JP4149439B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP4149439B2
JP4149439B2 JP2004517247A JP2004517247A JP4149439B2 JP 4149439 B2 JP4149439 B2 JP 4149439B2 JP 2004517247 A JP2004517247 A JP 2004517247A JP 2004517247 A JP2004517247 A JP 2004517247A JP 4149439 B2 JP4149439 B2 JP 4149439B2
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JP
Japan
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lead
sealing portion
tab
qfn
leads
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JP2004517247A
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English (en)
Japanese (ja)
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JPWO2004004005A1 (ja
Inventor
好彦 嶋貫
義弘 鈴木
孝司 土屋
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Renesas Technology Corp
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Renesas Technology Corp
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    • H10W72/00—
    • H10W70/424—
    • H10W74/016—
    • H10W74/111—
    • H10W72/0198—
    • H10W72/07352—
    • H10W72/321—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5449—
    • H10W72/5522—
    • H10W72/932—
    • H10W74/00—
    • H10W74/127—
    • H10W90/756—

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP2004517247A 2002-07-01 2003-05-30 半導体装置 Expired - Lifetime JP4149439B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002191666 2002-07-01
JP2002191666 2002-07-01
PCT/JP2003/006830 WO2004004005A1 (ja) 2002-07-01 2003-05-30 半導体装置およびその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008122984A Division JP4945508B2 (ja) 2002-07-01 2008-05-09 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2004004005A1 JPWO2004004005A1 (ja) 2005-11-04
JP4149439B2 true JP4149439B2 (ja) 2008-09-10

Family

ID=29996942

Family Applications (3)

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JP2004517247A Expired - Lifetime JP4149439B2 (ja) 2002-07-01 2003-05-30 半導体装置
JP2008122984A Expired - Lifetime JP4945508B2 (ja) 2002-07-01 2008-05-09 半導体装置
JP2011141849A Expired - Lifetime JP5379189B2 (ja) 2002-07-01 2011-06-27 半導体装置

Family Applications After (2)

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JP2008122984A Expired - Lifetime JP4945508B2 (ja) 2002-07-01 2008-05-09 半導体装置
JP2011141849A Expired - Lifetime JP5379189B2 (ja) 2002-07-01 2011-06-27 半導体装置

Country Status (6)

Country Link
US (4) US7525184B2 (enExample)
JP (3) JP4149439B2 (enExample)
KR (1) KR100975692B1 (enExample)
CN (2) CN100533722C (enExample)
TW (1) TWI290764B (enExample)
WO (1) WO2004004005A1 (enExample)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4523138B2 (ja) * 2000-10-06 2010-08-11 ローム株式会社 半導体装置およびそれに用いるリードフレーム
DE10221857A1 (de) * 2002-05-16 2003-11-27 Osram Opto Semiconductors Gmbh Verfahren zum Befestigen eines Halbleiterchips in einem Kunststoffgehäusekörper, optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung
CN100533722C (zh) * 2002-07-01 2009-08-26 株式会社瑞萨科技 半导体器件
JP4417150B2 (ja) * 2004-03-23 2010-02-17 株式会社ルネサステクノロジ 半導体装置
US7791180B2 (en) 2004-10-01 2010-09-07 Yamaha Corporation Physical quantity sensor and lead frame used for same
JP2006108306A (ja) * 2004-10-04 2006-04-20 Yamaha Corp リードフレームおよびそれを用いた半導体パッケージ
JP4698234B2 (ja) * 2005-01-21 2011-06-08 スタンレー電気株式会社 表面実装型半導体素子
JP2008277405A (ja) * 2007-04-26 2008-11-13 Rohm Co Ltd 半導体モジュール
US20080265248A1 (en) * 2007-04-27 2008-10-30 Microchip Technology Incorporated Leadframe Configuration to Enable Strip Testing of SOT-23 Packages and the Like
JP5155644B2 (ja) * 2007-07-19 2013-03-06 ルネサスエレクトロニクス株式会社 半導体装置
US7847376B2 (en) * 2007-07-19 2010-12-07 Renesas Electronics Corporation Semiconductor device and manufacturing method of the same
JP5173654B2 (ja) * 2007-08-06 2013-04-03 セイコーインスツル株式会社 半導体装置
US20090315159A1 (en) * 2008-06-20 2009-12-24 Donald Charles Abbott Leadframes having both enhanced-adhesion and smooth surfaces and methods to form the same
JP4941509B2 (ja) * 2008-10-20 2012-05-30 株式会社デンソー 電子制御装置
JP4987041B2 (ja) * 2009-07-27 2012-07-25 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
TWI453831B (zh) 2010-09-09 2014-09-21 台灣捷康綜合有限公司 半導體封裝結構及其製造方法
US9263374B2 (en) 2010-09-28 2016-02-16 Dai Nippon Printing Co., Ltd. Semiconductor device and manufacturing method therefor
JP5699322B2 (ja) * 2010-09-28 2015-04-08 大日本印刷株式会社 半導体装置
TWI443785B (zh) * 2011-07-27 2014-07-01 矽品精密工業股份有限公司 半導體晶圓、晶片、具有該晶片之半導體封裝件及其製法
US20140131086A1 (en) * 2011-09-06 2014-05-15 Texas Instuments Incorporated Lead Frame Strip with Half (1/2) Thickness Pull Out Tab
JP5953703B2 (ja) * 2011-10-31 2016-07-20 ソニー株式会社 リードフレームおよび半導体装置
JP5947107B2 (ja) * 2012-05-23 2016-07-06 ルネサスエレクトロニクス株式会社 半導体装置
JP5954013B2 (ja) * 2012-07-18 2016-07-20 日亜化学工業株式会社 半導体素子実装部材及び半導体装置
JP2014056985A (ja) * 2012-09-13 2014-03-27 Nitto Denko Corp 封止体の製造方法、封止体製造用枠状スペーサ、封止体及び電子機器
CN103715102A (zh) * 2012-09-28 2014-04-09 德克萨斯仪器股份有限公司 带有改进的封装分离性的引脚框架带
US9589929B2 (en) 2013-03-14 2017-03-07 Vishay-Siliconix Method for fabricating stack die package
US9966330B2 (en) 2013-03-14 2018-05-08 Vishay-Siliconix Stack die package
JP6513465B2 (ja) * 2015-04-24 2019-05-15 日本航空電子工業株式会社 リード接合構造
JP6555927B2 (ja) * 2015-05-18 2019-08-07 大口マテリアル株式会社 半導体素子搭載用リードフレーム及び半導体装置の製造方法
JP6468085B2 (ja) * 2015-06-11 2019-02-13 株式会社デンソー 基板、および、その製造方法
JP6721346B2 (ja) 2016-01-27 2020-07-15 ローム株式会社 半導体装置
US9870985B1 (en) * 2016-07-11 2018-01-16 Amkor Technology, Inc. Semiconductor package with clip alignment notch
JP6399126B2 (ja) * 2017-03-07 2018-10-03 大日本印刷株式会社 リードフレームおよびリードフレームの製造方法
US10211128B2 (en) 2017-06-06 2019-02-19 Amkor Technology, Inc. Semiconductor package having inspection structure and related methods
JP6417466B1 (ja) * 2017-11-28 2018-11-07 アオイ電子株式会社 半導体装置およびその製造方法
CN109037183A (zh) * 2018-06-13 2018-12-18 南通通富微电子有限公司 一种半导体芯片封装阵列和半导体芯片封装器件
CN109037078A (zh) * 2018-06-13 2018-12-18 南通通富微电子有限公司 一种半导体芯片封装方法
CN109065519B (zh) * 2018-06-13 2020-12-25 南通通富微电子有限公司 一种半导体芯片封装器件
CN109065518B (zh) * 2018-06-13 2020-12-25 南通通富微电子有限公司 一种半导体芯片封装阵列
US11600557B2 (en) * 2018-08-21 2023-03-07 Texas Instruments Incorporated Packaged device having selective lead pullback for dimple depth control
JP6631669B2 (ja) * 2018-09-05 2020-01-15 大日本印刷株式会社 リードフレームおよびリードフレームの製造方法
US11270969B2 (en) 2019-06-04 2022-03-08 Jmj Korea Co., Ltd. Semiconductor package
US10910294B2 (en) 2019-06-04 2021-02-02 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor device and method of manufacturing semiconductor device
JP7381168B2 (ja) * 2019-12-09 2023-11-15 日清紡マイクロデバイス株式会社 半導体装置の設計方法
TWM606836U (zh) * 2020-09-18 2021-01-21 長華科技股份有限公司 導線架
CN115547969A (zh) * 2021-06-30 2022-12-30 意法半导体股份有限公司 制造半导体器件的方法、对应的基板和半导体器件

