (en) 2007-11-21 2011-11-01 Panasonic Corporation Coil device
US7825502B2 (en) 2008-01-09 2010-11-02 Fairchild Semiconductor Corporation Semiconductor die packages having overlapping dice, system using the same, and methods of making the same
US8183967B2 (en) * 2008-07-11 2012-05-22 Cooper Technologies Company Surface mount magnetic components and methods of manufacturing the same
US8659379B2 (en) 2008-07-11 2014-02-25 Cooper Technologies Company Magnetic components and methods of manufacturing the same
US9859043B2 (en) * 2008-07-11 2018-01-02 Cooper Technologies Company Magnetic components and methods of manufacturing the same
US9558881B2 (en) 2008-07-11 2017-01-31 Cooper Technologies Company High current power inductor
US8279037B2 (en) 2008-07-11 2012-10-02 Cooper Technologies Company Magnetic components and methods of manufacturing the same
JP4650536B2 (ja) * 2008-07-28 2011-03-16 ソニー株式会社 電界結合器、通信装置、通信システム及び電界結合器の製造方法。
CN101673609A (zh) 2008-09-09 2010-03-17 鸿富锦精密工业（深圳）有限公司 电感器及其上的电感线圈
DE102008051491A1 (de) 2008-10-13 2010-04-29 Tyco Electronics Amp Gmbh Leadframe für elektronische Bauelemente
JP2010118574A (ja) 2008-11-14 2010-05-27 Denso Corp リアクトル、及びその製造方法
US8486762B2 (en) 2009-03-06 2013-07-16 Utac Hong Kong Limited Leadless array plastic package with various IC packaging configurations
JP4714779B2 (ja) 2009-04-10 2011-06-29 東光株式会社 表面実装インダクタの製造方法とその表面実装インダクタ
US20100277267A1 (en) 2009-05-04 2010-11-04 Robert James Bogert Magnetic components and methods of manufacturing the same
US9276339B2 (en) 2009-06-02 2016-03-01 Hsio Technologies, Llc Electrical interconnect IC device socket
US20100314728A1 (en) 2009-06-16 2010-12-16 Tung Lok Li Ic package having an inductor etched into a leadframe thereof
JP5650928B2 (ja) 2009-06-30 2015-01-07 住友電気工業株式会社 軟磁性材料、成形体、圧粉磁心、電磁部品、軟磁性材料の製造方法および圧粉磁心の製造方法
JP2009224815A (ja) 2009-07-07 2009-10-01 Sumida Corporation 防磁型薄型トランス
KR101089976B1 (ko) 2009-09-02 2011-12-05 삼성전기주식회사 평면형 트랜스포머
JP2011054811A (ja) 2009-09-03 2011-03-17 Panasonic Corp コイル部品およびその製造方法
US8350659B2 (en) 2009-10-16 2013-01-08 Crane Electronics, Inc. Transformer with concentric windings and method of manufacture of same
CN102044327A (zh) 2009-10-19 2011-05-04 富士电子工业株式会社 高频感应加热用薄型变压器
US20110123783A1 (en) 2009-11-23 2011-05-26 David Sherrer Multilayer build processses and devices thereof
WO2011077694A1 (ja) 2009-12-25 2011-06-30 株式会社タムラ製作所 リアクトル及びその製造方法
US8530981B2 (en) 2009-12-31 2013-09-10 Texas Instruments Incorporated Leadframe-based premolded package having acoustic air channel for micro-electro-mechanical system
JP4920089B2 (ja) 2010-01-14 2012-04-18 Ｔｄｋラムダ株式会社 エッジワイズコイル及びインダクタ
KR101493481B1 (ko) 2010-03-26 2015-02-13 히다치 훈마츠 야킨 가부시키가이샤 압분자심 및 그 제조방법
US20110287663A1 (en) 2010-05-21 2011-11-24 Gailus Mark W Electrical connector incorporating circuit elements
US8698587B2 (en) 2010-07-02 2014-04-15 Samsung Electro-Mechanics Co., Ltd. Transformer
US20120049334A1 (en) 2010-08-27 2012-03-01 Stats Chippac, Ltd. Semiconductor Device and Method of Forming Leadframe as Vertical Interconnect Structure Between Stacked Semiconductor Die
JP2012104724A (ja) 2010-11-12 2012-05-31 Panasonic Corp インダクタ部品
US20120176214A1 (en) 2011-01-07 2012-07-12 Wurth Electronics Midcom Inc. Flatwire planar transformer
US8943675B2 (en) 2011-02-26 2015-02-03 Superworld Electronics Co., Ltd. Method for making a shielded inductor involving an injection-molding technique
US10685780B2 (en) 2011-03-29 2020-06-16 Sony Corporation Electric power feed apparatus, electric power feed system, and electronic apparatus
CN102231320B (zh) 2011-04-15 2013-07-17 安徽千恩智能科技股份有限公司 电子式圆形电能表用大电流互感器及其生产方法
CN102171825B (zh) 2011-04-29 2013-02-27 华为技术有限公司 电源模块及其封装集成方法
US8288209B1 (en) 2011-06-03 2012-10-16 Stats Chippac, Ltd. Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die
US9001524B1 (en) 2011-08-01 2015-04-07 Maxim Integrated Products, Inc. Switch-mode power conversion IC package with wrap-around magnetic structure
US8916421B2 (en) 2011-08-31 2014-12-23 Freescale Semiconductor, Inc. Semiconductor device packaging having pre-encapsulation through via formation using lead frames with attached signal conduits
US8760872B2 (en) 2011-09-28 2014-06-24 Texas Instruments Incorporated DC-DC converter vertically integrated with load inductor structured as heat sink
US9141157B2 (en) 2011-10-13 2015-09-22 Texas Instruments Incorporated Molded power supply system having a thermally insulated component
TWI481071B (zh) 2012-01-12 2015-04-11 Light-emitting device LED 3D surface lead frame
US9627738B2 (en) * 2012-01-16 2017-04-18 Telefonaktiebolaget Lm Ericsson (Publ) Wideband multilayer transmission line transformer
