JP2004170430A - ムーブメントモジュールおよびこれを用いたメータ - Google Patents
ムーブメントモジュールおよびこれを用いたメータ Download PDFInfo
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- 238000013461 design Methods 0.000 claims description 54
- 239000011521 glass Substances 0.000 claims description 10
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
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- 229910052709 silver Inorganic materials 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
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- B60—VEHICLES IN GENERAL
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- B60K35/00—Instruments specially adapted for vehicles; Arrangement of instruments in or on vehicles
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B60K35/00—Instruments specially adapted for vehicles; Arrangement of instruments in or on vehicles
- B60K35/20—Output arrangements, i.e. from vehicle to user, associated with vehicle functions or specially adapted therefor
- B60K35/21—Output arrangements, i.e. from vehicle to user, associated with vehicle functions or specially adapted therefor using visual output, e.g. blinking lights or matrix displays
- B60K35/215—Output arrangements, i.e. from vehicle to user, associated with vehicle functions or specially adapted therefor using visual output, e.g. blinking lights or matrix displays characterised by the combination of multiple visual outputs, e.g. combined instruments with analogue meters and additional displays
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- B60K35/00—Instruments specially adapted for vehicles; Arrangement of instruments in or on vehicles
- B60K35/20—Output arrangements, i.e. from vehicle to user, associated with vehicle functions or specially adapted therefor
- B60K35/28—Output arrangements, i.e. from vehicle to user, associated with vehicle functions or specially adapted therefor characterised by the type of the output information, e.g. video entertainment or vehicle dynamics information; characterised by the purpose of the output information, e.g. for attracting the attention of the driver
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- B60K35/00—Instruments specially adapted for vehicles; Arrangement of instruments in or on vehicles
- B60K35/60—Instruments characterised by their location or relative disposition in or on vehicles
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/28—Structurally-combined illuminating devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D13/00—Component parts of indicators for measuring arrangements not specially adapted for a specific variable
- G01D13/02—Scales; Dials
- G01D13/04—Construction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- B60K2360/00—Indexing scheme associated with groups B60K35/00 or B60K37/00 relating to details of instruments or dashboards
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- B60K2360/331—Electroluminescent elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- B60K2360/00—Indexing scheme associated with groups B60K35/00 or B60K37/00 relating to details of instruments or dashboards
- B60K2360/40—Hardware adaptations for dashboards or instruments
