JP4941509B2 - 電子制御装置 - Google Patents
電子制御装置 Download PDFInfo
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- JP4941509B2 JP4941509B2 JP2009132257A JP2009132257A JP4941509B2 JP 4941509 B2 JP4941509 B2 JP 4941509B2 JP 2009132257 A JP2009132257 A JP 2009132257A JP 2009132257 A JP2009132257 A JP 2009132257A JP 4941509 B2 JP4941509 B2 JP 4941509B2
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Description
以下、本発明の第1実施形態について図を参照して説明する。本実施形態で示される電子制御装置は、例えば車載用の電子制御装置として用いられるものである。具体的には、自動変速機の電子制御装置として、自動変速機の内部に配置されたバルブボディ内に、ソレノイドや各種センサ等ともに一体化されたモジュールとして取り付けられる。
本実施形態では、第1実施形態と異なる部分についてのみ説明する。図7は、本実施形態に係る電子制御装置1の一部の拡大断面図であり、図2のB部拡大図に相当する図である。
本実施形態では、第1実施形態と異なる部分についてのみ説明する。図8は、本実施形態に係る電子制御装置1の一部の拡大断面図であり、図2のB部拡大図に相当する図である。この図に示されるように、導電性接着剤50は2列に形成されている。そして、各導電性接着剤50が密着補強材60でコーティングされている。
本実施形態では、第1実施形態と異なる部分についてのみ説明する。図9は、本実施形態に係る電子制御装置1の一部の拡大断面図であり、図2のB部拡大図に相当する図である。この図に示されるように、回路基板10には、回路基板10の一面11の外縁部11aにおいて、平面部および側面部によって構成された階段状の段差部19が備えられている。そして、応力緩衝部としての導電性接着剤50が回路基板10の段差部19に設けられ、密着補強材60によってコーティングされている。
本実施形態では、第1実施形態と異なる部分についてのみ説明する。図10は、本実施形態に係る回路基板10の平面図である。また、図11は、本実施形態に係る電子制御装置1の一部の拡大断面図であり、図2のB部拡大図に相当する図である。
本実施形態では、第5実施形態と異なる部分についてのみ説明する。図14は、本実施形態に係る電子制御装置1の一部の拡大断面図であり、図2のB部拡大図に相当する図である。この図に示されるように、回路基板10には、上述の階段状の段差部19が備えられている。そして、ボンディング部51が回路基板10の段差部19に配置され、ボンディング部51および段差部19が密着補強材60によって覆われている。
本実施形態では、第5実施形態と異なる部分についてのみ説明する。図15は、本実施形態に係る回路基板10の平面図である。この図に示されるように、回路基板10の一面11の外縁部11aにAl等のワイヤ52が配置されている。このワイヤ52は、回路基板10の各辺に沿って直線状に張られている。1本のワイヤ52の長さが例えば15mmであり、2本のワイヤ52がL字状に配置されている。
本実施形態では、上記各実施形態と異なる部分についてのみ説明する。図17は、本実施形態に係る電子制御装置1の一部の拡大断面図であり、図2のB部拡大図に相当する図である。この図に示されるように、回路基板10には、該回路基板10の一面11の外縁部11aに凹部11bが設けられている。そして、密着補強材60は、この凹部11bに埋め尽くされている。これにより、凹部11b内に配置された密着補強材60が厚くなるため、該密着補強材60によってモールド樹脂40の剥離応力を緩和することが可能となる。
本実施形態では、上記各実施形態と異なる部分についてのみ説明する。図18は、本実施形態に係る電子制御装置1の一部の拡大断面図であり、図2のB部拡大図に相当する図である。この図に示されるように、回路基板10には、上述の階段状の段差部19が設けられている。そして、密着補強材60は、段差部19の平面部および側面部によって構成された凹状の角部を覆っている。
第1〜第4実施形態では、導電性接着剤50は回路基板10およびモールド樹脂40よりも弾性率が低いものが用いられていたが、導電性接着剤50は少なくとも回路基板10よりも弾性率が低いものでも良い。すなわち、導電性接着剤50が少なくとも回路基板10よりも軟らかければ、モールド樹脂40から受ける剥離応力が低減されるからである。
