JP7129427B2 - 処理された積層ダイ - Google Patents

処理された積層ダイ Download PDF

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Publication number
JP7129427B2
JP7129427B2 JP2019562412A JP2019562412A JP7129427B2 JP 7129427 B2 JP7129427 B2 JP 7129427B2 JP 2019562412 A JP2019562412 A JP 2019562412A JP 2019562412 A JP2019562412 A JP 2019562412A JP 7129427 B2 JP7129427 B2 JP 7129427B2
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semiconductor die
die
die components
forming
layer
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JP2020520118A (ja
JP2020520118A5 (enExample
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シプリアン エメカ ウゾー
ギリアン ガオ
ローラ ウィルズ ミルカリミ
ジュニア ガイウス ギルマン ファウンテン
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インヴェンサス ボンディング テクノロジーズ インコーポレイテッド
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Publication of JP2020520118A publication Critical patent/JP2020520118A/ja
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Priority to JP2022131656A priority Critical patent/JP2022163235A/ja
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Priority to JP2024228795A priority patent/JP2025060841A/ja
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    • H10P72/0438—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H10P50/283—
    • H10P50/694—
    • H10P54/00—
    • H10P70/30—
    • H10P72/0428—
    • H10P72/74—
    • H10P72/7402—
    • H10W10/00—
    • H10W10/01—
    • H10W72/00—
    • H10W74/141—
    • H10W80/00—
    • H10W90/00—
    • H10P50/242—
    • H10P72/7416—
    • H10P72/7428—
    • H10P72/7434—
    • H10P90/1914—
    • H10W72/01353—
    • H10W72/01371—
    • H10W72/01951—
    • H10W72/01971—
    • H10W72/0198—
    • H10W72/07311—
    • H10W72/07331—
    • H10W72/934—
    • H10W72/953—
    • H10W80/327—
    • H10W90/20—
    • H10W90/297—
    • H10W90/792—
    • H10W90/794—

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Dicing (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Die Bonding (AREA)
  • Liquid Crystal Substances (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Pressure Sensors (AREA)
JP2019562412A 2017-05-11 2018-04-24 処理された積層ダイ Active JP7129427B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022131656A JP2022163235A (ja) 2017-05-11 2022-08-22 処理された積層ダイ
JP2024228795A JP2025060841A (ja) 2017-05-11 2024-12-25 処理された積層ダイ

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762504834P 2017-05-11 2017-05-11
US62/504,834 2017-05-11
US15/960,179 2018-04-23
US15/960,179 US10879212B2 (en) 2017-05-11 2018-04-23 Processed stacked dies
PCT/US2018/029094 WO2018208500A1 (en) 2017-05-11 2018-04-24 Processed stacked dies

Related Child Applications (1)

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JP2022131656A Division JP2022163235A (ja) 2017-05-11 2022-08-22 処理された積層ダイ

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JP2020520118A JP2020520118A (ja) 2020-07-02
JP2020520118A5 JP2020520118A5 (enExample) 2021-05-27
JP7129427B2 true JP7129427B2 (ja) 2022-09-01

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JP2022131656A Pending JP2022163235A (ja) 2017-05-11 2022-08-22 処理された積層ダイ
JP2024228795A Pending JP2025060841A (ja) 2017-05-11 2024-12-25 処理された積層ダイ

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JP2024228795A Pending JP2025060841A (ja) 2017-05-11 2024-12-25 処理された積層ダイ

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US (4) US10879212B2 (enExample)
EP (2) EP3635775B1 (enExample)
JP (3) JP7129427B2 (enExample)
KR (1) KR102320674B1 (enExample)
CN (2) CN117497456A (enExample)
TW (4) TW202510203A (enExample)
WO (1) WO2018208500A1 (enExample)

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