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09246427A (ja) * 1996-03-12 1997-09-19 Dainippon Printing Co Ltd 表面実装型半導体装置の製造方法および表面実装型半導体装置
JP2915892B2 (ja) * 1997-06-27 1999-07-05 松下電子工業株式会社 樹脂封止型半導体装置およびその製造方法
JP2000031366A (ja) 1998-07-14 2000-01-28 Dainippon Printing Co Ltd 樹脂封止型半導体装置とそれに用いられる回路部材およびそれらの製造方法
JP3482888B2 (ja) 1998-10-12 2004-01-06 松下電器産業株式会社 樹脂封止型半導体装置およびその製造方法
MY133357A (en) * 1999-06-30 2007-11-30 Hitachi Ltd A semiconductor device and a method of manufacturing the same
JP2001358279A (ja) * 2000-06-13 2001-12-26 Sony Corp 半導体装置及びリードフレーム
JP2002057244A (ja) * 2000-08-10 2002-02-22 Hitachi Ltd 半導体装置およびその製造方法
JP2002118222A (ja) * 2000-10-10 2002-04-19 Rohm Co Ltd 半導体装置
JP2002134674A (ja) * 2000-10-20 2002-05-10 Hitachi Ltd 半導体装置およびその製造方法
JP2002184927A (ja) * 2000-12-19 2002-06-28 Mitsui High Tec Inc 半導体装置の製造方法
CN100533722C (zh) * 2002-07-01 2009-08-26 株式会社瑞萨科技 半导体器件

Also Published As

Publication number Publication date
JP5379189B2 (ja) 2013-12-25
US7843049B2 (en) 2010-11-30
TW200416992A (en) 2004-09-01
KR100975692B1 (ko) 2010-08-12
US20110089548A1 (en) 2011-04-21
WO2004004005A1 (ja) 2004-01-08
KR20050024447A (ko) 2005-03-10
US7525184B2 (en) 2009-04-28
CN100533722C (zh) 2009-08-26
JP4945508B2 (ja) 2012-06-06
US20060017143A1 (en) 2006-01-26
TWI290764B (en) 2007-12-01
CN100342533C (zh) 2007-10-10
CN1666338A (zh) 2005-09-07
JPWO2004004005A1 (ja) 2005-11-04
JP2011187996A (ja) 2011-09-22
JP2008227531A (ja) 2008-09-25
US8390133B2 (en) 2013-03-05
CN101118891A (zh) 2008-02-06
US20130001804A1 (en) 2013-01-03
US8222720B2 (en) 2012-07-17
US20090200656A1 (en) 2009-08-13

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