KR100905735B1 - 무브먼트 모듈 - Google Patents
무브먼트 모듈 Download PDFInfo
- Publication number
- KR100905735B1 KR100905735B1 KR1020097000592A KR20097000592A KR100905735B1 KR 100905735 B1 KR100905735 B1 KR 100905735B1 KR 1020097000592 A KR1020097000592 A KR 1020097000592A KR 20097000592 A KR20097000592 A KR 20097000592A KR 100905735 B1 KR100905735 B1 KR 100905735B1
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- KR
- South Korea
- Prior art keywords
- dial
- module
- sheet
- meter
- shaped
- Prior art date
Links
- 238000013461 design Methods 0.000 abstract description 43
- 230000002829 reductive effect Effects 0.000 abstract description 15
- 230000006872 improvement Effects 0.000 abstract description 11
- 230000009467 reduction Effects 0.000 abstract description 8
- 239000000758 substrate Substances 0.000 description 24
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- 238000004519 manufacturing process Methods 0.000 description 15
- 239000010410 layer Substances 0.000 description 12
- 238000004891 communication Methods 0.000 description 11
- 239000003973 paint Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
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- 238000005530 etching Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
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Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/28—Structurally-combined illuminating devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- B60K35/00—Instruments specially adapted for vehicles; Arrangement of instruments in or on vehicles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- B60K35/00—Instruments specially adapted for vehicles; Arrangement of instruments in or on vehicles
- B60K35/20—Output arrangements, i.e. from vehicle to user, associated with vehicle functions or specially adapted therefor
- B60K35/21—Output arrangements, i.e. from vehicle to user, associated with vehicle functions or specially adapted therefor using visual output, e.g. blinking lights or matrix displays
- B60K35/215—Output arrangements, i.e. from vehicle to user, associated with vehicle functions or specially adapted therefor using visual output, e.g. blinking lights or matrix displays characterised by the combination of multiple visual outputs, e.g. combined instruments with analogue meters and additional displays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- B60K35/00—Instruments specially adapted for vehicles; Arrangement of instruments in or on vehicles
- B60K35/20—Output arrangements, i.e. from vehicle to user, associated with vehicle functions or specially adapted therefor
- B60K35/28—Output arrangements, i.e. from vehicle to user, associated with vehicle functions or specially adapted therefor characterised by the type of the output information, e.g. video entertainment or vehicle dynamics information; characterised by the purpose of the output information, e.g. for attracting the attention of the driver
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- B60K35/00—Instruments specially adapted for vehicles; Arrangement of instruments in or on vehicles
- B60K35/60—Instruments characterised by their location or relative disposition in or on vehicles
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D13/00—Component parts of indicators for measuring arrangements not specially adapted for a specific variable
- G01D13/02—Scales; Dials
- G01D13/04—Construction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- B60K2360/00—Indexing scheme associated with groups B60K35/00 or B60K37/00 relating to details of instruments or dashboards
- B60K2360/20—Optical features of instruments
- B60K2360/33—Illumination features
- B60K2360/331—Electroluminescent elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- B60K2360/00—Indexing scheme associated with groups B60K35/00 or B60K37/00 relating to details of instruments or dashboards
- B60K2360/40—Hardware adaptations for dashboards or instruments
- B60K2360/42—Circuit board features
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Transportation (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Instrument Panels (AREA)
- Details Of Measuring Devices (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Electroluminescent Light Sources (AREA)
