KR101551898B1 - 배선 기판, 반도체 장치 및 이들의 제조 방법 - Google Patents

배선 기판, 반도체 장치 및 이들의 제조 방법 Download PDF

Info

Publication number
KR101551898B1
KR101551898B1 KR1020080097094A KR20080097094A KR101551898B1 KR 101551898 B1 KR101551898 B1 KR 101551898B1 KR 1020080097094 A KR1020080097094 A KR 1020080097094A KR 20080097094 A KR20080097094 A KR 20080097094A KR 101551898 B1 KR101551898 B1 KR 101551898B1
Authority
KR
South Korea
Prior art keywords
support
layer
wiring
wiring board
wiring layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020080097094A
Other languages
English (en)
Korean (ko)
Other versions
KR20090035449A (ko
Inventor
겐타로 가네코
Original Assignee
신꼬오덴기 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신꼬오덴기 고교 가부시키가이샤 filed Critical 신꼬오덴기 고교 가부시키가이샤
Publication of KR20090035449A publication Critical patent/KR20090035449A/ko
Application granted granted Critical
Publication of KR101551898B1 publication Critical patent/KR101551898B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7424—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used as a support during the manufacture of self-supporting substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/334—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
    • Y10T29/4916—Simultaneous circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Wire Bonding (AREA)
KR1020080097094A 2007-10-05 2008-10-02 배선 기판, 반도체 장치 및 이들의 제조 방법 Active KR101551898B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007262753 2007-10-05
JPJP-P-2007-262753 2007-10-05

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR20150021511A Division KR20150033625A (ko) 2007-10-05 2015-02-12 배선 기판 및 반도체 장치

Publications (2)

Publication Number Publication Date
KR20090035449A KR20090035449A (ko) 2009-04-09
KR101551898B1 true KR101551898B1 (ko) 2015-09-09

Family

ID=40533076

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020080097094A Active KR101551898B1 (ko) 2007-10-05 2008-10-02 배선 기판, 반도체 장치 및 이들의 제조 방법
KR20150021511A Ceased KR20150033625A (ko) 2007-10-05 2015-02-12 배선 기판 및 반도체 장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR20150021511A Ceased KR20150033625A (ko) 2007-10-05 2015-02-12 배선 기판 및 반도체 장치

Country Status (5)