- B60K2360/42—Circuit board features
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
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- H01L2924/181—Encapsulation
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- H01L2924/181—Encapsulation
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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Abstract
【解決手段】ムーブメントモジュール83は、プリント基板83aと、プリント基板83aに実装されたステッパモータ83bと、プリント基板83aに実装され、ステッパモータ83bを駆動するドライバ素子83cと、プリント基板83aに形成された接続端子83eとを備えている。
【選択図】図6
Description
(A)透明性ベースフィルム301上に透明電極302が設けられた透明導電フィルムを用意する。
(B)次に、透明導電フィルムの透明電極302上に蛍光剤を印刷して発光層303を施す。
(C)次に、発光層303上に印刷により絶縁層304を施す。
(D)次に、絶縁層304上に印刷により裏面電極305を施し、EL3が完成する。
(E)ベースフィルム401上に銅箔402が設けられた銅箔フィルムを用意する。
(F)次に、銅箔フィルムの銅箔402にエッチングにて回路配線を作成する。
(G)次に、回路配線上に印刷により絶縁層403を施す。
(H)製作したEL3の裏面に製作したFPC4を接着剤で貼り付け封止する。
(I)次に、FPC4を封止した後のEL3の表側に印刷で文字板2を施すことにより、文字板モジュール1が完成する。
(A)まず、透明性ベースフィルム301、透明電極302、発光層303、絶縁層304、裏面電極305および保護層306からなるシート状のEL3を用意する。
(B)次に、EL3の裏面の保護層306上に導電材料404を印刷して回路配線を施す。
(C)次に、必要に応じて、導電材料404の回路配線上に印刷により絶縁層405を施す。これにより、シート状のEL3は、導電材料404の回路配線によって裏面側がFPC4と同様の機能を持つことになる。
(D)次に、EL3の表面のベースフィルム301上に印刷で文字板2を施すことにより、文字板モジュール1が完成する。
2 文字板(シート状文字板)
3 EL(シート状光源)
4 FPC(可撓性配線回路体)
5 表ガラス
6 見返し板
7 ケース
83 ムーブメントモジュール
83a プリント基板
83b ステッパモータ(ムーブメント)
83c ドライバ素子
83e 接続端子
Claims (10)
- プリント基板と、
前記プリント基板に実装されたステッパモータと、
前記プリント基板に実装され、前記ステッパモータを駆動するドライバ素子と、
前記プリント基板に形成された接続端子と
を備えたことを特徴とするムーブメントモジュール。 - 表面に意匠部を有するシート状文字板、該シート状文字板の裏面に固定され、上記意匠部を照明するシート状光源、および該シート状光源の裏面に固定された可撓性配線回路体を含む文字板モジュールと、
前記文字板モジュールにおける前記可撓性配線回路体に取り付けられた請求項1記載のムーブメントモジュールと、
前記文字板モジュールにおける前記文字板の前面に配置される見返し板と、
前記見返し板の前面に配置される表ガラスと、
前記文字板モジュールの裏面に配置され、前記見返し板との間で前記文字板モジュールを固定するケース
とからなることを特徴とするメータ。 - 前記シート状文字板と、前記シート状光源と、前記可撓性配線回路体は、それぞれ、ほぼ同一形状に形成されていることを特徴とする請求項2記載のメータ。
- 意匠部を有する文字板が表面に施され、上記意匠部を照明するシート状光源、および該シート状光源の裏面に固定された可撓性配線回路体を含む文字板モジュールと、
前記文字板モジュールにおける前記可撓性配線回路体に取り付けられた請求項1記載のムーブメントモジュールと、
前記文字板モジュールにおける前記文字板の前面に配置される見返し板と、
前記見返し板の前面に配置される表ガラスと、
前記文字板モジュールの裏面に配置され、前記見返し板との間で前記文字板モジュールを固定するケース
とからなることを特徴とするメータ。 - 前記可撓性配線回路体と前記シート状光源は、それぞれ、ほぼ同一形状に形成されていることを特徴とする請求項4記載のメータ。
- 表面に意匠部を有するシート状文字板、および該シート状文字板の裏面に固定されて上記意匠部を照明すると共に、可撓性配線回路体が裏面に施されたシート状光源を含む文字板モジュールと、
前記文字板モジュールにおける前記可撓性配線回路体に取り付けられた請求項1記載のムーブメントモジュールと、
前記文字板モジュールにおける前記文字板の前面に配置される見返し板と、
前記見返し板の前面に配置される表ガラスと、
前記文字板モジュールの裏面に配置され、前記見返し板との間で前記文字板モジュールを固定するケース
とからなることを特徴とするメータ。 - 前記シート状文字板と前記シート状光源は、それぞれ、ほぼ同一形状に形成されていることを特徴とする請求項6記載のメータ。
- 意匠部を有する文字板が表面に施され、可撓性配線回路体が裏面に施されたシート状光源からなる文字板モジュールと、
前記文字板モジュールにおける前記可撓性配線回路体に取り付けられた請求項1記載のムーブメントモジュールと、
前記文字板モジュールにおける前記文字板の前面に配置される見返し板と、
前記見返し板の前面に配置される表ガラスと、
前記文字板モジュールの裏面に配置され、前記見返し板との間で前記文字板モジュールを固定するケース
とからなることを特徴とするメータ。 - 前記文字板モジュールは、さらに追加部品取付用の接続端子部を備えている
ことを特徴とする請求項2から8のいずれか1項に記載のメータ。 - 前記シート状光源はシート状ELである
ことを特徴とする請求項2から9のいずれか1項に記載のメータ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2003422610A JP4414749B2 (ja) | 2002-09-20 | 2003-12-19 | メータ |
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JP2002275896 | 2002-09-20 | ||
JP2003422610A JP4414749B2 (ja) | 2002-09-20 | 2003-12-19 | メータ |
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Application Number | Title | Priority Date | Filing Date |
