JP5259270B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP5259270B2 JP5259270B2 JP2008168093A JP2008168093A JP5259270B2 JP 5259270 B2 JP5259270 B2 JP 5259270B2 JP 2008168093 A JP2008168093 A JP 2008168093A JP 2008168093 A JP2008168093 A JP 2008168093A JP 5259270 B2 JP5259270 B2 JP 5259270B2
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- JP
- Japan
- Prior art keywords
- voltage
- temperature
- memory cell
- temperature sensor
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/41—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger
- G11C11/413—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing, timing or power reduction
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Static Random-Access Memory (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008168093A JP5259270B2 (ja) | 2008-06-27 | 2008-06-27 | 半導体装置 |
| US12/432,796 US7961500B2 (en) | 2008-06-27 | 2009-04-30 | Semiconductor device |
| US13/102,295 US8279696B2 (en) | 2008-06-27 | 2011-05-06 | Semiconductor device |
| US13/584,271 US8611166B2 (en) | 2008-06-27 | 2012-08-13 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008168093A JP5259270B2 (ja) | 2008-06-27 | 2008-06-27 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010009674A JP2010009674A (ja) | 2010-01-14 |
| JP2010009674A5 JP2010009674A5 (enExample) | 2011-04-28 |
| JP5259270B2 true JP5259270B2 (ja) | 2013-08-07 |
Family
ID=41447206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008168093A Active JP5259270B2 (ja) | 2008-06-27 | 2008-06-27 | 半導体装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (3) | US7961500B2 (enExample) |
| JP (1) | JP5259270B2 (enExample) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5259270B2 (ja) * | 2008-06-27 | 2013-08-07 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP2010282317A (ja) * | 2009-06-03 | 2010-12-16 | Elpida Memory Inc | 内部電源回路、半導体装置、及び半導体装置の製造方法 |
| JP5263015B2 (ja) * | 2009-06-08 | 2013-08-14 | 富士通セミコンダクター株式会社 | 半導体メモリ |
| JP2012059330A (ja) * | 2010-09-10 | 2012-03-22 | Toshiba Corp | 半導体装置 |
| JP5659893B2 (ja) * | 2011-03-16 | 2015-01-28 | 株式会社リコー | 半導体記憶装置 |
| US8755239B2 (en) * | 2011-11-17 | 2014-06-17 | Texas Instruments Incorporated | Read assist circuit for an SRAM |
| US8693235B2 (en) * | 2011-12-06 | 2014-04-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods and apparatus for finFET SRAM arrays in integrated circuits |
| US9939827B1 (en) * | 2011-12-16 | 2018-04-10 | Altera Corporation | Temperature dependent power supply circuitry |
| US8995218B2 (en) * | 2012-03-07 | 2015-03-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US8938573B2 (en) * | 2012-06-30 | 2015-01-20 | Intel Corporation | Row hammer condition monitoring |
| JP2014041668A (ja) | 2012-08-21 | 2014-03-06 | Fujitsu Semiconductor Ltd | 半導体記憶装置及び半導体記憶装置の制御方法 |
| JP5886974B2 (ja) * | 2012-09-20 | 2016-03-16 | 株式会社日立製作所 | 半導体記憶装置 |
| JP2014086112A (ja) * | 2012-10-24 | 2014-05-12 | Fujitsu Semiconductor Ltd | 半導体記憶装置 |
| US9165668B1 (en) * | 2013-07-29 | 2015-10-20 | Western Digital Technologies, Inc. | Data retention monitoring using temperature history in solid state drives |
| US9330790B2 (en) | 2014-04-25 | 2016-05-03 | Seagate Technology Llc | Temperature tracking to manage threshold voltages in a memory |
| KR102251810B1 (ko) | 2014-09-30 | 2021-05-13 | 삼성전자주식회사 | 메모리 장치, 메모리 시스템 및 메모리 장치에 대한 제어 방법 |
| US9607676B2 (en) * | 2015-08-12 | 2017-03-28 | Avalanche Technology, Inc. | Method and apparatus for adjustment of current through a magnetoresistive tunnel junction (MTJ) based on temperature fluctuations |
| US9627041B1 (en) * | 2016-01-29 | 2017-04-18 | Qualcomm Incorporated | Memory with a voltage-adjustment circuit to adjust the operating voltage of memory cells for BTI effect screening |
| US9928898B2 (en) * | 2016-03-30 | 2018-03-27 | Qualcomm Incorporated | Wordline adjustment scheme |
| US9922700B2 (en) | 2016-05-24 | 2018-03-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Memory read stability enhancement with short segmented bit line architecture |