Country Link
US (2) US8502398B2 (https=)
JP (3) JP5398217B2 (https=)
KR (2) KR101551898B1 (https=)
CN (1) CN101404259A (https=)
TW (1) TWI447874B (https=)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8240036B2 (en) 2008-04-30 2012-08-14 Panasonic Corporation Method of producing a circuit board
JP5138459B2 (ja) * 2008-05-15 2013-02-06 新光電気工業株式会社 配線基板の製造方法
JP5101451B2 (ja) 2008-10-03 2012-12-19 新光電気工業株式会社 配線基板及びその製造方法
TWI468093B (zh) * 2008-10-31 2015-01-01 Princo Corp 多層基板之導孔結構及其製造方法
JP2011060892A (ja) * 2009-09-08 2011-03-24 Renesas Electronics Corp 電子装置、電子装置の製造方法
US9332642B2 (en) * 2009-10-30 2016-05-03 Panasonic Corporation Circuit board
EP2496061A4 (en) * 2009-10-30 2014-01-08 Panasonic Corp CIRCUIT BOARD AND SEMICONDUCTOR DEVICE WITH A COMPONENT MOUNTED ON A PCB
US20110110061A1 (en) * 2009-11-12 2011-05-12 Leung Andrew Kw Circuit Board with Offset Via
US8742561B2 (en) 2009-12-29 2014-06-03 Intel Corporation Recessed and embedded die coreless package
US8389337B2 (en) * 2009-12-31 2013-03-05 Intel Corporation Patch on interposer assembly and structures formed thereby
JP5566200B2 (ja) * 2010-06-18 2014-08-06 新光電気工業株式会社 配線基板及びその製造方法
JP5680401B2 (ja) * 2010-12-22 2015-03-04 新光電気工業株式会社 配線基板及び半導体パッケージ
TWI455268B (zh) * 2011-03-22 2014-10-01 南亞電路板股份有限公司 封裝載板及其製造方法
TWI473551B (zh) * 2011-07-08 2015-02-11 欣興電子股份有限公司 封裝基板及其製法
US20130098659A1 (en) * 2011-10-25 2013-04-25 Yiu Fai KWAN Pre-plated lead frame for copper wire bonding
US8927875B2 (en) * 2011-10-28 2015-01-06 Ibiden Co., Ltd. Wiring board and method for manufacturing wiring board
CN103249263A (zh) * 2012-02-07 2013-08-14 景硕科技股份有限公司 线路积层板的线路结构的制作方法
CN103379726A (zh) * 2012-04-17 2013-10-30 景硕科技股份有限公司 线路积层板的复层线路结构
JP5502139B2 (ja) * 2012-05-16 2014-05-28 日本特殊陶業株式会社 配線基板
JP5341227B1 (ja) * 2012-05-16 2013-11-13 日本特殊陶業株式会社 配線基板
TWI536508B (zh) * 2012-08-24 2016-06-01 日本特殊陶業股份有限公司 Wiring board
US9041207B2 (en) 2013-06-28 2015-05-26 Intel Corporation Method to increase I/O density and reduce layer counts in BBUL packages
JP6266907B2 (ja) * 2013-07-03 2018-01-24 新光電気工業株式会社 配線基板及び配線基板の製造方法
JP6131135B2 (ja) 2013-07-11 2017-05-17 新光電気工業株式会社 配線基板及びその製造方法
JP6223909B2 (ja) 2013-07-11 2017-11-01 新光電気工業株式会社 配線基板及びその製造方法
CN104299919B (zh) * 2013-07-15 2017-05-24 碁鼎科技秦皇岛有限公司 无芯层封装结构及其制造方法
KR101442423B1 (ko) * 2013-08-14 2014-09-17 삼성전기주식회사 전자부품 내장기판 제조 방법 및 전자부품 내장기판
CN104793026B (zh) * 2014-01-20 2018-09-28 旺矽科技股份有限公司 应用于探针测试装置的支撑结构及其制作方法
TW201539596A (zh) * 2014-04-09 2015-10-16 同欣電子工業股份有限公司 中介體及其製造方法
DE102014115815B4 (de) * 2014-10-30 2022-11-17 Infineon Technologies Ag Verfahren zur herstellung eines schaltungsträgers, verfahren zur herstellung einer halbleiteranordung, verfahren zum betrieb einer halbleiteranordnung und verfahren zur herstellung eines halbleitermoduls
US10285277B1 (en) * 2015-12-31 2019-05-07 Lockheed Martin Corporation Method of manufacturing circuits using thick metals and machined bulk dielectrics
JP2016105512A (ja) * 2016-03-01 2016-06-09 京セラサーキットソリューションズ株式会社 配線基板の製造方法
JP2017157739A (ja) 2016-03-03 2017-09-07 イビデン株式会社 電子部品付き配線板の製造方法
JP2017191688A (ja) * 2016-04-12 2017-10-19 デクセリアルズ株式会社 電気特性の検査方法
JP6594264B2 (ja) * 2016-06-07 2019-10-23 新光電気工業株式会社 配線基板及び半導体装置、並びにそれらの製造方法
KR102534940B1 (ko) * 2016-07-28 2023-05-22 삼성전기주식회사 인쇄회로기판
JP6935539B2 (ja) * 2016-11-30 2021-09-15 新光電気工業株式会社 配線基板の製造方法
CN108271313B (zh) * 2016-12-30 2021-03-16 奥特斯(中国)有限公司 用于部件承载件的具有纳米和/或微米结构的片材
JP7464352B2 (ja) * 2018-03-09 2024-04-09 日東電工株式会社 配線基板およびその製造方法
JP7202869B2 (ja) 2018-12-10 2023-01-12 ヌヴォトンテクノロジージャパン株式会社 半導体装置及び半導体装置の製造方法
JP7338991B2 (ja) * 2019-03-04 2023-09-05 リンクステック株式会社 支持体付き配線基板、支持体付き電子部品パッケージ及びこれらの製造方法
US11004819B2 (en) * 2019-09-27 2021-05-11 International Business Machines Corporation Prevention of bridging between solder joints
AT17082U1 (de) * 2020-04-27 2021-05-15 Zkw Group Gmbh Verfahren zur befestigung eines elektronischen bauteils
JP7508879B2 (ja) * 2020-06-16 2024-07-02 Ｔｏｐｐａｎホールディングス株式会社 支持体付き配線基板、配線基板、及び半導体装置
US20220161817A1 (en) * 2020-11-20 2022-05-26 Here Global B.V. Method, apparatus, and system for creating doubly-digitised maps
CN112445035A (zh) * 2020-11-30 2021-03-05 深圳同兴达科技股份有限公司 导电贴以及液晶显示模组
US11735529B2 (en) 2021-05-21 2023-08-22 International Business Machines Corporation Side pad anchored by next adjacent via
KR20230097817A (ko) * 2021-12-24 2023-07-03 삼성전기주식회사 인쇄회로기판, 캐리어 부착 인쇄회로기판 및 인쇄회로기판 패키지의 제조방법
US20240105575A1 (en) * 2022-09-26 2024-03-28 Intel Corporation Electrolytic surface finish architecture