US9494660B2 (en) 2012-03-20 2016-11-15 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US8946880B2 (en) 2012-03-23 2015-02-03 Texas Instruments Incorporated Packaged semiconductor device having multilevel leadframes configured as modules
DE102012007232B4 (de) 2012-04-07 2014-03-13 Susanne Weller Verfahren zur Herstellung von rotierenden elektrischen Maschinen
KR101941447B1 (ko) 2012-04-18 2019-01-23 엘지디스플레이 주식회사 평판 표시 장치
US20130307117A1 (en) 2012-05-18 2013-11-21 Texas Instruments Incorporated Structure and Method for Inductors Integrated into Semiconductor Device Packages
US8707547B2 (en) 2012-07-12 2014-04-29 Inpaq Technology Co., Ltd. Method for fabricating a lead-frameless power inductor
JP5724984B2 (ja) 2012-10-19 2015-05-27 トヨタ自動車株式会社 回転電機の固定子
TWI475579B (zh) 2012-12-14 2015-03-01 Ghing Hsin Dien 線圈
JP5782017B2 (ja) 2012-12-21 2015-09-24 トヨタ自動車株式会社 リアクトル及びその製造方法
US10840005B2 (en) 2013-01-25 2020-11-17 Vishay Dale Electronics, Llc Low profile high current composite transformer
US20140210062A1 (en) 2013-01-28 2014-07-31 Texas Instruments Incorporated Leadframe-Based Semiconductor Package Having Terminals on Top and Bottom Surfaces
US8998454B2 (en) 2013-03-15 2015-04-07 Sumitomo Electric Printed Circuits, Inc. Flexible electronic assembly and method of manufacturing the same
US20140340186A1 (en) 2013-04-10 2014-11-20 Pulse Electronics, Inc. Interleaved planar inductive device and methods of manufacture and use
US9411025B2 (en) 2013-04-26 2016-08-09 Allegro Microsystems, Llc Integrated circuit package having a split lead frame and a magnet
US9368423B2 (en) 2013-06-28 2016-06-14 STATS ChipPAC Pte. Ltd. Semiconductor device and method of using substrate with conductive posts and protective layers to form embedded sensor die package
US9190389B2 (en) 2013-07-26 2015-11-17 Infineon Technologies Ag Chip package with passives
CN103400819B (zh) 2013-08-14 2017-07-07 矽力杰半导体技术(杭州)有限公司 一种引线框架及其制备方法和应用其的封装结构
CN104795218B (zh) 2014-01-17 2017-03-01 台达电子工业股份有限公司 导电折片组、盖体及其所组合的导电组件以及磁性元件
US10515928B2 (en) 2014-01-29 2019-12-24 Texas Instruments Incorporated Stacked semiconductor system having interposer of half-etched and molded sheet metal
KR102004791B1 (ko) 2014-05-21 2019-07-29 삼성전기주식회사 칩 전자부품 및 그 실장기판
JP6606669B2 (ja) 2014-07-07 2019-11-20 パナソニックＩｐマネジメント株式会社 コイル部品およびその製造方法
CN105390246B (zh) 2014-08-21 2019-03-12 乾坤科技股份有限公司 电感及制造电感的方法
CN104300767A (zh) 2014-09-05 2015-01-21 胜美达电机（香港）有限公司 电源模块及其制造方法
US9852928B2 (en) 2014-10-06 2017-12-26 Infineon Technologies Ag Semiconductor packages and modules with integrated ferrite material
US20160181001A1 (en) 2014-10-10 2016-06-23 Cooper Technologies Company Optimized electromagnetic inductor component design and methods including improved conductivity composite conductor material
TWI573149B (zh) 2014-10-27 2017-03-01 吳李文相 平面線圈及其製法，以及使用該平面線圈之平面變壓器
US9704639B2 (en) 2014-11-07 2017-07-11 Solantro Semiconductor Corp. Non-planar inductive electrical elements in semiconductor package lead frame
KR101792317B1 (ko) 2014-12-12 2017-11-01 삼성전기주식회사 칩 전자부품 및 그 제조방법
US9960671B2 (en) 2014-12-31 2018-05-01 Avago Technologies General Ip (Singapore) Pte. Ltd. Isolator with reduced susceptibility to parasitic coupling
KR102107036B1 (ko) * 2015-01-27 2020-05-07 삼성전기주식회사 권선형 인덕터 및 그 제조 방법
US10446309B2 (en) 2016-04-20 2019-10-15 Vishay Dale Electronics, Llc Shielded inductor and method of manufacturing
JP2017220573A (ja) 2016-06-08 2017-12-14 Tdk株式会社 コイル部およびコイル装置
JP6681544B2 (ja) 2016-08-04 2020-04-15 パナソニックＩｐマネジメント株式会社 電子部品およびそれを用いた電子機器
CN116344173A (zh) 2016-08-31 2023-06-27 韦沙戴尔电子有限公司 具有低直流电阻的高电流线圈的电感器
TWI624845B (zh) 2016-11-08 2018-05-21 Alps Electric Co Ltd 電感元件及其製造方法
JP6520896B2 (ja) * 2016-11-16 2019-05-29 Tdk株式会社 磁気センサ用インダクタンス素子及びこれを備える磁気センサ
JP2018098312A (ja) 2016-12-12 2018-06-21 パナソニックＩｐマネジメント株式会社 インダクター
KR20180071644A (ko) 2016-12-20 2018-06-28 삼성전기주식회사 인덕터
CN207558566U (zh) 2017-09-15 2018-06-29 珠海群创新材料技术有限公司 一种热压一体成型电感器
KR102052819B1 (ko) 2018-04-10 2019-12-09 삼성전기주식회사 코일 부품의 제조방법
CN208596597U (zh) 2018-07-18 2019-03-12 周希骏 一种电感器的铜片绕组及电感器
CN208706396U (zh) 2018-07-18 2019-04-05 遂宁普思电子有限公司 低直流电阻、高饱和电流的电感器
CN209388809U (zh) 2019-01-28 2019-09-13 深圳顺络电子股份有限公司 一种射出成型电感
CN109754986B (zh) 2019-01-28 2024-01-05 东莞顺络电子有限公司 一种射出成型电感及其制造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000323336A (ja) 1999-03-11 2000-11-24 Taiyo Yuden Co Ltd インダクタ及びその製造方法
JP2004087607A (ja) 2002-08-23 2004-03-18 Alps Electric Co Ltd 磁気素子
JP2005310865A (ja) 2004-04-19 2005-11-04 Matsushita Electric Ind Co Ltd コイル部品
JP2012195399A (ja) 2011-03-16 2012-10-11 Panasonic Corp コイル部品およびその製造方法