- Electromechanical Clocks (AREA)
- Led Device Packages (AREA)
- Measuring Volume Flow (AREA)
Abstract
Description
Claims (1)
- 시트 형상 문자판과, 시트 형상 광원과, 가요성 배선회로체로 구성되는 문자판 모듈에 부착되는 무브먼트 모듈에 있어서,프린트 기판과,상기 프린트 기판의 한쪽 면에 실장된 스텝퍼 모터와,상기 프린트 기판의 다른쪽 면에 실장되고, 상기 스텝퍼 모터를 구동하는 드라이버 소자와,상기 프린트 기판의 단부에 형성되고, 상기 가요성 배선회로체의 대응하는 접속단자에 부착됨으로써, 상기 무브먼트 모듈을 당해 가요성 배선회로체에 고정하는 접속단자를 구비하고,상기 스텝퍼 모터의 회전축이, 상기 프린트 기판의 상기 다른쪽 면으로부터 돌출하고 상기 문자판 모듈에 설치된 관통구멍을 관통하여, 관통된 당해 회전축에, 이 문자판 모듈의 표면측에 배치되는 지침이 부착되는 것을 특징으로 하는 무브먼트 모듈.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2002-275896 | 2002-09-20 | ||
JP2002275896 | 2002-09-20 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020067024283A Division KR100933973B1 (ko) | 2002-09-20 | 2003-09-19 | 커넥터 모듈 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090015185A KR20090015185A (ko) | 2009-02-11 |
KR100905735B1 true KR100905735B1 (ko) | 2009-07-01 |
Family
ID=32089129
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020097000592A KR100905735B1 (ko) | 2002-09-20 | 2003-09-19 | 무브먼트 모듈 |
KR1020067024283A KR100933973B1 (ko) | 2002-09-20 | 2003-09-19 | 커넥터 모듈 |
KR1020057004692A KR100899345B1 (ko) | 2002-09-20 | 2003-09-19 | 문자판 모듈, 그 제조 방법, 및 이들을 이용한 미터 |
KR1020097005956A KR100933972B1 (ko) | 2002-09-20 | 2003-09-19 | 문자판 모듈 및 그 제조 방법 |
Family Applications After (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020067024283A KR100933973B1 (ko) | 2002-09-20 | 2003-09-19 | 커넥터 모듈 |
KR1020057004692A KR100899345B1 (ko) | 2002-09-20 | 2003-09-19 | 문자판 모듈, 그 제조 방법, 및 이들을 이용한 미터 |
KR1020097005956A KR100933972B1 (ko) | 2002-09-20 | 2003-09-19 | 문자판 모듈 및 그 제조 방법 |
Country Status (7)
Country | Link |
---|---|
US (3) | US20060044778A1 (ko) |
EP (4) | EP1541972B1 (ko) |
JP (5) | JP4414706B2 (ko) |
KR (4) | KR100905735B1 (ko) |
CN (4) | CN100507982C (ko) |
ES (3) | ES2423286T3 (ko) |
WO (1) | WO2004033999A1 (ko) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7347575B2 (en) * | 2004-07-13 | 2008-03-25 | Yazaki North America, Inc. | Vehicle gauge with embedded driver information |
JP4583889B2 (ja) * | 2004-11-12 | 2010-11-17 | 矢崎総業株式会社 | 計器装置 |
US7562993B2 (en) * | 2005-08-10 | 2009-07-21 | Denso International America, Inc. | Continuous LED instrument panel |
US20070245821A1 (en) * | 2006-04-11 | 2007-10-25 | Ching-Su Chiu | Luminescent refrigerant gauge device |
DE102006033040A1 (de) | 2006-07-14 | 2008-01-17 | Johnson Controls Automotive Electronics Gmbh | Anzeigevorrichtung für ein Kraftfahrzeug mit einem im wesentlichen parallelen Lichtbündel |
JP5189268B2 (ja) * | 2006-10-19 | 2013-04-24 | 矢崎総業株式会社 | 車両用表示装置 |
JP4851385B2 (ja) * | 2007-04-26 | 2012-01-11 | 株式会社デンソー | 車両用表示装置 |
WO2010059977A2 (en) * | 2008-11-20 | 2010-05-27 | Interplex Industries, Inc. | Solderless electronic component or capacitor mount assembly |
KR101293815B1 (ko) * | 2008-12-12 | 2013-08-06 | 후루카와 덴키 고교 가부시키가이샤 | 내부조명식 표시장치 및 그 표시패널 |
JP5549120B2 (ja) * | 2009-06-08 | 2014-07-16 | 株式会社日立製作所 | 鉄道車両用の電力変換装置 |
KR101422362B1 (ko) | 2009-07-10 | 2014-07-22 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치, 표시 패널 및 전자 기기 |
FR2948470B1 (fr) * | 2009-07-21 | 2011-09-16 | Valeo Systemes Thermiques | Procede de fabrication d'une interface homme/machine pour vehicule automobile et interface homme/machine conforme a ce procede |
JP5493831B2 (ja) * | 2009-12-25 | 2014-05-14 | 日本精機株式会社 | 計器装置 |
US8441801B2 (en) * | 2010-04-27 | 2013-05-14 | Electrolux Home Products, Inc. | Flexible mount system |
JP5636840B2 (ja) * | 2010-09-24 | 2014-12-10 | 株式会社バッファロー | 電子機器 |
KR101783955B1 (ko) * | 2011-02-10 | 2017-10-11 | 삼성디스플레이 주식회사 | 발광 다이오드 패키지 및 이를 구비한 백라이트 유닛 |
EP2707239A1 (de) * | 2011-05-13 | 2014-03-19 | Volkswagen Aktiengesellschaft | Anzeigeeinheit für ein fahrzeug |
US9902265B2 (en) | 2011-05-13 | 2018-02-27 | Volkswagen Ag | Display device for a vehicle, and vehicle |
US8460030B2 (en) * | 2011-06-21 | 2013-06-11 | Nai-Chien Chang | Connector with detachable module |
CN102955270A (zh) * | 2011-08-30 | 2013-03-06 | 昆山顺景光电有限公司 | 一种带汉字库的cog液晶显示模块 |
TWM442601U (en) * | 2012-04-26 | 2012-12-01 | Nai-Chien Chang | The wireless module and using the wireless module connector |
CN102923001A (zh) * | 2012-10-31 | 2013-02-13 | 埃泰克汽车电子(芜湖)有限公司 | 一种汽车仪表结构 |
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