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004319660A (ja) * 2003-04-15 2004-11-11 Toray Ind Inc 回路基板用部材および回路基板の製造方法
JP2005244104A (ja) * 2004-02-27 2005-09-08 Ngk Spark Plug Co Ltd 配線基板の製造方法
JP2006093576A (ja) * 2004-09-27 2006-04-06 Hitachi Cable Ltd 半導体装置及びその製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3635219B2 (ja) 1999-03-11 2005-04-06 新光電気工業株式会社 半導体装置用多層基板及びその製造方法
JP4691763B2 (ja) 2000-08-25 2011-06-01 イビデン株式会社 プリント配線板の製造方法
US7129158B2 (en) * 2001-09-28 2006-10-31 Ibiden Co., Ltd. Printed wiring board and production method for printed wiring board
JP2003297973A (ja) 2002-03-28 2003-10-17 Hitachi Chem Co Ltd 半導体パッケージ用基板、その製造方法、半導体パッケージおよびその製造方法
JP3888943B2 (ja) 2002-04-12 2007-03-07 イビデン株式会社 多層プリント配線板及び多層プリント配線板の製造方法
JP2006186321A (ja) 2004-12-01 2006-07-13 Shinko Electric Ind Co Ltd 回路基板の製造方法及び電子部品実装構造体の製造方法
JP4538373B2 (ja) 2005-05-23 2010-09-08 日本特殊陶業株式会社 コアレス配線基板の製造方法、及びそのコアレス配線基板を有する電子装置の製造方法
JP4146864B2 (ja) 2005-05-31 2008-09-10 新光電気工業株式会社 配線基板及びその製造方法、並びに半導体装置及び半導体装置の製造方法
EP1887845A4 (en) * 2005-06-30 2010-08-11 Ibiden Co Ltd CIRCUIT BOARD
JP2008258520A (ja) * 2007-04-09 2008-10-23 Shinko Electric Ind Co Ltd 配線基板の製造方法及び配線基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004319660A (ja) * 2003-04-15 2004-11-11 Toray Ind Inc 回路基板用部材および回路基板の製造方法
JP2005244104A (ja) * 2004-02-27 2005-09-08 Ngk Spark Plug Co Ltd 配線基板の製造方法
JP2006093576A (ja) * 2004-09-27 2006-04-06 Hitachi Cable Ltd 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JP5398217B2 (ja) 2014-01-29
JP2012209580A (ja) 2012-10-25
JP2009105393A (ja) 2009-05-14
US8779602B2 (en) 2014-07-15
US20120155048A1 (en) 2012-06-21
US8502398B2 (en) 2013-08-06
KR20150033625A (ko) 2015-04-01
CN101404259A (zh) 2009-04-08
KR20090035449A (ko) 2009-04-09
US20090095514A1 (en) 2009-04-16
TW200919672A (en) 2009-05-01
JP5456103B2 (ja) 2014-03-26
TWI447874B (zh) 2014-08-01
JP2012231167A (ja) 2012-11-22

Similar Documents

Publication Publication Date Title
KR101551898B1 (ko) 배선 기판, 반도체 장치 및 이들의 제조 방법
US8399779B2 (en) Wiring board and method of manufacturing the same
US9179552B2 (en) Wiring board
US20140097007A1 (en) Wiring substrate and method for producing the same
JP5221887B2 (ja) 配線基盤の製造方法
US7148566B2 (en) Method and structure for an organic package with improved BGA life
TWI294760B (https=)
TWI566648B (zh) Wiring board
JP4196606B2 (ja) 配線板の製造方法
JP5432800B2 (ja) 配線基板の製造方法
KR100908986B1 (ko) 코어리스 패키지 기판 및 제조 방법
JP2004200412A (ja) 半田バンプ付き配線基板およびその製造方法
JP2002076185A (ja) 回路基板装置及びその製造方法
JP2000077558A (ja) 印刷配線板とその製造方法
CN100581326C (zh) 多层印刷配线板及其制造方法
JP2008124339A (ja) 配線基板及びその製造方法
JP2004165238A (ja) プラスチックパッケージ及びその製造方法
JP2007158069A (ja) 半導体パッケージの外部接続構造及びその製造方法
JP6464774B2 (ja) 配線基板およびその製造方法
JP7412735B2 (ja) 半導体パッケージの製造方法
JP2004214252A (ja) 片面回路基板の製造方法
JP2004281752A (ja) 片面回路基板の製造方法及び片面回路基板
JP2002151618A (ja) ビルドアッププリント配線板およびその製造方法
JP2002093835A (ja) 接続部材及びその形成方法
JP2005093930A (ja) 多層基板とその製造方法

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

A107 Divisional application of patent
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0107 Divisional application

St.27 status event code: A-0-1-A10-A18-div-PA0107

St.27 status event code: A-0-1-A10-A16-div-PA0107

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20180816

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 11

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000