Also Published As

Publication number Publication date
KR20220153108A (ko) 2022-11-17
EP3507816A4 (en) 2020-02-26
TWI789230B (zh) 2023-01-01
TW202223933A (zh) 2022-06-16
CN109891530A (zh) 2019-06-14
MX2019002447A (es) 2019-06-24
JP7160438B2 (ja) 2022-10-25
CA3035547A1 (en) 2018-03-08
JP2022185088A (ja) 2022-12-13
JP2019530217A (ja) 2019-10-17
US10854367B2 (en) 2020-12-01
US20180061547A1 (en) 2018-03-01
EP3507816A1 (en) 2019-07-10
US20200035413A1 (en) 2020-01-30
TW201826294A (zh) 2018-07-16
CN109891530B (zh) 2023-05-02
US11875926B2 (en) 2024-01-16
US11049638B2 (en) 2021-06-29
TWI757330B (zh) 2022-03-11
US20210193360A1 (en) 2021-06-24
WO2018045007A1 (en) 2018-03-08
US20240347254A1 (en) 2024-10-17
KR20190040349A (ko) 2019-04-17
KR102571361B1 (ko) 2023-08-25
CN116344173A (zh) 2023-06-27

Similar Documents

Publication Publication Date Title
KR102464202B1 (ko) 낮은 직류 저항을 갖는 고전류 코일을 구비한 인덕터
US8183967B2 (en) Surface mount magnetic components and methods of manufacturing the same
US8659379B2 (en) Magnetic components and methods of manufacturing the same
CN102428526B (zh) 表面安装磁性部件及其制造方法
JP5860807B2 (ja) 高電流磁性要素及び製造方法
US8188824B2 (en) Surface mount magnetic components and methods of manufacturing the same
TWI467607B (zh) 電磁組件
CN109817427A (zh) 线圈组件
JP2020077794A (ja) 表面実装インダクタ
KR20150139267A (ko) 권선형 인덕터
TWI447759B (zh) 表面安裝磁性元件總成
HK40009223B (en) Inductor having high current coil with low direct current resistance
HK40009223A (en) Inductor having high current coil with low direct current resistance

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 4