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JP2003328121A Division JP4414706B2 (ja) | 2002-09-20 | 2003-09-19 | 文字板モジュールおよび文字板モジュールの製造方法 |
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JP2004170430A true JP2004170430A (ja) | 2004-06-17 |
JP4414749B2 JP4414749B2 (ja) | 2010-02-10 |
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JP2003328121A Expired - Fee Related JP4414706B2 (ja) | 2002-09-20 | 2003-09-19 | 文字板モジュールおよび文字板モジュールの製造方法 |
JP2003422611A Expired - Fee Related JP4095954B2 (ja) | 2002-09-20 | 2003-12-19 | コネクタモジュールおよびこれを用いたメータ |
JP2003422608A Pending JP2004200704A (ja) | 2002-09-20 | 2003-12-19 | Led表示素子およびこれを用いたメータ |
JP2003422610A Expired - Fee Related JP4414749B2 (ja) | 2002-09-20 | 2003-12-19 | メータ |
JP2003422609A Pending JP2004206120A (ja) | 2002-09-20 | 2003-12-19 | ディスプレイモジュールおよびこれを用いたメータ |
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JP2003328121A Expired - Fee Related JP4414706B2 (ja) | 2002-09-20 | 2003-09-19 | 文字板モジュールおよび文字板モジュールの製造方法 |
JP2003422611A Expired - Fee Related JP4095954B2 (ja) | 2002-09-20 | 2003-12-19 | コネクタモジュールおよびこれを用いたメータ |
JP2003422608A Pending JP2004200704A (ja) | 2002-09-20 | 2003-12-19 | Led表示素子およびこれを用いたメータ |
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US (3) | US20060044778A1 (ja) |
EP (4) | EP2113749B1 (ja) |
JP (5) | JP4414706B2 (ja) |
KR (4) | KR100933973B1 (ja) |
CN (4) | CN100507982C (ja) |
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- 2003-09-19 KR KR1020057004692A patent/KR100899345B1/ko not_active IP Right Cessation
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- 2003-09-19 KR KR1020097005956A patent/KR100933972B1/ko not_active IP Right Cessation
- 2003-09-19 CN CNB2007101011520A patent/CN100507982C/zh not_active Expired - Fee Related
- 2003-09-19 ES ES09167481T patent/ES2425845T3/es not_active Expired - Lifetime
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- 2003-09-19 EP EP09167472.1A patent/EP2116817B1/en not_active Expired - Lifetime
- 2003-09-19 KR KR1020097000592A patent/KR100905735B1/ko active IP Right Grant
- 2003-09-19 US US10/528,448 patent/US20060044778A1/en not_active Abandoned
- 2003-09-19 WO PCT/JP2003/012013 patent/WO2004033999A1/ja active Application Filing
- 2003-09-19 CN CN2009101453296A patent/CN101685028B/zh not_active Expired - Fee Related
- 2003-09-19 JP JP2003328121A patent/JP4414706B2/ja not_active Expired - Fee Related
- 2003-09-19 ES ES09167471T patent/ES2423286T3/es not_active Expired - Lifetime
- 2003-09-19 EP EP09167471.3A patent/EP2116816B1/en not_active Expired - Lifetime
- 2003-09-19 CN CN2009101453281A patent/CN101685027B/zh not_active Expired - Fee Related
- 2003-12-19 JP JP2003422611A patent/JP4095954B2/ja not_active Expired - Fee Related
- 2003-12-19 JP JP2003422608A patent/JP2004200704A/ja active Pending
- 2003-12-19 JP JP2003422610A patent/JP4414749B2/ja not_active Expired - Fee Related
- 2003-12-19 JP JP2003422609A patent/JP2004206120A/ja active Pending
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2008
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2006138759A (ja) * | 2004-11-12 | 2006-06-01 | Yazaki Corp | 計器装置 |
JP4583889B2 (ja) * | 2004-11-12 | 2010-11-17 | 矢崎総業株式会社 | 計器装置 |
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