KR100933973B1 - 커넥터 모듈 - Google Patents
커넥터 모듈 Download PDFInfo
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- KR100933973B1 KR100933973B1 KR1020067024283A KR20067024283A KR100933973B1 KR 100933973 B1 KR100933973 B1 KR 100933973B1 KR 1020067024283 A KR1020067024283 A KR 1020067024283A KR 20067024283 A KR20067024283 A KR 20067024283A KR 100933973 B1 KR100933973 B1 KR 100933973B1
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- 238000013461 design Methods 0.000 abstract description 43
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- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/28—Structurally-combined illuminating devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- B60K35/00—Instruments specially adapted for vehicles; Arrangement of instruments in or on vehicles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- B60K35/00—Instruments specially adapted for vehicles; Arrangement of instruments in or on vehicles
- B60K35/20—Output arrangements, i.e. from vehicle to user, associated with vehicle functions or specially adapted therefor
- B60K35/21—Output arrangements, i.e. from vehicle to user, associated with vehicle functions or specially adapted therefor using visual output, e.g. blinking lights or matrix displays
- B60K35/215—Output arrangements, i.e. from vehicle to user, associated with vehicle functions or specially adapted therefor using visual output, e.g. blinking lights or matrix displays characterised by the combination of multiple visual outputs, e.g. combined instruments with analogue meters and additional displays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- B60K35/00—Instruments specially adapted for vehicles; Arrangement of instruments in or on vehicles
- B60K35/20—Output arrangements, i.e. from vehicle to user, associated with vehicle functions or specially adapted therefor
- B60K35/28—Output arrangements, i.e. from vehicle to user, associated with vehicle functions or specially adapted therefor characterised by the type of the output information, e.g. video entertainment or vehicle dynamics information; characterised by the purpose of the output information, e.g. for attracting the attention of the driver
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- B60K35/00—Instruments specially adapted for vehicles; Arrangement of instruments in or on vehicles
- B60K35/60—Instruments characterised by their location or relative disposition in or on vehicles
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D13/00—Component parts of indicators for measuring arrangements not specially adapted for a specific variable
- G01D13/02—Scales; Dials
- G01D13/04—Construction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- B60K2360/00—Indexing scheme associated with groups B60K35/00 or B60K37/00 relating to details of instruments or dashboards
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- B60K2360/33—Illumination features
- B60K2360/331—Electroluminescent elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- B60K2360/00—Indexing scheme associated with groups B60K35/00 or B60K37/00 relating to details of instruments or dashboards
- B60K2360/40—Hardware adaptations for dashboards or instruments
- B60K2360/42—Circuit board features
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Transportation (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Instrument Panels (AREA)
- Details Of Measuring Devices (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Liquid Crystal (AREA)
- Led Device Packages (AREA)
- Electromechanical Clocks (AREA)
- Measuring Volume Flow (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims (8)
- 차량용 미터의 부재로서 사용되는 커넥터 모듈에 있어서,제 1 통부 및 상기 제 1 통부와는 칸막이된 제 2 통부를 가지는 하우징과,상기 제 1 통부의 바닥부를 관통하고, 일부가 상기 제 1 통부의 내부에 위치하고 또한 일부가 외부에 노출되도록 부착되고, 상기 제 1 통부의 내부에서 외부 커넥터와 접속하기 위한 제 1 접속단자와,상기 제 2 통부의 바닥부를 관통하고, 일부가 상기 제 2 통부의 내부에 위치하고 또한 일부가 외부에 노출되도록 부착된 제 2 접속단자와,상기 제 2 통부에 내장되고, 상기 제 2 접속단자에 착탈 자유롭게 접속되는 회로기판을 구비한 것을 특징으로 하는 커넥터 모듈.
- 제 1 항에 있어서, 상기 제 2 통부의 내부에 위치하는 상기 제 2 접속단자의 일부는 탄성 접촉부인 것을 특징으로 하는 커넥터 모듈.
- 제 1 항 또는 제 2 항에 있어서, 상기 제 2 통부의 개구를 막는 커버를 더 구비한 것을 특징으로 하는 커넥터 모듈.
