JP2011258921A5 - - Google Patents

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Publication number
JP2011258921A5
JP2011258921A5 JP2011011427A JP2011011427A JP2011258921A5 JP 2011258921 A5 JP2011258921 A5 JP 2011258921A5 JP 2011011427 A JP2011011427 A JP 2011011427A JP 2011011427 A JP2011011427 A JP 2011011427A JP 2011258921 A5 JP2011258921 A5 JP 2011258921A5
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JP
Japan
Prior art keywords
interconnect
solder resist
substrate
bump
sites
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JP2011011427A
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English (en)
Japanese (ja)
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JP6013705B2 (ja
JP2011258921A (ja
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Priority claimed from US12/813,335 external-priority patent/US9125332B2/en
Priority claimed from US12/969,451 external-priority patent/US9345148B2/en
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Publication of JP2011258921A publication Critical patent/JP2011258921A/ja
Publication of JP2011258921A5 publication Critical patent/JP2011258921A5/ja
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JP2011011427A 2010-06-10 2011-01-21 部分パット上にバンプを有するフリップチップ相互接続構造を形成する半導体デバイスおよびその方法 Active JP6013705B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US12/813,335 2010-06-10
US12/813,335 US9125332B2 (en) 2008-03-25 2010-06-10 Filp chip interconnection structure with bump on partial pad and method thereof
US12/969,451 2010-12-15
US12/969,451 US9345148B2 (en) 2008-03-25 2010-12-15 Semiconductor device and method of forming flipchip interconnection structure with bump on partial pad

Publications (3)

Publication Number Publication Date
JP2011258921A JP2011258921A (ja) 2011-12-22
JP2011258921A5 true JP2011258921A5 (https=) 2014-10-02
JP6013705B2 JP6013705B2 (ja) 2016-10-25

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JP2011011427A Active JP6013705B2 (ja) 2010-06-10 2011-01-21 部分パット上にバンプを有するフリップチップ相互接続構造を形成する半導体デバイスおよびその方法

Country Status (4)

Country Link
US (1) US9345148B2 (https=)
JP (1) JP6013705B2 (https=)
KR (1) KR101921332B1 (https=)
TW (1) TWI539540B (https=)

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