JP4095954B2 - コネクタモジュールおよびこれを用いたメータ - Google Patents
コネクタモジュールおよびこれを用いたメータ Download PDFInfo
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- JP4095954B2 JP4095954B2 JP2003422611A JP2003422611A JP4095954B2 JP 4095954 B2 JP4095954 B2 JP 4095954B2 JP 2003422611 A JP2003422611 A JP 2003422611A JP 2003422611 A JP2003422611 A JP 2003422611A JP 4095954 B2 JP4095954 B2 JP 4095954B2
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- 238000013461 design Methods 0.000 claims abstract description 55
- 239000011521 glass Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 description 24
- 239000000446 fuel Substances 0.000 description 17
- 230000002829 reductive effect Effects 0.000 description 15
- 238000004891 communication Methods 0.000 description 11
- 230000006872 improvement Effects 0.000 description 10
- 239000010410 layer Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 9
- 230000009467 reduction Effects 0.000 description 9
- 238000005259 measurement Methods 0.000 description 6
- 239000003973 paint Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 230000008901 benefit Effects 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 230000005855 radiation Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
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- B60K35/00—Instruments specially adapted for vehicles; Arrangement of instruments in or on vehicles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- B60K35/00—Instruments specially adapted for vehicles; Arrangement of instruments in or on vehicles
- B60K35/20—Output arrangements, i.e. from vehicle to user, associated with vehicle functions or specially adapted therefor
- B60K35/21—Output arrangements, i.e. from vehicle to user, associated with vehicle functions or specially adapted therefor using visual output, e.g. blinking lights or matrix displays
- B60K35/215—Output arrangements, i.e. from vehicle to user, associated with vehicle functions or specially adapted therefor using visual output, e.g. blinking lights or matrix displays characterised by the combination of multiple visual outputs, e.g. combined instruments with analogue meters and additional displays
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- B60K35/00—Instruments specially adapted for vehicles; Arrangement of instruments in or on vehicles
- B60K35/20—Output arrangements, i.e. from vehicle to user, associated with vehicle functions or specially adapted therefor
- B60K35/28—Output arrangements, i.e. from vehicle to user, associated with vehicle functions or specially adapted therefor characterised by the type of the output information, e.g. video entertainment or vehicle dynamics information; characterised by the purpose of the output information, e.g. for attracting the attention of the driver
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- B60K35/00—Instruments specially adapted for vehicles; Arrangement of instruments in or on vehicles
- B60K35/60—Instruments characterised by their location or relative disposition in or on vehicles
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/28—Structurally-combined illuminating devices
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- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D13/00—Component parts of indicators for measuring arrangements not specially adapted for a specific variable
- G01D13/02—Scales; Dials
- G01D13/04—Construction
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- B60—VEHICLES IN GENERAL
- B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- B60K2360/00—Indexing scheme associated with groups B60K35/00 or B60K37/00 relating to details of instruments or dashboards