| US10163524B2 (en) | 2016-06-22 | 2018-12-25 | Darryl G. Walker | Testing a semiconductor device including a voltage detection circuit and temperature detection circuit that can be used to generate read assist and/or write assist in an SRAM circuit portion and method therefor |
| US9940999B2 (en) | 2016-06-22 | 2018-04-10 | Darryl G. Walker | Semiconductor devices, circuits and methods for read and/or write assist of an SRAM circuit portion based on voltage detection and/or temperature detection circuits |
| US9633734B1 (en) * | 2016-07-14 | 2017-04-25 | Ememory Technology Inc. | Driving circuit for non-volatile memory |
| US10062431B2 (en) | 2016-11-07 | 2018-08-28 | Ambiq Micro, Inc. | SRAM with multiple power domains |
| US10714166B2 (en) * | 2018-08-13 | 2020-07-14 | Micron Technology, Inc. | Apparatus and methods for decoding memory access addresses for access operations |
| US10726926B2 (en) | 2018-09-29 | 2020-07-28 | Sandisk Technologies Llp | Hot-cold VTH mismatch using VREAD modulation |
| US11435811B2 (en) | 2019-12-09 | 2022-09-06 | Micron Technology, Inc. | Memory device sensors |
| US11955171B2 (en) | 2021-09-15 | 2024-04-09 | Mavagail Technology, LLC | Integrated circuit device including an SRAM portion having end power select circuits |
| WO2025013462A1 (ja) * | 2023-07-11 | 2025-01-16 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置、センシングデータの読み出し方法及び電子機器 |
Family Cites Families (50)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4020358A (en) * | 1975-12-16 | 1977-04-26 | General Electric Company | Device system and method for controlling the supply of power to an electrical load |
| DE3622713A1 (de) * | 1986-07-05 | 1988-01-07 | Blaupunkt Werke Gmbh | Schaltungsanordnung mit einer brueckenendstufe |
| JPH0685159A (ja) * | 1992-09-02 | 1994-03-25 | Hitachi Ltd | 半導体記憶装置とそれを用いたメモリ装置 |
| JPH06314491A (ja) | 1993-04-30 | 1994-11-08 | Hitachi Ltd | 半導体記憶装置 |
| US5784328A (en) * | 1996-12-23 | 1998-07-21 | Lsi Logic Corporation | Memory system including an on-chip temperature sensor for regulating the refresh rate of a DRAM array |
| JP3963990B2 (ja) * | 1997-01-07 | 2007-08-22 | 株式会社ルネサステクノロジ | 内部電源電圧発生回路 |
| JP2000155617A (ja) * | 1998-11-19 | 2000-06-06 | Mitsubishi Electric Corp | 内部電圧発生回路 |
| US6446019B1 (en) * | 1998-12-29 | 2002-09-03 | Intel Corporation | Method and apparatus for calibrating analog sensor measurement |
| JP4027343B2 (ja) * | 1999-10-06 | 2007-12-26 | キヤノン株式会社 | ズームレンズ及びそれを用いた撮像装置 |
| US6128239A (en) * | 1999-10-29 | 2000-10-03 | Hewlett-Packard | MRAM device including analog sense amplifiers |
| US6476716B1 (en) * | 2000-11-15 | 2002-11-05 | Dallas Semiconductor Corporation | Temperature-controlled variable resistor |
| US6824307B2 (en) * | 2000-12-12 | 2004-11-30 | Harris Corporation | Temperature sensor and related methods |
| US6662136B2 (en) * | 2001-04-10 | 2003-12-09 | International Business Machines Corporation | Digital temperature sensor (DTS) system to monitor temperature in a memory subsystem |
| US6735546B2 (en) * | 2001-08-31 | 2004-05-11 | Matrix Semiconductor, Inc. | Memory device and method for temperature-based control over write and/or read operations |
| US6608790B2 (en) * | 2001-12-03 | 2003-08-19 | Hewlett-Packard Development Company, L.P. | Write current compensation for temperature variations in memory arrays |
| EP1420412B1 (en) * | 2002-11-18 | 2008-07-09 | STMicroelectronics S.r.l. | Circuit and method for temperature tracing of devices including an element of chalcogenic material, in particular phase change memory devices |
| US6954394B2 (en) * | 2002-11-27 | 2005-10-11 | Matrix Semiconductor, Inc. | Integrated circuit and method for selecting a set of memory-cell-layer-dependent or temperature-dependent operating conditions |
| JP2005108307A (ja) | 2003-09-29 | 2005-04-21 | Nec Electronics Corp | 半導体記憶装置 |
| JP4497906B2 (ja) * | 2003-12-10 | 2010-07-07 | 株式会社東芝 | 半導体集積回路装置 |
| US7079438B2 (en) * | 2004-02-17 | 2006-07-18 | Hewlett-Packard Development Company, L.P. | Controlled temperature, thermal-assisted magnetic memory device |