11 回路基板の一面
11a 回路基板の一面の外縁部
11b 凹部
12 回路基板の他面
13 電子部品
18 回路基板の側面
19 段差部
20 ベース部材
40 モールド樹脂
50 導電性接着剤
51 ボンディング部
52 ワイヤ
60 密着補強材
Claims (12)
- ヒートシンクとして機能するベース部材(20)と、
一面(11)および該一面(11)の反対側の他面(12)を有し、前記一面(11)に電子部品(13)が搭載され、前記他面(12)に前記ベース部材(20)が接着された回路基板(10)と、
少なくとも、前記ベース部材(20)の前記回路基板(10)が接着された側の面と、前記回路基板(10)を封止したモールド樹脂(40)とを備えた電子制御装置であって、
前記回路基板(10)の一面(11)の少なくとも、外縁部(11a)には、前記一面(11)の外縁部(11a)における前記回路基板(10)の上の部位と前記モールド樹脂(40)との接合部分の応力を、前記一面(11)の外縁部(11a)に前記モールド樹脂(40)が設けられたときの前記一面(11)の外縁部(11a)における前記回路基板(10)の上の部位と前記モールド樹脂(40)との接合部分の応力よりも低くする応力緩衝部(50〜52、60)が備えられており、
前記回路基板(10)は、前記回路基板(10)の一面(11)の外縁部(11a)に、平面部および側面部によって構成された階段状の段差部(19)を備えており、
前記応力緩衝部(50〜52、60)は、前記回路基板(10)よりも弾性率が低いものであり、前記モールド樹脂(40)よりも弾性率が低いものであり、前記回路基板(10)の一面(11)の外縁部(11a)のうち、前記一面(11)の中心から最も離れた場所に配置されており、前記段差部(19)を覆うように配置されていることを特徴とする電子制御装置。 - 前記応力緩衝部は、導電性接着剤(50)であることを特徴とする請求項1に記載の電子制御装置。
- 前記応力緩衝部は、絶縁性樹脂であることを特徴とする請求項1に記載の電子制御装置。
- 前記応力緩衝部は、前記回路基板(10)の一面(11)と該一面(11)に隣接する側面(18)とによって構成された角部を覆うように配置されていることを特徴とする請求項2または3に記載の電子制御装置。
- 前記応力緩衝部は、前記モールド樹脂(40)と前記回路基板(10)とを密着させるための密着補強材(60)でコーティングされていることを特徴とする請求項2ないし4のいずれか1つに記載の電子制御装置。
- 前記応力緩衝部(50〜52、60)は、ワイヤによって形成されると共に前記段差部(19)に配置されたボンディング部(51)と、前記回路基板(10)よりも弾性率が低い密着補強材(60)と、を有して構成されており、
前記密着補強材(60)は前記ボンディング部(51)をコーティングすると共に、前記段差部(19)を覆うように配置されていることを特徴とする請求項1に記載の電子制御装置。 - 前記応力緩衝部(50〜52、60)は、前記段差部(19)に配置されたワイヤ(52)と、前記回路基板(10)よりも弾性率が低い密着補強材(60)と、を有して構成されており、
前記密着補強材(60)は、前記ワイヤ(52)をコーティングすると共に、前記段差部(19)を覆うように配置されていることを特徴とする請求項1に記載の電子制御装置。 - 前記応力緩衝部(50〜52、60)は、前記段差部(19)に配置されたダミー部品と、前記ダミー部品に前記回路基板(10)よりも弾性率が低い密着補強材(60)と、を有して構成されており、
前記密着補強材(60)は前記ダミー部品をコーティングすると共に、前記段差部(19)を覆うように配置されていることを特徴とする請求項1に記載の電子制御装置。 - 前記応力緩衝部(50〜52、60)は、前記回路基板(10)の一面(11)の外縁部(11a)にL字状に配置されていることを特徴とする請求項1ないし8のいずれか1つに記載の電子制御装置。
- 前記応力緩衝部(50〜52、60)は、前記回路基板(10)の一面(11)の外縁部(11a)を一周して囲むように配置されていることを特徴とする請求項1ないし8のいずれか1つに記載の電子制御装置。
- 前記応力緩衝部(50〜52、60)は、前記回路基板(10)の一面(11)の外縁部(11a)に断続的に配置されていることを特徴とする請求項1ないし8のいずれか1つに記載の電子制御装置。
- 前記応力緩衝部(50〜52、60)は、前記回路基板(10)の一面(11)の外縁部(11a)それぞれにドット状に配置されていることを特徴とする請求項1ないし11のいずれか1つに記載の電子制御装置。
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