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Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2002-00275896 | 2002-09-20 | ||
JP2002275896 | 2002-09-20 | ||
PCT/JP2003/012013 WO2004033999A1 (ja) | 2002-09-20 | 2003-09-19 | 文字板モジュールおよびその製造方法並びにled表示素子、ディスプレイモジュール、ムーブメントモジュール、コネクタモジュールおよびこれらを用いたメータ |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020057004692A Division KR100899345B1 (ko) | 2002-09-20 | 2003-09-19 | 문자판 모듈, 그 제조 방법, 및 이들을 이용한 미터 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020097000592A Division KR100905735B1 (ko) | 2002-09-20 | 2003-09-19 | 무브먼트 모듈 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070008700A KR20070008700A (ko) | 2007-01-17 |
KR100933973B1 true KR100933973B1 (ko) | 2009-12-28 |
Family
ID=32089129
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020067024283A KR100933973B1 (ko) | 2002-09-20 | 2003-09-19 | 커넥터 모듈 |
KR1020057004692A KR100899345B1 (ko) | 2002-09-20 | 2003-09-19 | 문자판 모듈, 그 제조 방법, 및 이들을 이용한 미터 |
KR1020097005956A KR100933972B1 (ko) | 2002-09-20 | 2003-09-19 | 문자판 모듈 및 그 제조 방법 |
KR1020097000592A KR100905735B1 (ko) | 2002-09-20 | 2003-09-19 | 무브먼트 모듈 |
Family Applications After (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020057004692A KR100899345B1 (ko) | 2002-09-20 | 2003-09-19 | 문자판 모듈, 그 제조 방법, 및 이들을 이용한 미터 |
KR1020097005956A KR100933972B1 (ko) | 2002-09-20 | 2003-09-19 | 문자판 모듈 및 그 제조 방법 |
KR1020097000592A KR100905735B1 (ko) | 2002-09-20 | 2003-09-19 | 무브먼트 모듈 |
Country Status (7)
Country | Link |
---|---|
US (3) | US20060044778A1 (ko) |
EP (4) | EP2113749B1 (ko) |
JP (5) | JP4414706B2 (ko) |
KR (4) | KR100933973B1 (ko) |
CN (4) | CN100507982C (ko) |
ES (3) | ES2423310T3 (ko) |
WO (1) | WO2004033999A1 (ko) |
Families Citing this family (32)
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US7347575B2 (en) * | 2004-07-13 | 2008-03-25 | Yazaki North America, Inc. | Vehicle gauge with embedded driver information |
JP4583889B2 (ja) * | 2004-11-12 | 2010-11-17 | 矢崎総業株式会社 | 計器装置 |
US7562993B2 (en) * | 2005-08-10 | 2009-07-21 | Denso International America, Inc. | Continuous LED instrument panel |
US20070245821A1 (en) * | 2006-04-11 | 2007-10-25 | Ching-Su Chiu | Luminescent refrigerant gauge device |
DE102006033040A1 (de) * | 2006-07-14 | 2008-01-17 | Johnson Controls Automotive Electronics Gmbh | Anzeigevorrichtung für ein Kraftfahrzeug mit einem im wesentlichen parallelen Lichtbündel |
JP5189268B2 (ja) * | 2006-10-19 | 2013-04-24 | 矢崎総業株式会社 | 車両用表示装置 |
JP4851385B2 (ja) * | 2007-04-26 | 2012-01-11 | 株式会社デンソー | 車両用表示装置 |
US8305769B2 (en) * | 2008-11-20 | 2012-11-06 | Interplex Industries, Inc. | Solderless electronic component or capacitor mount assembly |
EP2378505B1 (en) * | 2008-12-12 | 2020-03-25 | Furukawa Electric Co., Ltd. | Internally illuminated display and display panel therefor |
JP5549120B2 (ja) * | 2009-06-08 | 2014-07-16 | 株式会社日立製作所 | 鉄道車両用の電力変換装置 |
KR101857405B1 (ko) | 2009-07-10 | 2018-05-11 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
FR2948470B1 (fr) * | 2009-07-21 | 2011-09-16 | Valeo Systemes Thermiques | Procede de fabrication d'une interface homme/machine pour vehicule automobile et interface homme/machine conforme a ce procede |
JP5493831B2 (ja) * | 2009-12-25 | 2014-05-14 | 日本精機株式会社 | 計器装置 |
US8441801B2 (en) * | 2010-04-27 | 2013-05-14 | Electrolux Home Products, Inc. | Flexible mount system |
JP5636840B2 (ja) * | 2010-09-24 | 2014-12-10 | 株式会社バッファロー | 電子機器 |
KR101783955B1 (ko) * | 2011-02-10 | 2017-10-11 | 삼성디스플레이 주식회사 | 발광 다이오드 패키지 및 이를 구비한 백라이트 유닛 |
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