| JP2005234935A (ja) * | 2004-02-20 | 2005-09-02 | Renesas Technology Corp | 情報記憶装置 |
| KR20050118952A (ko) * | 2004-06-15 | 2005-12-20 | 삼성전자주식회사 | 히스테리리스 특성을 갖는 온도 감지 회로 |
| CN1954389B (zh) * | 2004-06-22 | 2012-10-03 | 富士通半导体股份有限公司 | 半导体存储器 |
| US7142009B1 (en) * | 2004-09-15 | 2006-11-28 | Altera Corporation | Adaptive power supply voltage regulation for programmable logic |
| EP1798519A4 (en) * | 2004-10-07 | 2012-06-06 | Yamaha Corp | GEOMAGNETIC SENSOR, GEOMAGNETIC SENSOR CORRECTION METHOD, TEMPERATURE SENSOR, TEMPERATURE SENSOR CORRECTION METHOD, AND GEOMAGNETIC DETECTION DEVICE |
| US7113424B2 (en) * | 2004-11-23 | 2006-09-26 | Infineon Technologies Ag | Energy adjusted write pulses in phase-change memories |
| US7184313B2 (en) * | 2005-06-17 | 2007-02-27 | Saifun Semiconductors Ltd. | Method circuit and system for compensating for temperature induced margin loss in non-volatile memory cells |
| JP5100035B2 (ja) | 2005-08-02 | 2012-12-19 | ルネサスエレクトロニクス株式会社 | 半導体記憶装置 |
| JP4669518B2 (ja) * | 2005-09-21 | 2011-04-13 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP2007193928A (ja) | 2005-12-19 | 2007-08-02 | Matsushita Electric Ind Co Ltd | 半導体記憶装置 |
| KR100655084B1 (ko) * | 2006-01-17 | 2006-12-08 | 삼성전자주식회사 | 센스앰프 인에이블 회로 및 이를 갖는 반도체 메모리 장치 |
| KR100842996B1 (ko) * | 2006-02-06 | 2008-07-01 | 주식회사 하이닉스반도체 | 온도에 따라 선택적으로 변경되는 워드 라인 전압을발생하는 워드 라인 전압 발생기와, 이를 포함하는 플래시메모리 장치 및 그 워드 라인 전압 발생 방법 |
| KR100744131B1 (ko) * | 2006-02-21 | 2007-08-01 | 삼성전자주식회사 | 냉온에서 동작 속도가 향상되는 메모리 집적회로 장치 |
| JP4821363B2 (ja) * | 2006-02-21 | 2011-11-24 | 日産自動車株式会社 | 組電池制御装置および組電池制御方法 |
| US7460394B2 (en) * | 2006-05-18 | 2008-12-02 | Infineon Technologies Ag | Phase change memory having temperature budget sensor |
| US7603249B1 (en) * | 2006-04-19 | 2009-10-13 | Darryl Walker | Semiconductor device having variable parameter selection based on temperature and test method |
| US7283414B1 (en) * | 2006-05-24 | 2007-10-16 | Sandisk 3D Llc | Method for improving the precision of a temperature-sensor circuit |
| KR100809334B1 (ko) * | 2006-09-05 | 2008-03-05 | 삼성전자주식회사 | 상변화 메모리 장치 |
| JP2008071440A (ja) * | 2006-09-14 | 2008-03-27 | Matsushita Electric Ind Co Ltd | 強誘電体メモリ装置及びその制御方法 |
| KR100851989B1 (ko) * | 2006-10-12 | 2008-08-13 | 주식회사 하이닉스반도체 | 반도체 메모리 장치의 온도정보 출력회로 및 방법 |
| ITRM20060652A1 (it) * | 2006-12-06 | 2008-06-07 | Micron Technology Inc | Compensazione di temperatura di segnali di memoria impiegando segnali digitali |
| ITRM20060675A1 (it) * | 2006-12-14 | 2008-06-15 | Micron Technology Inc | Sensore di temperatura su chip |
| US8018780B2 (en) * | 2007-01-18 | 2011-09-13 | Texas Instruments Incorporated | Temperature dependent back-bias for a memory array |
| KR100856060B1 (ko) * | 2007-04-06 | 2008-09-02 | 주식회사 하이닉스반도체 | 반도체메모리소자의 내부리프레쉬신호 생성장치 |
| US7796424B2 (en) * | 2007-06-21 | 2010-09-14 | Qimonda North America Corp. | Memory device having drift compensated read operation and associated method |
| JP5212370B2 (ja) * | 2007-07-12 | 2013-06-19 | 富士通セミコンダクター株式会社 | 半導体装置 |
| JP5259270B2 (ja) * | 2008-06-27 | 2013-08-07 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| KR101020282B1 (ko) * | 2008-07-09 | 2011-03-07 | 주식회사 하이닉스반도체 | 온도센서 |
| US8027187B2 (en) * | 2008-09-12 | 2011-09-27 | Micron Technology, Inc. | Memory sensing devices, methods, and systems |
| US7755965B2 (en) * | 2008-10-13 | 2010-07-13 | Seagate Technology Llc | Temperature dependent system for reading ST-RAM |
-
2008
- 2008-06-27 JP JP2008168093A patent/JP5259270B2/ja active Active
-
2009
- 2009-04-30 US US12/432,796 patent/US7961500B2/en active Active
-
2011
- 2011-05-06 US US13/102,295 patent/US8279696B2/en active Active
-
2012
- 2012-08-13 US US13/584,271 patent/US8611166B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20090323400A1 (en) | 2009-12-31 |
| US7961500B2 (en) | 2011-06-14 |
| US20120320664A1 (en) | 2012-12-20 |
| JP2010009674A (ja) | 2010-01-14 |
| US8279696B2 (en) | 2012-10-02 |
| US20110211385A1 (en) | 2011-09-01 |
| US8611166B2 (en) | 2013-12-17 |
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