- B60K2360/20—Optical features of instruments
- B60K2360/33—Illumination features
- B60K2360/331—Electroluminescent elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- B60K2360/00—Indexing scheme associated with groups B60K35/00 or B60K37/00 relating to details of instruments or dashboards
- B60K2360/40—Hardware adaptations for dashboards or instruments
- B60K2360/42—Circuit board features
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
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- Details Of Connecting Devices For Male And Female Coupling (AREA)
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Description
イヤーハーネスコネクタ84gが接続され、接続端子84eの弾性接触部に、車種に応じて取り替え可能な制御回路基板84hが、スロットイン式に着脱自在に接続される。制御回路基板84hは、車種毎に異なるメータ制御回路を構成する電子部品を実装した回路基板である。
(A)透明性ベースフィルム301上に透明電極302が設けられた透明導電フィルムを用意する。
(B)次に、透明導電フィルムの透明電極302上に蛍光剤を印刷して発光層303を施す。
(C)次に、発光層303上に印刷により絶縁層304を施す。
(D)次に、絶縁層304上に印刷により裏面電極305を施し、EL3が完成する。
(E)ベースフィルム401上に銅箔402が設けられた銅箔フィルムを用意する。
(F)次に、銅箔フィルムの銅箔402にエッチングにて回路配線を作成する。
(G)次に、回路配線上に印刷により絶縁層403を施す。
(H)製作したEL3の裏面に製作したFPC4を接着剤で貼り付け封止する。
(I)次に、FPC4を封止した後のEL3の表側に印刷で文字板2を施すことにより、文字板モジュール1が完成する。
(A)まず、透明性ベースフィルム301、透明電極302、発光層303、絶縁層304、裏面電極305および保護層306からなるシート状のEL3を用意する。
(B)次に、EL3の裏面の保護層306上に導電材料404を印刷して回路配線を施す。
(C)次に、必要に応じて、導電材料404の回路配線上に印刷により絶縁層405を施す。これにより、シート状のEL3は、導電材料404の回路配線によって裏面側がFPC4と同様の機能を持つことになる。
(D)次に、EL3の表面のベースフィルム301上に印刷で文字板2を施すことにより、文字板モジュール1が完成する。
2 文字板(シート状文字板)
3 EL(シート状光源)
4 FPC(可撓性配線回路体)
5 表ガラス
6 見返し板
7 ケース
84 コネクタモジュール
84a ハウジング
84b 筒部(第1の筒部)
84c 筒部(第2の筒部)
84d 接続端子(第1の接続端子)
84e 接続端子(第2の接続端子)
84f カバー
84g ワイヤーハーネスコネクタ(外部コネクタ)
84h 制御回路基板
Claims (12)
- 第1の筒部および第2の筒部を有するハウジングと、
前記第1の筒部の底部を貫通して、一部が前記第1の筒部の内部に位置しかつ一部が前記ハウジングの外部に露出するように取り付けられ、前記第1の筒部の内部で外部コネクタと接続するための第1の接続端子と、
前記第2の筒部の底部を貫通して、一部が前記第2の筒部の内部に位置しかつ一部が前記ハウジングの外部に露出するように取り付けられた第2の接続端子と、
前記第2の筒部に内蔵されて、前記第2の接続端子に着脱自在に接続される回路基板と
を備えたことを特徴とするコネクタモジュール。 - 前記第2の筒部の内部に位置する前記第2の接続端子の一部は弾性接触部であることを特徴とする請求項1記載のコネクタモジュール。
- 前記第2の筒部の開口をふさぐカバーをさらに備えたことを特徴とする請求項1または2記載のコネクタモジュール。
- 表面に意匠部を有するシート状文字板、該シート状文字板の裏面に固定され、上記意匠部を照明するシート状光源、および該シート状光源の裏面に固定された可撓性配線回路体を含む文字板モジュールと、
前記外部に露出している第1および第2の接続端子の一部が、それぞれ、前記文字板モジュールにおける前記可撓性配線回路体に接続された請求項1から3のいずれか1項に記載のコネクタモジュールと、
前記文字板モジュールにおける前記文字板の前面に配置される見返し板と、
前記見返し板の前面に配置される表ガラスと、
前記文字板モジュールの裏面に配置され、前記見返し板との間で前記文字板モジュールを固定するケース
とからなることを特徴とするメータ。 - 前記シート状文字板と、前記シート状光源と、前記可撓性配線回路体は、それぞれ、ほぼ同一形状に形成されていることを特徴とする請求項4記載のメータ。
- 意匠部を有する文字板が表面に施され、上記意匠部を照明するシート状光源、および該シート状光源の裏面に固定された可撓性配線回路体を含む文字板モジュールと、
前記外部に露出している第1および第2の接続端子の一部が、それぞれ、前記文字板モジュールにおける前記可撓性配線回路体に接続された請求項1から3のいずれか1項に記載のコネクタモジュールと、
前記文字板モジュールにおける前記文字板の前面に配置される見返し板と、
前記見返し板の前面に配置される表ガラスと、
前記文字板モジュールの裏面に配置され、前記見返し板との間で前記文字板モジュールを固定するケース
とからなることを特徴とするメータ。 - 前記可撓性配線回路体と前記シート状光源は、それぞれ、ほぼ同一形状に形成されていることを特徴とする請求項6記載のメータ。
- 表面に意匠部を有するシート状文字板、および該シート状文字板の裏面に固定されて上記意匠部を照明すると共に、可撓性配線回路体が裏面に施されたシート状光源を含む文字板モジュールと、
前記外部に露出している第1および第2の接続端子の一部が、それぞれ、前記文字板モジュールにおける前記可撓性配線回路体に接続された請求項1から3のいずれか1項に記載のコネクタモジュールと、
前記文字板モジュールにおける前記文字板の前面に配置される見返し板と、
前記見返し板の前面に配置される表ガラスと、
前記文字板モジュールの裏面に配置され、前記見返し板との間で前記文字板モジュールを固定するケース
とからなることを特徴とするメータ。 - 前記シート状文字板と前記シート状光源は、それぞれ、ほぼ同一形状に形成されていることを特徴とする請求項8記載のメータ。
- 意匠部を有する文字板が表面に施され、可撓性配線回路体が裏面に施されたシート状光源からなる文字板モジュールと、
前記外部に露出している第1および第2の接続端子の一部が、それぞれ、前記文字板モジュールにおける前記可撓性配線回路体に接続された請求項1から3のいずれか1項に記載のコネクタモジュールと、
前記文字板モジュールにおける前記文字板の前面に配置される見返し板と、
前記見返し板の前面に配置される表ガラスと、
前記文字板モジュールの裏面に配置され、前記見返し板との間で前記文字板モジュールを固定するケース
とからなることを特徴とするメータ。 - 前記文字板モジュールは、さらに追加部品取付用の接続端子部を備えている
ことを特徴とする請求項4から10のいずれか1項に記載のメータ。 - 前記シート状光源はシート状ELである
ことを特徴とする請求項4から11のいずれか1項に記載のメータ。
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KR (4) | KR100933973B1 (ja) |
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